Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Next Generation High Density Build-Up PKG Substrate
In recent years,along with the further progress of network systems,mobile communication systems and high performance
servers printed wiring boards (PWBs),which are key components in these produ
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Event
IPC APEX EXPO 2005
Qualification of ALIVH-G Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets; PDAs are demanding
increased routing densities for printed circuit boards. The handheld wi
.. read more
Event
IPC APEX EXPO 2005
Use of Novel Adhesive-lined CCL Material in Single-pressed Multi-layer Circuit Boards with Inner Via-Holes in all Layers
This newly developed material and process enable the manufacturing,using a single pressing process,of multi-layer circuit
boards with inner via-holes in every layer. Because this material utili
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Event
IPC APEX EXPO 2005
New Improved Polyimides for Increased Reliability
A Design of Experiment (DOE) was conducted to determine the best filler,or combination of fillers that would offer the best
reduction of CTE expansion from 50oC to 260o C without compromising e
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Event
IPC APEX EXPO 2005
All Polyimide Thin Multi-Layer Substrate
As a promising candidate for future substrate with high pin-count and low transmission loss at high frequency,we have
developed an all polyimide multi-layered board laminated by single batch pr
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Event
IPC APEX EXPO 2005
Novel Polyimide Build-up Material for Fine-line Fabrication
We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount
high speed CPUs with high I/O numbers. These PWBs meet the following require
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Event
IPC APEX EXPO 2005
Design of Experiment in Micro-Via Thermal Fatigue Test
The objectives of the present study are to design,fabricate,and test various configurations of micro-vias over military
thermal environment,and then evaluate the impacts of micro-via design/man
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Event
IPC APEX EXPO 2004
Qualification of Stacked Microvia Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets and PDAs,are
demanding increased routing densities for printed circuit boards. The handheld
.. read more
Event
IPC APEX EXPO 2004
Evaluation of Underfill Material on Board Level Reliability Improvement of Wafer Level CSP Component
In recent years,Wafer Level Chip Scale Packages (WLCSP) are used not only in the hand held devices but also in high-end
networking and telecommunication products. Due to their small footprint a
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Event
IPC APEX EXPO 2004
The Effect of Thermal Loaded Bend Test on the Solder Joint Reliability
With the function of today’s electronic devices become more and more complicate,the high I/O flip chip ball grid array
package (FCBGA) is used more popularly in recent years. The FCBGA package
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Event
IPC APEX EXPO 2004
Investigation of the Manufacturing Challenges of 2577 I/O Flip Chip Ball Grid Arrays
Higher I/O Ball Grid Arrays (BGAs) are high speed,high pin count,and high performance array packages. These BGAs are
also more complex in structure than “standard” BGAs and are generally target
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Event
IPC APEX EXPO 2004
Adhesive Deposit Performance Characterization using Standard X-ray Analysis Tools
Quantifying SMT adhesive dispensing performance has typically been attribute analysis via a microscope. Individual
adhesive deposits were inspected for strings or tails,extra dots,missing dots
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Event
IPC APEX EXPO 2004
When are Conductive Adhesives an Alternative to Solder?
Conductive adhesives (CAs) have been an important problem-solving class of assembly materials for decades,but primarily
as die attaches products,ever since they replaced metallurgical systems.
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Event
IPC APEX EXPO 2004
Comparative Evaluation of AOI Systems
The electronic industry trend of smaller component packages and tighter spacing has put greater demands on manufacturing
for process control and product verification. Defects must be caught ear
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Event
IPC APEX EXPO 2004
Solder Paste Printing Inspection – An Inside Look
Industry cost control pressures and technology drivers demand more powerful 3D AOI machines for control of solder paste
printing. Here is an inside look at the factors potential purchasers of t
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Event
IPC APEX EXPO 2004
Dynamic Testing and Modeling for Solder Joint Reliability Evaluation
The behavior of BGA solder joints under dynamic loads has become more significant in recent years. This work explored test
methodologies for solder joint failure evaluation under dynamic loads.
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Event
IPC APEX EXPO 2004
Comparing Digital and Analogue X-ray Inspection for BGA,Flip Chip and CSP Analysis
Non-destructive testing during the manufacture of printed wiring boards (PWBs) has become ever more important for
checking product quality without compromising productivity. Using x-ray inspect
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Event
IPC APEX EXPO 2004
Thermal Mechanical Analysis T-260 Printed Wiring Board Testing
Evaluation of printed wiring boards (PWBs) for thermal reliability during assembly and rework operations by Thermal
Mechanical Analyzer (TMA) “T-260” testing has been an accepted practice for m
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Event
IPC APEX EXPO 2004
Issues and Challenges of Testing Modern Low Voltage Devices with Conventional In-Circuit Testers
The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device
manufacturers have moved to satisfy market demands for more powerful products,sma
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Event
IPC APEX EXPO 2004
Lead Free First Article Inspection: The Key to Success
Process,Process,Process – these words must ring loudly in our ears,and must be at the forefront of lead free
implementation. The smaller process windows dictated by lead free alloys are going t
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Event
IPC APEX EXPO 2004
Deposition of Gold and Silver Surface Finishes Using Organic-Based Solutions
A novel electrochemical plating process for depositing gold and silver surface finishes using environmentally benign,
organic-based solutions as the plating bath is being investigated. The plat
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Event
IPC APEX EXPO 2004
Neutral Type Auto-Catalytic Electroless Gold Plating Process
In order to understand the reaction mechanism of an auto-catalytic type gold plating bath,it is necessary to recognize the
following reactions --- oxidation of reducing agent,gold deposition an
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Event
IPC APEX EXPO 2004
Study of SMT Assembly Processes for Fine Pitch CSP Packages
The SMT (surface mount technology) assembly process for 0.4 mm pitch CSP (chip scale package) components was studied
in this work. For the screen printing process,the printing performance of di
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Event
IPC APEX EXPO 2004
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
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Event
IPC APEX EXPO 2004
A Fast,Precise and Reproducible QC-Rheometry Routine for Solder Paste
SPC data has shown that the solder paste printing process is the primary source of soldering defects in SMT assembly.
Consequently,verification of the specified printing properties of solder pa
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Event
IPC APEX EXPO 2004
Optimizing Solder Paste Printing For Wafer Bumping
Recently,wafer bumping using solder paste with very fine solder powder has come into focus as more cost effective than
conventional sputtered or plated methods. This additive method revolves ar
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Event
IPC APEX EXPO 2004
Solder Paste Printing of High Density Substrates using Enhanced Print Technology
The research discussed in this paper uses an innovative enhancement technique for printing High Density substrates. The
technique takes advantage of high frequency low amplitude vibrations appl
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Event
IPC APEX EXPO 2004
Investigating Compliant Tooling Solutions within a Mass Imaging Process
The printing process is always highlighted as contributing the most process defects to a surface mount manufacturing
production facility; typical values presented are around the 60% range. Fact
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Event
IPC APEX EXPO 2004
Squeegee Blades vs. Pump Technology: A Comparison of Solder Paste Print Performance
Enclosed print heads have recently been available to circuit board manufacturers as an alternate technology to conventional
squeegee printing. By design,enclosed print heads offer several advan
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Event
IPC APEX EXPO 2004
A New Non-Halogen Flame-Retardant System for Printed Wiring Boards
There is continued interest in utilizing alternatives to bromine-based flame retardants for printed wiring boards. As a result,a
wide variety of phosphorus and non-phosphorus systems have been
.. read more
Event
IPC APEX EXPO 2004
New Materials for HDI Interconnect Applications
A study was conduced to see if faster laser ablation rates,improved fracture resistance and better copper adhesion
after electroless plating could be engineered into existing Resin Coated Foils
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Event
IPC APEX EXPO 2004
High Phosphorous Electroless Nickel Process for Mobile Phone PWBs
An Electroless Nickel and Immersion Gold (ENIG) plating process with a middle phosphorous content nickel layer is
currently a mainstream final finishing application for mobile phone Printed Wir
.. read more
Event
IPC APEX EXPO 2004
Next Generation Organic Solderability Preservatives (OSP) for Lead-free soldering and Mixed Metal Finish PWB’s and BGA Substrates
With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly
becoming more critical,fabricators and OEM’s must determine the mo
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Event
IPC APEX EXPO 2004
Phosphorus in Electroless Nickel Layers – Curse or Blessing?
The influence of co-deposited Phosphorous (P) (from low to high P) within an electroless Nickel layer,regarding the
reliability of the solder joint integrity was investigated. The solder joint
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Event
IPC APEX EXPO 2004
The Chemistry and Properties of a Newly Developed Immersion Silver Coating for PWB
To meet the emerging requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating
from hot-air-leveled SnPb solder to alternative final finishes. A thin
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Event
IPC APEX EXPO 2004
Implementation of Immersion Silver PCB Surface Finish In Compliance With Underwriters Laboratories
At times,the electronics industry changes faster than the testing and regulatory groups serving the industry. In this case,the
electronics supply chain thoroughly evaluated the new printed circ
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Event
IPC APEX EXPO 2004
Lead and Lead-free Solder Project LCIA Characterization Methods
This paper describes the life-cycle impact assessment methodology developed by the University of Tennessee to calculate
the impacts resulting from the use of lead and lead-free solders during t
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Event
IPC APEX EXPO 2004
End-of-Life Management of Electronics Products Through Functional Signature Analysis
This paper presents a functional signature analysis method for the end-of-life management of products,particularly for
electrical-electronics and electromechanical applications.
Due to the fast
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Event
IPC APEX EXPO 2004
Introduction to Microvia Design
Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and
conditions that designers needs to consider to introduce microvias t
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Event
IPC APEX EXPO 2004
CAD Toolsets: Today,Tomorrow and Over the Horizon
One of the most enabling product industries in the world today is Computer Automated Design (CAD). Can you imagine how
far technology would have progressed if not for the automation of computer
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Event
IPC APEX EXPO 2004
PCB Design Using the Metric System
There are many ways of specifying units for many different measurements,and over the years they have developed a life of
their own. For example,length was once measured with glorious imprecisio
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Event
IPC APEX EXPO 2004
The CAD Library of the Future
The electronics industry is constantly growing and introducing new technology sometimes faster than we can keep up with. This
paper reviews one of the single most important,but sometimes overlo
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Event
IPC APEX EXPO 2004
VIGOR European Project New Industrial Applications in 3-D Interconnection
The 3-D interconnection and packaging emerged from the last decade. Today,the 3-D interconnection technologies are
becoming mature and their reliability assessed. 3-D technology constitutes the
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Event
IPC APEX EXPO 2004
Liquid Solders for High Temperature Solder Joints
This paper presents a new joining technology for high-temperature application of solder joints,based on the results of the
joint research project "TLSD". By the use of temporary liquid solder j
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Event
IPC APEX EXPO 2004
Using High Volume Electronics Manufacturing Technology to Develop a High Volume Fuel Cell Manufacturing Process
During the last several years there has been and continues to be an enormous investment by both governments and industry in
the development and manufacture of fuel cells. The United States,Japa
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Event
IPC APEX EXPO 2004
Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces
The underfill process has become common practice in the assembly of flip chip and CSP devices and the practice of area
array assembly has been adopted by many board designers and component asse
.. read more
Event
IPC APEX EXPO 2004
Wafer Applied Underfill: Flip Chip Assembly and Reliability
Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller,lighter,
and less expensive packages,and flip chip is an important enabling te
.. read more
Event
IPC APEX EXPO 2004
Influence of Flux and Powder Morphology on Void Formation in Silicon Wafer Bumping
Use of solder paste as a material to bump silicon wafers for interconnection to other level of package interconnection is a
simple and cost effective process. However,the material properties of
.. read more
Event
IPC APEX EXPO 2004
Flip Chip Connections Using Bumps,Wells,and Imprinting
A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and
wells filled with solder paste are provided on a flexible substrate serv
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Event
IPC APEX EXPO 2004
Stencil Design and Performance for Flip Chip/Wafer Bumping
There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted
using a stencil aperture that is larger than the wafer pad. This perm
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Event
IPC APEX EXPO 2004