Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Eu Rohs Recast – Are You Ready?
Since the European Union (EU) first published the Restriction on the use of Certain Hazardous Substances in electrical and electronic equipment directive (RoHS) in 2003,the document required up
.. read more
Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. read more
The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. read more
An Analytical Characterization and Comparison of Adhesion Test for PCBs
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes which severely stress the mecha
.. read more
Simple Tools for Managing Engineering,Purchasing and Assembly Data
As the assembly of electronic products becomes more automated the collection,storage and retrieval of electronic data demands additional software tools to manage data. The wide spread use of we
.. read more
Dynamic LEAN Shop Floor SMT Material Control Starting ONLY What You Can Finish
In high mix (250+ Assemblies) environments,ensuring small batches are delivered in a timely yet flexible manner without large levels of safety stock and WIP requires the very best of LEAN Manuf
.. read more
Low dk Thermoplastic Substrate for Broadband Antennas
In high frequency circuit boards PTFE is widely used as a substrate material. It offers very low dielectric constant and low losses. However,it is relatively expensive to fabricate,making the c
.. read more
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Polyphenylene Ether Macromonomer. Viii. Low Z-Axis Cte,Low Df Epoxy Laminates
Properties of printed circuit board laminates are a function of the type and levels of its components. Endeavors to a balance various performance criteria involve balancing the types and amount
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Seventh Report: Mixed Metallurgy Solder Joint Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are
.. read more
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing
High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur
.. read more
Embedded Components: A Comparative Analysis of Reliability
In light of new process and product technologies in the field of embedded components,questions arise with respect to
advantages and potential disadvantages to standard SMT component placement w
.. read more
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more
The Enigmatic Breakout Angle
We describe a coupon design that makes available,in an elegant and efficient way,information unattainable even from multiple-coupon vertical cross-sections. The new design allows quantitative d
.. read more
Nano Technology Improve Critical Printing Process
The challenges of successful solder printing in the High Volume / Low Mix cell phone environment,which is linked with the continuing trend to miniaturize electronic assemblies,requires a new ap
.. read more
Evaluation of Lead Free Solder Paste Materials for PCBA
Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical
.. read more
A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation,Collaboration,and Cloud Computing
In electronics design,Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet,a part has a third view,whic
.. read more
Quantitative Evaluation of New SMT Stencil Materials
High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase,so do the challenges of maintaining a successfu
.. read more
Sculpted Flex Circuits as an Electronics Packaging Solution
Sculpted Flex Circuits are a very cost effective,low profile termination solution that is not very well known. These Flex Circuit hybrids can provide the user a simple interconnection between c
.. read more
Weigh/Bake/Weigh Testing To Determine Moisture Content in Printed Boards
Entrapped moisture within printed boards can expand during soldering operations,causing delamination or other damage. Available methods for determining moisture content may be destructive
or no
.. read more
HDI Training & Implementation at Eagle Test Systems
Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m
.. read more
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies,generating much concern. A head-in-pillow defect is the in
.. read more
Void or Not to Void
- Background: What is a void?
- What is a "macro" void?
- What is a “planar” void?
- What is a “shrinkage” void?
- What is a “microvia” void?
- What is a “pinhole” void?
- What is a “Kirkendall
.. read more
Drop Testing of a Pb-Free Board after Assembly and SnPb-Rework
•Board-level drop shock test was performed on 9 assemblies
–63 parts / board
–Parts representative of military package styles
•Assembled on Pb-free compatible laminate with SAC 305 solder
•Sele
.. read more
Management and Mitigation of Tin Whiskers for Lead-Free Electronics
The lead-free directive from the EU has created a number of challenges for high reliability electronic applications. Key among those challenges is the need to address the issue of tin whiskers.
.. read more
Improving Tin Whisker Testing through Quantitative Measurements of Plated Film Properties
- Correlating film properties to the propensity to whisker will lead to the development of a comprehensive whisker growth model and create successful mitigation strategies.
•Hillock and whisker
.. read more
Leveraging IPC 1752 for Product Lifecycle Analytics
- Regulations are driving increasing IPC-1752 use
- More restricted substances and product categories in scope
- The business challenge is much bigger than “regulatory compliance”
- Teams incre
.. read more
Reliability and Quality Planning in the Product Development Cycle
In globally competitive markets,managing product quality,reliability and risk is not an option. However,it also brings its own unique set of challenges to complex organizations:
- Product desig
.. read more
Eu Rohs Recast – Are You Ready?
Since the European Union (EU) first published the Restriction on the use of Certain Hazardous Substances in electrical and electronic equipment directive (RoHS) in 2003,the document required up
.. read more
Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. read more
The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. read more
An Analytical Characterization and Comparison of Adhesion Test for PCBs
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes which severely stress the mecha
.. read more
Simple Tools for Managing Engineering,Purchasing and Assembly Data
As the assembly of electronic products becomes more automated the collection,storage and retrieval of electronic data demands additional software tools to manage data. The wide spread use of we
.. read more
Dynamic LEAN Shop Floor SMT Material Control Starting ONLY What You Can Finish
In high mix (250+ Assemblies) environments,ensuring small batches are delivered in a timely yet flexible manner without large levels of safety stock and WIP requires the very best of LEAN Manuf
.. read more
Low dk Thermoplastic Substrate for Broadband Antennas
In high frequency circuit boards PTFE is widely used as a substrate material. It offers very low dielectric constant and low losses. However,it is relatively expensive to fabricate,making the c
.. read more
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Polyphenylene Ether Macromonomer. Viii. Low Z-Axis Cte,Low Df Epoxy Laminates
Properties of printed circuit board laminates are a function of the type and levels of its components. Endeavors to a balance various performance criteria involve balancing the types and amount
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Seventh Report: Mixed Metallurgy Solder Joint Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are
.. read more
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing
High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur
.. read more
Embedded Components: A Comparative Analysis of Reliability
In light of new process and product technologies in the field of embedded components,questions arise with respect to
advantages and potential disadvantages to standard SMT component placement w
.. read more
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more
The Enigmatic Breakout Angle
We describe a coupon design that makes available,in an elegant and efficient way,information unattainable even from multiple-coupon vertical cross-sections. The new design allows quantitative d
.. read more
Nano Technology Improve Critical Printing Process
The challenges of successful solder printing in the High Volume / Low Mix cell phone environment,which is linked with the continuing trend to miniaturize electronic assemblies,requires a new ap
.. read more
Evaluation of Lead Free Solder Paste Materials for PCBA
Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical
.. read more
A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation,Collaboration,and Cloud Computing
In electronics design,Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet,a part has a third view,whic
.. read more
Quantitative Evaluation of New SMT Stencil Materials
High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase,so do the challenges of maintaining a successfu
.. read more
Sculpted Flex Circuits as an Electronics Packaging Solution
Sculpted Flex Circuits are a very cost effective,low profile termination solution that is not very well known. These Flex Circuit hybrids can provide the user a simple interconnection between c
.. read more
Weigh/Bake/Weigh Testing To Determine Moisture Content in Printed Boards
Entrapped moisture within printed boards can expand during soldering operations,causing delamination or other damage. Available methods for determining moisture content may be destructive
or no
.. read more
HDI Training & Implementation at Eagle Test Systems
Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m
.. read more
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies,generating much concern. A head-in-pillow defect is the in
.. read more
Void or Not to Void
- Background: What is a void?
- What is a "macro" void?
- What is a “planar” void?
- What is a “shrinkage” void?
- What is a “microvia” void?
- What is a “pinhole” void?
- What is a “Kirkendall
.. read more
Drop Testing of a Pb-Free Board after Assembly and SnPb-Rework
•Board-level drop shock test was performed on 9 assemblies
–63 parts / board
–Parts representative of military package styles
•Assembled on Pb-free compatible laminate with SAC 305 solder
•Sele
.. read more
Management and Mitigation of Tin Whiskers for Lead-Free Electronics
The lead-free directive from the EU has created a number of challenges for high reliability electronic applications. Key among those challenges is the need to address the issue of tin whiskers.
.. read more
Improving Tin Whisker Testing through Quantitative Measurements of Plated Film Properties
- Correlating film properties to the propensity to whisker will lead to the development of a comprehensive whisker growth model and create successful mitigation strategies.
•Hillock and whisker
.. read more
Leveraging IPC 1752 for Product Lifecycle Analytics
- Regulations are driving increasing IPC-1752 use
- More restricted substances and product categories in scope
- The business challenge is much bigger than “regulatory compliance”
- Teams incre
.. read more
Reliability and Quality Planning in the Product Development Cycle
In globally competitive markets,managing product quality,reliability and risk is not an option. However,it also brings its own unique set of challenges to complex organizations:
- Product desig
.. read more