Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Stretchable Hybrid Electronics (S.H.E.) Constructions Based on a Novel Thermosetting Polymer System
This presentation covers Stretchable hybrid electronics. Stretchable electronics have the most industry uses in wearable technology and for mobile sensing and response devices. T
.. read more
Next-Generation Additive Electronics -Precise Multi-Material Deposition for Circuits, Electro-Mechanical Parts and Antennas
This presentation covers additive manufacturing and the direct deposit of multiple metals. This additive capability is best utilized for the production of complicated circuits such as
.. read more
Additive Manufacturing of a Heat Exchanger for a Radar System
The defense industry has realized the importance of Additive Manufacturing (AM) and how this technology can be utilized where parts can be fabricated inexpensively with reduction in lead tim
.. read more
The Effects of Filler Morphology on The Fracture Toughness of Thermally Conductive Adhesives
Thermally conductive adhesives are widely implemented in a variety of electronic assemblies. These adhesives combine the function of mechanical fasteners and thermal interface materials into
.. read more
Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies
The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one pro
.. read more
High and Matched Refractive Index Liquid Adhesives for Optical Device Assembly
There is an increase in the number of optical sensors and cameras being integrated into electronics devices. These go beyond cell phone cameras into automotive sensors, wearables, and other
.. read more
Optimising Solder Paste Volume for Low Temperature Reflow of BGA Packages
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower proc
.. read more
Low Temperature SMT Solder Evaluation
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional
.. read more
Developments in Electroless Copper Processes to Improve Performance in am SAPMobile Applications
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnec
.. read more
Semi-Additive Process (SAP) Utilizing Very Uniform Ultrathin Copper by A Novel Catalyst
The demand for miniaturization and higher density electronic products has continued steadily for years and this trend is expected to continue, according to various semiconductor techno
.. read more
Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wire bond pads when
.. read more
Development and Classification of Conductive Circuitry for E-textiles
This paper examines the development and classification of flexible and stretchable conductive pathways to carry power and data and details the technical challenges as well as the methodologi
.. read more
Bladder Inflation Method for Mechanical Testing of Stretchable Electronics and Wearable Devices
The advent of electronic materials with the potential to undergo extreme deformation while maintaining conductivity has led to the development of advanced stretchable electronic systems. The
.. read more
Additive Manufacturing for Next Generation Microwave Electronics and Antennas
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkj
.. read more
Insertion Loss Performance Differences Due to Plated Finish and Different Circuit Structures
Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss is generally dependent upo
.. read more
A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Robust Solder Joints and Better Reliability of Electronic Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to brittle solder joints failures. Due to these reasons, there are field failures and reliabi
.. read more
Surface Treatment Enabling Low Temperature Soldering to Aluminum
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular
.. read more
Approaching FCT with Low-Cost Modular and Fully Integrated Test Fixtures
Constant increases in feature density of printed circuit board assemblies (PCBA) has highlighted the importance of functional circuit test (FCT) systems in a manufacturing process. Automated
.. read more
The Next RF Probing Challenge: IoT and 5G
IoT and 5G applications have theirchallenges when it comes to functional testing –especially for the probing part inside a functional test fixture(hereinafter referred to as “FCT” fixture).I
.. read more
Creating Reusable Manufacturing Tests for High-Speed I/O with Synthetic Instruments
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second(Gbps) to several hundred Gbps. While manufacturing te
.. read more
Copper Filled Microvias - The New Hidden Threat Links of Faith Are Not Created Equally
Microvias connect adjacent copper layers to complete electrical paths. Copper-filled microvias can be stacked to form connections beyond adjacent copper layers. Staggered microvias stitch ad
.. read more
Impact of Assembly Cycles on Copper Wrap Plating
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predic
.. read more
Smart Molded Structures Bring Surfaces to Life
This paper introduces structural electronics technology enabling smart molded structures. It also presents a case for developing industry standards specific to structural electronics materia
.. read more
Development of Flexible Hybrid Electronics
Flexible hybrid electronics (FHE) refer to a category of flexible electronics that are made through a combination of traditional assembly process of electronic components with the high-preci
.. read more
Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics for Brain-Machine Interfaces
Inherent variation among human brains causes difficulty in the design of electroencephalography (EEG)-enabled universal brain-machine interfaces (BMI). Existing EEG systems suffer from incon
.. read more
Low Temperature Soldering: Thermal Cycling Reliability Performance
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu
.. read more
New-Generation, Low-TemperatureLead-Free Solder for SMT Assembly
Sn3Ag0.5Cu (SAC305)is the major solder alloy after RoHS was adopted by the European Union. Since its melting temperature is relatively higher than eutectic SnPb alloy, the peak reflow temper
.. read more
PCB Manufacturing for Electronics Megatrends
The world as we know it is changing. Electronic megatrends are impacting the world and rapidly changing the way we experience day-to-day life. The imminent 5Gwireless infrastructure will be
.. read more
Assembly Challenges of Die and Die-Size BGAs
This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level
.. read more
Board Level Reliability Testing of RF Packages
Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a suppli
.. read more
Stretchable Hybrid Electronics (S.H.E.) Constructions Based on a Novel Thermosetting Polymer System
This presentation covers Stretchable hybrid electronics. Stretchable electronics have the most industry uses in wearable technology and for mobile sensing and response devices. T
.. read more
Next-Generation Additive Electronics -Precise Multi-Material Deposition for Circuits, Electro-Mechanical Parts and Antennas
This presentation covers additive manufacturing and the direct deposit of multiple metals. This additive capability is best utilized for the production of complicated circuits such as
.. read more
Additive Manufacturing of a Heat Exchanger for a Radar System
The defense industry has realized the importance of Additive Manufacturing (AM) and how this technology can be utilized where parts can be fabricated inexpensively with reduction in lead tim
.. read more
The Effects of Filler Morphology on The Fracture Toughness of Thermally Conductive Adhesives
Thermally conductive adhesives are widely implemented in a variety of electronic assemblies. These adhesives combine the function of mechanical fasteners and thermal interface materials into
.. read more
Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies
The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one pro
.. read more
High and Matched Refractive Index Liquid Adhesives for Optical Device Assembly
There is an increase in the number of optical sensors and cameras being integrated into electronics devices. These go beyond cell phone cameras into automotive sensors, wearables, and other
.. read more
Optimising Solder Paste Volume for Low Temperature Reflow of BGA Packages
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower proc
.. read more
Low Temperature SMT Solder Evaluation
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional
.. read more
Developments in Electroless Copper Processes to Improve Performance in am SAPMobile Applications
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnec
.. read more
Semi-Additive Process (SAP) Utilizing Very Uniform Ultrathin Copper by A Novel Catalyst
The demand for miniaturization and higher density electronic products has continued steadily for years and this trend is expected to continue, according to various semiconductor techno
.. read more
Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wire bond pads when
.. read more
Development and Classification of Conductive Circuitry for E-textiles
This paper examines the development and classification of flexible and stretchable conductive pathways to carry power and data and details the technical challenges as well as the methodologi
.. read more
Bladder Inflation Method for Mechanical Testing of Stretchable Electronics and Wearable Devices
The advent of electronic materials with the potential to undergo extreme deformation while maintaining conductivity has led to the development of advanced stretchable electronic systems. The
.. read more
Additive Manufacturing for Next Generation Microwave Electronics and Antennas
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkj
.. read more
Insertion Loss Performance Differences Due to Plated Finish and Different Circuit Structures
Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss is generally dependent upo
.. read more
A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Robust Solder Joints and Better Reliability of Electronic Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to brittle solder joints failures. Due to these reasons, there are field failures and reliabi
.. read more
Surface Treatment Enabling Low Temperature Soldering to Aluminum
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular
.. read more
Approaching FCT with Low-Cost Modular and Fully Integrated Test Fixtures
Constant increases in feature density of printed circuit board assemblies (PCBA) has highlighted the importance of functional circuit test (FCT) systems in a manufacturing process. Automated
.. read more
The Next RF Probing Challenge: IoT and 5G
IoT and 5G applications have theirchallenges when it comes to functional testing –especially for the probing part inside a functional test fixture(hereinafter referred to as “FCT” fixture).I
.. read more
Creating Reusable Manufacturing Tests for High-Speed I/O with Synthetic Instruments
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second(Gbps) to several hundred Gbps. While manufacturing te
.. read more
Copper Filled Microvias - The New Hidden Threat Links of Faith Are Not Created Equally
Microvias connect adjacent copper layers to complete electrical paths. Copper-filled microvias can be stacked to form connections beyond adjacent copper layers. Staggered microvias stitch ad
.. read more
Impact of Assembly Cycles on Copper Wrap Plating
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predic
.. read more
Smart Molded Structures Bring Surfaces to Life
This paper introduces structural electronics technology enabling smart molded structures. It also presents a case for developing industry standards specific to structural electronics materia
.. read more
Development of Flexible Hybrid Electronics
Flexible hybrid electronics (FHE) refer to a category of flexible electronics that are made through a combination of traditional assembly process of electronic components with the high-preci
.. read more
Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics for Brain-Machine Interfaces
Inherent variation among human brains causes difficulty in the design of electroencephalography (EEG)-enabled universal brain-machine interfaces (BMI). Existing EEG systems suffer from incon
.. read more
Low Temperature Soldering: Thermal Cycling Reliability Performance
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu
.. read more
New-Generation, Low-TemperatureLead-Free Solder for SMT Assembly
Sn3Ag0.5Cu (SAC305)is the major solder alloy after RoHS was adopted by the European Union. Since its melting temperature is relatively higher than eutectic SnPb alloy, the peak reflow temper
.. read more
PCB Manufacturing for Electronics Megatrends
The world as we know it is changing. Electronic megatrends are impacting the world and rapidly changing the way we experience day-to-day life. The imminent 5Gwireless infrastructure will be
.. read more
Assembly Challenges of Die and Die-Size BGAs
This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level
.. read more
Board Level Reliability Testing of RF Packages
Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a suppli
.. read more