Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Investigating the Metric 0201 Assembly Process
The advance in technology and its relentless develop mentis delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst r
.. read more
Balancing Air Assisted Atomization for Improved Conformal Coating Quality
Polymer coating materials protect electronics from harsh environments, assuring safe and reliable performance. To reach the highest level of reliability, coatings must be selectively applied
.. read more
Automated Conformal Coating of Circuit Card Assemblies Using Polyurethane Material
The development of an automated circuit card assembly(CCA)conformal coating process using a low outgassing polyurethane material was essential for meeting the increase in customer demand fro
.. read more
High Performance Light and Moisture Dual Curable Automotive Conformal Coating
Light-curable materials can provide significant benefits over conventional technologies, including lower operating costs driven by lower labor needs, space savings, lower energy demand, and
.. read more
Future of “Substances and Materials in Products ”Data Exchange Formats as Standards
To support regulations on hazardous substances in materials and in products like the automotive EU End of Life Vehicle (ELV) directive, the Electronics and Electrical Equipment Restriction o
.. read more
Endocrine Disrupting Chemicals and Bioaccumulative Substances –The Next Wave of Regulated Substances in Electronics
Until recently, virtually all restricted materials in electronics were classified as either carcinogens (e.g. Pb) or reproductive toxins (e.g. phthalates). Two new categories of restricted m
.. read more
High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)
The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu
.. read more
Moisture Effects on the High Frequency Testing of Laminates
Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high fre
.. read more
Tolerance Mistaken: Impacts of not properly addressing material, industry standards and assembly process limitations
As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes.
.. read more
Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance
This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"&n
.. read more
The Importance of Non-Destructive Bare Board Inspection –Preventing Failure Before You Start Work
The operation and reliability of any electronic assembly is very dependent on the performance, quality and consistency of the bare printed circuit board (PCB). Without good quality bare boar
.. read more
Analyzing a Printed Circuit Board with Oxide Residue
A number of similar Printed Wiring Assemblies (PWAs) had been subjected to final electrical tests on automated test equipment when a common test failure was recognized. All PWAs were failing
.. read more
Outgassing Behaviour of SMT Flux Residue During Reflow Soldering
SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can
.. read more
How to Manage Material Outgassing in Reflow Oven
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-pa
.. read more
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new
.. read more
Designing a High Performance Electroless Nickel and Immersion Gold to Maximize Highest Reliability
The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with referen
.. read more
Multilayered Flexible Hybrid Screen Printed Circuits on Disposable Medical Grade Substrates
This paper details the realization of a multi-layered, printed, conformable hybrid circuit. The circuit was created using silver(Ag) flake ink as a conductive layer and UV acrylic-based ink
.. read more
Printed Electronics for Medical Devices
As is the case with many other markets where faster, highly capable technologies have resulted in more intelligent processes and products, the medical device sector is also undergoing a “sma
.. read more
Fabric Weaving and Circuit Orientations Impact for Skew / Signal Integrity
This Presentation discusses Improvements for signal integrity. Signal integrity is based on the copper surface roughness, the oxides on the copper, and the Dielectric constant of the D
.. read more
Innovations for future RF designs
This Slide show presents RF Cap Layers to normal FR4 Dielectric materials. This material can be used in multiple configurations including Single sided, Double sided, and Hybrid.&n
.. read more
Higher Defluxing Temperature and Low Standoff Component Cleaning-A Connection?
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remai
.. read more
Methodology for Developing Cleaning Process Parameters
Electronic assembly processes range from simple to complex and involve a wide range of materials to produce. Each step in the process and each assembly material used will have some impact on
.. read more
IPC-J-STD-001 Rev G, Amendment 1, Section 8 Cleanliness SectionSIR Test Method for Developing Objective Evidence for the Production Assembly
Since the 1970s, ROSE testing was used to determine “clean enough.” In 2015, the J-STD-001 committee assigned a team to develop the next generation of “cleanliness” requirements. Section 8 d
.. read more
Oxidation Resistant Nano-Cu Sintering Paste for Die Attach Applications
A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance. T
.. read more
Fluxes Suppressing Non-Wet-Open at BGA Assembly
With the advancement in miniaturization, the die is getting thinner and the solder balls are getting smaller for BGAs. Consequently, the thermal warpage is getting more severe due to the mis
.. read more
Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is “when we should switch from Ty
.. read more
Interconnect Reliability Correlation with System Design and Transportation Stress
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping c
.. read more
Multiphysics Design for Thermal Management to Increase Radar Capabilities
Increased demand for radar capabilities has required increasingly more efficient thermal management techniques. Simple cold plates using tubes or channels are frequently used to cool high po
.. read more
Realization of a New Concept for Power Chip Embedding
Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top
.. read more
Investigating the Metric 0201 Assembly Process
The advance in technology and its relentless develop mentis delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst r
.. read more
Balancing Air Assisted Atomization for Improved Conformal Coating Quality
Polymer coating materials protect electronics from harsh environments, assuring safe and reliable performance. To reach the highest level of reliability, coatings must be selectively applied
.. read more
Automated Conformal Coating of Circuit Card Assemblies Using Polyurethane Material
The development of an automated circuit card assembly(CCA)conformal coating process using a low outgassing polyurethane material was essential for meeting the increase in customer demand fro
.. read more
High Performance Light and Moisture Dual Curable Automotive Conformal Coating
Light-curable materials can provide significant benefits over conventional technologies, including lower operating costs driven by lower labor needs, space savings, lower energy demand, and
.. read more
Future of “Substances and Materials in Products ”Data Exchange Formats as Standards
To support regulations on hazardous substances in materials and in products like the automotive EU End of Life Vehicle (ELV) directive, the Electronics and Electrical Equipment Restriction o
.. read more
Endocrine Disrupting Chemicals and Bioaccumulative Substances –The Next Wave of Regulated Substances in Electronics
Until recently, virtually all restricted materials in electronics were classified as either carcinogens (e.g. Pb) or reproductive toxins (e.g. phthalates). Two new categories of restricted m
.. read more
High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)
The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu
.. read more
Moisture Effects on the High Frequency Testing of Laminates
Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high fre
.. read more
Tolerance Mistaken: Impacts of not properly addressing material, industry standards and assembly process limitations
As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes.
.. read more
Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance
This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"&n
.. read more
The Importance of Non-Destructive Bare Board Inspection –Preventing Failure Before You Start Work
The operation and reliability of any electronic assembly is very dependent on the performance, quality and consistency of the bare printed circuit board (PCB). Without good quality bare boar
.. read more
Analyzing a Printed Circuit Board with Oxide Residue
A number of similar Printed Wiring Assemblies (PWAs) had been subjected to final electrical tests on automated test equipment when a common test failure was recognized. All PWAs were failing
.. read more
Outgassing Behaviour of SMT Flux Residue During Reflow Soldering
SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can
.. read more
How to Manage Material Outgassing in Reflow Oven
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-pa
.. read more
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new
.. read more
Designing a High Performance Electroless Nickel and Immersion Gold to Maximize Highest Reliability
The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with referen
.. read more
Multilayered Flexible Hybrid Screen Printed Circuits on Disposable Medical Grade Substrates
This paper details the realization of a multi-layered, printed, conformable hybrid circuit. The circuit was created using silver(Ag) flake ink as a conductive layer and UV acrylic-based ink
.. read more
Printed Electronics for Medical Devices
As is the case with many other markets where faster, highly capable technologies have resulted in more intelligent processes and products, the medical device sector is also undergoing a “sma
.. read more
Fabric Weaving and Circuit Orientations Impact for Skew / Signal Integrity
This Presentation discusses Improvements for signal integrity. Signal integrity is based on the copper surface roughness, the oxides on the copper, and the Dielectric constant of the D
.. read more
Innovations for future RF designs
This Slide show presents RF Cap Layers to normal FR4 Dielectric materials. This material can be used in multiple configurations including Single sided, Double sided, and Hybrid.&n
.. read more
Higher Defluxing Temperature and Low Standoff Component Cleaning-A Connection?
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remai
.. read more
Methodology for Developing Cleaning Process Parameters
Electronic assembly processes range from simple to complex and involve a wide range of materials to produce. Each step in the process and each assembly material used will have some impact on
.. read more
IPC-J-STD-001 Rev G, Amendment 1, Section 8 Cleanliness SectionSIR Test Method for Developing Objective Evidence for the Production Assembly
Since the 1970s, ROSE testing was used to determine “clean enough.” In 2015, the J-STD-001 committee assigned a team to develop the next generation of “cleanliness” requirements. Section 8 d
.. read more
Oxidation Resistant Nano-Cu Sintering Paste for Die Attach Applications
A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance. T
.. read more
Fluxes Suppressing Non-Wet-Open at BGA Assembly
With the advancement in miniaturization, the die is getting thinner and the solder balls are getting smaller for BGAs. Consequently, the thermal warpage is getting more severe due to the mis
.. read more
Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is “when we should switch from Ty
.. read more
Interconnect Reliability Correlation with System Design and Transportation Stress
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping c
.. read more
Multiphysics Design for Thermal Management to Increase Radar Capabilities
Increased demand for radar capabilities has required increasingly more efficient thermal management techniques. Simple cold plates using tubes or channels are frequently used to cool high po
.. read more
Realization of a New Concept for Power Chip Embedding
Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top
.. read more