Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Reliability and Failure Analysis of Lead-Free Solder Joints
This paper provides a comparison of the air-to-air thermal cyclic reliability and associated failure modes of second level interconnects in lead-free,1.27 mm pitch,256 I/O BGA devices with eute
.. read more
Accelerating Plating Cycles and Reducing Costs: Improving the Plating of High Aspect Ratio Holes & Blind Vias
This paper describes a new technology for speeding the initiation and uniformity of electroplating deposits that does
not depend on modifying the chemistry or physical environment of the platin
.. read more
Advanced Laminate and Prepreg for PWBs with Embedded Components
The technology for embedding components in PWBs will change the process how PWB are fabricated over the next
few years. At the present time,polymer thick film is the most frequently used materi
.. read more
The Advanced NiAu-Process for Second Image Technology
Designs of new electronic products show a significant drive for smaller and more complex PWBs. This continuing trend of miniaturization affects components in the same way as for the connecting
.. read more
Beyond Periodic Pulse Reverse
According to Michael Shernerof of Scientific American (Jan. 2002) technology has advanced more in the past one century than in the previous one hundred centuries. Yet it seems from a technical
.. read more
Board Finishes for the EMS Provider
Some new alternative PWB surface finishes have been entering the industry over the past few years. In order for any
new board surface finish to be accepted for general use,it must be approved b
.. read more
Breaking the Information Bottleneck in Printed Circuit Board Engineering Teams: The Promise of New Software Innovation
This paper addresses the challenges of pre-production engineering,why the engineering department is viewed as a
bottleneck in many PCB companies,and how a dedicated software system breaks the i
.. read more
Component Damage from Printed Circuit Board Loading
Electronic components are being used in increasingly more severe shock environments. This combined with an
industry trend of increased component reliability to help reduce electronic system dow
.. read more
Conductive Anodic Filament Growth Failure
With increasing focus on reliability and miniaturized designs,Conductive Anodic Filament (CAF) as failure
mechanism is gaining a lot of attention. Smaller geometries make the printed circuit bo
.. read more
Conductive Anodic Filament Resistant FR-4 Substrates
As the trend to increased interconnection density continues,conductive printed circuit board features become closer and closer together. It is now common to see 3 mil lines and spaces on local
.. read more
Controlled Surface Etching Process for Fine Line/Space Circuits
The design rule of PWBs and substrates for plastic packages is moving towards higher density as semiconductor
chip design evolves into increasingly finer lines. First,it was studied how fine th
.. read more
Cost Effects of Pulse Plating Reversal Current
Direct Current plating in acid copper baths containing organic supplements shows us that during electrolysis,these organic additives are attracted by the copper anode and being adsorbed on its
.. read more
Cost-Effective Laminate Materials Made by Continuous Lamination Using Thermosetting Polymer Alloys (TPA) for Microwave and High Speed Applications
Utilizing continuous lamination techniques,new materials are being developed to meet demanding market
requirements. Laminates produced using Thermosetting Polymer Alloys (TPA) are cost effectiv
.. read more
Defining Accelerated Test Requirements for PWBs: A Physics-Based Approach
Typically thermal cycle test requirements for printed wiring boards (PWBs) are somewhat arbitrarily established for
a particular product. Many programs simply default to a standard test without
.. read more
Design Considerations Affecting the Measured Capacitance of Embedded Singulated Capacitors
The physical placement of embedded singulated capacitors in relation to one another and to other board structures could have an impact on the measured capacitance of individual capacitors. For
.. read more
Developmental Halogen-Free High Performance Dielectric Substrates (with Different Reinforcement Supports) for the PCB/HDI and High-Frequency Applications
This paper presents a comparison of several resin systems on different support reinforcements including on
Thermount®1 (or NWA),E-Glass (or E),and NE-Glass2 (SITM) (or NE). The resin systems co
.. read more
Digital Printing Systems for Printed Circuit Board Legends
The development of digital printing systems for printed circuit board legends (a.k.a. nomenclature,indent or letter
screening) is a major technological leap. Legend marking on printed circuit b
.. read more
Direct Laser Drillable Ultra Thin Copper Foils for Advanced PCB Manufacture
The demand for small packaging for portable electronic equipment and reduced chip form factor with higher interconnect fan-out,is driving printed circuit substrate technology rapidly forward. T
.. read more
Dry Film Resist Stripping from Overplated Lines
The ideal outer layer has a uniform circuit height throughout the board. This is a challenge to produce with pattern
plating,because the plated metal height depends on the current density,which
.. read more
The Effect of Etch Taper,Prepreg and Resin Flow of the Value of the Differential Impedance
Many printed circuit board manufacturers report that the measured value of the differential impedance is a few ohms greater than the calculated value when the substrate is FR4. There may be sev
.. read more
Electrically Mediated Pulse Reverse Copper Plating of Electronic Interconnects without Brighteners/Levelers
This paper describes a process for plating of interconnects for advanced electronic modules. In contrast to traditional
chemical mediation of plating processes,this process is electrically medi
.. read more
Electrochemical Migration Testing Results - Evaluating PWB Design,Manufacturing Process,and Laminate Material Impacts on CAF Resistance
Various requirements have developed for printed wiring boards regarding the minimum spacing between features.
Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out
.. read more
Embedded Ceramic Resistors and Capacitors in PWB-Process and Design
Design and processing of ceramic resistors and capacitors fired onto copper foil and embedded into FR4 circuit
boards are presented and discussed. Evolution of design guidelines and processing
.. read more
Embedded Mezzanine Capacitor Technology for Printed Wiring Boards
A novel technology for embedding discrete capacitors in a mezzanine layer of an HDI PWB was developed and
implemented by Motorola in partnership with its PWB supply chain. The technology is bas
.. read more
Embedded Optical Fiber
The power attenuation of the optical fiber due to bends is investigated for the feasibility of the integration optical
fiber into PCBs.
.. read more
Embedded Passives Technology Implementation in RF Applications
Motorola has developed a suite of technologies for embedding resistors,inductors,and capacitors in HDI printed
wiring boards. This paper describes the technology and presents a case study demon
.. read more
Experimental and Numerical Assessment of Plated Via Reliability
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed
.. read more
An FEA Study of Image Transfer in Printed Wiring Boards
A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the
board. This can lead to difficulties in forming the external circuitry. Typical
.. read more
Full-Wave Electromagnetic Simulation of PWB Structures
Because high performance products are limited in speed by packaging and interconnections,signal integrity analysis
and PWB simulation become nowadays very pressing and key issues. Taking into a
.. read more
HID's Technology Influence on Signal Integrity
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings
some interesting new solutions to age-old signal integrity (SI) concerns,and
.. read more
Reliability and Failure Analysis of Lead-Free Solder Joints
This paper provides a comparison of the air-to-air thermal cyclic reliability and associated failure modes of second level interconnects in lead-free,1.27 mm pitch,256 I/O BGA devices with eute
.. read more
Accelerating Plating Cycles and Reducing Costs: Improving the Plating of High Aspect Ratio Holes & Blind Vias
This paper describes a new technology for speeding the initiation and uniformity of electroplating deposits that does
not depend on modifying the chemistry or physical environment of the platin
.. read more
Advanced Laminate and Prepreg for PWBs with Embedded Components
The technology for embedding components in PWBs will change the process how PWB are fabricated over the next
few years. At the present time,polymer thick film is the most frequently used materi
.. read more
The Advanced NiAu-Process for Second Image Technology
Designs of new electronic products show a significant drive for smaller and more complex PWBs. This continuing trend of miniaturization affects components in the same way as for the connecting
.. read more
Beyond Periodic Pulse Reverse
According to Michael Shernerof of Scientific American (Jan. 2002) technology has advanced more in the past one century than in the previous one hundred centuries. Yet it seems from a technical
.. read more
Board Finishes for the EMS Provider
Some new alternative PWB surface finishes have been entering the industry over the past few years. In order for any
new board surface finish to be accepted for general use,it must be approved b
.. read more
Breaking the Information Bottleneck in Printed Circuit Board Engineering Teams: The Promise of New Software Innovation
This paper addresses the challenges of pre-production engineering,why the engineering department is viewed as a
bottleneck in many PCB companies,and how a dedicated software system breaks the i
.. read more
Component Damage from Printed Circuit Board Loading
Electronic components are being used in increasingly more severe shock environments. This combined with an
industry trend of increased component reliability to help reduce electronic system dow
.. read more
Conductive Anodic Filament Growth Failure
With increasing focus on reliability and miniaturized designs,Conductive Anodic Filament (CAF) as failure
mechanism is gaining a lot of attention. Smaller geometries make the printed circuit bo
.. read more
Conductive Anodic Filament Resistant FR-4 Substrates
As the trend to increased interconnection density continues,conductive printed circuit board features become closer and closer together. It is now common to see 3 mil lines and spaces on local
.. read more
Controlled Surface Etching Process for Fine Line/Space Circuits
The design rule of PWBs and substrates for plastic packages is moving towards higher density as semiconductor
chip design evolves into increasingly finer lines. First,it was studied how fine th
.. read more
Cost Effects of Pulse Plating Reversal Current
Direct Current plating in acid copper baths containing organic supplements shows us that during electrolysis,these organic additives are attracted by the copper anode and being adsorbed on its
.. read more
Cost-Effective Laminate Materials Made by Continuous Lamination Using Thermosetting Polymer Alloys (TPA) for Microwave and High Speed Applications
Utilizing continuous lamination techniques,new materials are being developed to meet demanding market
requirements. Laminates produced using Thermosetting Polymer Alloys (TPA) are cost effectiv
.. read more
Defining Accelerated Test Requirements for PWBs: A Physics-Based Approach
Typically thermal cycle test requirements for printed wiring boards (PWBs) are somewhat arbitrarily established for
a particular product. Many programs simply default to a standard test without
.. read more
Design Considerations Affecting the Measured Capacitance of Embedded Singulated Capacitors
The physical placement of embedded singulated capacitors in relation to one another and to other board structures could have an impact on the measured capacitance of individual capacitors. For
.. read more
Developmental Halogen-Free High Performance Dielectric Substrates (with Different Reinforcement Supports) for the PCB/HDI and High-Frequency Applications
This paper presents a comparison of several resin systems on different support reinforcements including on
Thermount®1 (or NWA),E-Glass (or E),and NE-Glass2 (SITM) (or NE). The resin systems co
.. read more
Digital Printing Systems for Printed Circuit Board Legends
The development of digital printing systems for printed circuit board legends (a.k.a. nomenclature,indent or letter
screening) is a major technological leap. Legend marking on printed circuit b
.. read more
Direct Laser Drillable Ultra Thin Copper Foils for Advanced PCB Manufacture
The demand for small packaging for portable electronic equipment and reduced chip form factor with higher interconnect fan-out,is driving printed circuit substrate technology rapidly forward. T
.. read more
Dry Film Resist Stripping from Overplated Lines
The ideal outer layer has a uniform circuit height throughout the board. This is a challenge to produce with pattern
plating,because the plated metal height depends on the current density,which
.. read more
The Effect of Etch Taper,Prepreg and Resin Flow of the Value of the Differential Impedance
Many printed circuit board manufacturers report that the measured value of the differential impedance is a few ohms greater than the calculated value when the substrate is FR4. There may be sev
.. read more
Electrically Mediated Pulse Reverse Copper Plating of Electronic Interconnects without Brighteners/Levelers
This paper describes a process for plating of interconnects for advanced electronic modules. In contrast to traditional
chemical mediation of plating processes,this process is electrically medi
.. read more
Electrochemical Migration Testing Results - Evaluating PWB Design,Manufacturing Process,and Laminate Material Impacts on CAF Resistance
Various requirements have developed for printed wiring boards regarding the minimum spacing between features.
Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out
.. read more
Embedded Ceramic Resistors and Capacitors in PWB-Process and Design
Design and processing of ceramic resistors and capacitors fired onto copper foil and embedded into FR4 circuit
boards are presented and discussed. Evolution of design guidelines and processing
.. read more
Embedded Mezzanine Capacitor Technology for Printed Wiring Boards
A novel technology for embedding discrete capacitors in a mezzanine layer of an HDI PWB was developed and
implemented by Motorola in partnership with its PWB supply chain. The technology is bas
.. read more
Embedded Optical Fiber
The power attenuation of the optical fiber due to bends is investigated for the feasibility of the integration optical
fiber into PCBs.
.. read more
Embedded Passives Technology Implementation in RF Applications
Motorola has developed a suite of technologies for embedding resistors,inductors,and capacitors in HDI printed
wiring boards. This paper describes the technology and presents a case study demon
.. read more
Experimental and Numerical Assessment of Plated Via Reliability
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed
.. read more
An FEA Study of Image Transfer in Printed Wiring Boards
A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the
board. This can lead to difficulties in forming the external circuitry. Typical
.. read more
Full-Wave Electromagnetic Simulation of PWB Structures
Because high performance products are limited in speed by packaging and interconnections,signal integrity analysis
and PWB simulation become nowadays very pressing and key issues. Taking into a
.. read more
HID's Technology Influence on Signal Integrity
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings
some interesting new solutions to age-old signal integrity (SI) concerns,and
.. read more