Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Environmentally Friendly Low Transmission Loss Base/Multilayer Materials
The frequencies used to communicate and process information have been extended beyond the GHz band to the microwave
band to handle the growing volume of data. Moreover,increasing global interes
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Novel Material having Low Transmission Loss and Low Thermal Expansion designed for High Frequency Multi-layer Printed Circuit Board Applications
A new multi-layer PCB (printed circuit board) having low transmission loss and low thermal expansion that meets up-coming
further high speed and high volume data transmission demands was develo
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Semiconductor Technology ITRS Roadmap
For four decades,the semiconductor industry has distinguished itself by the rapid pace of improvement in its products. The
principal categories of improvement trends are shown in Table 1 with e
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System in Package: Identified Technology Needs from the 2994 iNEMI Roadmap
System in package (SiP) technology has grown significantly in the past several years. It was barely mentioned in the National
Electronics Manufacturing Initiative’s (NEMI’s) 2000 roadmap,but by
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Roadmap to Compliance: The Role of Electronic Data Exchange in Supporting the European Union RoHS and WEEE Directives
The upcoming European Union RoHS and WEEE directives are driving new requirements for the management and exchange
of information,both across the extended electronics manufacturing value chain,a
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Site-Specific Measurement of Cathodic Pulse Shape and Plating Current Density for Optimization of Pulse Plating Lines
Two important aspects concerning optimum performance of a (reverse) pulse plating line are (i) the uniform and correct pulse
shapes anywhere on the PCB and (ii) the uniformity of the plating cu
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The Property Research and Applications of Vertical Pulse Copper Plating
Horizontal and vertical pulse plating have been widely used for panel plating in PCB industry,but rarely used for pattern
plating. This article analyzes and reviews the crystal structure,throwi
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A Performance Simulation Tool for Bipolar Pulsed PCB Plating
The copper plating process is one of the most critical steps in the high end PCB manufacturing process. Although the
deposition inside through holes and blind holes is the key factor for reduci
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Understanding the Impact of Accelerated Temperature Profiles on Lead-Free Soldering
Traditional reflow profiles for lead-free soldering typically require longer processing times due to elevated peak temperatures
and flux activation times defined by solder paste suppliers. Thes
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Maximizing Lead Free Wetting
As lead free assembly is ramping up,wetting of lead free solder pastes is surfacing as the major paste performance tradeoff.
Global efforts to significantly increase lead free wetting chemicall
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Effects of Cooling Slopes in Lead Free Reflow
As more electronic assemblers move to lead free SMT production,concerns are raised over reflow cooling slopes and effects
on solder joints. Due to the higher peak temperatures,cooling slopes ar
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Reliability and Requirement of HDI Blind Hole
Nowadays there are two major ways to achieve the conducting function of HDI Blind Hole One is to employ conducting
metal paste to fill in the blind holes after laser drilling. The other is to f
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New Circuit Formation Technology for High Density PWB
To meet future requirements for PWBs,various technologies of processes,materials and tools of PWBs have been discussed.
Especially important are technologies of circuit formation for high-end P
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Internal Strain Free & Homogeneous Glass Fabrics for High Performance HDI Boards
A recent trend of increasing circuit density,particularly in the areas of plastic packages and multi-layer boards,has resulted in
ceaseless demand of improved mechanical properties for laminate
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20μm Prepreg Substrates for Ultra-Thin Insulated Single-Layer
Recent increasing demand for miniaturization and multi-functionality of electronic devices has lead to higher PWBs circuit
density design,requiring thinner insulation layers,smaller via holes a
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Development of the High Thermal Conduction Laminates for Large Current Board
With the objective of developing high thermal conductive laminates capable of being used as high current-carrying wiring
boards for automotive and industrial applications,we identified the opti
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Japan’s JISSO Technology Roadmaps
Japan has a long history of publishing very important technology roadmaps. Some of the Japanese roadmaps published in the
past are:
JPCA Roadmaps
Report on the Technology Roadmap for Advanced S
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The European Roadmap
A unified European roadmap for PWBs does not exist today. It is also most unlikely that a unified roadmap will available in a
foreseeable future time. However,the EIPC has worked together with
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What makes the IPC Roadmap Unique?
Have you ever been confused after you have read two or three different roadmaps and even though they were supposedly
mapping the same attribute in the same time periods,the numbers in the cells
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Characterization of Acid Copper Plating Solution for Via-Filling
The use of acid copper plating process for via-filling effectively forms interlayer connection in build-up PWBs with
high-density interconnections. However,in the case of copper film deposited
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Improving Printed Circuit Board Plating with Eductor Agitation
This paper will review eductor agitation systems at PWB installations to improve the electroplating of printed circuit boards.
Significant environmental and productivity improvements have been
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'Bridging the Gap’ – Technical Capabilities of a Direct Plate PTH Process
In contrast to electroless copper,direct metallization processes are inherently less expensive to operate,more environmental
friendly,requires less floor space and are more efficient. Among the
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Perspectives on Repaired Lead-Free Solder Joints
The use of lead-free (LF) solders as a replacement for traditional tin-lead (SnPb) solders in military and high reliability
applications has a number of technical challenges unique to the indus
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The Use of SAC Solder and Pb-Free Lead Materials in the Repair Scenario
Much work has been done involving the introduction of RoHS and WEEE Directives across the European Union and the
world. Although the use of Pb is limited in new products and equipment,older Pb-
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Corrosion Factor and Effects of Tin - Zinc Lead-Free Solder on Copper Substrate in Environmental Tests
We coated copper substrate with tin-zinc lead-free solder (Sn-9Zn and Sn-8Zn-3Bi),and then we performed the following
corrosion tests: the salt mist test,the gas corrosion test,and the weatheri
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