Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Solid,Reliable and Planar Microvias Using (Mostly) Conventional Multilayer PCB Technology
Despite the strong increase in demand for high-density circuit boards,very few manufacturers are offering microvia architectures in high volume. Current microvia technologies require significan
.. read more
Microvia PWB's Qualified for Avionics,Microvias Can Enhance PWB Reliability
Laser-drilled microvias are being added to the list of approved technologies for printed wiring boards destined for use in a rapidly increasing number of application types and environments. Mic
.. read more
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. read more
Folded-Flex and Stacked CSP,the 3D Solution for SiP Applications
The multiple die chip-scale package technology (identified as the ?Z™) is a truly innovative,folded-flex stacked packaging technology. The concept has already been proven in a collaborative dev
.. read more
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. read more
Overcoming Technical and Business Issues Associated with System in Package Adoption
In today's world of electronics the keywords are smaller,faster and cheaper. With more and more circuitry going onto existing circuit boards,the designers are searching for ways to contain this
.. read more
Advanced Packaging Using Liquid Crystalline Polymer (LCP) Substrates
Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp
.. read more
The Era of the 3-D System In Package (SIP) will be Ushered in by Japanese Mobile Phones
It is becoming impossible to realize the latest mobile phones and other mobile equipment without Chip Size Packages (CSP) and other high-density semiconductor package technology. At present,the
.. read more
Yield Enhancement in BGA Substrates and Packaging
The growing use of high density interconnect (HDI) substrates in the microelectronics packaging industry has brought along a broad range of yield issues. Many of these issues are associated wit
.. read more
The Evolution of Any Layer IVH Structure PWB
With the advent of digitisation,networking,broadband telecommunication,and miniaturization in electronic set products,electronic devices are essentially required to deliver high electrical and
.. read more
Copper Foil Technology for High-Frequency Applications
Advances in information/communications technology are transforming the Internet from a medium for searching for information into a medium for providing and receiving various types of informatio
.. read more
Material Properties of LCP Film and its Broad Applications in IT-Related Devices
All-aromatic polyester,one of the super engineering plastics,is highly regarded as a base material of electronic circuit for its environmental compatibility,moisture resistance,dimensional stab
.. read more
PTFE based Solutions for the Future of High Speed Digital
A growing need is developing in the high-speed digital arena (backpanels,motherboards,line cards etc) for materials offering sufficient signal integrity for applications up to 10 Gbps. One solu
.. read more
Manufacturing and Reliability Evaluation of a Lead-Free Electronics Network Card
Lead-free manufacturing is becoming an industry initiative for environmental and legislative reasons. Lead-Free processing is rather new to the industry and the development of a successful asse
.. read more
Design of Experiments to Assess the Solderability of Various Printed Wiring Board Finishes
There are two main driving forces that are causing the electronics industry to take a look at alternatives to hot air solder leveling (HASL) as a surface finish for printed wiring boards (PWB).
.. read more
Where Crystal Planes Meet: Contribution to the Understanding of the Tin Whisker Growth Process
The texture of a tin deposit has been described as a key factor influencing whisker growth. Based on X-ray diffraction (XRD) and whisker growth data,this paper intends to show one possible mech
.. read more
Microstructural Evolution and Damage Mechanisms in Pb-Free Solder Joints During Extended -40 Degrees C to 125 Degrees C Thermal Cycles
A comparative study of package-to-board interconnections of a 1.27mm pitch BGA package using two Pb-free alloys and Sn-Pb solder in extended –40 to 125°C thermal cycling is described. The micro
.. read more
Solid,Reliable and Planar Microvias Using (Mostly) Conventional Multilayer PCB Technology
Despite the strong increase in demand for high-density circuit boards,very few manufacturers are offering microvia architectures in high volume. Current microvia technologies require significan
.. read more
Microvia PWB's Qualified for Avionics,Microvias Can Enhance PWB Reliability
Laser-drilled microvias are being added to the list of approved technologies for printed wiring boards destined for use in a rapidly increasing number of application types and environments. Mic
.. read more
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. read more
Folded-Flex and Stacked CSP,the 3D Solution for SiP Applications
The multiple die chip-scale package technology (identified as the ?Z™) is a truly innovative,folded-flex stacked packaging technology. The concept has already been proven in a collaborative dev
.. read more
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. read more
Overcoming Technical and Business Issues Associated with System in Package Adoption
In today's world of electronics the keywords are smaller,faster and cheaper. With more and more circuitry going onto existing circuit boards,the designers are searching for ways to contain this
.. read more
Advanced Packaging Using Liquid Crystalline Polymer (LCP) Substrates
Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp
.. read more
The Era of the 3-D System In Package (SIP) will be Ushered in by Japanese Mobile Phones
It is becoming impossible to realize the latest mobile phones and other mobile equipment without Chip Size Packages (CSP) and other high-density semiconductor package technology. At present,the
.. read more
Yield Enhancement in BGA Substrates and Packaging
The growing use of high density interconnect (HDI) substrates in the microelectronics packaging industry has brought along a broad range of yield issues. Many of these issues are associated wit
.. read more
The Evolution of Any Layer IVH Structure PWB
With the advent of digitisation,networking,broadband telecommunication,and miniaturization in electronic set products,electronic devices are essentially required to deliver high electrical and
.. read more
Copper Foil Technology for High-Frequency Applications
Advances in information/communications technology are transforming the Internet from a medium for searching for information into a medium for providing and receiving various types of informatio
.. read more
Material Properties of LCP Film and its Broad Applications in IT-Related Devices
All-aromatic polyester,one of the super engineering plastics,is highly regarded as a base material of electronic circuit for its environmental compatibility,moisture resistance,dimensional stab
.. read more
PTFE based Solutions for the Future of High Speed Digital
A growing need is developing in the high-speed digital arena (backpanels,motherboards,line cards etc) for materials offering sufficient signal integrity for applications up to 10 Gbps. One solu
.. read more
Manufacturing and Reliability Evaluation of a Lead-Free Electronics Network Card
Lead-free manufacturing is becoming an industry initiative for environmental and legislative reasons. Lead-Free processing is rather new to the industry and the development of a successful asse
.. read more
Design of Experiments to Assess the Solderability of Various Printed Wiring Board Finishes
There are two main driving forces that are causing the electronics industry to take a look at alternatives to hot air solder leveling (HASL) as a surface finish for printed wiring boards (PWB).
.. read more
Where Crystal Planes Meet: Contribution to the Understanding of the Tin Whisker Growth Process
The texture of a tin deposit has been described as a key factor influencing whisker growth. Based on X-ray diffraction (XRD) and whisker growth data,this paper intends to show one possible mech
.. read more
Microstructural Evolution and Damage Mechanisms in Pb-Free Solder Joints During Extended -40 Degrees C to 125 Degrees C Thermal Cycles
A comparative study of package-to-board interconnections of a 1.27mm pitch BGA package using two Pb-free alloys and Sn-Pb solder in extended –40 to 125°C thermal cycling is described. The micro
.. read more