Happy Tuesday from IPC APEX EXPO 2021!

Mar 09, 2021

| By Deanne Janda

Happy Tuesday from IPC APEX EXPO 2021! We hope you enjoyed the cutting-edge content of our professional development courses along with the inspiring keynote delivered by John Mitchell, IPC president and CEO.

John is back to give you the highlights of today’s schedule.

Watch this space for more IPC APEX EXPO news – we have two more keynotes for you to enjoy, another day of professional development courses, technical conference sessions will be underway tomorrow, and you will have chances to win prizes, but only if you register for IPC APEX EXPO 2021!

There is still time to join us for a jam-packed week of professional development courses, cutting-edge technical conference sessions, inspiring keynotes, exciting networking opportunities, as well as new product presentations from more than 200 exhibitors!

REGISTER NOW

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IPC President and CEO John Mitchell announced IPC’s ESG (environmental, social and governance) for Electronics initiative during Monday’s keynote: Industry 2030: The Big Ideas Reshaping Electronics Manufacturing. The new ESG for Electronics Initiative will develop guidance for electronics manufacturers on an industry-specific approach to ESG practices and reporting and to develop aspirational goals that the industry is working together to achieve. To view additional information on IPC’s ESG for Electronics Initiative, including an ESG FAQ and call for steering group participation, go to www.ipc.org/esg-electronics. The recording of this keynote will be available on demand March 15 through June 13, 2021.

Professional Development courses delivered this week will be available to registrants Monday March 15 through June 13, 2021. See a complete list of available courses.

One of Monday’s courses, “Reflow Soldering Process and Influence on Defects,” led by Dr. S. Manian Ramkumar, included live demos to better demonstrate the reflow process for tin-lead and lead-free soldering.

What encourages potential tombstoning? Dale Lee, Plexus Corporation, explained in his professional development course Design for Excellence, Reliability, Assembly, Printed Board Fabrication and mores.

Advice to the Emerging Engineers: “With determination and focused effort, you can go as far as you want to go in this industry.” Bob Neves, Microtek Laboratories, and Don DuPriest, Lockheed Martin, lead the conversation on “Forgotten Tribal Knowledge” with IPC Emerging Engineers. The recording of this session will be available Monday, March 15, through June 13, 2021.

Stay connected at www.ipcapexexpo.org.

IPC’s Highest Honor, the Raymond E. Pritchard Hall of Fame Award, Presented to Karen McConnell, Long-time IPC Volunteer and Mentor

Mar 9, 2021

In recognition and acknowledgement of her extraordinary contributions to IPC and the electronics industry, Karen McConnell, Northrop Grumman, was presented with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO on Tuesday, March 9. IPC’s most prestigious award, the Hall of Fame is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.

McConnell is a senior staff CAD CAM engineer in the engineering environment development and support department at Northrop Grumman Enterprise Services sector in Linthicum, Maryland. Her primary responsibility is developing a common shared EDM library and supporting the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.

An active IPC volunteer and leader for IPC and the electronics industry for more than 30 years, McConnell supports numerous IPC standards development committees, including the Land Pattern Committee, Design for Excellence (DFX) Subcommittee, Generic Requirements for Digital Twin Task Group, CFX Subcommittee, Terms and Definition Committee and Electronics Documentation Committee.

Karen was elected Chairperson of IPC’s Technical Activities Executive Committee (TAEC) in 2020 and serves as Chairperson of the Technical Activities Executive Committee Global Committee. She is also chairperson of the IPC Design Community Leadership team. A recipient of the IPC President’s Award in 2013, McConnell is a strong advocate for new engineers, serving as one of the first mentors in IPC’s Emerging Engineer program.

“Karen’s contributions to IPC are extraordinary,” said John Mitchell, IPC president and CEO. “Her passion for the industry and commitment to the growth of younger engineers moved IPC and the electronics industry forward. We are thrilled to welcome her as the newest recipient of the IPC Hall of Fame award.”

IPC Honors Calumet Electronics Corp. and GM China with Corporate Recognition Awards

Mar 9, 2021

IPC bestowed its highest corporate honors on two IPC member companies, Calumet Electronics Corporation and General Motors (GM) China. During the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2021, the Peter Sarmanian Corporate Recognition Award was presented to Calumet Electronics Corp. and the Stan Plzak Corporate Recognition Award was presented to GM China.

The Peter Samarian Corporate Recognition award, named for a former IPC Board Chairman, recognizes an IPC-member company in the printed board industry (PCB) that has supported IPC through participation in technical and management programs while providing leadership for the industry.

Calumet Electronics is a 100% “Made in America” PCB manufacturer that is actively engaged in reskilling its workforce for advanced manufacturing technologies. The company was an early participant in the administration’s “Pledge to America’s Workers,” which calls on companies and trade groups to expand skilled workforce programs. Calumet joined IPC and others as representatives of the industry invited to the White House to explain our workforce initiatives.

And, Calumet takes pride in an educated workforce. Approximately 22% of their staff have earned either a Certified IPC Specialist or Certified IPC Trainer credential under the IPC-A-600 certification program.

Named for former IPC Board Chairman and founding member of the IPC Electronics Manufacturing Services Industry Management Council, the IPC Stan Plzak Corporate Recognition Award honors an IPC-member company in the electronics assembly industry (EMS) that actively contributes to the industry while supporting IPC technical and/or management programs.

Since 2016, GM China has worked closely with IPC to help train and certify GM China and joint ventures’ teams on auto-related standards, using IPC standards for electrical assembly, product design, and the manufacturing process.

GM China also supports the update of IPC standards through seminars and best practice workshops, hosting more than 200 suppliers and 1,000 attendees to learn how to utilize IPC standards to improve quality performance.

“We are privileged to have Calumet Electronics. and GM China as members of IPC,” said John Mitchell, IPC president and CEO. “We benefit tremendously from their leadership, knowledge and expertise. Their involvement in IPC has directly contributed to IPC’s global growth in the electronics industry.”

IPC Holds Board Election at IPC APEX EXPO

New board member elected, another re-elected to second term

Mar 9, 2021

The Nominating and Governance Committee of the IPC Board of Directors presented one new member candidate and one term-renewal candidate for election at the 64th IPC Annual Meeting on March 9, held in conjunction with IPC APEX EXPO 2021. All board members serve a four-year term.

The newly elected Board members are:

First-term director: Elke Eckstein, President and CEO, ENICS (Zürich, Switzerland)
Second-term director: Cao Xi, Technical Director, Advanced Process Lab, Huawei (Shenzhen, China)

"IPC is privileged to have Elke and Cao added to our current slate of Board members. Both are active contributors to IPC initiatives, and we look forward to their continued contributions to advancing IPC and helping the electronics industry build electronics better," said John Mitchell, IPC president and CEO.

For additional information on IPC's Board of Directors including bios on newly elected Board members, contact Sandy Gentry, IPC communications director, at SandyGentry@ipc.org. For information on IPC APEX EXPO, visit www.ipcapexexpo.org.

IPC Launches New ESG for Electronics Initiative to Provide Guidance to Industry on ESG Practices and Reporting

Mar 8, 2021

IPC today unveiled a new ESG for Electronics Initiative to develop guidance for electronics manufacturers on an industry-specific approach to ESG (environmental, social and governance) practices and reporting and to develop aspirational goals that the industry is working together to achieve.

As part of this initiative, IPC has engaged electronics industry leaders and ESG experts to develop and distribute guidance on key aspects of reporting that demonstrate a commitment to ESG principles. This guidance is intended to help the industry meet ESG goals by providing industry-specific definitions, benchmarks, self-assessments and recommendations.

In developing its guidance, IPC will employ practices similar to its global standards development process/protocol. Members of the ESG for Electronics Steering Group will review initial proposals and existing methodologies, and direct working sub-groups to establish, refine and finalize guidance specifics.

“This initiative truly reaffirms our industry’s commitment to build electronics better,” said John Mitchell, IPC president and CEO. “And to build electronics better, manufacturers must do so with awareness and responsibility to environment, social, and corporate governance factors, fully integrating them into their business core. IPC’s ESG for Electronics initiative will weave together existing and bold, new industry activities to support industry engagement on a range of societal concerns, including circularity and our renewed efforts towards eco-design and raw materials management.”

To view additional information on IPC’s ESG for Electronics Initiative, including an ESG FAQ and call for steering group participation, go to www.ipc.org/esg-electronics.

The first ever virtual IPC APEX EXPO has launched!

Mar 08, 2021

| By Deanne Janda

The first ever virtual IPC APEX EXPO has launched! We’ve cut the ribbon and are thrilled to connect with attendees and exhibitors online.

IPC’s President and CEO John Mitchell highlights what is happening today at IPC APEX EXPO 2021.

What makes the IPC APEX EXPO virtual experience unique?

Live Q+A sessions after each educational presentation. Have your questions ready!
Three thought-provoking keynotes that will provide a glimpse into the future of our industry. (FREE with the Event Essentials Pass)
The IPC Annual Meeting and Awards Ceremony, offering a chance to celebrate the accomplishments of your peers. (FREE with the Event Essentials Pass)
On-demand access to technical conference sessions and professional development courses until June 13, 2021.
Networking opportunities that can’t be beat: an escape room, trivia, and Name That Tune – you know you want to participate! (FREE with the Event Essentials Pass)

We’ve saved you a seat – come join us for the first virtual IPC APEX EXPO!

NEW PRODUCTS. NEW EQUIPMENT. NEW SERVICES.

Learn what’s new from EXHIBITORS during their 30-minute New Product Presentations, allowing you to access new equipment, products, and services from a variety of exhibitors. Set up one-on-one meetings to learn more about what might work to create your own factory of the future. View the Exhibitor New Product Presentation schedule.

Stay up-to-date at ipcapexexpo.org

IPC Presents Wide-Ranging Policy Priorities to Biden Administration, Notes Synergies Between “Build Electronics Better” and “Build Back Better”

Mar 4, 2021

In a letter to U.S. President Joe Biden, IPC applauds the Biden administration’s early directions on manufacturing policy and maps a detailed policy agenda to drive growth and resilience in electronics manufacturing.

“Your call for a resurgence in U.S. manufacturing signals a federal commitment that is sorely needed and long overdue,” wrote IPC President and CEO John Mitchell. “The U.S. Government needs to move beyond rhetorical support and provide meaningful and tangible programs that collectively constitute a coordinated, bipartisan vision for the future of manufacturing.”

The letter outlines policy recommendations in five key areas, including:

Strengthen the defense electronics industrial base.
1. Implement Section 841 of the FY21 National Defense Authorization Act, which will bolster the security and resiliency of the U.S. defense electronics supply chain.
2. Address concerns with the government’s Cybersecurity Maturity Model Certification (CMMC).
Develop and implement a strategy to promote the factories of the future.
1. Establish an interagency manufacturing policy lead.
2. Invest in R&D for the entire electronics ecosystem.
3. Bring back the U.S. supply chain.
Expand and upskill the workforce.
1. Support industry-recognized worker credentials.
2. Reduce the burden for apprenticeship program implementation.
Rebuild trade relationships.
1. Revive multilateral trade pacts and dispute-resolution bodies.
2. Endorse and implement a North American Manufacturing Initiative.
Protect human health and the environment via practical policies and regulations.
1. Structure regulations to build on industry best practices.
2. Work with industry to ensure policies and regulations are based on existing data and information.

“IPC works with industry to ‘Build Electronics Better,’” Mitchell writes. “Your administration aims for the U.S. to ‘Build Back Better.’ Our shared language suggests we have a shared vision of creating skilled, well-paying jobs in a cleaner economy that renews and extends U.S. leadership in electronics manufacturing.”

View full letter here.

Solving the Surface Finish Selection Paradox for Next Generation PCB Technologies

Mar 03, 2021

| By Kunal Shah

Surface finish is applied on to copper (Cu) integration scheme on printed circuit boards (PCBs). Choice of surface finish is critical especially for next generation HDI, high frequency PCBs because the performance and reliability of the electronic assemblies depends on the right selection. I hope you will join me for my professional development course, PD05: Role and Selection Criteria of Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-Microwave, High Frequencies, March 11, at IPC APEX EXPO 2021, where I will discuss this in detail.

There are several surface finish options available on the market and one (OEM, PCB manufacturers, PCB designers, EMS) needs to consider the following critical selection criteria,

Insertion loss: Next generation electronic assemblies require HDI, high frequency PCBs. Right choice of surface finish is critical to attain optimum signal integrity with minimal insertion loss.
Solder joint reliability: Few surface finishes options (i.e., ENIG, etc.) tend to form brittle solder joints with lead-free solder. Also, Ni based surface finishes form Sn-Ni intermetallics/solder joints which are less strong to Sn-Cu intermetallics. Can the surface finish participate in ensuring smaller intermetallics and robust solder joints? The choice of the surface finish is critical in ensuring robust solder joints in your final assembly.
Shelf life: Looking at the current pandemic situation going on around the world, longer shelf life is critical due to supply chain disruptions across the world.
Reflow cycles during assembly: With ever-increasing complexity of the electronic assemblies, it is paramount to have the surface finish that can withstand multiple reflow cycles (3+).
Cost-effective: It is also critical to review cost during the selection of the surface finish. There are few options that involve use of precious metals, i.e., Ag, Au, Palladium (Pd). Thickness of these precious metals-based surface finishes are critical to ensure cost-effectiveness.

Overall performance and reliability of electronic assemblies depends on the right material selection of every component involved. The surface finishes on the PCBs are critical piece to ensure the optimum performance and reliability of the electronic assemblies. Pay attention while selecting surface finishes for next generation PCB technologies.

What you will learn from my PD course:

Role of surface finish for next generation PCB technologies
5G, HDI, RF-Microwave, High Frequencies
Selection criteria of surface finish for next generation PCB technologies
5G, HDI, RF-Microwave, High Frequencies
Currently available surface finish options in the market and their pros and cons

IPC Issues Industry Alert to Members Regarding U.S. EPA Prohibition of PIP (3:1) in Electronics

Mar 3, 2021

IPC alerted members about the U.S. Environmental Protection Agency’s (EPA) final risk management rules to reduce exposure to five persistent, bioaccumulative, and toxic chemicals (PBTs). The alert calls attention to the rules, which went into effect February 5, 2021, and to one of the five PBTs with a history of use in electronics: phenol, isopropylated, phosphate (3:1) (known as PIP (3:1)).

The final rule for PIP (3:1) prohibits the processing and distribution of this chemical substance and products containing this chemical substance as of March 8, 2021. There are some exceptions to the prohibition, for example, for new and replacement parts for automotive and aerospace industries, however, there are no electronics industry exceptions.

As a chemical that can perform several functions simultaneously, sometimes under extreme conditions, PIP (3:1) has several distinctive applications: It is used as a plasticizer; a flame retardant; an anti-wear additive; or an anti-compressibility additive in hydraulic fluid, lubricating oils, lubricants and greases, various industrial coatings, and in adhesives and sealants. PIP (3:1) is also used in plastic-containing materials that are used to form tubes, harnesses, cables, sleeves, gaskets, and covers of parts – parts that are used in electrical or electronic products.

IPC seeks out member input on the EPA final rule, requesting information on how the final rule may adversely affect supply chains for electronics manufacturers. To provide input, contact Kelly Scanlon, EHS policy and research director, at KellyScanlon@ipc.org. To view news on EPA’s final PIP (3:1) ruling and other advocacy and EHS-related information, visit www.ipc.org/ipc-advocacy.

PIP (3:1) Implications: IPC Issues Industry Alert on Prohibition of PIP (3:1)

Mar 01, 2021

The U.S. Environmental Protection Agency’s (EPA) final risk management rules to reduce exposure to persistent, bioaccumulative, and toxic chemicals (PBTs) went into effect on February 5, 2021. Some of the five PBTs listed have a history of use in electronics, including phenol, isopropylated, phosphate (3:1) (known as PIP (3:1)).

The final rule for PIP (3:1) prohibits the processing and distribution of this chemical substance or products containing this chemical substance as of March 8, 2021. There are some exceptions to the prohibition, for example, for new and replacement parts for automotive and aerospace industries, however, there are no electronics industry exceptions.

If the March 8 prohibition will have adverse impacts on your supply chain or if you have information regarding the function of PIP (3:1) in electronics and the types and quantity of products affected, please contact Kelly Scanlon, IPC’s director of environmental policy and research as soon as possible.

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