New IPC White Paper Focuses on Use of Artificial Intelligence in Automated Optical Inspection in Electronics Manufacturing
A new white paper, “Unlocking AI for Automated Optical Inspection” released today by IPC’s Chief Technologist Council, focuses on AI’s role in AOI processes for printed circuit board assemblies (PCBAs). According to data within the white paper, recent advancements in technology, particularly in Cloud AI, IoT and Smart Manufacturing, have provided opportunities to further enhance AOI performance. AI solutions leveraging deep learning and edge computing technologies have shown significant improvements in AOI accuracy and efficiency.
While the white paper focuses on the application of computer vision AI for automating inspection (i.e., applying AI for pattern recognition on inspection images), the rapidly growing availability and maturity of generative AI presents future possibility in generating inspection criteria.
Key focus areas within the white paper include:
AI systems explanation
The use of AI in AOI
Challenges with deploying AI on the manufacturing floor
“AI Enhancement to AOI for PCBA” project
Technical Strategy Recommendations
“AI has shown significant potential in the realm of AOI, particularly in improving detection accuracy, reducing manual intervention and improving production efficiency. It presents many opportunities for the electronics manufacturing industry to increase reliability, speed up time to market and reduce costs and time associated with manual adjustments to systems,” said Matt Kelly, IPC chief technology officer and vice president of technology solutions. “However, several challenges must be addressed before AI can be widely adopted on electronics manufacturing production floors. AI research, industry collaboration and an ecosystem of standards, will help close the gap in AI adoption within the electronics manufacturing industry.”
Download “Unlocking AI for Automated Optical Inspection at https://go.ipc.org/aoi-whitepaper.
IPC Driving Electronics Policy and Growth in South Asia
By Arpita Das, Deputy Manager, Events and Communication, IPC India
IPC is making waves across South Asia, strengthening its government relations efforts to support the region’s rapidly evolving electronics and manufacturing industries. From India’s ambitious policy shifts to Malaysia’s expanding semiconductor sector and the UAE’s push for localized production, IPC is working closely with key stakeholders to ensure that manufacturers have the resources and policies they need to thrive in an increasingly competitive landscape.
IPC in India
India’s electronics manufacturing sector is set for a major leap in 2025, driven by bold policy shifts and strategic investments. On February 1, 2025, Finance Minister Nirmala Sitharaman announced the removal of import duties on PCBs, camera module parts, and USB cables, providing a significant boost to global players like Apple and Xiaomi.
To further accelerate local production, the government is rolling out a $2.86 billion Production-Linked Incentive (PLI) scheme, expected to attract $4.576 billion USD in investments. NITI Aayog, a government agency and public policy think tank in India, has set an ambitious goal of reaching $500 billion in electronics manufacturing by 2030, generating 6 million new jobs and reinforcing India’s position as a global electronics hub.
In the 2025 Union Budget, the Indian government is doubling down on skills development to support this growing industry. A key highlight is the establishment of five National Centres of Excellence dedicated to advanced manufacturing, upskilling the workforce under the “Make for India, Make for the World” initiative. Additionally, $57.2 million has been allocated to a Centre of Excellence in Artificial Intelligence for Education, fostering innovation and research in AI.
The budget also supports the expansion of Global Capability Centers (GCCs) in Tier-2 cities, aiming to bridge the talent gap between urban and rural areas. These efforts demonstrate the government’s commitment to equipping the workforce with the expertise needed to drive India’s electronics manufacturing into a new era.
IPC in Southeast Asia (SEA)
Meanwhile, IPC is making significant strides in Malaysia’s electronics and semiconductor industry, engaging closely with key government agencies and institutions to enhance product quality and workforce skills. Between January 13 and 24, IPC’s Executive Director (SEA) and newly appointed Country Manager, Dr. Ranee Ramya, met with multiple government bodies to promote IPC’s educational initiatives to help manufacturers improve their export capabilities.
In 2024, IPC reinforced its commitment to skills development in the country by signing Memorandums of Understanding (MoUs) with the Penang Skills Development Center and the Selangor Human Resource Development Center. Additionally, the Malaysian Trade Promotion Agency will support local SMEs in participating in the IPC APEX 2025 show in the USA, providing them with global exposure.
To further strengthen the semiconductor advanced packaging industry, IPC has launched new industry guidelines and specialized training programs. These initiatives include Validation Services to enhance global competitiveness, alongside technical sessions and networking events fostering collaboration between government, industry, and academia.
IPC in MEA
The Middle East’s wire harness market is gaining momentum, driven by surging demand in the automotive and industrial sectors. As regional economies push for diversification beyond energy, investment in local manufacturing is becoming a top priority, fueling the growing need for wire harnesses.
With shifting geopolitical dynamics, defense-related manufacturing is also expanding, with countries prioritizing domestic production of critical components. The UAE’s “Make in UAE” initiative is at the forefront of this movement, further driving demand for wire harnesses in defense, automotive, and industrial applications.
Between January 27 and 31, IPC’s Executive Director and Head of International Relations (MEA) visited Abu Dhabi and Dubai, engaging with key stakeholders to promote IPC’s cable and wire harness programs covering certification, skill development, competitions, and exhibitions. IPC is also strengthening collaborations with government agencies and trade associations, ensuring industry growth aligns with global best practices.
Do you have any questions or suggestions on IPC’s activities in South Asia? Contact Gaurab Majumdar, IPC India, Southeast Asia & MEA Executive Director.
First Pan-European Electronics Design Conference (PEDC) in Vienna Inspires Participants from 20 Countries
The first Pan-European Electronics Design Conference (PEDC) in Vienna was a great success The new international conference, organized by Fachverband Elektronikdesign und -fertigung e. V. (FED) and IPC, brought together experts and industry representatives from 20 countries and four continents. The aim of the PEDC was to create a new European platform for the exchange of information on current developments and trends in electronics design.
Opening and technical program at the highest level
Dieter Müller, chairman of FED, and Matt Kelly, IPC CTO and vice president, technology solutions, opened the event and emphasized the relevance of the conference for the European electronics industry. “PEDC offers a unique opportunity to discuss current topics such as the role of artificial intelligence in electronics design, as well as the challenges and opportunities in the area of sustainability. We are proud to establish PEDC as a platform for the international exchange of knowledge in the electronics industry – and especially for designers,” said Müller.
“With all of the rapid changes occurring in semiconductor chiplet architectures and component level packaging, it’s extremely important to drive a chip-to-package-to-system co-design approach to enable next generation electronic systems and products. The PEDC conference, with its focus on AI integration, new design flows, and tools was an important step to bring together OEMs, suppliers, and academia to collaborate and share their knowledge. The platform helped the supply chain to drive next generation design practices and expertise within Europe and across the globe,” summarized Kelly.
Exciting technical program and lively discussions
The keynotes from Prof. Thomas Ebel from the University of Southern Denmark and Lukas Henkel, OV Technologies, provided important impetus: while Ebel highlighted the use of artificial intelligence (AI) in the development of passive components, Henkel presented the development of an open-source smartwatch. Afterwards, a panel discussion moderated by Alexander Gerfer, Würth Elektronik, addressed the topic of AI in electronics design. A second panel – moderated by Didrik Bech, Altium, – had a lively discussion about how the life cycle of electronic products can be made sustainable.
Accompanying exhibition and networking
At the accompanying exhibition, 13 companies presented their products related to electronics design. Participants made intensive use of the breaks to exchange ideas about new technologies and make valuable contacts. At a networking reception, participants were able to make new contacts and deepen existing ones in a relaxed atmosphere.
Strong momentum for the future
After two intensive days full of discussions and high-level presentations, the PEDC draws a positive conclusion. The conference has shown that AI has the potential to revolutionize electronics design and that sustainability in the electronics industry will become increasingly important to us. The first PEDC has impressively demonstrated that there is a need for a pan-European exchange format in Europe. The collaboration between IPC and FED proved to be a complete success.
“Without the commitment of our speakers, the organizing team, the program committee members and our sponsors, this success would not have been possible,” concluded Peter Tranitz, senior director of solutions, IPC.