IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design

IPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System. This two-week course provides advanced training in wire harness design, an essential skill in today's competitive wire harness assembly industry.

 

Led by Didem Üstün, a seasoned IPC/WHMA-certified expert with over a decade of industry experience, the course offers participants a deep dive into the complexities of designing, assembling, and troubleshooting wire harnesses. Üstün's expert guidance, combined with a robust curriculum that includes foundational concepts and practical, hands-on techniques, ensures that learners acquire the knowledge and skills they need to excel.

 

Course Details:

  • Duration: 2 weeks

  • Format: Online, featuring live sessions twice weekly, recorded for on-demand recorded sessions.

Learning and Performance Objectives:

  • Master fundamental and advanced aspects of wire harness design, including materials selection and troubleshooting.

  • Gain practical experience through project-based learning that mimics real-world challenges.

Who Should Enroll:

  • Designers new to the field of wire harness technology.

  • Operators preparing to work with wire harness designs.

  • Industry professionals are seeking to deepen their cable and wire harness assembly expertise.

Carlos Plaza, IPC senior director of education development said, "This program is specifically designed to address the growing demand for skilled wire harness designers who can innovate and excel in an evolving industry."

Benefits of Enrolling:

  • Learn from an industry leader and become proficient in the latest industry standards, including IPC/WHMA-A-620.

  • Enhance career opportunities and readiness for industry-specific challenges.

 

Enrollment is now open, and spots are limited. To register or find more information about "Introduction to Wire Harness Design I," visit IPC's course page.

Explore our latest blog post on IPC's website to learn more about the exciting new Wire Harness Design course.

IPC Hand Soldering Competition 2025 Regional Qualification - France

Date
- (3:00 - 9:30am CDT)

Join the Regional Qualification France for the IPC Hand Soldering Competition (HSC) at Global Industrie Lyon on 11-13 March 2025.

Skilled soldering experts (F/M) will compete for 60 minutes on a complex circuit board assembly to win the 2025 National title, earn a cash prize, and compete for a coveted spot at the IPC Hand Soldering World Championship later this year.

Competition for Professionals

The professional competitors will be judged by IPC Master Instructors (MIT) on soldering a complex printed circuit board with a maximum time of 60 minutes under IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality, and the speed at which the assembly was produced.

Prizes for Professionals

The professionals will receive cash prizes: the winner and two runners-up.

  • 1st place – 300 €
  • 2nd place – 200 €
  • 3rd place – 100 €

IPC Hand Soldering World Championship: The winner will be invited by IPC (all expenses covered by IPC) to compete in the HSC World Final in November at productronica tradeshow in Munich, Germany.

Hand Soldering Best Company Team Award: This year again, nominate a team to win the Hand Soldering Best Company Team Award. For any company enlisting 2 or 3 competitors, the highest combined scores of competitors from the same company will determine which company will receive the HSC Best Company Team Award.

Registration is free of charge.

You do not need to be an IPC member to take part.

You do not need to be IPC-certified to take part.

How to register?

Fill in the registration form and book your competition slot.

The registration deadline is Friday 7 March 2025.

You will receive a confirmation email specifying your date and time to compete.

For more information, please get in touch with Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org).

Region

IPC Hand Soldering Competition 2025 Regional Qualification - United Kingdom

Date
- (3:30 - 9:30am CST)

Join the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) at Farnborough International Exhibition Centre on 4-6 February 2025.

Skilled soldering experts (F/M) will compete for 60 minutes on a complex circuit board assembly to win the 2025 National title, earn a cash prize, and compete for a coveted spot at the IPC Hand Soldering World Championship later this year.

Competition for Professionals

The professional competitors will be judged by IPC Master Instructors (MIT) on soldering a complex printed circuit board with a maximum time of 60 minutes under IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality, and the speed at which the assembly was produced.

Prizes for Professionals

The professionals will receive cash prizes: the winner and two runners-up.

  • 1st place – 300 €
  • 2nd place – 200 €
  • 3rd place – 100 €

IPC Hand Soldering World Championship: The winner will be invited by IPC (all expenses covered by IPC) to compete in the HSC World Final in November at productronica tradeshow in Munich, Germany.

Hand Soldering Best Company Team Award: This year again, nominate a team to win the Hand Soldering Best Company Team Award. For any company enlisting 2 or 3 competitors, the highest combined scores of competitors from the same company will determine which company will receive the HSC Best Company Team Award.

Registration is free of charge.

You do not need to be an IPC member to take part.

You do not need to be IPC-certified to take part.

How to register?

Fill in the registration form and book your competition slot.

You will receive a confirmation email specifying your date and time to compete.

The registration deadline is  Friday 31 January 2025. 

For more information, please get in touch with Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org).

Region
Farnborough International Exhibition Centre

ShowCentre, Etps Road
Farnborough
GU14 6TQ
United Kingdom

Farnborough International Exhibition Centre

Farnborough International Exhibition Centre
ShowCentre, Etps Road
Farnborough, GU14 6TQ
United Kingdom

IPC Launches Comprehensive White Paper on Double Materiality Assessments

Today, IPC released its latest white paper, Why Double Materiality Assessments Matter: Compliance and Competitive Advantage. This publication offers a roadmap for companies in the electronics industry to navigate the European Union’s Corporate Sustainability Reporting Directive (CSRD) and leverage double materiality assessments (DMAs) for sustainable growth and competitive differentiation.

 

Developed in partnership with Anthesis Group, a leading global sustainability consultancy, the white paper provides actionable guidance to help companies address dual reporting obligations under the CSRD. DMAs require businesses to assess both their environmental and societal impacts (impact materiality) and the financial implications of sustainability-related issues (financial materiality). 

 

The 12-page white paper addresses areas critical to implementing DMAs successfully including understanding double materiality and its dual perspectives, following a structured approach to conducting DMAs, navigating relevant regulations such as the CSRD, and engaging stakeholders effectively throughout the process. Additionally, it highlights the strategic advantages DMAs offer and includes a glossary and FAQ section to address common questions. 

 

“The CSRD marks a landmark shift in sustainability reporting requirements for companies and the completion of a double materiality assessment represents an opportunity to deliver value beyond compliance,” said Mari Desangles, principal consultant, ESG advisory & mandatory reporting at Anthesis. “Through a double materiality assessment, industry members can understand their most significant sustainability-related impacts, risks, and opportunities, and then make informed strategic designs about how to address them.”

 

“More importantly, the white paper delves into the value proposition that DMAs offer organizations beyond just regulatory compliance. By understanding how sustainability issues affect their business and vice versa, electronics companies empowered by IPC resources can gain operational efficiencies in a competitive global marketplace,” said Kelly Scanlon, IPC lead sustainability strategist and white paper co-author.

 

The white paper highlights practical scenarios for businesses of varying size and location, including how a European semiconductor manufacturer would utilize a double materiality assessment to identify risks in its supply chain, from responsible sourcing of raw materials to production waste management. Another example features a multinational technology corporation aligning its reporting with both CSRD and ISSB standards, achieving greater transparency and operational efficiencies across its subsidiaries. The white paper also details the use of stakeholder mapping and tiered engagement strategies for effective communication with investors, suppliers, and internal teams.

 

Table of contents:

  • Introduction 

  • Double Materiality Assessments: Two Sides of the Sustainability Coin 

  • Conducting a Double Materiality Assessment: A Structured Approach 

  • Regulations and Frameworks: CSRD and Beyond 

  • CSRD Impact on Technology Companies: Three Examples 

  • Engaging Electronics Industry Stakeholders and SMEs for a Successful Process 

  • Electronics Industry Considerations — Complex Supply Chains 

  • From Compliance to Competitive Edge: How DMAs Drive Sustainability Leadership 

  • Frequently Asked Questions (FAQ) and Glossary of Terms 

  • About IPC International, Inc. and Anthesis Group 

 

Download the white paper at https://go.ipc.org/dma-whitepaper.

Designing for Success: How DFM, DFT, and DFA Impact PCB Production

Date
-

This one-hour webinar will teach you how to design printed circuit boards (PCBs) that are easy to manufacture, test, and assemble. You’ll learn about three important design principles: Design for Manufacturing (DFM), Design for Test (DFT), and Design for Assembly (DFA). These principles help you create PCBs that save time, lower costs, and ensure the final product works as expected.

We’ll explain what DFM, DFT, and DFA mean and why they matter for your design. You’ll see how DFM makes simple PCBs by choosing the right materials, layer stack-ups, and trace sizes. Then, we’ll explore DFT, ensuring your board can be easily tested to catch any issues before production. Finally, we’ll cover DFA, which helps make assembly smoother by correctly placing components and avoiding errors.

Throughout the webinar, we’ll share real-world examples of what happens when these principles are followed—and when they’re not. You’ll also learn about necessary IPC standards, like IPC-2221 and IPC-A-610, that guide good PCB design practices. By the end of the session, you’ll know how to create reliable, cost-effective, and easy PCBs.

This webinar is perfect for anyone working on PCB designs, from beginners to experienced designers. Whether creating your first board or looking to improve your process, this session will give you the tools and tips to succeed. Join us to learn how to design PCBs that work perfectly from the start!

Speaker Bios

John Watson

John Watson brings over 44 years of experience in the electronics industry, with 24 of those dedicated to PCB design and engineering. Throughout his distinguished career, John has worked with leading companies such as Teledyne API, Emerson Computer Power, and Legrand Corporation. He also served honorably in the U.S. Army’s Military Intelligence field. John is a technical expert in using various PCB Design ECAD Software. 
A significant undertaking is honing the next generation of PCB Designers, enhancing proficiency in PCB Design, and improving the overall quality of PCB design workflows for industry-leading companies.

In addition to his industry role, John is a professor at Palomar College in San Marcos and the University of California San Diego, teaching foundational and advanced PCB design courses. He is also a highly regarded author, contributing regularly to blogs and white papers and as a monthly columnist for I-Connect007. John is the author of two books on Library and Data Management and is a sought-after international speaker, having delivered lectures across the United States, Europe, and Asia.

As a member of the IPC Designer Leadership Council, John is deeply committed to shaping the future of PCB design education and resources. Being part of an organization that has influenced the industry for decades remains one of the most rewarding aspects of his career.

 

 

The Engineering Webinar Series will provides FREE, live, monthly educational experiences and videos discussing key design issues surrounding aspects of quality, defect detection & remediation, and design finalization & fabrication. All sessions are recorded and registered attendees will receive a link to the video to watch on-demand.