New IPC White Paper Focuses on Use of Artificial Intelligence in Automated Optical Inspection in Electronics Manufacturing
A new white paper, “Unlocking AI for Automated Optical Inspection” released today by IPC’s Chief Technologist Council, focuses on AI’s role in AOI processes for printed circuit board assemblies (PCBAs). According to data within the white paper, recent advancements in technology, particularly in Cloud AI, IoT and Smart Manufacturing, have provided opportunities to further enhance AOI performance. AI solutions leveraging deep learning and edge computing technologies have shown significant improvements in AOI accuracy and efficiency.
While the white paper focuses on the application of computer vision AI for automating inspection (i.e., applying AI for pattern recognition on inspection images), the rapidly growing availability and maturity of generative AI presents future possibility in generating inspection criteria.
Key focus areas within the white paper include:
AI systems explanation
The use of AI in AOI
Challenges with deploying AI on the manufacturing floor
“AI Enhancement to AOI for PCBA” project
Technical Strategy Recommendations
“AI has shown significant potential in the realm of AOI, particularly in improving detection accuracy, reducing manual intervention and improving production efficiency. It presents many opportunities for the electronics manufacturing industry to increase reliability, speed up time to market and reduce costs and time associated with manual adjustments to systems,” said Matt Kelly, IPC chief technology officer and vice president of technology solutions. “However, several challenges must be addressed before AI can be widely adopted on electronics manufacturing production floors. AI research, industry collaboration and an ecosystem of standards, will help close the gap in AI adoption within the electronics manufacturing industry.”
Download “Unlocking AI for Automated Optical Inspection at https://go.electronics.org/aoi-whitepaper.
IPC Driving Electronics Policy and Growth in South Asia
By Arpita Das, Deputy Manager, Events and Communication, IPC India
IPC is making waves across South Asia, strengthening its government relations efforts to support the region’s rapidly evolving electronics and manufacturing industries. From India’s ambitious policy shifts to Malaysia’s expanding semiconductor sector and the UAE’s push for localized production, IPC is working closely with key stakeholders to ensure that manufacturers have the resources and policies they need to thrive in an increasingly competitive landscape.
IPC in India
India’s electronics manufacturing sector is set for a major leap in 2025, driven by bold policy shifts and strategic investments. On February 1, 2025, Finance Minister Nirmala Sitharaman announced the removal of import duties on PCBs, camera module parts, and USB cables, providing a significant boost to global players like Apple and Xiaomi.
To further accelerate local production, the government is rolling out a $2.86 billion Production-Linked Incentive (PLI) scheme, expected to attract $4.576 billion USD in investments. NITI Aayog, a government agency and public policy think tank in India, has set an ambitious goal of reaching $500 billion in electronics manufacturing by 2030, generating 6 million new jobs and reinforcing India’s position as a global electronics hub.
In the 2025 Union Budget, the Indian government is doubling down on skills development to support this growing industry. A key highlight is the establishment of five National Centres of Excellence dedicated to advanced manufacturing, upskilling the workforce under the “Make for India, Make for the World” initiative. Additionally, $57.2 million has been allocated to a Centre of Excellence in Artificial Intelligence for Education, fostering innovation and research in AI.
The budget also supports the expansion of Global Capability Centers (GCCs) in Tier-2 cities, aiming to bridge the talent gap between urban and rural areas. These efforts demonstrate the government’s commitment to equipping the workforce with the expertise needed to drive India’s electronics manufacturing into a new era.
IPC in Southeast Asia (SEA)
Meanwhile, IPC is making significant strides in Malaysia’s electronics and semiconductor industry, engaging closely with key government agencies and institutions to enhance product quality and workforce skills. Between January 13 and 24, IPC’s Executive Director (SEA) and newly appointed Country Manager, Dr. Ranee Ramya, met with multiple government bodies to promote IPC’s educational initiatives to help manufacturers improve their export capabilities.
In 2024, IPC reinforced its commitment to skills development in the country by signing Memorandums of Understanding (MoUs) with the Penang Skills Development Center and the Selangor Human Resource Development Center. Additionally, the Malaysian Trade Promotion Agency will support local SMEs in participating in the IPC APEX 2025 show in the USA, providing them with global exposure.
To further strengthen the semiconductor advanced packaging industry, IPC has launched new industry guidelines and specialized training programs. These initiatives include Validation Services to enhance global competitiveness, alongside technical sessions and networking events fostering collaboration between government, industry, and academia.
IPC in MEA
The Middle East’s wire harness market is gaining momentum, driven by surging demand in the automotive and industrial sectors. As regional economies push for diversification beyond energy, investment in local manufacturing is becoming a top priority, fueling the growing need for wire harnesses.
With shifting geopolitical dynamics, defense-related manufacturing is also expanding, with countries prioritizing domestic production of critical components. The UAE’s “Make in UAE” initiative is at the forefront of this movement, further driving demand for wire harnesses in defense, automotive, and industrial applications.
Between January 27 and 31, IPC’s Executive Director and Head of International Relations (MEA) visited Abu Dhabi and Dubai, engaging with key stakeholders to promote IPC’s cable and wire harness programs covering certification, skill development, competitions, and exhibitions. IPC is also strengthening collaborations with government agencies and trade associations, ensuring industry growth aligns with global best practices.
Do you have any questions or suggestions on IPC’s activities in South Asia? Contact Gaurab Majumdar, IPC India, Southeast Asia & MEA Executive Director.
First Pan-European Electronics Design Conference (PEDC) in Vienna Inspires Participants from 20 Countries
The first Pan-European Electronics Design Conference (PEDC) in Vienna was a great success The new international conference, organized by Fachverband Elektronikdesign und -fertigung e. V. (FED) and IPC, brought together experts and industry representatives from 20 countries and four continents. The aim of the PEDC was to create a new European platform for the exchange of information on current developments and trends in electronics design.
Opening and technical program at the highest level
Dieter Müller, chairman of FED, and Matt Kelly, IPC CTO and vice president, technology solutions, opened the event and emphasized the relevance of the conference for the European electronics industry. “PEDC offers a unique opportunity to discuss current topics such as the role of artificial intelligence in electronics design, as well as the challenges and opportunities in the area of sustainability. We are proud to establish PEDC as a platform for the international exchange of knowledge in the electronics industry – and especially for designers,” said Müller.
“With all of the rapid changes occurring in semiconductor chiplet architectures and component level packaging, it’s extremely important to drive a chip-to-package-to-system co-design approach to enable next generation electronic systems and products. The PEDC conference, with its focus on AI integration, new design flows, and tools was an important step to bring together OEMs, suppliers, and academia to collaborate and share their knowledge. The platform helped the supply chain to drive next generation design practices and expertise within Europe and across the globe,” summarized Kelly.
Exciting technical program and lively discussions
The keynotes from Prof. Thomas Ebel from the University of Southern Denmark and Lukas Henkel, OV Technologies, provided important impetus: while Ebel highlighted the use of artificial intelligence (AI) in the development of passive components, Henkel presented the development of an open-source smartwatch. Afterwards, a panel discussion moderated by Alexander Gerfer, Würth Elektronik, addressed the topic of AI in electronics design. A second panel – moderated by Didrik Bech, Altium, – had a lively discussion about how the life cycle of electronic products can be made sustainable.
Accompanying exhibition and networking
At the accompanying exhibition, 13 companies presented their products related to electronics design. Participants made intensive use of the breaks to exchange ideas about new technologies and make valuable contacts. At a networking reception, participants were able to make new contacts and deepen existing ones in a relaxed atmosphere.
Strong momentum for the future
After two intensive days full of discussions and high-level presentations, the PEDC draws a positive conclusion. The conference has shown that AI has the potential to revolutionize electronics design and that sustainability in the electronics industry will become increasingly important to us. The first PEDC has impressively demonstrated that there is a need for a pan-European exchange format in Europe. The collaboration between IPC and FED proved to be a complete success.
“Without the commitment of our speakers, the organizing team, the program committee members and our sponsors, this success would not have been possible,” concluded Peter Tranitz, senior director of solutions, IPC.
Welcome to the Winter 2025 Issue of IPC Community!
by Michelle Te, Managing Editor, IPC Community magazine
As the managing editor, I know exactly what it takes to put together each issue of IPC Community: months of planning, writing, and execution in order to share the most relevant thoughts, activities, and ideas from IPC and its members.
So, I'm thrilled to present the Winter 2025 issue of IPC Community. Each time we plan an issue, we want to know not only who you are and what you do, but why you do it. That’s what makes it all so interesting and fun. We’re truly a global electronics association. So, here are just some of the highlights from this issue. What resonates most with you?
Technological innovations: Our in-depth review of IPC's new semiconductor course is a standout feature. This article demystifies complex semiconductor concepts, making them accessible to everyone. Nyron Rouse, IPC’s director of grants, writes, "This course is a game-changer for anyone looking to deepen their understanding of semiconductor technology." Nyron was new to the electronics industry when he joined IPC and has quickly become up to speed through general courses like these.
Industry intelligence: Shawn DuBravac, IPC's chief economist, offers a masterful analysis of the current economic landscape. His article delves into the effects of shifting trade patterns and tariffs. "Understanding these economic shifts is vital for staying ahead in our industry." DuBravac notes. With so much attention on tariffs, this article is essential reading.
Sustainability: In each issue, you’ll see sustainability as a central theme. In the Winter 2025 issue, we feature an article from iNEMI outlining a roadmap for sustainability efforts and highlighting industry leaders making significant strides. "Sustainability isn't just a trend; it's our responsibility."
Workforce development: Addressing the talent shortage is a major focus, no matter which continent you’re on. From China to the U.S., we explore innovative solutions and share a vision for developing future-ready engineers. One of our contributors emphasizes, "Building a robust workforce is essential for our industry's future."
Global events: "Connecting with international developments is key to our success." Stay informed about major industry events like electronica 2024 in Munich last fall, where IPC had a very successful booth. We also provide updates on IPC's activities in Asia and India, showcasing the global impact of our community.
Member profiles: Be inspired by the success stories of companies like WHMA member Paras Wires and individuals like Siti Wahab, an EMS provider in Malaysia. These profiles highlight the resilience and innovation that drive our industry forward. "Innovation is at the heart of everything we do,” Siti says. She’s among a growing group of female business leaders in Malaysia and is strongly supported by her government. I know you’re going to love her story.
Standards and solutions: Keep up with the latest IPC standards and discover practical solutions to common challenges. This section is crucial for anyone looking to stay compliant and efficient. An industry expert asserts, "Staying updated on standards is non-negotiable."
Education and training: In each issue, you’ll discover the latest instructor-led courses IPC. This time, we share upcoming IPC courses in Europe and Southeast Asia. We also feature a “day in the life of an apprentice,” by focusing on the hands-on training and continuous learning at Arc-Tronics. One of our apprentices says, "Hands-on experience is invaluable." Would you like to start an apprenticeship program at your business? Read through this article to find out how.
Spotlight and awards: We celebrate the achievements within our community in this spotlight on the 2024 Golden Gnomes. These stories of excellence and dedication are sure to inspire and motivate you. One of the award recipients said, "Recognition fuels our passion for excellence." It will have you saying “red carpet” faster than a TMZ announcer.
Additional highlights: This issue also includes articles on PCB design instructor John Watson, a review of the highly successful regional roundtables run by Mark Wolfe, a focus on the IPC Technology Solutions Team led by Matt Kelly, and a really inspiring member profile on Barbara Pauls, who started her business in her parents’ basement. It took hard work, ingenuity, and real street smarts to build her business, but she’s made it work. Did you know four of her five children now work for the company?
The Winter 2025 issue of IPC Community will be a highlight of your month. You’ll get to know IPC and some its members in a way you’ve never seen before. That’s our goal and we think we’re doing it right. Whether you're looking for the latest trends, practical advice, or inspiring stories, this issue has something for everyone. Happy reading!
Electronics Industry Demand Reaches Neutral Ground
IPC releases January 2025 Global Sentiment of the Electronics Manufacturing Supply Chain report
Demand in the electronics industry recovered to 100 in December, marking the threshold between contraction and expansion after four consecutive months below this level according to IPC’s January Sentiment of the Global Electronics Manufacturing Supply Chain Report. Of the four demand components, the Backlog Index remained below 100 and was the only component unchanged over the past month. The New Orders Index rose by four points to 102, moving marginally into expansion territory. Similarly, the Shipment Index increased by four points, reflecting broader improvements in volume indicators.
Cost pressures continue to challenge operations. The Labor Costs Index held steady this month, while the Material Costs Index climbed three points, recovering slightly from its all-time low. However, aggregated cost indicators reached a four-month high, signaling persistent cost pressures on operations.
In response to special questions regarding companies’ current work from home practices, minimal changes are expected in 2025 work arrangements. Factory floor policies remain rooted in traditional on-site requirements, reflecting the operational challenges and technical demands of these roles. Europe stands out with the largest flexibility increase, as hybrid arrangements are projected to grow by 5 percent.
“While 2025 work-from-home policies suggest incremental shifts toward flexibility, particularly in APAC and Europe, these changes are more pronounced for non-factory employees,” said Shawn DuBravac, Ph.D., IPC chief economist and report author. “For factory floor employees, minor increases in hybrid work are anticipated, but on-site roles remain the overwhelming standard, underscoring the rigidity of these positions,” Dr. DuBravac added.
Additional survey data show:
- Half of electronics manufacturers are currently experiencing rising labor (52 percent) and material (51 percent) costs.
- European electronics manufacturers, along with those operating globally, anticipate a decline in material costs over the next six months more so when compared to North American electronics manufacturers.
- Over the next six months, electronics manufacturers expect labor and material costs to remain high, with ease of recruitment likely to remain challenging.
These results are based upon the findings of IPC’s Current State of Electronics Manufacturing Survey, fielded between December 11 and December 31, 2024.
Read the full report.
The AI Advantage in PCB Design: Techniques and Trends
Date
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BACK BY POPULAR DEMAND -- John Watson explores how artificial intelligence (AI) is revolutionizing printed circuit board (PCB) design in this must-attend webinar, "The AI Advantage in PCB Design: Tools and Trends." This session will provide a deep dive into the transformative impact of AI on the PCB design process, helping engineers and designers tackle challenges with greater efficiency and innovation.
The webinar begins with an introduction to AI's fundamental role in modern PCB design. Participants will learn how AI enhances traditional workflows, offering capabilities beyond human limitations. From circuit optimization to error reduction, AI enables faster, smarter, and more precise design outcomes.
Through real-world examples, the session will highlight how AI is being used to solve common PCB design challenges, such as managing complex routing patterns, improving thermal performance, and reducing the time spent on iterative design revisions. These case studies will show how companies have integrated AI to address bottlenecks, reduce costs, and accelerate product development timelines.
Additionally, this webinar will explore the potential hurdles of adopting AI technologies in PCB design. Topics will include data preparation, the need for effective collaboration between engineers and AI systems, and the importance of validating AI-driven recommendations. Attendees will also get a glimpse into the future of AI in PCB design, including its role in fully autonomous design systems and its integration with next-generation technologies like augmented reality (AR) and virtual reality (VR).
What Participants Will Learn
1. How AI is transforming the design process in general.
2. The benefits of using AI are in improving efficiency and accuracy.
3. Key features and capabilities of AI-powered tools.
4. Real-world examples of AI solving design challenges.
5. Common challenges when adopting AI technologies.
6. Exciting future possibilities for AI in design and engineering.
Speaker Bios
John Watson brings over 44 years of experience in the electronics industry, with 24 of those dedicated to PCB design and engineering. Throughout his distinguished career, John has worked with leading companies such as Teledyne API, Emerson Computer Power, and Legrand Corporation. He also served honorably in the U.S. Army’s Military Intelligence field. John is a technical expert in using various PCB Design ECAD Software.
A significant undertaking is honing the next generation of PCB Designers, enhancing proficiency in PCB Design, and improving the overall quality of PCB design workflows for industry-leading companies.
In addition to his industry role, John is a professor at Palomar College in San Marcos and the University of California San Diego, teaching foundational and advanced PCB design courses. He is also a highly regarded author, contributing regularly to blogs and white papers and as a monthly columnist for I-Connect007. John is the author of two books on Library and Data Management and is a sought-after international speaker, having delivered lectures across the United States, Europe, and Asia.
As a member of the IPC Designer Leadership Council, John is deeply committed to shaping the future of PCB design education and resources. Being part of an organization that has influenced the industry for decades remains one of the most rewarding aspects of his career.
The Engineering Webinar Series will provides FREE, live, monthly educational experiences and videos discussing key design issues surrounding aspects of quality, defect detection & remediation, and design finalization & fabrication. All sessions are recorded and registered attendees will receive a link to the video to watch on-demand.