Stable Model-based and Constrained PCB Design

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Discover how to optimize your PCB design process with rigorous constraint management. Join this webinar to learn about the power of model-based PCB design and the importance of digital twins in creating high-quality, manufacturable boards.

Key Topics:

  • Model-based PCB design engineering: Understand the benefits and techniques of using models to drive your design process.
  • The need for digital twins: Learn how digital twins can provide a comprehensive representation of your PCB, enabling better decision-making and risk mitigation.
  • Winning design constraints: Discover effective strategies for defining and implementing design constraints that ensure manufacturability and yield.
  • Putting it all together: See how to integrate model-based design, digital twins, and constraint management to achieve optimal results.

Leave this webinar with a clear understanding of how to:

  • Create stable and manufacturable PCBs
  • Improve design efficiency and reduce errors
  • Maximize yield and minimize costs

Don't miss this opportunity to gain valuable insights into the future of PCB design.

Speaker Bios

Fil Arzola November 13

Fil Arzola is a Senior PCB Design Engineer and has worked in the Aerospace Design Community for over 30 years. Fil's expertise is with RF and Mixed-Signal board designs and his main focus deals with small complex packaging solutions. He's a firm believer in LC-SwaP, DFM/A, Model-based design engineering and solving puzzles. Fil is a graduate of the University of California, Davis, with a BSEE in Electrical and Computer Engineering. He enjoys mentoring junior engineers and hopes to start a university class on PCB Design Engineering.

 

 

The Engineering Webinar Series will provides FREE, live, monthly educational experiences and videos discussing key design issues surrounding aspects of quality, defect detection & remediation, and design finalization & fabrication. All sessions are recorded and registered attendees will receive a link to the video to watch on-demand. 
 

Fall 2024 Issue of IPC Community Now Available

There’s so much happening at IPC, so be sure to open the latest issue of IPC Community, brimming with must-read features on members of the electronics industry who are making a difference in their own unique way.

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  • Our member profiles feature Virginia-based Weidmuller, a heart-warming story from E-Tron, and you’ll discover how the owners of Out of the Box Manufacturing are successfully tackling workforce talent challenges.
  • We feature an in-depth conversation with European market researcher Dieter Weiss, who’s giving back to the industry through data research, and you must read about the somewhat unconventional but ultimately satisfying sustainability-driven lifestyle of IPC course instructor Kris Moyer.
  • IPC Chief Economist Shawn DuBravac breaks down inventory costs following the pandemic, while IPC Japan Representative Yusaku Kono gives an update on how Japan’s electronics economy is recovering after the pandemic and the phenomenal growth of IPC standards and certifications in Japan.
  • Regarding sustainability, IPC Community visited with Zhou (Peter) Guoyin, a pioneer in ESG standards. You can also learn more about circularity in electronics from IPC's Lead Sustainability Strategist Kelly Scanlon, and Stanley Merritt, a member of the IPC Sustainability Leadership Council, educates us on supply chain sustainability, particularly in aerospace and defense.
  • We’ve devoted a special section to IEMI, the premier electronics manufacturing trade show sponsored by IPC India, which crossed borders this year to host events in Malaysia and India with great success. Dr. John W. Mitchell, IPC president and CEO attended both events and shares his insights on what it means to host the event in Malaysia.
  • For printed circuit board designers, check out the article highlighting the Pan-European Design Conference in January and learn how to participate in this exciting new opportunity in Vienna.
  • As always, you’ll discover instructor-led courses happening this winter, learn about the latest standards releases, and see what's happening around the world with IPC in our Q4 calendar.

SEE WHAT’S INSIDE

 

IPC Recommends Greater Focus on Electronics Needed for US-based AI Data Centers

New white paper serves as a blueprint for strengthening PCB assembly capabilities in the United States

A new white paper from IPC, “AI-based Data Centers for the United States: Technologies, Supply Chains, and Resiliency Gaps,” explores the actions needed to improve the supply chain resiliency of U.S.-based artificial intelligence (AI) data centers and the electronics used in them.

 

AI servers are crucial for a variety of applications across different industries. In manufacturing, they are utilized for quality control such as inspecting products for defects using computer vision. Additionally, AI controls robotic systems for tasks such as assembly, welding, and packaging. These applications leverage AI servers' high computational power, data processing capabilities, and machine learning models. The strong and growing demand for these applications means the AI server market is expected to grow at a 12.3 percent compound annual growth rate over the next five years. Electronic components and assemblies are critical to the functioning of such data centers.   

 

The most significant addition to the forecast is the addition of detail for accelerated servers, including GPU servers. The white paper analyzes several critical areas requiring government attention and investments to enable a more resilient AI server supply chain.

 

“When the high-performance computing market is added to the electronics portion of defense, aerospace, and space market, the overall North American market size is on the order of $70 billion to $90 billion,” says report coauthor Matt Kelly, IPC chief technology officer and vice president of technology solutions. “The size of these combined segments justifies government efforts to strengthen electronics capability and capacity to enable a resilient advanced packaging supply chain.” 

 

The white paper, also coauthored by Devan Iyer, IPC chief strategist, advanced packaging, and Chris Mitchell, IPC vice president of global government relations, provides a “SWOT” analysis and recommendations on the infrastructure needed to produce AI-based servers and storage equipment for data centers and to strengthen associated electronics assembly capabilities in the U.S., with particular emphasis on these areas of importance:

  • IC-substrate design and fabrication

  • AI component assembly and test

  • HBM chip assembly manufacturing

  • PCB design/HDI fabrication

  • PCBA assembly and test

 

“Several areas are identified that are critical and require significant government attention and investment to enable a stronger, more resilient domestic supply chain for next-generation AI server data centers from design to manufacture,” added Dr. Iyer. 

 

To download the report, visit https://go.ipc.org/ai-datacenters.