PCB Designers to Vie for Design Champion Title at IPC APEX EXPO 2024

Registration now open for virtual preliminary heat

Jan 4, 2024

For the third consecutive year, IPC is hosting an IPC Design Competition, inviting printed circuit board designers to compete to become the IPC Design Champion of 2024. The IPC Design Competition is composed of two heats – a virtual preliminary heat and an in-person layout final for the three top competitors on April 9, 2024, at IPC APEX EXPO in Anaheim, Calif.

The virtual preliminary heat will be held January 15 to February 9, allowing designers to use their preferred tools to complete a full board buildup within 25 days. Provided with only a schematic, a component BOM (bill of materials) and a use-case brief, competitors will be responsible for completing the board and exporting a documentation package via Gerber or IPC-2581, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology. Competitors will be judged on their implementation of design rules and layout per IPC standards as well as general implementation of design for excellent (DFX) principles.

“This year, we have placed emphasis on making the design easier to complete in the time allotted. The preliminary designs should take no longer than 10-12 hours for the average designer to complete,” said Patrick Crawford, manager, design standards and related industry programs. “Anyone with an interest in board design can register, but we’re recommending that hobbyists and professionals alike have several years of experience designing boards and a familiarity with and ability to implement IPC standards requirements.”

Three finalists will be invited to participate in the four-hour layout final at IPC APEX EXPO 2024 and will join the IPC India Design Competition Champion to compete. In the final round, competitors will be given a partially complete project file and will have four hours to complete a layout including design rule specification, routing, and component placement. Competitors will be provided complimentary short-term licenses of Altium Designer to use for the finals competition.

Registration for the IPC Design Competition is free and closes January 15, 2024. For more information, including eligibility requirements, information on preliminary and final heats and registration form, visit www.ipc.org/ipc-design-competition-2024.

Electronics Industry Sentiment Slips in Final Month of 2023

IPC Releases December 2023 Global Sentiment of the Electronics Supply Chain Report

Jan 3, 2024

Electronics industry sentiment took a dip in December with New Order, Shipment, and Backlog Indices falling, with only Capacity Utilization Index holding steady. Despite the dip, overall demand sentiment remained in positive territory, per IPC’s December 2023 Global Sentiment of the Electronics Supply Chain Report.

And though materials costs continue to improve, labor costs remain a pain point. Three-fifths (58 percent) of electronics manufacturers say they are currently experiencing rising labor costs.

“In the December survey, IPC asked industry executives what they believed would happen to printed circuit board (PCB) demand for domestically produced PCBs if prices were to decline by 25 percent,” noted Shawn DuBravac, IPC chief economist. “On average, respondents predicted demand would rise by 16 percent. Notably, manufacturers in North America predicted demand would rise by 20 percent on average, higher than in both Europe and APAC.”

Additional survey data show:

The New Order Index fell four points after rising five points in November 2023.
The Labor Costs Index fell two points to 128, the lowest level recorded for this metric.
Over the next six months, electronics manufacturers expect to see continued increase in both labor and material costs, while also anticipating a notable increase in both orders and shipments.
Profit margins are expected to improve somewhat, while ease of recruitment and backlogs are likely to remain challenging.

For the report, IPC surveyed hundreds of companies from around the world, including a wide range of company sizes representing the full electronics manufacturing value chain.

View full report.

“R2-D2 Expert” and Former Principal Concept Technical Director for Walt Disney Imagineering, Paul Bailey, to Keynote IPC APEX EXPO 2024

Jan 2, 2024

Each year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2024 will feature Paul Bailey, mixed-media artist, technologist and vice president and general manager of AOA West, a design, production and project management company in Burbank, Calif.

A former principal concept technical director for Walt Disney Imagineering, Bailey will present the IPC APEX EXPO opening keynote on Tuesday, April 9, “The Art of the Impossible,” discussing the creation of “moonshot” projects like Star Wars: Rise of the Resistance and Millennium Falcon: Smugglers Run and other projects, while discussing the “why” and deep purpose behind the decisions made, as well as the human side of leading a team while attempting projects of this magnitude.

With expertise in illusions, special effects, and show technology integration, Bailey’s extensive work in the themed entertainment industry spans nearly three decades and covers a wide range of storytelling tools, methods, and environments. While at Disney, he worked in multiple roles at Walt Disney Imagineering, totaling 15 years of combined service on global projects. Bailey developed the projection system used in Millennium Falcon: Smugglers Run and directed the delivery of the Star Wars: Rise of the Resistance attraction. He was also responsible for bringing all the Astromech droids to life in the Star Wars: Galaxy’s Edge area of the parks, gaining him the distinction of “R2-D2 expert.”

In addition to Paul Bailey’s opening keynote, IPC President and CEO John W. Mitchell will explore the impact of automation, artificial intelligence, and responsive technology and dispel doubts about the role humans will have in this changing landscape during his keynote, “The Future of the Human Workforce: Maximizing Potential in an Automated World,” on Wednesday, April 10. Closing out IPC APEX EXPO 2024, Shawn DuBravac, IPC chief economist, will deliver the closing keynote on Thursday, April 11 and will ride the wave of change with keynote attendees as he explores the trends revolutionizing the electronics industry, in his keynote, “The Next Wave in Electronics: Trends Reshaping Our Industry.”

Opening and closing keynotes are free to all IPC APEX EXPO participants with advance registration ($50 online and onsite after April 6, 2024). The Wednesday luncheon keynote is included in All-Access, World Convention and Full Technical Conference packages or available as an a la carte purchase. Meetings and courses will run April 6-11; the technical conference and exhibition will run April 9-11, 2023. For more information on schedule and registration options, visit www.IPCAPEXEXPO.org.

2023 Was a Landmark Year for IPC in Government Policy

Dec 21, 2023

By: Chris Mitchell, IPC Vice President, Global Government Relations

In the spirit of reflecting on the year just passed and looking ahead to the new year, here are the highlights of IPC’s government policy advocacy efforts in 2023.

While it’s a bold statement to make, I would venture to say that 2023 was one of IPC’s most successful years ever in having a positive impact in the halls of government. The scope and scale of our collective accomplishments are a new “high water mark,” laying the groundwork for even more success in the years to come.

Just look at all the progress on these items that IPC and its members have been pushing for years:

The “Silicon-to-Systems” Approach: In Q1, the U.S. Government launched the “CHIPS for America” program, including IPC-proposed commitments to devote some CHIPS Act funding to other parts of the electronics ecosystem, including printed circuit boards (PCBs), IC substrates, and advanced packaging. U.S. Commerce Secretary Gina Raimondo reiterated the need for an ecosystem approach on several key occasions, and in November, the Biden administration released a “Vision for the National Advanced Packaging Manufacturing Program” (NAPMP), including roughly $3 billion to drive U.S. leadership in advanced packaging. In September, the U.S. Government and private-sector stakeholders including IPC co-hosted a CHIPS Research and Development Standards Summit, focused on identifying priorities for relevant standards activities and enabling a diverse, standards-capable workforce.
Tangible Funding and Support: IPC’s advocacy of the entire electronics ecosystem is beginning to pay off in tangible funding and support for our industry. For example, IPC members TTM and Calumet Electronics each announced major investments in production of advanced technologies (IC substrates and UHDI, respectively) backed by state and/or federal government authorities. In December, IPC subsidiary U.S. Partnership for Assured Electronics (USPAE) selected seven companies out of 25 finalists to receive a combined $10 million for research and development of cutting-edge commercial technologies with defense capabilities. And on another track with funding from the U.S. Department of Defense, USPAE announced it is developing a new business model that could support advanced PCB manufacturing growth through services, workforce development, and research.
PCBs: After months of IPC advocacy, U.S. President Biden issued a “presidential determination” that greater domestic production of PCBs is critical to national security. A bipartisan team in Congress reintroduced their PCB Act to reinforce the effort. We’re continuing to advocate for more resilient, trusted, and secure defense electronics supply chains in all nations.
Workforce Development: In November, the U.S. Department of Labor (DOL) approved IPC’s National Program Standards of Apprenticeship – the first-ever in the U.S. electronics manufacturing industry – in a move designed to expand the skilled workforce for this strategically vital industry. The DOL’s action affirms that IPC’s Registered Apprentice programs are recognized nationally and provide valuable, hands-on experience with a defined pathway to secure, well-paying careers. Six companies – ASMPT, Calumet Electronics, Flex, Microboard, Out of the Box Manufacturing, and TTM Technologies – have endorsed the apprenticeship initiative to the DOL, signaling their interest in launching programs within their companies.
Sustainability in Electronics: Acknowledging all the efforts underway in all parts of the world to encourage greener, more sustainable economies, IPC this year launched a Sustainability for Electronics Leadership Council and several Action Groups; and we published a white paper on the key sustainability issues facing our industry.
PFAS Bans: Meanwhile, we rallied the industry to face the prospect of partial or full bans on PFAS chemicals, and we joined with allies in submitting comments in those proceedings in Europe and the United States.
Electronics in Europe: The European Institutions in April reached agreement on the European Chips Act and in November launched the Chips Joint Undertaking (Chips JU), the public/private body that will manage chips research, development, and innovation (R&D&I) projects at the EU level. IPC maintained a fruitful, ongoing dialogue with the European Commission, and together with partners and stakeholders we submitted a report with recommendations to bolster Europe’s PCB and EMS sectors.
EU Reporting Burdens: IPC urged the European Commission to reduce the reporting burden on electronics manufacturers in the European Union, responding to the EC’s call for evidence on the requirements that cause the most administrative burden. IPC will continue to engage with the European Commission to reduce administrative burdens linked to reporting requirements by at least 25%.
Industry Thought Leadership: In our role as the voice of electronics manufacturing, IPC released major reports on IC substrates; the European PCB and EMS sectors; and sustainability in electronics design and manufacturing, not to mention our regular economic outlook reports and industry sentiment surveys.
New Faces: Over the course of the year, IPC welcomed several new faces in its Washington office. Richard Cappetto, a 14-year veteran of the U.S. House of Representatives, is our new senior director for North American government relations; Michelle Mermelstein is the new senior director of media engagement; Nyron Rouse is the new director of government grants and strategic funding initiatives; and Kate Koger is our new public affairs coordinator. The rest of the team is Kelly Scanlon, lead sustainability strategist; Alison James, senior director of European government relations; and yours truly, Chris Mitchell, VP of global government relations.
Member Input: The IPC GR Committee has been rejuvenated with the addition of several new members, and IPC hosted an EMS Summit to gather more input and policy priorities from that key sector.

We welcome you to join us. In 2024, the IPC GR Team will continue to advocate for you, your company, and the entire industry on all these issues and more. Our efforts may include meetings, calls, and letters with government officials; official comments in regulatory proceedings; and educational events, reports, social media posts, and media coverage.

We need and welcome your participation in any of this important collective work. Here’s how you can stay informed and involved:

Take IPC’s five-minute survey on what’s important to you and contact your elected officials via the IPC Action Alert Center.
Follow us LinkedIn and share our posts with your networks.
Subscribe to IPC Global Advocacy Report: If you are a member of IPC, manage your e-mail preferences and opt in to receive “Advocacy” updates. If you are not an IPC member or not sure — please send a note to friends@ipc.org, and our staff will add you to the list. See prior editions of Global Advocacy Report.
Explore our IPC Government Relations information online.
Contact one of us if you have any questions or insights to contribute.

We thank you for your support and look forward to making more progress in the months ahead.

North American EMS Industry Shipments Up 0.2 Percent in November

IPC releases EMS industry results for November 2023

Dec 20, 2023

IPC announced today the November 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.23.

Total North American EMS shipments in November 2023 were up 0.2 percent compared to the same month last year. Compared to the preceding month, November shipments decreased 1.4 percent.

EMS bookings in November decreased 10.1 percent year-over-year and increased 4.3 percent from the previous month.

“Despite a small rise in new orders this month, the year-to-date trend deteriorated to its lowest point in 2023,” said Shawn DuBravac, IPC chief economist. “With one month remaining in the year, shipments should end the year higher compared to last year, despite weak order flow.”

November 2023 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

North American PCB Industry Shipments Down 22.5 Percent in November

IPC releases PCB industry results for November 2023

Dec 20, 2023

IPC announced today the November 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.97.

Total North American PCB shipments in November 2023 were down 22.5 percent compared to the same month last year. Compared to the preceding month, November shipments were down 16.3 percent.

PCB bookings in November were down 9.2 percent compared to the same month last year. November bookings were down 9 percent compared to the preceding month.

“PCB shipments were roughly five percent below our expectations for the month. The year-to-date trend fell to its lowest point of the year,” said Shawn DuBravac, IPC chief economist. “Weak order flow in November suggests the year will likely end on a flat note.”

PCB book to bill ratio chart November 2023

PCB book to bill ratio chart 2 November 2023

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

Overcoming the Challenges for Implementing IPC J-STD-001 in Your Factory

WEBINAR REGISTRATION

Date

Feb 7, 2024 | 12:00 - 1:01pm CST

Implementation of a new process, machine, or material triggers a qualification event for that change under the new H revision of IPC J-STD-001.

When a change in specific materials is being considered, one must determine and provide objective evidence that the improvement does not increase the quality or functionality risk of the product. In order to quantify the risk, the CM and/or OEM are required to acquire quantitative data before implementing the process change. The methodology developed in this webinar is designed to assist the user in incorporating specific tools and analytical measurements to ensure the product’s reliability via objective evidence and controls. This webinar illustrates the challenges of a real-life implementation of a new material change and the subsequent qualification.

Speaker Bio

Denis Barbini, Ph.D., is an esteemed electronics manufacturing and assembly professional. Formerly the Associate Director of the A.R.E.A. Consortium, he led the identification of critical needs in emerging technologies and assembly processes. With extensive hands-on experience, Denis has provided invaluable guidance and solutions to companies worldwide. His expertise lies in implementing cost-effective, reliable, and robust processes for electronic devices. Recently, he transitioned to the role of ZESTRON's Technical Solutions Manager, leveraging his 25 years of experience to drive the development of critical projects and explore new industry sectors. Denis's technical prowess, extensive experience, and commitment to innovation make him a respected authority in the field, shaping advancements and enabling excellence in manufacturing processes.

WEBINAR REGISTRATION

IPC Hand Soldering Competition 2024 Regional Qualification - United Kingdom

Date

Feb 6 - 8, 2024 | All day

Join the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) to take place at Farnborough International Exhibition Centre on 6-8 February 2024.

Skilled soldering experts (F/M) will be competing for 60 minutes on a complex circuit board assembly to win the 2024 National title, earn a cash prize , and compete for a coveted spot at the IPC Hand Soldering World Championship later this year.

Competition for Professionals

The professional competitors will be judged by IPC Master Instructors (MIT) on soldering a complex printed circuit board with a maximum time of 60 minutes under IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality of the assembly, and the speed at which the assembly was produced.

Prizes for Professionals

Cash prizes will be awarded to the professionals: the winner and two runners-up.

1st place – 300€
2nd place – 200€
3rd place – 100€

IPC Hand Soldering World Championship: The winner at Instrutec will be invited by IPC (all expenses covered by IPC) to compete in the HSC World Final in November at Electronica tradeshow in Munich, Germany.

Hand Soldering Best Company Team Award: This year again, nominate a team to win the Hand Soldering Best Company Team Award. For any company enlisting 2 or 3 competitors, the highest combined scores of competitors from the same company will determine which company will receive the HSC Best Company Team Award.

Registration is free of charge.

You do not need to be an IPC member to take part.

You do not need to be IPC-certified to take part.

How to register?

Fill in the registration form and book your competition slot.

You will receive a confirmation email specifying your date and time to compete.

The deadline for registration is set to 02.02.2024.

For more information, please contact Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org).

Farnborough International Convention Center - Regional HSC Competition - UK

Show Centre, Etps Road
Farnborough
GU146FD
United Kingdom

Farnborough International Convention Center - Regional HSC Competition - UK

Farnborough International Convention Center - Regional HSC Competition - UK
Show Centre, Etps Road
Farnborough, GU146FD
United Kingdom

Test Methods to Validate Acceptable Levels of Flux and Other Process Residues on Production Assemblies

WEBINAR REGISTRATION

Date

Jan 10, 2024 | 1:00 - 2:00pm EST (12:00 - 1:00pm CST)

Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is the number of soldering process steps used to build the assembly. Selective soldering, wave soldering, manual, and rework soldering can spread flux residues across the assembly. Pockets of active residue can be present when the flux is not fully heat-activated. For high reliability, the best practice is to clean the assembly.

This webinar will teach best practices for qualifying and validating acceptable electrical hardware performance. The methods taught during this presentation can be used to meet the requirements of IPC J-STD-001H ~ Section 8: Cleanliness.

Speaker Bio

Dr. Mike Bixenman, Chief Technology Officer (CTO) and co-founder of KYZEN Corp. and Magnalytix, LLC, has over 30 years of experience designing electronic assembly cleaning materials and process integration. Sharing his research, knowledge, and expertise is Mike’s passion. He believes in the power of collaboration by working with others to solve problems quickly. An active member of several industry associations, he has chaired and led many committees, symposiums, and task groups committed to understanding the cleaning and reliability challenges of today’s ever-changing electronics industry. Dr. Bixenman holds four earned degrees, including a Doctorate in Business Administration (DBA).

WEBINAR REGISTRATION