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Event Location

4, 129, Mount Poonamallee Rd
Manapakkam
chennai 600089
Tamil Nadu
India

Event Venue Website
https://radhahotels.com/feathers-chennai/

Event Location

Event Location
4, 129, Mount Poonamallee Rd
chennai, TN 600089
India

Electronics Industry Welcomes Reintroduction of Bipartisan Proposal to Boost U.S. Printed Circuit Board Sector

Legislation complements Biden’s “Presidential Determination” on PCBs

The electronics manufacturing industry is welcoming the reintroduction of bipartisan legislation in the U.S. Congress that would help rebuild the country’s printed circuit board (PCB) sector.

The Protecting Circuit Boards and Substrates Act, reintroduced today by Reps. Blake Moore (R-UT) and Anna Eshoo (D-CA), incentivizes purchases of domestically produced PCBs as well as support industry investments in factories, equipment, workforce training, and research and development.

The legislation comes amid increasing attention to the wider electronics supply chain into which semiconductors fit. In March, President Joe Biden issued a “Presidential Determination” under the Defense Production Act (DPA) that prioritizes the domestic manufacture of PCBs as a matter of national security. The month before, U.S. Commerce Secretary Gina Raimondo told a podcast that “circuit board” companies would have opportunities for CHIPS Act funding.

IPC President and CEO John W. Mitchell said, “This bipartisan bill addresses well-known vulnerabilities in U.S. electronics manufacturing, taking a ‘silicon-to-systems’ approach that prioritizes greater innovation and resiliency across the entire industry. We thank Reps. Eshoo and Moore for their leadership, and we call on all Members of Congress to support this bill.” 

PCBs are as integral to electronics as semiconductor chips, their better-known partners. They are the physical platform upon which microelectronic components such as chips and capacitors are mounted and interconnected. Electronic systems cannot function without PCBs.  

However, according to “Leadership Lost,” a report published by IPC, the United States “has lost its historic dominance in the PCB sector.” Since 2000, the U.S. share of global PCB production has fallen from over 30% to just 4%, with China now dominating the sector at around 50%. Any loss of access to non-domestic sources of PCBs would be “catastrophic,” the report said.

Numerous government and industry reports have raised the alarm for almost 20 years. For example, a 2018 Commerce Department report characterized the sector as “dying on the vine,” and the department’s 2022 report on the information and communications technology (ICT) industry noted the same supply chain risks.

Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets

IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) requalification to Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif.

Arlon produces and sells military-grade, copper-clad laminates, prepregs, and packaging substrates to the global electronics industry. The company continues to be listed as an IPC-4101E trusted source capable of manufacturing in accordance with industry best practices for IPC slash sheets 40, 41, and 42, the polyimide-based slash sheets covered in IPC-4101E. Arlon successfully requalified their product, 85N to slash sheets 40 and 41 of IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards. Arlon successfully requalified their product, 37N to meet the requirements of slash sheet 42 from the same standard.

According to John Wright, Arlon’s director of quality, “Having our polyimide products listed on IPC’s Validation Services Qualified Products List gives our customers the assurance that our processes and products continue to meet or exceed IPC-4101 slash sheet specifications.” Wright commented further by saying, “As a supplier into the global aerospace, industrial, and military markets, we feel that IPC’s Validation Services program provides our customer base the confidence that Arlon’s products will consistently meet their design and performance requirements.”

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes that conform to IPC standards.

“Arlon has differentiated itself from the competition in the polyimide market by becoming part of IPC's global network of trusted industry sources,” said Randy Cherry, IPC director of Validation Services. “We are pleased to recognize Arlon for their requalification and being the first U.S. facility as a trusted supplier conforming to IPC-4101E as well as covering all three polyimide specification sheets.”

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.     

Arlon and other trusted sources of suppliers can be found on IPC's QML/QPL (Qualified Product Listing) database at www.ipcvalidation.org.   

IPC and ITI to Host 2023 Virtual Conference on Critical and Emerging Environmental Product Requirements

IPC and the Information Technology Industry Council (ITI) will host a virtual conference, “Critical and Emerging Environmental Product Requirements” on June 6 from 11:00 am to 3:30 pm EDT. The event will explore the latest environmental requirements that impact product design, manufacturing, supply chain management, and technology innovation.

Speakers include leading technical and environmental regulatory experts Nicolas Robin from Plastics Europe; Elizabeth Nichols, Ph.D., from the U.S. Department of State Bureau of Oceans and International Environmental and Scientific Affairs, Office of Environmental Quality; and Julian Lageard and Kevin Wolfe from Intel Corporation.

Robin will cover PFAS restrictions; Dr Nichols will present an overview of U.S. efforts to enhance circularity; Lageard will address PFAS restrictions and how they will impact the electronics manufacturing industry; and Wolfe will recommend pathways to understand and respond to developing regulatory restrictions, with an aim to avoid disruptions to supply chain and manufacturing.

In addition to learning from featured speakers, attendees will participate in a panel with members of the Strategic Management Team of the RoHS Umbrella Industry Project. Project Chairs Steven Andrews, Assent; Sue Fortunato-Esbach, Assent; and Michael Müller, Ph.D., Rosenberger GmbH, will foster discussion on discussion on RoHS specific issues including the latest status of the RoHS 2 Review, the latest news on Exemption Packs, and latest developments on additional restricted substances.

“Staying ahead of environmental policies and regulations can be complicated, but it is critical,” said Suhani Chitalia, IPC manager of environmental regulatory affairs. “Any misunderstanding or misinterpretation of these regulations could impart dire production disruptions and financial burdens. This conference will provide anyone who is responsible for keeping their organization in compliance with environmental regulations the tools they need.”

“Environmental compliance regulations worldwide are dynamic and fluctuating,” said Chris Cleet, ITI vice president of policy, environment and sustainability. “This annual conference gives companies a unique opportunity to engage with key government officials and subject matter experts about the current policy landscape and what lies ahead. Empowering resources compliance professionals is also a top priority and attendees will be able to provide critical feedback on what’s needed to effectively navigate new regulations and stay ahead of future changes.”

The event is sponsored by Benchmark Gensuite, Source Intelligence, and GreenSoft Technology, Inc.

For detailed information on the agenda, speakers or to register for the “ITI and IPC Conference on Critical and Emerging Environmental Product Requirements,” visit www.ipc.org/event/critical-environmental-requirements-electronics-conference-2023.

Road to Reliability: High Voltage (e-Mobility Electronics Hardware Reliability Webinar Series)

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Date
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We are delighted to announce that Dr. Helmut Schweigart from Zestron, Michael Schleicher of Danfoss-Semikron, and Bob Neves of Microtek Laboratories will participate in the upcoming session. They will address essential topics related to high-voltage systems, such as Testing, Corrosion, and Failure Modes. As high voltages introduce unique challenges, there is an increased possibility of system failures.

Our "Road to Reliability" series aims to bring industry leaders together to discuss the hurdles in achieving reliability for new e-mobility technology. We will examine reliability drivers, technology applications, and target lifecycles.

Join us for this informative session to better understand technology gaps, broaden your professional connections, and uncover strategies for meeting reliability objectives.

Moderator: Brian O'Leary, Indium Corporation

We want to thank our Road to Reliability series sponsor: Indium Corporation

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IPC/IMAPS On-Shoring Advanced Packaging and Assembly Workshop

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Date
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Bringing together government agencies, the Defense Industrial Base (DIB) and advanced packaging and assembly providers, the workshop will focus on efforts to onshore advanced packaging and identify newly created programs to address U.S. Government and Defense requirements critical to microelectronics assembly and packaging supply chain onshoring.

The workshop will feature two days of focused sessions by invited speakers, a panel discussion, and a variety of networking opportunities.

Keynotes include:

  • “CHIPS” presented by Eric Lin, U.S. Department of Commerce
  • “DPA/Title III and ICAM/IBAS Activity” presented by Anthony Di Stasio, Office of the Under Secretary of Defense (A&S)  
  • “Next Generation Microelectronics Manufacturing (NGMM)” presented by Carl McCants, Ph.D., DARPA
  • “DoD ME Commons” presented by Dev Shenoy, Ph.D., Office of the Undersecretary of Defense and Director of the Defense Microelectronics Cross Functional Team

The event will kick-off on Monday, July 10 with a pre-program day with two-hour professional development courses and working group sessions addressing a variety of topics relevant to the onshoring of advanced packaging. 

IPC/IMAPS On-Shoring Advanced Packaging and Assembly Workshop

Westin Tysons Corner
7801 Leesburg Pike
Falls Church, VA 22043
United States

IPC/IMAPS On-Shoring Advanced Packaging and Assembly Workshop

IPC/IMAPS On-Shoring Advanced Packaging and Assembly Workshop
Westin Tysons Corner
Falls Church, VA 22043
United States

LEARN MORE

IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington, D.C.

Bringing together government agencies, the Defense Industrial Base (DIB) and advanced packaging and assembly providers, the workshop will focus on efforts to onshore advanced packaging and identify newly created programs to address U.S. Government and Defense requirements critical to microelectronics assembly and packaging supply chain onshoring.

The workshop will feature two days of focused sessions by invited speakers, a panel discussion, and a variety of networking opportunities.

Keynotes include:

  • “CHIPS” presented by Eric Lin, U.S. Department of Commerce
  • “DPA/Title III and ICAM/IBAS Activity” presented by Anthony Di Stasio, Office of the Under Secretary of Defense (A&S)  
  • “Next Generation Microelectronics Manufacturing (NGMM)” presented by Carl McCants, Ph.D., DARPA
  • “DoD ME Commons” presented by Dev Shenoy, Ph.D., Office of the Undersecretary of Defense and Director of the Defense Microelectronics Cross Functional Team

The event will kick-off on Monday, July 10 with a pre-program day with two-hour professional development courses and working group sessions addressing a variety of topics relevant to the onshoring of advanced packaging. 

“Our message to policymakers is that building a more robust, domestic ecosystem for advanced electronics will require a few key policy decisions: investment in advanced packaging capacity and research and development, supply chain partnership promotion and strategic decisions on what we are building and for whom,” said Matt Kelly IPC chief technical officer and member of event organizing committee. “This workshop brings all the important players to the table – policy makers, the Defense Industrial Base, and commercial suppliers – all who have a goal to improve on advanced packaging and assembly onshoring strategies.”

For detailed information on the agenda, speakers or to register for the “On-Shoring Advanced Packaging and Assembly” workshop, visit http://www.imaps.org/onshoring.

 

Eskilstuna Elektronik Partner AB Requalifies for IPC J-STD-001/IPC-A-610 Qualified Manufacturers Listing

IPC's Validation Services Program has awarded an IPC J-STD-001/IPC-A-610 Qualified Manufacturers Listing (QML) Class 3 requalification to Eskilstuna Elektronik Partner AB (EEPAB), located in Esklistuna, Sweden. Eskilstuna Elektronik Partner AB continues to be a trusted source and supplier to original equipment manufacturers (OEMs), meeting the stringent requirements of two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.

Eskilstuna Elektronik Partner AB is a full-service provider -- from idea to finished solutions -- developing products to the specific needs and conditions for each client.

During the IPC Validation Services QML audit, Eskilstuna Elektronik Partner AB fulfilled or exceeded the requirements for the electronics industry’s most rigorous classification, Class 3, which is intended for high-performance electronics assemblies. The company continues to be recognized as an IPC trusted source capable of manufacturing in accordance with industry best practices.

IPC's Validation Services QPL/QML Programs were developed to promote supply chain verification and recognition. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize Eskilstuna Elektronik Partner AB for maintaining their participation in IPC's network of trusted suppliers.”

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org  or call +1 847-597-2892.

New to IPC Membership? Now What?

Date
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Wondering how to make the most of your IPC membership? We can help.
This free 30-minute webinar presented by Logan Smith, Member and Customer Support Team Lead, will show you how to navigate the membership website pages to access all your benefits and how to participate in all the activities that IPC membership has to offer.

The webinar will cover:

  • Getting started with IPC membership
  • Access to free documents and courses
  • Technical resources
  • Promoting your company to the industry

Register

Global Banking Crisis Continues; Inflation Rates Remain Stubbornly High in Both Europe and the United States

IPC Issues April Economic Outlook Report

Economic data over the last month indicates that while inflation remains stubbornly high, economic growth is slowing. The base case scenario for the United States right now suggests a recession in the middle two quarters of the year. The U.S. economy should grow about 1.2 percent this year, but growth in the back half of the year will be weak.

Germany recently raised its economic growth forecast for the year to 0.4 percent, up from the previous 0.2 percent, but the environment in both the United States and Europe remains persistently difficult. It remains uncertain how sharply higher interest rates will fully impact the economy.

“Supply constraints are easing everywhere which on the surface looks like a good thing. But it likely also means that backlogs will wane in the second half of the year. In the absence of new demand, output will likely be weak,” said Shawn DuBravac, IPC chief economist.

Additional data in the April 2023 IPC Economic Outlook show:

  • The U.S. economy grew 1.1 percent in the first quarter, coming in below an expected rise of 1.9 percent. However, the headline number masks underlying strength in the economy.
  • U.S. manufacturing sentiment contracted for the fifth consecutive month in April. The manufacturing PMI rose 0.8 percentage points in the last month, but not enough to move back into expansionary territory.
  • The European economy grew during the first quarter of the year, edging up 0.1 percent in the euro area and up 0.3 percent in the EU. The economy is up 1.3 percent in both areas compared to the first quarter of last year.
  • In the EU, manufacturing output in electronics end markets rose in February, increasing 1.3% from the prior month and 2.9% from the year-ago period.

View April 2023 IPC Economic Outlook. For more information on IPC’s industry intelligence program including current research and reports, visit www.ipc.org/advocacy/industry-intelligence.

 

 

 

 

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