IPC Events: Build Electronics Better with Standards and Solutions Conference - Powered by FLEX

Date
- (4:00 - 10:00am CDT)

IPC Day Romania: Build Electronics Better with Standards and Solutions, Conference Powered by Flex, will provide a unique opportunity to learn about the latest advancements in electronics manufacturing, participate in industry discussions, and network with a community of professionals dedicated to building electronics better, in the city of Timisoara - 2023 European Capital of Culture!

Presentation and panel discussions will feature industry experts in electronics reliability, e-mobility, medical meets 5G, education and training, and IPC leadership. The world-class lineup includes speakers and panelists from NASA, Stellantis, Bosch, Flex, Indium, TTM Technologies, Viscom, Nokia, IPC, The Polytechnic University, and Vitesco. Complete agenda coming soon!

Topics include:

  • Electronics Reliability
    • Introduction to solder joint reliability standards & simulations,
    • electronics reliability in space applications.
  • E-mobility Reliability Panel
  • Medical meets 5G
  • Education and Training – University studies and IPC certification and training programs
  • IPC opportunities to participate in standards development, educational opportunities, and events

Who should attend?

  • Manufacturing, quality, and design engineers
  • Members of Academia
  • Senior and junior engineering students
  • Specialist or Practitioner in Manufacturing 

Location: Auditorium of the Library of the Polytechnical University in Timisoara, Romania
Bulevardul Vasile Pârvan 2
300073 Timișoara, Romania

Download the event's agenda here.

Registration

Registration is free. Please complete the form to register.

Hotel Information

Check-in and check-out dates can be adjusted until 15 September 2023.

To take advantage of these room blocks, please send an email to andreaturcott@ipc.org before 15 September 2023 including your request for hotel and indicate which hotel you prefer along with check-in and checkout dates. We will send you your confirmation number. 

Important note: Cancellations/modifications are free of charge until 15 September.

Hotel Timisoara

Hotel Timisoara
Mărășești 1-3
Timișoara 300086, ROMÂNIA

Room blocks available: check-in 26/9- check-out 29/9, price between 95 EUR and 140 EUR per night.

NH Timisoara

NH Timisoara 
Strada Johann Heinrich Pestalozzi 1/a, Timișoara 300115, ROMÂNIA

Room blocks available: check-in 26/9- check-out 29/9, breakfast included price between 81 EUR and 126 EUR per night.

Del Corso Hotel

Del Corso Hotel 
Calea Bogdăneștilor 18
Timișoara, ROMÂNIA

Room blocks available: check-in 26/9- check-out 29/9, breakfast included price between 131 EUR and 140 EUR per night.

Auditorium of the Library of the Polytechnical University in Timisoara, Romania

Bulevardul Vasile Pârvan 2
300073 Timișoara
Romania

Auditorium of the Library of the Polytechnical University in Timisoara, Romania

Auditorium of the Library of the Polytechnical University in Timisoara, Romania
Bulevardul Vasile Pârvan 2
Timișoara, 300073
Romania

Cost Pressures Receding as Industry Expects Some Sector Growth in 2023

IPC Releases April Global Sentiment of the Electronics Supply Chain Report

Per IPC’s April 2023 Global Sentiment of the Electronics Supply Chain Report, last month delivered a mixed bag of industry sentiment: cost pressures are receding; industry demand appears to be slowing; and industry expects growth in some sectors.  

Survey results show:

  • 54 percent of respondents reported that labor and material costs are rising, but the number of companies experiencing rising costs continues to decline.
  • The Orders Index slipped to 105. While this is still in expansionary territory, it is the lowest it has been since the start of the survey.
  • Industry believes the military sector will grow 16 percent on average this year, followed by the aerospace sector and the communications sector which are both expected to grow by roughly 11 percent. The medical sector is expected to rise 10 percent. 
  • The automotive sector and industrial electronics sector are both expected to rise 5.6 percent. The consumer electronics sector is expected to decline 3 percent and the computer sector is expected to decline 7 percent in 2023.

“Over the next six months, electronics manufacturers expect to see continued increase in both labor and material costs,” said Shawn DuBravac, IPC chief economist. “Meanwhile, backlogs, ease of recruitment, and profit margins are expected to contract."                       

For the report, IPC surveyed hundreds of companies from around the world, including a wide range of company sizes representing the full electronics manufacturing value chain.

View full report.

Teledyne Cable Solutions Awarded IPC/WHMA-A-620 Qualified Manufacturers Listing

IPC's Validation Services Program has awarded an IPC/WHMA-A-620 Qualified Manufacturers Listing (QML) Class 3, to Teledyne Cable Solutions (Division of Teledyne Marine Interconnect Solutions), in Dallas, Texas. Teledyne Cable Solutions, with over 50 years of experience in providing cable solutions, has been added to the trusted quality supplier list meeting the stringent requirements of IPC’s foremost Standard: IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.

Teledyne Cable Solutions has fulfilled or exceeded the requirements for the electronics industry’s most rigorous classification, Class 3, which is intended for high performance electronic cable assemblies and continues is recognized as an IPC trusted source capable of manufacturing in accordance with industry best practices.

IPC's Validation Services QPL/QML Programs were developed to promote supply chain verification and recognition. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provide technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize Teledyne Cable Solutions for becoming part of IPC's network of trusted suppliers.”

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or call +1 847-597-2892.

Nathan Edwards to Lead USPAE as New Executive Director

Effective May 1, 2023, Nathan Edwards will transition into the role of executive director of the U.S. Partnership for Assured Electronics (USPAE). Currently serving as director of government development, Edwards will replace Chris Peters who will continue with the organization as a senior advisor, providing continuity and focus on special projects.

As executive director of USPAE, Edwards will be responsible for establishing and growing the organization to help ensure the U.S. Government has access to trusted, secure, and resilient electronics supply chains. One of the organization’s signature programs is the $42 million Defense Electronics Consortium, which provides a contract vehicle for the Department of Defense (DoD) to work on electronics-related challenges with trusted partners in industry and academia, including small and medium-sized innovators that typically do not do business with DoD.

 Edwards joined USPAE in August 2022 after being highly recommended by several members of the electronics manufacturing community. He has significant electronics expertise stemming from an impressive academic record and valuable experience in commercial and government environments. Much of that experience involves security of microelectronics and hardware systems, including five patents for the protection of embedded technologies. Edwards’s previous employers have ranged from Medtronic and Boeing to Sandia National Laboratories. He also has supported the Trusted and Assured Microelectronics program under the Office of the Secretary of Defense.

“Nathan’s electronics expertise and experience in both commercial and government segments make him ideally suited to continue the growth of USPAE,” said board member and retired Navy Rear Admiral Kevin Sweeney. “Chris has done a superb job as founding director and we’re grateful that he will help transition Nathan into this leadership role.”

Adds John W. Mitchell, IPC president and CEO and USPAE board member, “We’re fortunate to have both Nathan and Chris as part of the USPAE leadership team. “Nathan knows the U.S. Government customer well, including the Department of Defense, and has substantial technical expertise. His work at USPAE will help us bridge the gap between industry capabilities and the governments’ needs for electronics that support our national and economic security. Chris’s extensive experience in driving the innovation and adoption of solutions throughout manufacturing supply chains has helped connect the electronics industry and government.”

For more information on USPAE, visit www.USPAE.org or send inquiries to info@uspae.org.

North American PCB Industry Sales Up 11.6 Percent in March

IPC releases PCB industry results for March 2023

IPC announced today the March 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.91.

Total North American PCB shipments in March 2023 were up 11.6 percent compared to the same month last year. Compared to the preceding month, March shipments were up 30.1 percent.

PCB bookings in March were down 10.5 percent compared to the same month last year. March bookings were up 2.3 percent compared to the preceding month.

“The book-to-bill slipped this month, but this was driven in part by strong shipments,” said Shawn DuBravac, IPC chief economist. “Order flow is holding steady, but at lower levels than a year ago.”  

March 2023 PCB book to bill ratio chart 1
March 2023 PCB book to bill ratio chart 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

North American EMS Industry Down 3.1 Percent in March

IPC releases EMS industry results for March 2023

IPC announced today the March 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.28.

Total North American EMS shipments in March 2023 were down 3.1 percent compared to the same month last year. Compared to the preceding month, March shipments increased 6.2 percent.

EMS bookings in March decreased 7.1 percent year-over-year and increased 9.9 percent from the previous month.

“The pattern that emerged in Fall 2022 continued into March. EMS shipments continue to show strength as supply chain challenges dissipate but order flow remains weak,” said Shawn DuBravac, IPC chief economist.

March 2023 EMS book to bill chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

European Chips Act Crosses the Finish Line as IPC Looks to the Future

Apr 21, 2023
| By Sandy Gentry

By Alison James, senior director, European government relations

This week, the European Institutions reached provisional agreement on the European Chips Act, paving the way for the region’s introduction of an important framework to build out innovation in the European semiconductor ecosystem and security of supply for Europe’s industries.

The European Chips Act, proposed by the European Commission in February 2022, has been the subject of negotiation with the European Parliament and the EU Council (Member States). While this week’s agreement must still be finalized, endorsed and formally adopted by both institutions, it sets the wheels in motion for the roll-out of Europe’s own Chips Act. Formally, following adoption, the EU Council will pass an amendment for the establishment of the Chips Joint Undertaking under Horizon Europe. Both legal texts will be published at that time.

IPC welcomes the European Chips Act as an important step towards strengthening European leadership in innovation and secure and resilient supply chains. In the negotiation process, IPC strongly welcomed fresh emphasis brought by the European Parliament to strengthening European semiconductor packaging capability and enabling a more robust electronics ecosystem. Throughout the process, IPC has urged the adoption of a final package that reflects the strategic role of advanced packaging in driving semiconductor innovation and ensures needed funding is allocated accordingly (see our position on the initial draft legislation).

In an executive meeting with European Government officials organized by IPC and iMAPS on April 13th, industry leaders welcomed the imminent adoption of the Chips Act and its inclusion of packaging in scope. They discussed next steps needed to enable European leadership in back-end segments of the value chain, including IC substrate fabrication and semiconductor assembly & test. The meeting also included leading European EMS and Printed Circuit Board companies that underscored the next steps needed to support a more resilient European electronics manufacturing ecosystem “silicon-to-systems.”

A silicon-to-system strategy would enhance the region’s capabilities and capacities to package semiconductors into advanced components but also include the assembly of those components onto printed circuit boards. This entire silicon to systems ecosystem is necessary to support Europe’s digital and green transitions.

IPC applauds the dedicated work of the European institutions in their negotiation process on the Chips Act.  We remain committed to working with the EU Institutions, the industry and other key stakeholders in the Chips Act implementation, as well as the region’s broader initiatives to realign industrial policies to address vital vulnerabilities and ensure a more competitive, resilient and sustainable electronics industry. 

For more information on the European Chips Act and Industrial Strategy, contact me at AlisonJames@ipc.org.

 

 

Spring Issue of IPC Community Now Available for Download

The Spring issue of IPC Community is now available for download. This quarterly publication was created with IPC members and industry in mind! In this issue, readers will find articles, interviews, columns, graphics, surveys, IPC member benefits, and so much more.

Each issue is designed to celebrate the success between IPC and its members and how this relationship benefits the entire electronics manufacturing industry.  

What’s inside? Here are just a few of the features in this edition:

  • Industry intelligence from Shawn DuBravac regarding the impact of shipping costs this year on electronics manufacturers
  • What it means to validate to IPC-1791 and become a Trusted Supplier for the DoD
  • How a seasoned industry insider teamed up with a newcomer to shake up the standards committees
  • Mexico is on the move and IPC is making inroads with important aerospace and automotive clusters
  • How IPC is evaluating sustainability efforts within the industry, as well as the impact of PFAS chemicals and expectations for manufacturers

Download a copy.

IPC Forum: IPC Issues Call for Participation for High Reliability Forum

IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments. The High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport in Linthicum (Baltimore), Md.

IPC invites innovators and technologists to submit an abstract for a technical presentation during the conference. The IPC High Reliability Technical Forum Program Committee seeks proposals for technical presentations on the following topics:

  • High Reliable Materials: PCB Fabrication Materials, Interconnecting, Bonding, Thermal/Power Management, Conductivity/Resistivity, Use Conditions/Environment (A&D vs. Automotive vs. Medical/Implantable vs. High Perf Computing, etc.), Environmental Restrictions/Impact, Substrates for Advanced Packaging
  • Design and Fabrication for High Reliability: Materials Compatibility, Flexible Printed Boards in RF/Microwave Applications, Design for Reliability/Determining Reliability Requirements, System of Systems Architecture, Levels of Redundancy, HDI/Microvia Reliability -- Test Methods and Design Rules, Micro HDI and Substrate Technologies, First Level Interconnect Methodologies; Use of Simulation in the Design Process, Automotive/High Voltage Applications
  • Assembly for High Reliability: Next Generation Solder Alloys, Solder Paste and Coating Selection for High Reliability, Reliability of Cleaning, Testing and Coating Strategies, Assembly Materials -- Coating, Cleaning, Underfilling, Encapsulation, Effects of No-Clean Residues, Voiding in Solder Joints, 3D Package Level Reliability, Assembly for Automotive/High Voltage Applications
  • Testing for High Reliability: Fatigue Behavior and Reliability Testing for Solder Joints using Next Generation Solder Alloys, Harsh Environment Reliability and Testing, Thermal Stress Test Methods, Connector Failure Modes and Reliability, Vibration and Shock Test Methods for Predicting Reliability, HDI/Microvia Reliability, Automotive/High Voltage Applications, Heterogeneous Integration/Advanced Packaging for High Reliability
  • Issues around Quality, Standards for High Reliability: Supply Chain, Reshoring/Onshoring, Failure Modes Effects Analysis (FMEA), Reliability Assurance and Prediction Workflows, Selection of Appropriate Class of Electronics, Requirements for Specific Class of Electronics, Manufacturing Standards, Emerging Electronic Technologies

“We are thrilled to welcome attendees back to the first High Reliability Forum since 2019,” said David Bergman, IPC vice president of standards and technology. “We are eager to see the exciting new work from experts in all areas of the industry including PCB design, fabrication materials, emerging technologies, and other applications with specialized reliability requirements.”

Abstracts summarizing original and previously unpublished work must be submitted for consideration to present. Presentations should be non-commercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest, and contain technical and/or appropriate test results.

Abstracts are due on Monday, June 5, 2023 and will be peer-reviewed by the Technical Program Committee. Accepted abstracts will be invited to deliver a podium presentation in person at the High Reliability Forum in Linthicum Heights, Maryland, October 17-19, 2023.  

For more information or to submit an abstract, visit www.ipc.org/event/high-reliability-forum. For questions regarding general event information, contact Julia Gumminger, IPC professional development and events manager, at JuliaGumminger@ipc.org.

For exhibit and sponsorship opportunities, contact Alicia Balonek, senior director, trade shows and events, at AliciaBalonek@ipc.org.

Helping the Electronics Manufacturing Industry Build Electronics Better

Industry professionals to meet at IPC SummerCom to develop internationally recognized standards

Hundreds of experts from around the world will discuss electronics manufacturing standards in more than 80 meetings May 13–18 at IPC SummerCom in Milwaukee.

Facilitated by representatives from OEMs, PCB manufacturers, EMS providers, design firms, and other organizations, IPC standards development committees establish benchmarks for excellence in electronics manufacturing.

According to David Bergman, IPC vice president of standards and technology, IPC has more than 300+ active multilingual standards that cover nearly every stage of the electronics development product cycle.

“IPC SummerCom is all about IPC standards, and through standards development committee meetings, everyone in the industry can engage in an exchange of ideas about current industry trends as well as the identification of new standards and updates to current ones,” said Bergman. “Used by companies of all sizes in more than 90 countries by all manufacturing sectors, IPC standards help the electronics manufacturing industry build electronics better.”

Standards development committee meetings will cover industry benchmarks in assembly and joining; assembly equipment, base materials; cleaning and coating; electronic documentation technology; electronic product data description; embedded devices; environment, health and safety; fabrication processes; flexible and rigid-flex printed boards; high speed/high frequency interconnection; management; packaged electronic components; printed board design technology, printed electronics; process control; product assurance; product reliability; rigid printed boards; terms and definitions; testing; and wearable electronics/e-textiles.

In addition to standards meetings, IPC will celebrate the accomplishments of  “IPC A-Teams” at the Golden Gnomes Award Ceremony on May 16. The awards, inspired by IPC’s fictional TechNet gnomes Clumpy and Kloumpios, recognize the outstanding and creative work of IPC A-Teams. IPC A-Teams are dedicated groups of volunteers within IPC working groups who take on a significant amount of work on behalf of their groups.

This year, IPC SummerCom will be co-located with the Electrical Wire Processing Technology Expo (EWPTE) at the Wisconsin Center. IPC SummerCom registration gives participants free access to EWPTE. For more information on standards development activities at IPC SummerCom or to register, visit www.ipc.org/event/ipc-summercom. For more information on all IPC standards development activities, visit www.ipc.org/standards.

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