Global Electronics Association Knowledge Hub

While the Ni-stabilized Sn-0.7Cu alloy is now well established as a viable lead-free solder in large scale commercial printed circuit board assembly the effect of Ni is not yet fully understood .. read more

Lead free implementation will present new challenges for PCB manufacturers from a design,soldering process,and QC standpoint. The higher reflow process temperatures will cause greater thermal s .. read more

OEE (Overall Equipment Effectiveness) is commonly used in a wide range of businesses when it comes to measuring and monitoring manufacturing performance. Even though OEE has been applied in var .. read more

A tier one supplier to the automotive industry has determined that a key to staying competitive in the electronics manufacturing industry is to adopt open standards for the exchange of data. Sp .. read more

Factory simulation has been used extensively to optimize and reduce costs across many manufacturing disciplines. Unfortunately,general purpose factory simulators do not effectively model the sp .. read more

In the past the use of filling pastes in PCB production was largely limited to via hole fillers. These materials with a solids content of 100% are still successfully employed today to close via .. read more

PTFE-FR4 hybrid laminated multi-layer PCB technology is being applied more and more widely. This technology requires blind via fabrication in a PTFE core. This paper gives a picture of the manu .. read more

In order to get excellent signal Integrity,half PTH holes will be a new trend in high frequency backpanel designing. Backdrilling is necessary for this application. This paper explores the appl .. read more

In this study,the DIG process (Direct Immersion Gold),is investigated. DIG is a process in which gold is plated directly on copper as a surface finish for printed circuit board and package appl .. read more

Microvoids are tiny voids in solder joints and differ from the more well known solder joint voiding in their individual size and location. The microvoids discussed herein are described as an ab .. read more

Manufacturers of electronic devices,from home audio equipment to automotive keyless entry systems,are increasingly seeking a reliable,cost effective method for uniquely identifying and tracking .. read more

Conductive inks and polymers based on metals were originally envisaged for quick repairs to Printed Circuit Boards (PCBs) and semiconductor chips. Increasingly these materials are being used to .. read more

In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave soldering,and rework),for different component types,different PCB sizes and fi .. read more

This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200- 250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac .. read more

We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec .. read more

Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels there is an extreme need for improved PTH processing. There are sev .. read more

The frequencies used to communicate and process information have been extended beyond the GHz band to the microwave band to handle the growing volume of data. Moreover,increasing global interes .. read more

A new multi-layer PCB (printed circuit board) having low transmission loss and low thermal expansion that meets up-coming further high speed and high volume data transmission demands was develo .. read more

For four decades,the semiconductor industry has distinguished itself by the rapid pace of improvement in its products. The principal categories of improvement trends are shown in Table 1 with e .. read more

System in package (SiP) technology has grown significantly in the past several years. It was barely mentioned in the National Electronics Manufacturing Initiative’s (NEMI’s) 2000 roadmap,but by .. read more

The upcoming European Union RoHS and WEEE directives are driving new requirements for the management and exchange of information,both across the extended electronics manufacturing value chain,a .. read more

Two important aspects concerning optimum performance of a (reverse) pulse plating line are (i) the uniform and correct pulse shapes anywhere on the PCB and (ii) the uniformity of the plating cu .. read more

Horizontal and vertical pulse plating have been widely used for panel plating in PCB industry,but rarely used for pattern plating. This article analyzes and reviews the crystal structure,throwi .. read more

The copper plating process is one of the most critical steps in the high end PCB manufacturing process. Although the deposition inside through holes and blind holes is the key factor for reduci .. read more

Traditional reflow profiles for lead-free soldering typically require longer processing times due to elevated peak temperatures and flux activation times defined by solder paste suppliers. Thes .. read more

As lead free assembly is ramping up,wetting of lead free solder pastes is surfacing as the major paste performance tradeoff. Global efforts to significantly increase lead free wetting chemicall .. read more

As more electronic assemblers move to lead free SMT production,concerns are raised over reflow cooling slopes and effects on solder joints. Due to the higher peak temperatures,cooling slopes ar .. read more

Nowadays there are two major ways to achieve the conducting function of HDI Blind Hole One is to employ conducting metal paste to fill in the blind holes after laser drilling. The other is to f .. read more

To meet future requirements for PWBs,various technologies of processes,materials and tools of PWBs have been discussed. Especially important are technologies of circuit formation for high-end P .. read more

A recent trend of increasing circuit density,particularly in the areas of plastic packages and multi-layer boards,has resulted in ceaseless demand of improved mechanical properties for laminate .. read more

Recent increasing demand for miniaturization and multi-functionality of electronic devices has lead to higher PWBs circuit density design,requiring thinner insulation layers,smaller via holes a .. read more

With the objective of developing high thermal conductive laminates capable of being used as high current-carrying wiring boards for automotive and industrial applications,we identified the opti .. read more

Japan has a long history of publishing very important technology roadmaps. Some of the Japanese roadmaps published in the past are: JPCA Roadmaps Report on the Technology Roadmap for Advanced S .. read more

A unified European roadmap for PWBs does not exist today. It is also most unlikely that a unified roadmap will available in a foreseeable future time. However,the EIPC has worked together with .. read more

Have you ever been confused after you have read two or three different roadmaps and even though they were supposedly mapping the same attribute in the same time periods,the numbers in the cells .. read more

The use of acid copper plating process for via-filling effectively forms interlayer connection in build-up PWBs with high-density interconnections. However,in the case of copper film deposited .. read more

This paper will review eductor agitation systems at PWB installations to improve the electroplating of printed circuit boards. Significant environmental and productivity improvements have been .. read more

In contrast to electroless copper,direct metallization processes are inherently less expensive to operate,more environmental friendly,requires less floor space and are more efficient. Among the .. read more

The use of lead-free (LF) solders as a replacement for traditional tin-lead (SnPb) solders in military and high reliability applications has a number of technical challenges unique to the indus .. read more

Much work has been done involving the introduction of RoHS and WEEE Directives across the European Union and the world. Although the use of Pb is limited in new products and equipment,older Pb- .. read more

We coated copper substrate with tin-zinc lead-free solder (Sn-9Zn and Sn-8Zn-3Bi),and then we performed the following corrosion tests: the salt mist test,the gas corrosion test,and the weatheri .. read more

In recent years,along with the further progress of network systems,mobile communication systems and high performance servers printed wiring boards (PWBs),which are key components in these produ .. read more

The trends of increased functionality and reduced size of portable wireless products,such as handsets; PDAs are demanding increased routing densities for printed circuit boards. The handheld wi .. read more

This newly developed material and process enable the manufacturing,using a single pressing process,of multi-layer circuit boards with inner via-holes in every layer. Because this material utili .. read more

A Design of Experiment (DOE) was conducted to determine the best filler,or combination of fillers that would offer the best reduction of CTE expansion from 50oC to 260o C without compromising e .. read more

As a promising candidate for future substrate with high pin-count and low transmission loss at high frequency,we have developed an all polyimide multi-layered board laminated by single batch pr .. read more

We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount high speed CPUs with high I/O numbers. These PWBs meet the following require .. read more

The objectives of the present study are to design,fabricate,and test various configurations of micro-vias over military thermal environment,and then evaluate the impacts of micro-via design/man .. read more

The trends of increased functionality and reduced size of portable wireless products,such as handsets and PDAs,are demanding increased routing densities for printed circuit boards. The handheld .. read more

In recent years,Wafer Level Chip Scale Packages (WLCSP) are used not only in the hand held devices but also in high-end networking and telecommunication products. Due to their small footprint a .. read more