Global Electronics Association Knowledge Hub

With the function of today’s electronic devices become more and more complicate,the high I/O flip chip ball grid array package (FCBGA) is used more popularly in recent years. The FCBGA package .. read more

Higher I/O Ball Grid Arrays (BGAs) are high speed,high pin count,and high performance array packages. These BGAs are also more complex in structure than “standard” BGAs and are generally target .. read more

Quantifying SMT adhesive dispensing performance has typically been attribute analysis via a microscope. Individual adhesive deposits were inspected for strings or tails,extra dots,missing dots .. read more

Conductive adhesives (CAs) have been an important problem-solving class of assembly materials for decades,but primarily as die attaches products,ever since they replaced metallurgical systems. .. read more

The electronic industry trend of smaller component packages and tighter spacing has put greater demands on manufacturing for process control and product verification. Defects must be caught ear .. read more

Industry cost control pressures and technology drivers demand more powerful 3D AOI machines for control of solder paste printing. Here is an inside look at the factors potential purchasers of t .. read more

The behavior of BGA solder joints under dynamic loads has become more significant in recent years. This work explored test methodologies for solder joint failure evaluation under dynamic loads. .. read more

Non-destructive testing during the manufacture of printed wiring boards (PWBs) has become ever more important for checking product quality without compromising productivity. Using x-ray inspect .. read more

Evaluation of printed wiring boards (PWBs) for thermal reliability during assembly and rework operations by Thermal Mechanical Analyzer (TMA) “T-260” testing has been an accepted practice for m .. read more

The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device manufacturers have moved to satisfy market demands for more powerful products,sma .. read more

Process,Process,Process – these words must ring loudly in our ears,and must be at the forefront of lead free implementation. The smaller process windows dictated by lead free alloys are going t .. read more

A novel electrochemical plating process for depositing gold and silver surface finishes using environmentally benign, organic-based solutions as the plating bath is being investigated. The plat .. read more

In order to understand the reaction mechanism of an auto-catalytic type gold plating bath,it is necessary to recognize the following reactions --- oxidation of reducing agent,gold deposition an .. read more

The SMT (surface mount technology) assembly process for 0.4 mm pitch CSP (chip scale package) components was studied in this work. For the screen printing process,the printing performance of di .. read more

As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and process controls but also risks knowledge. To overcome humidity issue,par .. read more

SPC data has shown that the solder paste printing process is the primary source of soldering defects in SMT assembly. Consequently,verification of the specified printing properties of solder pa .. read more

Recently,wafer bumping using solder paste with very fine solder powder has come into focus as more cost effective than conventional sputtered or plated methods. This additive method revolves ar .. read more

The research discussed in this paper uses an innovative enhancement technique for printing High Density substrates. The technique takes advantage of high frequency low amplitude vibrations appl .. read more

The printing process is always highlighted as contributing the most process defects to a surface mount manufacturing production facility; typical values presented are around the 60% range. Fact .. read more

Enclosed print heads have recently been available to circuit board manufacturers as an alternate technology to conventional squeegee printing. By design,enclosed print heads offer several advan .. read more

There is continued interest in utilizing alternatives to bromine-based flame retardants for printed wiring boards. As a result,a wide variety of phosphorus and non-phosphorus systems have been .. read more

A study was conduced to see if faster laser ablation rates,improved fracture resistance and better copper adhesion after electroless plating could be engineered into existing Resin Coated Foils .. read more

An Electroless Nickel and Immersion Gold (ENIG) plating process with a middle phosphorous content nickel layer is currently a mainstream final finishing application for mobile phone Printed Wir .. read more

With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly becoming more critical,fabricators and OEM’s must determine the mo .. read more

The influence of co-deposited Phosphorous (P) (from low to high P) within an electroless Nickel layer,regarding the reliability of the solder joint integrity was investigated. The solder joint .. read more

To meet the emerging requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled SnPb solder to alternative final finishes. A thin .. read more

At times,the electronics industry changes faster than the testing and regulatory groups serving the industry. In this case,the electronics supply chain thoroughly evaluated the new printed circ .. read more

This paper describes the life-cycle impact assessment methodology developed by the University of Tennessee to calculate the impacts resulting from the use of lead and lead-free solders during t .. read more

This paper presents a functional signature analysis method for the end-of-life management of products,particularly for electrical-electronics and electromechanical applications. Due to the fast .. read more

Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and conditions that designers needs to consider to introduce microvias t .. read more

One of the most enabling product industries in the world today is Computer Automated Design (CAD). Can you imagine how far technology would have progressed if not for the automation of computer .. read more

There are many ways of specifying units for many different measurements,and over the years they have developed a life of their own. For example,length was once measured with glorious imprecisio .. read more

The electronics industry is constantly growing and introducing new technology sometimes faster than we can keep up with. This paper reviews one of the single most important,but sometimes overlo .. read more

The 3-D interconnection and packaging emerged from the last decade. Today,the 3-D interconnection technologies are becoming mature and their reliability assessed. 3-D technology constitutes the .. read more

This paper presents a new joining technology for high-temperature application of solder joints,based on the results of the joint research project "TLSD". By the use of temporary liquid solder j .. read more

During the last several years there has been and continues to be an enormous investment by both governments and industry in the development and manufacture of fuel cells. The United States,Japa .. read more

The underfill process has become common practice in the assembly of flip chip and CSP devices and the practice of area array assembly has been adopted by many board designers and component asse .. read more

Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller,lighter, and less expensive packages,and flip chip is an important enabling te .. read more

Use of solder paste as a material to bump silicon wafers for interconnection to other level of package interconnection is a simple and cost effective process. However,the material properties of .. read more

A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and wells filled with solder paste are provided on a flexible substrate serv .. read more

There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted using a stencil aperture that is larger than the wafer pad. This perm .. read more

Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as viable drop-in replacements to tin-lead solder. High melting point tin alloys such .. read more

Applications using flip chips in high temperature and high current designs have increased in recent years,and this trend is expected to continue. Markets utilizing these designs include high pe .. read more

A new set of constitutive equations for a class of lead-free solder alloys,Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu is proposed in this investigation. These equations are applied to a 256PBGA (plastic ba .. read more

Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have been the standard in printed circuit assembly processes. Lead-free sol .. read more

Solder preforms are precise shapes of metal,produced by the high-speed stamping or forming of solder wire or ribbon. Preforms provide a highly repeatable volume of solder,with 100% metal conten .. read more

Surface mount assembly has dominated its through-hole predecessor since the early 1990s. The higher density and lower ultimate cost of SMT makes it a preferred assembly technology. However,the .. read more

Numerous technical articles have dealt with machine parameters,and their effect on wave soldering of Printed Circuit Boards in the range of 40-93 mils and the typical 6 to 8 layers. This resear .. read more

This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high - frequency & flex designs by examining: 1. How the material set has now been .. read more

A common industry practice is to confirm the characteristic impedance of critical PCB traces meet specified performance tolerances before any components are attached. A popular technique is to .. read more