Global Electronics Association Knowledge Hub

Efforts to reduce high frequency signal losses associated with dielectric materials have driven development and commercialization of more cost effective low loss laminate materials. These devel .. read more

This paper will discuss the two primary transmission components that concern designers today. These components affect the signal integrity of all high-speed transmissions in printed circuit boa .. read more

The impedance and electrical property variation resulting from spatial patterns in woven glass reinforced laminate materials are greatly impacting high speed interconnect designs. As the transf .. read more

When transitioning to lead-free reflow,consideration should be given to the additional costs of operation,above and beyond material costs.1 Impacts to the overall reflow process should be caref .. read more

Successful reflow soldering is a key to productivity and profitability,yet many assemblers may be using a nonoptimized reflow profile. Years ago,when IR ovens were the norm and solder pastes we .. read more

Epoxy molding compounds are used extensively in the electronics industry to encapsulate surface mount Integrated Circuits (ICs). The primary purpose of encapsulating the SMT package using these .. read more

We often hear or use the terms “World Class Manufacturing” or “Best in Class Manufacturing” in reference to our manufacturing operation or perhaps a competitor’s or supplier’s manufacturing ope .. read more

To estimate the ability of a process to perform according to the product’s design (i.e.,specification),process capability indices (Cp,Cpk,etc.) are used. What most people fail to realize,howeve .. read more

Today,there are only three certainties in a circuit board market that for the last three years has proven anything but certain: death,taxes,and military business. As the overall North American .. read more

The overall mission and foundation of business today,as it was yesterday and undoubtedly will be tomorrow,is to maximize customer service. Customer Relationship Management (CRM),although a rela .. read more

Loyal customers are customers who will pay premium price for exceptional products and services,refer other customers to buy products and services,buy a whole range of products and services from .. read more

Lean and Continuous Improvement are distinct performance improvement strategies. Each has its own objective and methodology and is highly inter-woven. Lean Manufacturing uses the strategy of Ka .. read more

Mass transfer effects and reactor design play an important role in the plating process of electronic interconnects. To improve the behaviour and performance of the plating reactors used for ele .. read more

Colloidal graphite direct metalization processes have proven their usefulness as a replacement for electroless copper. This is especially the case in high technology and quick turn applications .. read more

There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR) plating to electroplate printed circuit boards. PPR plating offers .. read more

With an increasing number of designers specifying conductive material for plugging through-holes,a more robust process to produce 100% fill is needed for the whole range of aspect ratios. With .. read more

This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster,smaller and higher performance communication and electronic devices,build-u .. read more

The technology shift toward higher performance (low Dk,low Df,faster signal speeds) resin materials for high reliability high layer count multlayer interconnect devices is moving rapidly. PWB f .. read more

PTFE material is very hydrophobic and among the most difficult to deposit electroless copper or direct metallization. These materials have very low friction,which makes a surface non-wettable. .. read more

Traditional reduced black oxide processes for inner layer bonding have been superseded by a newer generation of peroxidesulfuric texturing processes. These lower cost processes,based on an orga .. read more

In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the dominate factor. Material selection,trace geometry,and choice of coppe .. read more

Microvias are the fastest growing new technology for printed circuits. Once you understand the basics,the advanced topics bring the real advantage to light. This talk will highlight the procedu .. read more

The need for dynamic compact models for Integrated Circuits (ICs) is a well-recognized problem in electronics cooling simulations of electronic systems. Simplified thermal models have been repo .. read more

The electrical properties of PCB substrates are one of the primary factors used in designing high-frequency printed circuit boards. The loss tangent is the electrical property used by material .. read more

As digital data rates reach 5Gb/s,10Gb/s and beyond,digital designers are finding it increasingly difficult to meet their design constraints using FR4. While there are a host of alternative mat .. read more

Whilst the number of new ASIC designs has decreased over the last couple of years,there has been a dramatic increase in the number of FPGA designs implemented. Not only have the number of desig .. read more

Tombstoning of SnAgCu is affected by the solder composition. At vapor phase soldering,both wetting force and wetting time at a temperature well above the melting point have no correlation with .. read more

The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress has gained popularity among leading research institutes and industri .. read more

Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes. While some companies are taking advantage of the situation and are us .. read more

An issue that has emerged from the increasing use by the electronics industry of lead-free solders in mass production wave soldering is the erosion of the copper of printed circuit board patter .. read more

Developing lead free connector products involves at least two distinct steps: removing the lead from the product and ensuring the product has sufficient thermal stability. Lead is most commonly .. read more

The commercial use of lead-free solder has been making significant gains worldwide in recent years. To identify the effects of thermo-mechanical stress on Sn-Ag-Cu and Sn-Zn-Bi solder with diff .. read more

As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase seen in the amount of studies performed for electronics assemblies sold .. read more

This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive,but non-exhaustive .. read more

For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with 95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre .. read more

Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has passed legislation requiring the removal of lead from electronics assembly b .. read more

The continued functional densification and integration in networking products is driving the need to study large form factor printed circuit boards that use high I/O packages (either ceramics c .. read more

The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout the electronics supply chain. The University of Massachusetts Lowell has bro .. read more

As the need for higher performance,higher I/O count packaging solutions at lower costs continues to grow,opportunities exist to support these applications with higher performance wire bonded pa .. read more

A new,green epoxy mold compound has been developed to encapsulate fine pitch PBGA and 3D-stacked die CSP packages. When evaluated on these packages,the compound provided very good wire sweep pe .. read more

A variety of mechanical and thermal stress related problems related to Flip Chip Ball Grid Array Packages (FCBGAs) are often solved by the Finite Element Method. Often,the question for the stre .. read more

The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design specific activity. The implementation and use of a standardized s .. read more

Various test methods are used to characterize the PCB plated-thru-hole reliability. One such method is the Interconnect Stress Test (IST). The results from this test are often used to qualify P .. read more

Conductive Anodic Filamentation is a subsurface failure mode for woven glass reinforced laminates (FR4) materials,where a copper salt filament allows bridging between via walls or other copper .. read more

Lead-free alloys under consideration have physical properties,which may directly impact industry standard electronic assembly cleaning processes. The purpose of this study is to evaluate how th .. read more

The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide move toward lead-free manufacturing,has initiated a closer scrutiny towards e .. read more

Chip scale packages (CSPs) are widely used in portable electronic products where there is also a growing trend to lead free assembly. Many CSP designs will meet the thermal cycle or thermal sho .. read more

The miniaturization trend in electronics has proliferated the use of Chip Scale Packages (CSPs) in electronics assembly. CSPs used in portable devices are subjected to harsh mechanical and ther .. read more

A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip Size Package (CSP) solder fillet. Mechanically stressing the package serves as a .. read more

When we think of optoelectronics in the USA,we automatically think of telecom applications. These fueled huge growth at the turn of the millennium,and even after the bubble burst in 2001-2,tele .. read more