Is That Splice Really Good Enough? Improving Fiber Optic Splice Loss Measurement
Results from a National Electronics Manufacturing Initiative (NEMI) project,formed to improve aspects of fiber optic fusion
splicing,are reported. The focus of this paper is ultra low loss spli
.. read more
Event
IPC APEX EXPO 2004
Creating a New Optoelectronics Standard: Specifications for Process Carriers Used to Handle Optical Fibers in Manufacturing
The lack of consistency and compatibility in process carrier designs was cited as an early barrier to automation in the
nascent fiber-optics industry. Under the auspices of the National Electro
.. read more
Event
IPC APEX EXPO 2004
NEMI Cost Analysis: Optical Versus Copper Backplanes
The outlook for optical PCBs is unclear for mainly three reasons: 1) today's limits for copper boards can be stretched with
design and manufacturing improvements,2) the market demand for next g
.. read more
Event
IPC APEX EXPO 2004
Drawing Note Generator
This paper will describe the method used to automate drawing note creation at Lockheed Martin. It will discuss the reasons
for the automation and some of the decisions that needed to be made be
.. read more
Event
IPC APEX EXPO 2004
Via in Pad Study Evaluating the Impact on Circuit Design,Board Layout,Manufacturing,Emissions Compliance and Product Reliability
Driving factors for the use of via in pad technology include the growing trend towards more dense and complex printed
circuit board designs as well as the need to minimize parasitic capacitance
.. read more
Event
IPC APEX EXPO 2004
Reliability of High Density,High Layer Count,Multilayer Backplanes
This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count,
large panel format multilayer printed wiring boards that are used for b
.. read more
Event
IPC APEX EXPO 2004
Designing Embedded Resistors and Capacitors
Embedded passives,i.e.,resistors and capacitors built right into the printed circuit board substrate,is a rapidly emerging and
pivotal technology for the PCB industry preceded only by the plate
.. read more
Event
IPC APEX EXPO 2004
Design Considerations for Thin-Film Embedded Resistor and Capacitor Technologies
Embedded passives technologies can provide benefits of size,performance,cost,and reliability to high density,highspeed
designs. A number of embedded passive technology solutions are available t
.. read more
Event
IPC APEX EXPO 2004
Embedded Passives in High Layer Count High Reliability Printed Wiring Boards
This paper will discuss the use of thin film buried resistors and thin core plane pairs in high layer count high reliability
printed wiring boards used in single and double sided surface mount
.. read more
Event
IPC APEX EXPO 2004
“Built-In-Trace” Resistors
The newly developed Ohmega-Ply “Resistor-Built-in-Trace” technology uses low-ohmic resistive materials for embedded
resistors congruent to the circuitry in a multilayer PCB or HDI substrate. Hi
.. read more
Event
IPC APEX EXPO 2004
Performance of Polymeric Ultra-thin Substrates for Use as Embedded Capacitors: Comparison of Unfilled and Filled Systems with Ferroelectric Particles
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Based on this
work we have continued to characterize the performance and reliability of
.. read more
Event
IPC APEX EXPO 2004
Decoupling with Anodized Ta
Novel configurations of decoupling capacitors were formed by anodizing Ta,resulting in Ta2O5 films 2000 Å thick and k =
23,giving about 110 nF/cm2. Since the dielectric is very thin,the parasit
.. read more
Event
IPC APEX EXPO 2004
New Developments in Polymer Thick Film Resistor Technology
Motorola has been using embedded polymer thick film resistors on immersion silver-plated copper terminations in products
for four years,and in the past year other firms have begun using this te
.. read more
Event
IPC APEX EXPO 2004
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. read more
Event
IPC APEX EXPO 2004
Lead-Free Implementation: Drop-In Manufacturing
The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully
reported their total completion to Lead-free production across all facilitie
.. read more
Event
IPC APEX EXPO 2004
Lead Free Process Transition Solder Paste Characteristic Assessment
The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original
draft of the legislation. A true Pb-free solution for product such
.. read more
Event
IPC APEX EXPO 2004
Design Technology,What Does the Roadmap Say?
Event
IPC Fall Meetings 2004
IPC 2610 - Documentation Package
With the advent of CAD and CAM tools,the need arose for a more complete method of data transfer. As layer count
increased,the number of files increased. As trace size and spacing began to decre
.. read more
Event
IPC Fall Meetings 2004
Principles of Land Pattern Design
Event
IPC Fall Meetings 2004
Principles for Implementing BGA and CSP Technology
As IC technology advances,electronic packaging for the ICs has had to advance as well. The package methodology has become technically more sophisticated and physically more complex. For many IC
.. read more
Event
IPC Fall Meetings 2004
Barriers to Implementation of High Performance Embedded Capacitance Laminates
Event
IPC Fall Meetings 2004
Designing Resistors to Embed
Embedding resistors right into the printed circuit board substrate is not new,but it is gaining momentum as a rapidly
emerging and pivotal technology for the PCB industry,perhaps preceded only
.. read more
Event
IPC Fall Meetings 2004
PWB Design: Beyond Copper Interconnects
Two emerging board technologies,embedded passives and embedded optical waveguides,have the potential to change the way that printed wiring boards operate. No longer will interconnects be relega
.. read more
Event
IPC Fall Meetings 2004
Materials Information for Flex Designers and Fabricators
A flexible circuit is more than just thin materials made into an interconnecting device. Understanding the characteristics of the materials and their properties versus circuit design type and r
.. read more
Event
IPC Fall Meetings 2004
CSP Requirements Being Addressed by IPC Flexible Circuits Standards
Event
IPC Fall Meetings 2004
Developments to Improve the Process Window and Pin Testability of Lead Free Solder Pastes
Event
IPC Fall Meetings 2004
Performance and Printing of Pb-Free Solder Paste for 100-micron Pitch Geometries
Recent advances in chip technologies have prompted a rapid increase in the density of solder joints in electronic components. Further reductions in pitch are likely,leading to joint structures
.. read more
Event
IPC Fall Meetings 2004
Flex Based 3D Package Innovations for Enabling Low Cost System Level Integration and Miniaturization
Hand-held communication and entertainment products continue to dominate the consumer markets worldwide and,with each generation,offering more and more features and/or capability. And even thoug
.. read more
Event
IPC Fall Meetings 2004
How to Design with Flex in Mind
Event
IPC Fall Meetings 2004
Flexible Printed Boards
This paper describes flexible printed circuit boards,used as “Product Boards” or “Interposers”,chip mounting structures. Traditionally,flexible circuit boards are made with polyimide dielectric
.. read more
Event
IPC Fall Meetings 2004
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. read more
Event
IPC Printed Circuits Expo 2003
Cost-Effective Placement Machine Capability Analysis and Process Control
New component packaging formats create the need for greater production process stability,reproducibility and
precision. This leads to a growing demand for process control solutions.
As manufact
.. read more
Event
IPC Fall Meetings 2003
Optimized System Design Through Industry Benchmarking of Fabrication Tolerances and Material Properties
Benchmarking of industry fabrication capability,feature tolerances and material property variation is essential to
aligning product requirements and industry capability. Statistical based chara
.. read more
Event
IPC Fall Meetings 2003
A Case Study of an OEM's Program to Assess Supplier Capabilities,Technology Availability,and Reliability for Advanced Printed Circuit Boards
Teradyne,Inc. has been involved with Conductor Analysis Technologies,Inc. (CAT Inc.) for over 4 years and the
IPC D-36 Subcommittee for over 2 years. This paper describes the initial motivation
.. read more
Event
IPC Fall Meetings 2003
AOI for NPI and Process Control
Event
IPC Fall Meetings 2003
Design for manufacture and inspection
Event
IPC Fall Meetings 2003
Integration of AOI in a Total Quality Management Program
Event
IPC Fall Meetings 2003
Laser-Based 3D AOI for SMT Assembly Processes
Event
IPC Fall Meetings 2003
Challenges in Bare Die Mounting
Traditionally,the evolution of advanced IC assemblies has been due to defense and aerospace applications,where
reliability,size and weight were at a premium,and cost was a secondary considerati
.. read more
Event
IPC Fall Meetings 2003
Galvanic Compatibility of Immersion Gold and Immersion Silver Printed Wiring Board Finishes with Aluminum
Numerous industry studies have been performed examining the compatibility between new plating finishes and other metals
used in printed wiring assemblies. The transition to the new printed wiri
.. read more
Event
IPC Fall Meetings 2003
The Study,Measurement,and Prevention of Tarnish on Immersion Silver Board Finishes
With increased environmental legislation against lead in the electronics industry1,circuit board manufacturers are
expecting chemical suppliers to formulate lead free alternatives with the same
.. read more
Event
IPC Fall Meetings 2003
Solderability of Sn/Cu Lead-Free Solder as a HASL Bare Board Final Finish
Sn/Cu lead-free solder is a good alternative to 63/37 solder for use in HASL processes. Solderability of Sn/Cu
surface exceeds that of 63/37 solder,nickel-gold,OSP,silver,and immersion tin both
.. read more
Event
IPC Fall Meetings 2003
Immersion Silver and Immersion Tin IPC Plating Committee 4-14 Industry Update
The development of two new industry specifications – IPC-4553 (immersion silver IAg) and IPC-4554 (immersion tin ISn)
are well under way. Following in a tradition started with the development o
.. read more
Event
IPC Fall Meetings 2003
What’s Wrong With My Surface Finish? An Evaluation of the Limitations of Common Surface Finishes
This paper will highlight the shortcomings of each of the commonly used surface finishes available on the market
today. The goal is to spark the industry interest,that it may double its efforts
.. read more
Event
IPC Fall Meetings 2003
Enhanced Embedded Passives Technology – From Distributed to Discrete
Embedded passives are entering a new phase of improved product capability and enhanced processes. Thinner,
higher capacitance embedded distributed capacitance (EDC) materials are coming to mark
.. read more
Event
IPC Fall Meetings 2003
Decoupling with Integrated Capacitors
Successive generations of ICs demand higher peak current levels and faster current rise times,challenging traditional surface
mount decoupling. The considerably lower parasitic inductance of in
.. read more
Event
IPC Fall Meetings 2003
Designing Ceramic Thick-Film Capacitors for Embedding in Printed Circuit Boards
This paper presents an emerging technology for embedding discrete ceramic thick-film capacitors directly into
printed circuit boards. Their use frees up surface real estate allowing for smaller
.. read more
Event
IPC Fall Meetings 2003
Size and Cost Modeling for Embedded Passives
Lower cost is frequently listed as the main driver for moving to embedded passives. Unfortunately,understanding
the true cost difference between a design using embedded passives and the same de
.. read more
Event
IPC Fall Meetings 2003
Stress Effects on Thin Film Nichrome Embedded Resistor Tolerance
Electronic devices with high performance are becoming smaller and lighter. The passive components required to
enable high performance consume premium space on the surface of the printed circuit
.. read more
Event
IPC Fall Meetings 2003