Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Using Flux-Coated Solder Preforms to Repeatably Achieve Low Voiding in Power ICs: An Automotive Case Study
For an automotive transmission control unit (TCU) platform, the bottom ground pad of a high power low-profile quad flat package (LQFP) component soldered to the thermal pad of the PCB had a
.. weiterlesen
Effects of BGA Rework on Board-Level Reliability
The research goal was to establish a limit for the number of rework cycles for Ball Gird Arrays (BGAs) and to determine the clearance required between a BGA and its surrounding components on
.. weiterlesen
Novel Automatic Repair of Populated PCBs in a Cost-Effective and Adaptive Way
Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of th
.. weiterlesen
Non-Destructive BGA Rework Using Infrared Heating Technology
During the past few years, it has become increasingly difficult to physically rework printed circuit board (PCB) assemblies. Such mundane operations as soldering, desoldering and component r
.. weiterlesen
Quality Assurance for Advanced Packaging Prototyping: Solder Paste Behavior as Key Monitoring Parameter
Highly reliable and high-yield prototyping in the early stages of development is crucial for innovations in next generation microelectronic systems to demonstrate the results of research. Th
.. weiterlesen
QFN Thermal Pad Design for Void Minimization
Different types of components with soldered bottom terminations are increasingly used in the electronics industry with the principal objective to improve heat dissipation.
The larg
.. weiterlesen
A Novel Copper Via Filling Electrolyte for Plating on IC Substrates
The Semi-Additive Process (SAP) is a standard process to enable very fine lines and spaces to produce highly sophisticated Integrated Circuit Substrates (ICS). When operating with lines and
.. weiterlesen
Novel Surface Finish for 5G-mmWave frequency PCB Technologies- How to Achieve Optimum Signal Integrity
The next generation devices using high frequency of 5G to mmWave and greater has called for innovation in materials used in electronics manufacturing to realize the optimum signal integrity
.. weiterlesen
Reassessing Surface Finish Performance for Next Generation Technology
PCB Fabricators have long since abandoned Hot-Air Levelling, with several alternative final finishes (ImAg, ImSn, OSP, ENIG and ENEPIG) now well established as having a track record of meeti
.. weiterlesen
A High Thermal Performance Die Attaching Paste based on Hybrid Pressure-less Silver Sintering Technology for Aerospace Application
Aerospace and defense applications present unique challenges for material suppliers. As increasingly adoption of wide bandgap semiconductor materials and advanced diverse accessible heteroge
.. weiterlesen
Failure Characteristics of PCBs in Automotive EV Powertrain Applications and Solution Proposals to Improve Reliability and Robustness
The rapid change to and steep rise of electric vehicles (EV) results in many challenges for the design, manufacturing, testing, and the understanding of reliability and robustness for printe
.. weiterlesen
Expandable Bio-based Polymers: A Lightweight Future for Electronics Ruggedization – Immersion Study
“Light weighting” has become an important trend in numerous manufacturing divisions. Lightweight materials are particularly valuable in any portable device including mass transit systems, au
.. weiterlesen
Selective Solder Nozzles: Insight Into Wear Mechanisms and Future Developments
Selective soldering utilizes wettable metal nozzles for controlled application of solder to components. The wetting of solder to the nozzles is part of a complex mechanism that causes wear o
.. weiterlesen
New Soldering Technology for High and Mixed-Volume Through-Hole Pin Devices
Surface mount technology was developed in the 1960s and implemented on printed circuit boards in the 1980s. High-density electronic assemblies are dominated nowadays by surface mount devices
.. weiterlesen
Photonic Soldering of Wafer-level Chip-scale Packaged Components on Polyethylene Terephthalate Flex Board
Advanced implementation of wearables and IOT applications require attachment of components on lightweight, mechanically flexible, and low-cost substrates. Candidate materials that meet these
.. weiterlesen
Gold Brush Plating Rework of Power Logic Circuit Card Assembly in an Aerospace Electronic Application
Selective electrodeposition (brush plating) was successfully used to rework a solder-contaminated, hard gold-plated copper flag connector for a circuit card assembly (CCA). The localized rep
.. weiterlesen
iNEMI General Purpose Flowers of Sulfur Corrosion Chamber
The iNEMI flowers of sulfur (FoS) corrosion chamber was developed to study creep corrosion on printed circuit board assemblies(PCBAs). The chamber, typically run at 50 or 60oC, has corrosive
.. weiterlesen
Reducing Dust Deposition on Electronic Equipment by Optimizing Cooling Air Flow Patterns
Environmental dust accumulation on electronic equipment can impact the performance and reliability of the equipment in various ways. This includes mechanical effects (such as obstructions of
.. weiterlesen
Electronic Board Defect Classification and Detection with Deep Learning
Inspection means have increasingly been incorporated into typical manufacturing of boards, substrates and/or systems. A significant number of automatic inspections rely on the analysis of im
.. weiterlesen
Beyond The Hype -The Digital Twin Demystified
Digitalization changes everything, everywhere. It is inevitable, new business drivers are forcing the Electronics industry to rethink every element of their business. Virtually every company
.. weiterlesen
Energy Efficient Reflow Soldering Process Using Embedded Carbon Layers
As the reflow soldering process is the main energy consumer in a SMT assembly line, there is a high potential for cost reduction by significantly reducing the amount of energy needed. Meltin
.. weiterlesen
Can 150μm Pitch Flip Chip be Done on Standard SMT Lines?
As miniaturization trends continue in the electronics industry, System in Package (SiP) technology is gaining more and more traction. In many ways, some SiP modules are just surface mount te
.. weiterlesen
Investigating the Metric 0201 Assembly Process
The advance in technology and its relentless develop mentis delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst r
.. weiterlesen
Balancing Air Assisted Atomization for Improved Conformal Coating Quality
Polymer coating materials protect electronics from harsh environments, assuring safe and reliable performance. To reach the highest level of reliability, coatings must be selectively applied
.. weiterlesen
Automated Conformal Coating of Circuit Card Assemblies Using Polyurethane Material
The development of an automated circuit card assembly(CCA)conformal coating process using a low outgassing polyurethane material was essential for meeting the increase in customer demand fro
.. weiterlesen
High Performance Light and Moisture Dual Curable Automotive Conformal Coating
Light-curable materials can provide significant benefits over conventional technologies, including lower operating costs driven by lower labor needs, space savings, lower energy demand, and
.. weiterlesen
Future of “Substances and Materials in Products ”Data Exchange Formats as Standards
To support regulations on hazardous substances in materials and in products like the automotive EU End of Life Vehicle (ELV) directive, the Electronics and Electrical Equipment Restriction o
.. weiterlesen
Endocrine Disrupting Chemicals and Bioaccumulative Substances –The Next Wave of Regulated Substances in Electronics
Until recently, virtually all restricted materials in electronics were classified as either carcinogens (e.g. Pb) or reproductive toxins (e.g. phthalates). Two new categories of restricted m
.. weiterlesen
High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)
The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu
.. weiterlesen
Moisture Effects on the High Frequency Testing of Laminates
Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high fre
.. weiterlesen
Using Flux-Coated Solder Preforms to Repeatably Achieve Low Voiding in Power ICs: An Automotive Case Study
For an automotive transmission control unit (TCU) platform, the bottom ground pad of a high power low-profile quad flat package (LQFP) component soldered to the thermal pad of the PCB had a
.. weiterlesen
Effects of BGA Rework on Board-Level Reliability
The research goal was to establish a limit for the number of rework cycles for Ball Gird Arrays (BGAs) and to determine the clearance required between a BGA and its surrounding components on
.. weiterlesen
Novel Automatic Repair of Populated PCBs in a Cost-Effective and Adaptive Way
Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of th
.. weiterlesen
Non-Destructive BGA Rework Using Infrared Heating Technology
During the past few years, it has become increasingly difficult to physically rework printed circuit board (PCB) assemblies. Such mundane operations as soldering, desoldering and component r
.. weiterlesen
Quality Assurance for Advanced Packaging Prototyping: Solder Paste Behavior as Key Monitoring Parameter
Highly reliable and high-yield prototyping in the early stages of development is crucial for innovations in next generation microelectronic systems to demonstrate the results of research. Th
.. weiterlesen
QFN Thermal Pad Design for Void Minimization
Different types of components with soldered bottom terminations are increasingly used in the electronics industry with the principal objective to improve heat dissipation.
The larg
.. weiterlesen
A Novel Copper Via Filling Electrolyte for Plating on IC Substrates
The Semi-Additive Process (SAP) is a standard process to enable very fine lines and spaces to produce highly sophisticated Integrated Circuit Substrates (ICS). When operating with lines and
.. weiterlesen
Novel Surface Finish for 5G-mmWave frequency PCB Technologies- How to Achieve Optimum Signal Integrity
The next generation devices using high frequency of 5G to mmWave and greater has called for innovation in materials used in electronics manufacturing to realize the optimum signal integrity
.. weiterlesen
Reassessing Surface Finish Performance for Next Generation Technology
PCB Fabricators have long since abandoned Hot-Air Levelling, with several alternative final finishes (ImAg, ImSn, OSP, ENIG and ENEPIG) now well established as having a track record of meeti
.. weiterlesen
A High Thermal Performance Die Attaching Paste based on Hybrid Pressure-less Silver Sintering Technology for Aerospace Application
Aerospace and defense applications present unique challenges for material suppliers. As increasingly adoption of wide bandgap semiconductor materials and advanced diverse accessible heteroge
.. weiterlesen
Failure Characteristics of PCBs in Automotive EV Powertrain Applications and Solution Proposals to Improve Reliability and Robustness
The rapid change to and steep rise of electric vehicles (EV) results in many challenges for the design, manufacturing, testing, and the understanding of reliability and robustness for printe
.. weiterlesen
Expandable Bio-based Polymers: A Lightweight Future for Electronics Ruggedization – Immersion Study
“Light weighting” has become an important trend in numerous manufacturing divisions. Lightweight materials are particularly valuable in any portable device including mass transit systems, au
.. weiterlesen
Selective Solder Nozzles: Insight Into Wear Mechanisms and Future Developments
Selective soldering utilizes wettable metal nozzles for controlled application of solder to components. The wetting of solder to the nozzles is part of a complex mechanism that causes wear o
.. weiterlesen
New Soldering Technology for High and Mixed-Volume Through-Hole Pin Devices
Surface mount technology was developed in the 1960s and implemented on printed circuit boards in the 1980s. High-density electronic assemblies are dominated nowadays by surface mount devices
.. weiterlesen
Photonic Soldering of Wafer-level Chip-scale Packaged Components on Polyethylene Terephthalate Flex Board
Advanced implementation of wearables and IOT applications require attachment of components on lightweight, mechanically flexible, and low-cost substrates. Candidate materials that meet these
.. weiterlesen
Gold Brush Plating Rework of Power Logic Circuit Card Assembly in an Aerospace Electronic Application
Selective electrodeposition (brush plating) was successfully used to rework a solder-contaminated, hard gold-plated copper flag connector for a circuit card assembly (CCA). The localized rep
.. weiterlesen
iNEMI General Purpose Flowers of Sulfur Corrosion Chamber
The iNEMI flowers of sulfur (FoS) corrosion chamber was developed to study creep corrosion on printed circuit board assemblies(PCBAs). The chamber, typically run at 50 or 60oC, has corrosive
.. weiterlesen
Reducing Dust Deposition on Electronic Equipment by Optimizing Cooling Air Flow Patterns
Environmental dust accumulation on electronic equipment can impact the performance and reliability of the equipment in various ways. This includes mechanical effects (such as obstructions of
.. weiterlesen
Electronic Board Defect Classification and Detection with Deep Learning
Inspection means have increasingly been incorporated into typical manufacturing of boards, substrates and/or systems. A significant number of automatic inspections rely on the analysis of im
.. weiterlesen
Beyond The Hype -The Digital Twin Demystified
Digitalization changes everything, everywhere. It is inevitable, new business drivers are forcing the Electronics industry to rethink every element of their business. Virtually every company
.. weiterlesen
Energy Efficient Reflow Soldering Process Using Embedded Carbon Layers
As the reflow soldering process is the main energy consumer in a SMT assembly line, there is a high potential for cost reduction by significantly reducing the amount of energy needed. Meltin
.. weiterlesen
Can 150μm Pitch Flip Chip be Done on Standard SMT Lines?
As miniaturization trends continue in the electronics industry, System in Package (SiP) technology is gaining more and more traction. In many ways, some SiP modules are just surface mount te
.. weiterlesen
Investigating the Metric 0201 Assembly Process
The advance in technology and its relentless develop mentis delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst r
.. weiterlesen
Balancing Air Assisted Atomization for Improved Conformal Coating Quality
Polymer coating materials protect electronics from harsh environments, assuring safe and reliable performance. To reach the highest level of reliability, coatings must be selectively applied
.. weiterlesen
Automated Conformal Coating of Circuit Card Assemblies Using Polyurethane Material
The development of an automated circuit card assembly(CCA)conformal coating process using a low outgassing polyurethane material was essential for meeting the increase in customer demand fro
.. weiterlesen
High Performance Light and Moisture Dual Curable Automotive Conformal Coating
Light-curable materials can provide significant benefits over conventional technologies, including lower operating costs driven by lower labor needs, space savings, lower energy demand, and
.. weiterlesen
Future of “Substances and Materials in Products ”Data Exchange Formats as Standards
To support regulations on hazardous substances in materials and in products like the automotive EU End of Life Vehicle (ELV) directive, the Electronics and Electrical Equipment Restriction o
.. weiterlesen
Endocrine Disrupting Chemicals and Bioaccumulative Substances –The Next Wave of Regulated Substances in Electronics
Until recently, virtually all restricted materials in electronics were classified as either carcinogens (e.g. Pb) or reproductive toxins (e.g. phthalates). Two new categories of restricted m
.. weiterlesen
High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)
The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu
.. weiterlesen
Moisture Effects on the High Frequency Testing of Laminates
Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high fre
.. weiterlesen