Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Tolerance Mistaken: Impacts of not properly addressing material, industry standards and assembly process limitations
As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes.
.. weiterlesen
Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance
This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"&n
.. weiterlesen
The Importance of Non-Destructive Bare Board Inspection –Preventing Failure Before You Start Work
The operation and reliability of any electronic assembly is very dependent on the performance, quality and consistency of the bare printed circuit board (PCB). Without good quality bare boar
.. weiterlesen
Analyzing a Printed Circuit Board with Oxide Residue
A number of similar Printed Wiring Assemblies (PWAs) had been subjected to final electrical tests on automated test equipment when a common test failure was recognized. All PWAs were failing
.. weiterlesen
Outgassing Behaviour of SMT Flux Residue During Reflow Soldering
SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can
.. weiterlesen
How to Manage Material Outgassing in Reflow Oven
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-pa
.. weiterlesen
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new
.. weiterlesen
Designing a High Performance Electroless Nickel and Immersion Gold to Maximize Highest Reliability
The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with referen
.. weiterlesen
Multilayered Flexible Hybrid Screen Printed Circuits on Disposable Medical Grade Substrates
This paper details the realization of a multi-layered, printed, conformable hybrid circuit. The circuit was created using silver(Ag) flake ink as a conductive layer and UV acrylic-based ink
.. weiterlesen
Printed Electronics for Medical Devices
As is the case with many other markets where faster, highly capable technologies have resulted in more intelligent processes and products, the medical device sector is also undergoing a “sma
.. weiterlesen
Fabric Weaving and Circuit Orientations Impact for Skew / Signal Integrity
This Presentation discusses Improvements for signal integrity. Signal integrity is based on the copper surface roughness, the oxides on the copper, and the Dielectric constant of the D
.. weiterlesen
Innovations for future RF designs
This Slide show presents RF Cap Layers to normal FR4 Dielectric materials. This material can be used in multiple configurations including Single sided, Double sided, and Hybrid.&n
.. weiterlesen
Higher Defluxing Temperature and Low Standoff Component Cleaning-A Connection?
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remai
.. weiterlesen
Methodology for Developing Cleaning Process Parameters
Electronic assembly processes range from simple to complex and involve a wide range of materials to produce. Each step in the process and each assembly material used will have some impact on
.. weiterlesen
IPC-J-STD-001 Rev G, Amendment 1, Section 8 Cleanliness SectionSIR Test Method for Developing Objective Evidence for the Production Assembly
Since the 1970s, ROSE testing was used to determine “clean enough.” In 2015, the J-STD-001 committee assigned a team to develop the next generation of “cleanliness” requirements. Section 8 d
.. weiterlesen
Oxidation Resistant Nano-Cu Sintering Paste for Die Attach Applications
A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance. T
.. weiterlesen
Fluxes Suppressing Non-Wet-Open at BGA Assembly
With the advancement in miniaturization, the die is getting thinner and the solder balls are getting smaller for BGAs. Consequently, the thermal warpage is getting more severe due to the mis
.. weiterlesen
Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is “when we should switch from Ty
.. weiterlesen
Interconnect Reliability Correlation with System Design and Transportation Stress
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping c
.. weiterlesen
Multiphysics Design for Thermal Management to Increase Radar Capabilities
Increased demand for radar capabilities has required increasingly more efficient thermal management techniques. Simple cold plates using tubes or channels are frequently used to cool high po
.. weiterlesen
Realization of a New Concept for Power Chip Embedding
Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top
.. weiterlesen
Stretchable Hybrid Electronics (S.H.E.) Constructions Based on a Novel Thermosetting Polymer System
This presentation covers Stretchable hybrid electronics. Stretchable electronics have the most industry uses in wearable technology and for mobile sensing and response devices. T
.. weiterlesen
Next-Generation Additive Electronics -Precise Multi-Material Deposition for Circuits, Electro-Mechanical Parts and Antennas
This presentation covers additive manufacturing and the direct deposit of multiple metals. This additive capability is best utilized for the production of complicated circuits such as
.. weiterlesen
Additive Manufacturing of a Heat Exchanger for a Radar System
The defense industry has realized the importance of Additive Manufacturing (AM) and how this technology can be utilized where parts can be fabricated inexpensively with reduction in lead tim
.. weiterlesen
The Effects of Filler Morphology on The Fracture Toughness of Thermally Conductive Adhesives
Thermally conductive adhesives are widely implemented in a variety of electronic assemblies. These adhesives combine the function of mechanical fasteners and thermal interface materials into
.. weiterlesen
Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies
The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one pro
.. weiterlesen
High and Matched Refractive Index Liquid Adhesives for Optical Device Assembly
There is an increase in the number of optical sensors and cameras being integrated into electronics devices. These go beyond cell phone cameras into automotive sensors, wearables, and other
.. weiterlesen
Optimising Solder Paste Volume for Low Temperature Reflow of BGA Packages
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower proc
.. weiterlesen
Low Temperature SMT Solder Evaluation
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional
.. weiterlesen
Tolerance Mistaken: Impacts of not properly addressing material, industry standards and assembly process limitations
As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes.
.. weiterlesen
Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance
This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"&n
.. weiterlesen
The Importance of Non-Destructive Bare Board Inspection –Preventing Failure Before You Start Work
The operation and reliability of any electronic assembly is very dependent on the performance, quality and consistency of the bare printed circuit board (PCB). Without good quality bare boar
.. weiterlesen
Analyzing a Printed Circuit Board with Oxide Residue
A number of similar Printed Wiring Assemblies (PWAs) had been subjected to final electrical tests on automated test equipment when a common test failure was recognized. All PWAs were failing
.. weiterlesen
Outgassing Behaviour of SMT Flux Residue During Reflow Soldering
SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can
.. weiterlesen
How to Manage Material Outgassing in Reflow Oven
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-pa
.. weiterlesen
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new
.. weiterlesen
Designing a High Performance Electroless Nickel and Immersion Gold to Maximize Highest Reliability
The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with referen
.. weiterlesen
Multilayered Flexible Hybrid Screen Printed Circuits on Disposable Medical Grade Substrates
This paper details the realization of a multi-layered, printed, conformable hybrid circuit. The circuit was created using silver(Ag) flake ink as a conductive layer and UV acrylic-based ink
.. weiterlesen
Printed Electronics for Medical Devices
As is the case with many other markets where faster, highly capable technologies have resulted in more intelligent processes and products, the medical device sector is also undergoing a “sma
.. weiterlesen
Fabric Weaving and Circuit Orientations Impact for Skew / Signal Integrity
This Presentation discusses Improvements for signal integrity. Signal integrity is based on the copper surface roughness, the oxides on the copper, and the Dielectric constant of the D
.. weiterlesen
Innovations for future RF designs
This Slide show presents RF Cap Layers to normal FR4 Dielectric materials. This material can be used in multiple configurations including Single sided, Double sided, and Hybrid.&n
.. weiterlesen
Higher Defluxing Temperature and Low Standoff Component Cleaning-A Connection?
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remai
.. weiterlesen
Methodology for Developing Cleaning Process Parameters
Electronic assembly processes range from simple to complex and involve a wide range of materials to produce. Each step in the process and each assembly material used will have some impact on
.. weiterlesen
IPC-J-STD-001 Rev G, Amendment 1, Section 8 Cleanliness SectionSIR Test Method for Developing Objective Evidence for the Production Assembly
Since the 1970s, ROSE testing was used to determine “clean enough.” In 2015, the J-STD-001 committee assigned a team to develop the next generation of “cleanliness” requirements. Section 8 d
.. weiterlesen
Oxidation Resistant Nano-Cu Sintering Paste for Die Attach Applications
A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance. T
.. weiterlesen
Fluxes Suppressing Non-Wet-Open at BGA Assembly
With the advancement in miniaturization, the die is getting thinner and the solder balls are getting smaller for BGAs. Consequently, the thermal warpage is getting more severe due to the mis
.. weiterlesen
Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is “when we should switch from Ty
.. weiterlesen
Interconnect Reliability Correlation with System Design and Transportation Stress
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping c
.. weiterlesen
Multiphysics Design for Thermal Management to Increase Radar Capabilities
Increased demand for radar capabilities has required increasingly more efficient thermal management techniques. Simple cold plates using tubes or channels are frequently used to cool high po
.. weiterlesen
Realization of a New Concept for Power Chip Embedding
Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top
.. weiterlesen
Stretchable Hybrid Electronics (S.H.E.) Constructions Based on a Novel Thermosetting Polymer System
This presentation covers Stretchable hybrid electronics. Stretchable electronics have the most industry uses in wearable technology and for mobile sensing and response devices. T
.. weiterlesen
Next-Generation Additive Electronics -Precise Multi-Material Deposition for Circuits, Electro-Mechanical Parts and Antennas
This presentation covers additive manufacturing and the direct deposit of multiple metals. This additive capability is best utilized for the production of complicated circuits such as
.. weiterlesen
Additive Manufacturing of a Heat Exchanger for a Radar System
The defense industry has realized the importance of Additive Manufacturing (AM) and how this technology can be utilized where parts can be fabricated inexpensively with reduction in lead tim
.. weiterlesen
The Effects of Filler Morphology on The Fracture Toughness of Thermally Conductive Adhesives
Thermally conductive adhesives are widely implemented in a variety of electronic assemblies. These adhesives combine the function of mechanical fasteners and thermal interface materials into
.. weiterlesen
Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies
The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one pro
.. weiterlesen
High and Matched Refractive Index Liquid Adhesives for Optical Device Assembly
There is an increase in the number of optical sensors and cameras being integrated into electronics devices. These go beyond cell phone cameras into automotive sensors, wearables, and other
.. weiterlesen
Optimising Solder Paste Volume for Low Temperature Reflow of BGA Packages
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower proc
.. weiterlesen
Low Temperature SMT Solder Evaluation
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional
.. weiterlesen