Unlock Your PCB Design Potential with IPC's Comprehensive Courses

May 14, 2024
| By Corey Lynn

Key Summary

• IPC offers PCB design courses for beginners through advanced professionals
• Courses cover engineering methods, rigid-flex design, foundational skills, and specialized applications
• Training helps designers improve workflows, reduce errors, and adopt modern tools
• Military and aerospace courses focus on precision, standards, and reliability
• IPC programs provide expert instruction, industry alignment, and career-advancing knowledge

In the ever-evolving world of electronics, staying ahead of the curve is essential for any professional in the field. At IPC, we understand the importance of cutting-edge knowledge and skills, which is why we offer a range of PCB Design courses tailored to meet the needs of designers at every level. Whether you're a beginner or a seasoned expert, our courses provide the tools and insights you need to excel. Let's explore how these courses can transform your PCB engineering methods and elevate your career.

Transforming Your PCB Engineering Methods

Are you looking to revolutionize your PCB design process? Our "Transforming Your PCB Engineering Methods" course is designed to do just that. This course delves into advanced techniques and methodologies that can streamline your workflow, reduce errors, and enhance the overall quality of your designs. You'll learn about the latest tools and technologies shaping the future of PCB design engineering. This course is perfect for those who want to stay ahead of the competition and ensure their designs are at the forefront of innovation. Learn more.

PCB Design for Rigid-Flex Boards

Rigid-flex boards combine the best of both rigid and flexible circuits. However, designing these boards requires a unique set of skills and knowledge. Our "PCB Design for Rigid-Flex Boards" course covers everything you need to know about designing these versatile boards. From understanding the materials and processes involved to mastering the specific design rules, this course will equip you with the expertise to create robust and reliable rigid-flex boards for various applications. Learn more.

Introduction to PCB Design I & II

For those just starting out in PCB design, our "Introduction to PCB Design I" and "Introduction to PCB Design II" courses provide a solid foundation. These courses cover the basics of PCB design, including schematic capture, layout techniques, and design for manufacturability. You'll gain hands-on experience with industry-standard software and learn best practices that will set you up for success in your PCB design career. Whether you're a student, a new professional, or someone looking to switch careers, these courses are the perfect starting point. Learn more about Introduction to PCB Design I or Introduction to PCB Design II.

PCB Design for Military & Aerospace Applications

Designing PCBs for military and aerospace applications requires a high level of precision and reliability. Our "PCB Design for Military & Aerospace Applications" course is tailored to meet the stringent requirements of these industries. You'll learn about the specific standards and guidelines that must be followed, as well as advanced techniques for ensuring the durability and performance of your designs in challenging environments. This course is ideal for professionals in or aspiring to enter the military and aerospace sectors. Learn more.

Why Choose IPC for Your PCB Design Education?

At IPC, we are committed to providing top-notch education that meets industry standards. Our courses are developed and taught by experts with extensive experience in the field, ensuring that you receive practical, real-world knowledge. By enrolling in our courses, you'll gain access to the latest trends and technologies in PCB design, networking opportunities with peers and industry leaders, and the confidence to tackle even the most complex design challenges.
Invest in your future with IPC's PCB Design courses and take your skills to the next level. Whether you're looking to transform your engineering methods, master rigid-flex board design, build a strong foundation, or specialize in military and aerospace applications, we have the course for you.

Ready to Get Started?

Unlock your potential and become a leader in the PCB design industry with IPC.
 

Q:
What types of PCB design courses does IPC offer?
A:

IPC provides courses for all skill levels, including introductory PCB design, rigid-flex design, advanced engineering methods, and specialized training for military and aerospace applications. Each course focuses on practical skills aligned with industry needs.
 

Q:
How can the “Transforming Your PCB Engineering Methods” course help designers?
A:

This course teaches advanced methodologies to streamline workflows, enhance design quality, and reduce errors. It also introduces modern tools and technologies that help designers stay competitive in a rapidly evolving electronics landscape.
 

Q:
Who should take the introductory PCB design courses?
A:

These courses are ideal for beginners, students, new professionals, or individuals transitioning into PCB design. They teach foundational skills such as schematic capture, layout techniques, and design for manufacturability using industry-standard tools.
 

Q:
What does the rigid-flex design course cover?
A:

The course explains materials, manufacturing considerations, and design rules unique to rigid-flex boards. It prepares designers to create reliable hybrid designs used in applications that demand flexibility and durability.
 

Q:
Why choose IPC for PCB design education?
A:

IPC courses are developed by industry experts and follow current standards. Learners gain practical, real-world training, exposure to new technologies, and opportunities to connect with peers and leaders, helping them advance professionally.

USPAE/IPC Workshop: Bolstering U.S. IC Substrate Capabilities

Date
- (8:00am - 4:30pm CDT)

USPAE and IPC would like to invite you to participate in an IC substrate workshop planned for May 16, 2024, in Washington, D.C. The workshop will further IPC’s work on a U.S. Department of Defense-funded project to study and recommend approaches to addressing the country’s lack of IC substrate manufacturing capabilities.

In addition to morning and luncheon keynotes featuring government leaders, the workshop will divide participants into breakout groups exploring four key areas:

  • Technology Requirements
  • Workforce Needs
  • Standards Solutions
  • Financial Competitiveness

Efforts will be made in advance of the workshop to ensure equitable distribution of participants across breakout groups and to ensure that key segments are represented. If there are others in your company or in the industry who you believe should be invited to this workshop, please reach out to JoeO'Neil@ipc.org.

View agenda. 

Registration closes May 10.

The Willard Hotel

1401 Pennsylvania Avenue
Washington, DC 20004
United States

The Willard Hotel

The Willard Hotel
1401 Pennsylvania Avenue
Washington, DC 20004
United States

Electronics Industry Sentiment Rose in April, Hitting New High

According to IPC’s April Sentiment of the Global Electronics Manufacturing Supply Chain, April 2024 marked the third consecutive month of sentiment growth among electronics manufacturers.

When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.

Approximately 54 percent of electronics manufacturers are experiencing rising labor costs, and just over 43 percent are reporting rising material costs. At the same time, ease of recruitment and profit margins are presently declining.

Additional survey data show:

  • The Demand Index slipped 0.23 percent in April, the New Orders Index recorded a two-point decline, and the Shipments Index and Capacity Utilization Index each fell one point.
  • The Cost Index declined to its lowest level despite persistent inflationary pressures. The index remains in expansionary territory but continues to ebb lower.
  • Both the Labor Costs Index and the Material Costs Index declined four points.

IPC Chief Economist and survey author Shawn DuBravac said, “The industry outlook remains strongly positive, though it has slightly softened over the last month due to a more moderate demand forecast. Over the next six months, electronics manufacturers expect labor and material costs to remain relatively stable. Notably, orders, shipments, and capacity utilization are all expected to rise considerably over the next six months.”

Read the full report here.

Electronics Industry Urges Congress to Invest in PCB Industrial Base to Shore-up Dangerous Vulnerabilities

May 02, 2024

By Rich Cappetto, Senior Director, North American Government Relations

Key Summary

• IPC urges Congress to restore FY25 funding for U.S. PCB and advanced packaging manufacturing
• Biden’s proposed FY25 budget removes future funding for PCB and packaging industrial base support
• 49 industry executives signed IPC’s letter warning Congress of dangerous supply-chain vulnerabilities
• Despite CHIPS Act progress, the U.S. lacks capacity to produce advanced IC substrates and PCBs at scale
• Without investment, the U.S. cannot utilize leading-edge chips for defense systems due to packaging gaps
• IPC calls for reinstating $86M in Defense Production Act funding to secure critical electronics capabilities

As the spring season progressed in Washington, D.C., the petals have fallen from the city’s famed cherry blossoms yet again ending the annual springtime spectacle. Sixteen blocks to the east, Congress is now fully underway in deciding how to allocate precious taxpayer resources in FY 2025. I am left wondering: Will the U.S. commitment to securing its critical technology resources be as short-lived as the cherry blossoms?  

As things stand today, President Biden’s proposed FY25 budget would eliminate any further funding to bridge the national industrial shortfall in printed circuit boards (PCBs) and advanced packaging and it’s up to Congress to fix that oversight.

Today, IPC delivered a letter to Congress signed by 49 industry executives urging them to sustain current investments in the electronics industrial base or risk putting the United States even further behind the global competition.

Read the full letter here.

How did we get here? Over the last 18 months, industrial base policy has been in full bloom as the Biden Administration began to implement the CHIPS and Science Act and published the first-ever National Defense Industrial Strategy, including provisions to revive the entire electronics ecosystem. The administration announced a series of awards to various projects under the Defense Production Act and about 85% of the funds under the CHIPS Act manufacturing incentives have been allocated to large semiconductor companies. Commerce Secretary Gina Raimondo is projecting the U.S. will manufacture 20% of the world’s leading-edge chips by 2030, nearly doubling today’s output.

IPC has been supportive of the CHIPS Act from conception through implementation. The United States needs a reliable base for semiconductor manufacturing. At the same time, we’ve been clear and persistent that semiconductor manufacturing alone is insufficient to maintain the technological edge required by the U.S. national defense strategy.

Put simply, electronic systems depend on interconnection. A semiconductor chip by itself provides no utility until it is packaged, mounted on a PCB, and connected to other components. As electronic systems have become smaller and more complex, the interconnections themselves have become an advanced capability. Unfortunately, the advancements in manufacturing needed to build these more powerful designs have taken place largely outside of the United States over the last three decades. As a result, domestic manufacturing of advanced printed circuit boards, IC substrates and assembly of complex integrated systems lags behind the global state of the practice. So, despite historic investment in semiconductor manufacturing and a stated goal of building supply chain resilience, the U.S. military can’t use any of the expanded supply of leading-edge chips, because the United States does not have the capacity to produce the most advanced IC substrates and PCBs at all or at scale. IPC’s Chris Mitchell lays out the unfortunate story in a recent commentary article in National Defense Magazine.

If Congress passes an FY2025 budget without meaningful investments in U.S. PCB manufacturers, the electronics industry will have rallied in support only to see investment in its core capabilities pass it by. In the end, reinstating an additional $86 million in Defense Production Act funding is a fraction of a percent of total annual defense spending but it insures a secure supply of key parts to virtually all electronics in the full $850 billion defense budget. Discontinuing it in the next year would be an unfortunate missed opportunity. We can’t leave the United States in a position where we are designing defense technology we need yet can’t produce.

For all these reasons, IPC continues to call on Congress to follow through on the Presidential determination and address a critical vulnerability in the United States’ most important defense capabilities by appropriating robust funding for Defense Production Act purchases of PCBs and advanced packaging in FY2025.

Learn more at www.ipc.org/ipc-advocacy.

 

 

Q:
Why is IPC urging Congress to restore funding for PCBs and advanced packaging?
A:

Because the FY25 budget removes critical industrial-base funding needed to rebuild U.S. capacity in PCBs and IC substrates. IPC argues this creates severe vulnerabilities in defense and commercial electronics supply chains.
 

Q:
How does this relate to the CHIPS Act?
A:

While the CHIPS Act boosts semiconductor fabrication, chips cannot function until they are packaged, mounted on PCBs, and integrated into systems. The U.S. still lacks domestic capability in these areas, making CHIPS investments incomplete without PCB and packaging support.
 

Q:
What risks does the U.S. face without these investments?
A:

The U.S. could produce more leading-edge chips but remain unable to use them in defense technologies due to missing packaging and PCB capacity. This weakens national security and prolongs dependence on foreign supply chains.
 

Q:
What action did IPC take?
A:

IPC delivered a letter to Congress signed by 49 industry leaders urging full funding for PCB and advanced packaging under the Defense Production Act in FY2
 

Survey: How Smart are Your Manufacturing Processes?

Apr 29, 2024

Key Summary

• ICAMS is conducting a new Department of Defense study on challenges in adopting smart manufacturing technologies.
• The survey gathers insights to guide solutions that support manufacturing success and address industry hurdles.
• The survey is brief, asks no sensitive questions and keeps participant identities confidential.
• Participants may request the resulting publication once the study is completed.
• Manufacturers are encouraged to begin the survey through the provided Qualtrics link.

The Interdisciplinary Center for Advanced Manufacturing Systems (ICAMS) at Auburn University is again conducting a study on behalf of the Department of Defense to understand the issues and hurdles manufacturers face when adopting smart manufacturing technologies. That information then helps inform development of solutions to overcome those challenges and help manufacturers become more successful. You can read last year’s results here: Smart-Manufacturing-Study.pdf (auburn.edu). 

The survey should not take more than 10 minutes of your time. We will not be asking for any sensitive information, and your name and company’s name will not be associated with any information provided. Your insights will help us better understand several overarching industry issues. If you would like, we will provide you with this year’s resulting publication once it is completed. 

 We hope that you are willing to help with this project. If so, please begin the survey by clicking on the following link: https://auburn.qualtrics.com/jfe/form/SV_06BagaYQxZdk1mK?Source=I

If you have questions, please contact the Auburn ICAMS team at icams@auburn.edu.

Q:
What is the purpose of the ICAMS smart manufacturing survey?
A:

The survey aims to identify challenges manufacturers face when adopting smart manufacturing technologies to help develop effective solutions.
 

Q:
How long does the ICAMS smart manufacturing survey take to complete?
A:

The survey is designed to take no more than ten minutes from start to finish.
 

Q:
Does the ICAMS smart manufacturing survey request sensitive information?
A:

No. The survey does not ask for sensitive information, and participant names and company names are not associated with responses.

Enhancing Circularity: Opportunities for IC and Other Component Reuse

Date
-

This webinar focuses on circularity in electronics manufacturing, particularly on the recovery and reuse of integrated circuits (ICs).

The session includes an introduction by EarthShift Global (ESG) CEO Lise Laurin on the collaborative work ESG is conducting with the National Institute of Standards and Technolgy (NIST) to explore the potential for broader IC reuse.

This introduction is followed by a discussion on the role of electronic component reuse within the industry, and what challenges and opportunities exist for companies engaged in this practice.

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

North American PCB Industry Sales Down 23.8 Percent in March

IPC releases PCB industry results for March 2024

IPC announced today the March 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.13.

Total North American PCB shipments in March 2024 were down 23.8 percent compared to the same month last year. Compared to the preceding month, March shipments were up 12.2 percent.

PCB bookings in March were down 1.9 percent compared to the same month last year. March bookings were down 19.4 percent compared to the preceding month.

“The uptick in orders through the first quarter reverses the downtrend and reaffirms strength amid ongoing challenges,” said Shawn DuBravac, IPC’s chief economist.

March 2024 PCB book to bill ratio chart 1
March 2024 PCB book to bill ratio chart 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

North American EMS Industry Down Four Percent in March

IPC releases EMS industry results for March 2024

IPC announced today the March 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.31.

Total North American EMS shipments in March 2024 were down 4.0 percent compared to the same month last year. Compared to the preceding month, March shipments increased 0.1 percent.

EMS bookings in March increased 5.0 percent year-over-year and decreased 5.3 percent from the previous month.

“Strong order growth through the first quarter has helped lift the book-to-bill to its highest level in over a year, suggesting solid demand and positive momentum,” said Shawn DuBravac, IPC’s chief economist.

March 2024 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets

IPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.

Arlon produces and sells military-grade, copper-clad laminates, prepregs, and packaging substrates to the global electronics industry. The company continues to be listed as an IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards trusted source capable of manufacturing in accordance with industry best practices for IPC slash sheets 40, 41, and 42, the polyimide-based slash sheets covered in IPC-4101E. Arlon successfully requalified their product 33N, 35N and 85N to slash sheets 40 and 41 of IPC-4101E. Arlon also successfully requalified their products 37N and 38N to meet the requirements of slash sheet 42.

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also audits and certifies electronics companies' products and identifies processes that conform to IPC standards.

“Arlon has differentiated itself from the competition in the polyimide market by becoming part of IPC's global network of trusted industry sources,” said Randy Cherry, IPC director of Validation Services. “We are pleased to recognize Arlon for their requalification and for being the first U.S. facility to be a trusted supplier conforming to IPC-4101E as well as covering all three polyimide specification sheets.”

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.     

Arlon and other trusted sources of suppliers can be found on IPC's QML/QPL (Qualified Product Listing) database at www.ipcvalidation.org.   

Record Numbers of Exhibitors to Showcase their Products and Services at EWPTE 2024

WHMA/IPC announces that 215 exhibitors spanning over 50,000 nsf of exhibit space will introduce new product technologies, innovations and demonstrations of the electrical wire harness, wire, coil winding and cable processing industries’ newest advancements at Electrical Wire Processing Technology Expo (EWPTE) to be held at Baird Center May 14-16, 2024, in Milwaukee, Wis. This marks the largest number of exhibiting companies in the event’s history. More than 3,000 attendees are expected to attend this year’s event.

On an expanded show floor from previous years, top-rated suppliers will present best-in-class equipment, materials, processes and services to help attendees gain greater efficiency while improving their bottom lines.

"One of the top objectives for attendees is to see new products on the show floor, said Alicia Balonek, WHMA/IPC senior director of trade shows and events. “EWPTE has been recognized as a top 100 fastest growing show in the United States for net square footage and number of exhibiting companies and as a result, is considered as a 'best show to do business,' and provides ample opportunities to network with existing customers, meet new customers, grow business and increase revenue. For many attendees, EWPTE provides them the unique opportunity to come together to find solutions to challenging wire problems through training and education and for the opportunity to network and do business with industry leaders and subject matter experts all under one roof," Balonek added.

"With Baird Center’s new $456 million expansion, square footage of the convention center has now doubled," said Megan Seppmann, vice president of sales for the Wisconsin Center District, owners and operators of Baird Center. "We are excited to welcome EWPTE to our expanded, state-of-the-art venue as Baird Center and EWPTE continue to grow together."

Exhibit hours are Wednesday, May 15 from 9:00 am–5:00 pm CDT and Thursday, May 16 from 9:00 am–2:00 pm CDT. To view a complete list of companies exhibiting at EWPTE or to register, visit www.electricalwireshow.com.

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