Reliable Nickel-Free Surface Finish Solution for High-Frequency-HDIPCB Applications

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The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer.  Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads –a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper.

An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics  analyses, contact/sheet resistance comparison after every reflow cycle (up to 6 reflow cycles) to assess the prevention of copper atom diffusion into the gold layer, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency, high density interconnect (HDI)applications.

Key words: surface finish, ENIG, nickel-less technology, high reliability, robust solder joint, intermetallics.

Author(s)
Kunal Shah
Resource Type
Technical Paper
Event
IPC APEX EXPO 2020

Effect of QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction

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QFN-Quad Flat No-lead SMT-surface mount technology components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability.  QFN device thermal pad regions have been observed w/ excessive void densities >30% in area, which limits the thermal conductivity or performance of the device and often requires subsequent costly rework.  Voids also become more dominant for smaller devices as the surface area of the thermal pad regions decrease, but voids may not correspondingly reduce in size or density. Using various reflow profiles, solder paste volumes and over-print values showed a statistically significant reduction of large voids and void density using the solder paste over print method. In addition, void formation and escape paths were demonstrated using x-ray imaging technology equipment that can be programmed to simulate an actual SMT surface mount technology reflow profile on a thermal platform or hot plate and provide real-time X-ray imaging recording the materials physical and void behavior.

Author(s)
Norman J. Armendariz
Resource Type
Technical Paper
Event
IPC APEX EXPO 2020

IPC E-Textiles 2023 Conference: IPC Issues Call for Participation

IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego, California, in conjunction with IPC APEX EXPO 2023, the industry’s premier conference and exhibition for the electronics industry.

IPC E-Textiles 2023 is a multidisciplinary technical conference, providing an excellent opportunity for the e-textiles industry to learn, network, and collaborate on this vastly expanding technology space. By aligning IPC E-Textiles 2023 with IPC APEX EXPO, speakers and attendees will also have the opportunity to participate in IPC E-Textiles Committee standards meetings and take advantage of all events and education offered during IPC APEX EXPO.

IPC invites innovators and technologists from the e-textiles supply chain and academia to submit an abstract for a technical presentation during the conference. The IPC E-Textiles 2023 Program Committee seeks abstracts in the following topic areas:

  • E-Textiles Success Stories
  • Reliability and Standards
  • Economic and Business Aspects
  • Futuristic Thinking

Within these main topic areas, abstracts can focus on validation of product, washability, design, supply chain issues, innovations in materials, production, software and programming, and sustainability.

A 250-word technical conference abstract should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.

Technical conference paper abstracts are due August 1, 2022. To submit an abstract or course proposal, visit https://www.ipc.org/ipc-e-textiles-2023.

IPC also announces the IPC E-Textiles 2023 Program Committee, which will shape the technical deliverables and format for this exciting and educational event:

  • Vladan Koncar, Ph.D. – University of Lille – Ecole Nationale Supérieure des Arts et Industries Textiles (ENSAIT)
  • Pratyush Rai, Ph.D. – Nanowear, Inc.
  • Sahar Rostami – Myant
  • Yolita Wildman Nugent – Betazip, LLC

For questions about the call for abstracts or interest in exhibiting at IPC E-Textiles 2023, contact Chris Jorgensen, IPC director, technology transfer, at ChrisJorgensen@ipc.org.

IPC E-Textiles 2023

Event Website
Date
- (10:00am - 7:00pm CST)

IPC E-Textiles 2023, the international conference for the e-textiles industry, will be back live and in person Monday, January 23, 2023 in San Diego, California, in conjunction with IPC APEX EXPO 2023! Professional Development Courses about e-textiles and wearable electronics are also welcome for Sunday, January 22, 2023.

Collaborate with industry leaders in e-textiles technologies in fashion design, health and medical, sports and athletics, automotive, and military/aerospace. Every aspect of the e-textiles supply chain will be represented. This global e-textiles industry event allows product designers, technical experts and company executives from around the world to collaborate on new ideas, view and get hands-on access to the latest innovations, and learn how to build reliable products.

By aligning the conference with IPC APEX EXPO, the premier event for the electronics manufacturing industry, speakers and attendees will also have the opportunity to participate in IPC E-Textiles Committee standards meetings and take advantage of all events and education offered during IPC APEX EXPO.

San Diego Convention Center

111 W Harbor Dr
San Diego, CA 92101
United States

San Diego Convention Center

San Diego Convention Center
111 W Harbor Dr
San Diego, CA 92101
United States

Event Website

Fill The Void V - Mitigation of Voiding for Bottom Terminated Components

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Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables, but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).

When voiding is an issue, it is often not possible to change the solder paste or circuit board design due to end user requirements and time constraints. It is much easier to change the stencil design and the reflow profile in an effort to reduce voiding, and this can be done in a timely manner. Stencil design and reflow profile can be used to minimize voiding for BTCs like Quad Flat No Lead (QFN) components. Optimization of the windowpane size and web width can help with voiding. Changing the volume of solder paste on the I/O perimeter pads of QFNs also has an effect on voiding. Use of linear ramp-to-spike (RTS) reflow profiles reduces voiding with some solder pastes, while ramp-soak-spike (RSS) profiles work better for other solder pastes. Stencil design and reflow profile were optimized for a variety of QFN components in order to minimize voiding. The results of this testing were quantified, summarized and recommendations given for ideal voiding performance.

Author(s)
Tony Lentz, Greg Smith
Resource Type
Technical Paper
Event
IPC APEX EXPO 2020

North American PCB Industry Sales Up 2.1 Percent in April

IPC releases PCB industry results for April 2022

IPC announced today the April 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.03.

Total North American PCB shipments in April 2022 were up 2.1 percent compared to the same month last year. However, compared to the preceding month, April shipments fell 20.4 percent.

PCB year-to-date bookings in April were down 14.3 percent compared to last year. Bookings in April fell 5.4 percent from the previous month.

“PCB shipments have been marginally stronger than bookings through the first four months of the year. Shipments are up 6.7% compared to a decline in bookings of 2.6%,” said Shawn DuBravac, IPC’s chief economist. “The disconnect between shipments and orders is likely driven by backlogs for other components. Companies are disinclined to place PCB orders if they are waiting on other components. Despite strong shipments, the book-to-bill remains above 1.”

April 2022 PCB btb chart 1
April 2022 PCB btb chart 2

View charts in pdf format

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

EMS North America Industry Report, April 2022

IPC releases EMS industry results for April 2022

IPC announced today the April 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.36.

Total North American EMS shipments in April 2022 were up 4.3 percent compared to the same month last year. Compared to the preceding month, April shipments fell 10.7 percent.

EMS bookings in April fell 7.2 percent year-over-year and 2.4 percent from the previous month.

“EMS shipments continue to be constrained by supply chain disruptions and have been unable to keep pace with orders,” said Shawn DuBravac, IPC’s chief economist. “Shipments are 2.7% below last year's pace through the first four months of the year, while bookings are up 9.7% over the same time horizon.”

April 2020 EMS book to bill ratio charts

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

AirBorn Inc. Requalifies for IPC/WHMA-A-620 Qualified Manufacturers Listing

IPC's Validation Services Program has awarded a requalification of the IPC/WHMA-A-620 Qualified Manufacturers Listing (QML) Class 3, to AirBorn Inc. for two U.S. locations: Georgetown, Texas and Lake City, Pa. AirBorn Inc. continues to be a trusted source and supplier to original equipment manufacturers (OEMs), meeting the stringent requirements of one of IPC's foremost standards: IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.

During the IPC Validation Services QML audit, AirBorn Inc. fulfilled or exceeded the requirements for the electronics industry’s most rigorous classification, Class 3, which is intended for high-performance electronics assemblies. The company continues to be recognized as an IPC trusted source capable of manufacturing in accordance with industry best practices. “AirBorn Inc. is very proud to have their Georgetown, Texas and Lake City, Pennsylvania facilities requalified to IPC/WHMA-A-620,” said Jen Nelson, AirBorn Inc.’s vice president of operations and supply chain management.

IPC's Validation Services QPL/QML Programs were developed to promote supply chain verification and recognition. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize AirBorn Inc. for maintaining their participation in IPC's network of trusted suppliers.”

EWPTE, the Cable and Wire Harness Industry’s Exclusive Trade Show Returns as In-person Event and Draws More than 2,500 Attendees

From revolutionary advancements in electrical wire processing technology displayed on the show floor to expert insights conveyed in reimagined training and educational offerings, the Electrical Wire Processing Technology Expo (EWPTE), provided expanded networking and increased access to industry solutions that helped 2,574 attendees address business challenges and prepare for the future. The 2022 event was produced for the first time by the Wiring Harness Manufacturer’s Association (WHMA), IPC and the Wisconsin Center.

“We were thrilled to reconvene and reconnect after a two-year hiatus,” said Joe DeMan WHMA Board Chair, “but we were back and better than ever!” Our goal was for attendees and exhibitors to leave ‘wired and inspired’ and take their ideas and innovations developed on-site and turn them into real-world solutions and business opportunities.”

In workshop, seminar and technical conference sessions, attendees had access to new research on troubleshooting techniques, reliability, design, testing, and harness automation.

From attendee survey responses, attendees clearly achieved their business objectives while at the event. “EWPTE provides a great opportunity to see machines, suppliers, and tools in person to get a better understanding of the changing technology in wire processing. It allows me as a spectator to see new technology and machines in action that you can't see on a website or in a brochure. The variety of exhibitors and their products and services inspired me to think about other areas of my production and how I can improve them,” said Luke Morrill, manufacturing engineer, Peterson Engineering.

The EWPTE 2022 experience was equally positive for the 156 exhibitors who showcased their products and services on 37,100 square feet of show floor space. Total leads generated for exhibitors in 2022 was 8,929 according to lead count data.                       

“The overall show experience met and, in some cases, exceeded our expectations,” said Greg Wasko, executive vice president-partner, Mecal by Starn. “We could list many things that made the show great. What really matters… We more than doubled our leads from any show previously. Thank you IPC/WHMA staff for a job well done!”                                                          

Added Darren Teasck, president/managing director, Schleuniger, “The Schleuniger team was excited to return to Milwaukee and very pleased with the level of activity. After the events of the last couple years, it was more important than ever to reconnect face to face with customers, colleagues, and attendees. We enjoyed the opportunity to engage in person and look forward to seeing everyone again next year.”         

In 2023, EWPTE will return to the Wisconsin Center, May 16-18. For more information, visit www.electricalwireshow.com.

 

IPC Establishes European Subsidiary

To better support our European members’ interests, IPC announces the formation of IPC Electronics Europe GmbH. The subsidiary was officially registered with the German government on May 4, 2022. The new entity’s main office is located in central Munich.                   

John W. Mitchell, IPC president and CEO commented, “While we have been actively engaged and successful in Europe for more than 30 years, having a legal entity here now enhances our ability to serve the regional electronics industry and our membership in newer and bolder ways with renewed vigor.”

“We are very excited about the prospects of actively participating in significant consortiums and working groups in the EU to help drive newer standards, education, and advocacy solutions that will be vital in transforming the continent’s factories of the future,” said Sanjay Huprikar, president of IPC in Europe and South Asia.                     

IPC has plans in place to expand staff in Europe in addition to Francisco Fourcade who joined IPC in April as electronics standards manager to liaise with the growing number of new standards development committees forming in Europe. The organization will be adding talent to the certification, marketing, and industry intelligence teams over the next 18 months.

For more information on IPC Electronics Europe GmbH and the new office location, contact Philippe Leonard, senior director of operations, at PhilippeLeonard@ipc.org.

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