The call for sustainability in the electronics industry reverberates globally, marking a pivotal moment in our history. With a commitment to fostering change, IPC is actively engaged in empowering manufacturers to navigate this transformative journey. Through industry standards, workforce training, certification programs, and advocacy efforts, IPC champions a collaborative approach to address sustainability challenges head-on. As Dr. John W. Mitchell, president and CEO of IPC, underscores in the latest issue of PCB007 Magazine, the industry's future hinges on concerted efforts to build electronics sustainably, embracing conscientious lifecycle management and resource efficiency. IPC will continue to facilitate dialogue and innovation to shape a more sustainable future for all. Read more in PCB007 Magazine. IPC Contact: Kelly Scanlon

In March, the White House Office of Science and Technology Policy (OSTP) unveiled a strategy aimed at catalyzing microelectronics innovation in the United States. Aligned with the bipartisan CHIPS Act, the National Strategy on Microelectronics Research sets forth ambitious objectives for the coming five years. IPC was pleased to see advanced packaging, test, and assembly mentioned, and the emphasis on fostering a supportive ecosystem including materials, substrates, and interconnect technology was on target. IPC’s 2021 report on advanced packaging was also cited as a guiding reference. You can be sure IPC will refer to this strategy often as our advocacy continues, emphasizing a “silicon-to-systems” approach. IPC Contact:  Rich Cappetto

In early April, the European Commission took another step in advancing semiconductor technology by allocating the first tranche of funding for “pilot lines” under the European Chips Act. Managed by the Chips Joint Undertaking, which oversees the EU's investment in chips research, this allocation marks a pivotal moment in the region's technological advancement. Following a rigorous selection process, Imec, CEA-Leti, and Fraunhofer have emerged as key players among the Research and Technology Organizations (RTOs) entrusted with running these pilot lines. These lines will serve as crucial bridges “from lab to fab,” facilitating the transition of cutting-edge technologies from conception to commercialization. One of the pilot lines will specifically focus on advanced heterogeneous systems integration, highlighting the EU's commitment to fostering innovation across diverse domains within the semiconductor industry. Read the press release from Chips Joint Undertaking. IPC Contact: Alison James.

The U.S. EPA recently finalized a risk management rule for methylene chloride under the Toxic Substances Control Act (TSCA). The rule seeks to ban all consumer and most commercial and industrial uses of methylene chloride, including uses in electrical equipment, appliance, and component manufacturing. The applications that EPA is allowing to continue will be subject to new mandates under a Workplace Chemical Protection Program. IPC is currently working to understand the potential impacts of this rule on the electronics manufacturing industry. To provide an overview of the EPA’s final regulatory action and implementation timeframes, the EPA is hosting a webinar on Tuesday, June 4, 2024, at 1:00 PM EDT. IPC members are encouraged to read the final rule and register for the webinar to learn more about this important change. IPC Contact: Kelly Scanlon.

by Michelle Mermelstein, IPC Director of Media Engagement 

A new video released today by IPC says “focusing on chips just isn’t enough” when it comes to ensuring America’s resilience and security. Instead, the U.S. Government should take a comprehensive “silicon-to-systems” approach to its CHIPS for America and defense electronics programs.

With animation and graphics, the video tells the story of how electronic systems are at the heart of everything – from cars to computers to phones and medical devices. The video was produced to help IPC share data supporting the need to recognize the value in the entire electronics ecosystem beyond just silicon chips.

In Washington and around the world, IPC is urging policymakers to take measures such as providing funding for defense purchases of “trusted” printed circuit boards (PCBs); enacting tax incentives for purchases of domestic PCBs; developing more skilled workers and career pathways in electronics; and using CHIPS Act funding to ramp up production of related essentials such as integrated circuit substrates and “advanced packaging.” 

IPC is promoting the video to targeted audiences via its social media accounts, email newsletters, and other communications channels. IPC members and partners are encouraged to help spread the word by sharing the video with their professional networks, elected officials, and local leaders to help explain the need for the “silicon-to-systems” approach.