Chemicals Management for Electronics - USA 2024

Date
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IPC will be in Boston, MA on June 24th and 25th to keep on top of chemical management and its implication for achieving sustainability initiatives. IPC is proud to be a sponsor for this event and IPC members receive a 15% discount on registration. This event is hybrid – so we hope to see you there in person or on screen.

Hyatt Regency Boston Harbor

101 Harborside Drive
Boston, MA 02128
United States

Hyatt Regency Boston Harbor

Hyatt Regency Boston Harbor
101 Harborside Drive
Boston, MA 02128
United States

IPC's Collaborative Approach to Advocating for Sustainable Electronics

Jun 03, 2024
| By Kelly Scanlon

The call for sustainability in the electronics industry reverberates globally, marking a pivotal moment in our history. With a commitment to fostering change, IPC is actively engaged in empowering manufacturers to navigate this transformative journey. Through industry standards, workforce training, certification programs, and advocacy efforts, IPC champions a collaborative approach to address sustainability challenges head-on. As Dr. John W. Mitchell, president and CEO of IPC, underscores in the latest issue of PCB007 Magazine, the industry's future hinges on concerted efforts to build electronics sustainably, embracing conscientious lifecycle management and resource efficiency. IPC will continue to facilitate dialogue and innovation to shape a more sustainable future for all. Read more in PCB007 Magazine. IPC Contact: Kelly Scanlon

IPC Applauds White House’s Microelectronics Strategy

Jun 03, 2024

In March, the White House Office of Science and Technology Policy (OSTP) unveiled a strategy aimed at catalyzing microelectronics innovation in the United States. Aligned with the bipartisan CHIPS Act, the National Strategy on Microelectronics Research sets forth ambitious objectives for the coming five years. IPC was pleased to see advanced packaging, test, and assembly mentioned, and the emphasis on fostering a supportive ecosystem including materials, substrates, and interconnect technology was on target. IPC’s 2021 report on advanced packaging was also cited as a guiding reference. You can be sure IPC will refer to this strategy often as our advocacy continues, emphasizing a “silicon-to-systems” approach. IPC Contact:  Rich Cappetto

EU Chips Research Funding Bridges Lab-to-Fab Gap

Jun 03, 2024

In early April, the European Commission took another step in advancing semiconductor technology by allocating the first tranche of funding for “pilot lines” under the European Chips Act. Managed by the Chips Joint Undertaking, which oversees the EU's investment in chips research, this allocation marks a pivotal moment in the region's technological advancement. Following a rigorous selection process, Imec, CEA-Leti, and Fraunhofer have emerged as key players among the Research and Technology Organizations (RTOs) entrusted with running these pilot lines. These lines will serve as crucial bridges “from lab to fab,” facilitating the transition of cutting-edge technologies from conception to commercialization. One of the pilot lines will specifically focus on advanced heterogeneous systems integration, highlighting the EU's commitment to fostering innovation across diverse domains within the semiconductor industry. Read the press release from Chips Joint Undertaking. IPC Contact: Alison James.

IPC Evaluating Potential Impact of New U.S. EPA Rule on Methylene Chloride

Jun 03, 2024

The U.S. EPA recently finalized a risk management rule for methylene chloride under the Toxic Substances Control Act (TSCA). The rule seeks to ban all consumer and most commercial and industrial uses of methylene chloride, including uses in electrical equipment, appliance, and component manufacturing. The applications that EPA is allowing to continue will be subject to new mandates under a Workplace Chemical Protection Program. IPC is currently working to understand the potential impacts of this rule on the electronics manufacturing industry. To provide an overview of the EPA’s final regulatory action and implementation timeframes, the EPA is hosting a webinar on Tuesday, June 4, 2024, at 1:00 PM EDT. IPC members are encouraged to read the final rule and register for the webinar to learn more about this important change. IPC Contact: Kelly Scanlon.

James Will to Lead USPAE as New Executive Director

Effective May 28, 2024, James Will joined the U.S. Partnership for Assured Electronics (USPAE) as the association’s new executive director. USPAE is an IPC subsidiary that focuses on partnership with the U.S. Government to support a more robust defense electronics industrial base. Over its short history, USPAE has steered more than $30 million to industry for high priority projects.

As executive director of USPAE, Will is responsible for growing the organization to help ensure the U.S. Government has access to trusted, secure, and resilient electronics supply chains. One of the organization’s signature programs is the Defense Business Accelerator (DBX), which aims to revolutionize how the Department of Defense (DOD) drives dual-use technology development by harnessing the size and speed of the commercial market to accelerate the growth of a resilient dual-use electronics ecosystem.

 An engineer by training, Will comes to USPAE with a strong technical and operational background in the electronics industry and is active in industry organizations, including the National Defense Industrial Association (NDIA) and International Microelectronics Assembly and Packaging Society (iMAPS). His background includes leading and supporting enterprise A&D programs, from foundry to packaged and qualified high-reliability components. As a contractor to the Department of Energy National Nuclear Security Administration, he supported trusted foundry, semiconductor products and components, and assurance interests. Will, most recently, led aerospace and defense business development for SkyWater Technology Foundry. His additional commercial experience includes roles at Motorola and Infineon, from engineer to engineering management, including involvement in a 300mm fab startup.  

“I am excited to build USPAE’s role as a trusted third party that connects industry and U.S. Government stakeholders to promote an assured electronics supply chain,” said Will.  “Strengthening public-private sector collaboration is critical to both U.S. national security and economic growth. I am honored to leverage my experience developing solutions for the aerospace and defense industries to further USPAE’s mission of building a robust domestic ecosystem for electronics manufacturing.”

“With Jim’s extensive background in driving innovation and adopting solutions throughout the electronics supply chain, he is uniquely qualified in growing and positioning USPAE to help ensure the U.S. Government has access to trusted, secure, and resilient electronics,” said John Mitchell, USPAE Chairman of the Board. “Jim is well-respected in the defense manufacturing community, and we’re thrilled to have him at the helm of USPAE.”

For more information on USPAE, visit www.USPAE.org or send inquiries to info@uspae.org.

New IPC Video Urges “Silicon-to-Systems” Approach to CHIPS Funding

May 28, 2024

by Michelle Mermelstein, IPC Director of Media Engagement 

A new video released today by IPC says “focusing on chips just isn’t enough” when it comes to ensuring America’s resilience and security. Instead, the U.S. Government should take a comprehensive “silicon-to-systems” approach to its CHIPS for America and defense electronics programs.

 

With animation and graphics, the video tells the story of how electronic systems are at the heart of everything – from cars to computers to phones and medical devices. The video was produced to help IPC share data supporting the need to recognize the value in the entire electronics ecosystem beyond just silicon chips.

In Washington and around the world, IPC is urging policymakers to take measures such as providing funding for defense purchases of “trusted” printed circuit boards (PCBs); enacting tax incentives for purchases of domestic PCBs; developing more skilled workers and career pathways in electronics; and using CHIPS Act funding to ramp up production of related essentials such as integrated circuit substrates and “advanced packaging.” 

IPC is promoting the video to targeted audiences via its social media accounts, email newsletters, and other communications channels. IPC members and partners are encouraged to help spread the word by sharing the video with their professional networks, elected officials, and local leaders to help explain the need for the “silicon-to-systems” approach.

 

North American PCB Industry Sales Up 9.4 Percent in April

IPC releases PCB industry results for April 2024

IPC announced today the April 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.06.

Total North American PCB shipments in April 2024 were up 9.4 percent compared to the same month last year. Compared to the preceding month, April shipments were up 18.6 percent.

PCB bookings in April were up 2.6 percent compared to the same month last year. April bookings were up 2.9 percent compared to the preceding month.

“Over the last few months, the PCB sector has demonstrated solid performance,” said Shawn DuBravac, IPC’s chief economist. “Strong PCB shipments this month pulled the Book-to-Bill down from its recent high last month.”

April 2024 PCB book to bill ratio chart 1
April 2024 book to bill ration chart 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

North American EMS Industry Down 2.1 Percent in April

IPC releases EMS industry results for April 2024

IPC announced today the April 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.42.

Total North American EMS shipments in April 2024 were down 2.1 percent compared to the same month last year. Compared to the preceding month, April shipments decreased 1.9 percent.

EMS bookings in April increased 33.6 percent year-over-year and increased 16.0 percent from the previous month.

“Strong orders this month have pulled the EMS Book-to-Bill to its highest level since February 2022,” said Shawn DuBravac, IPC’s chief economist.

April 2024 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

Growing Wire Harness Industry in India Highlighted at EWPTE 2024

May 24, 2024

by Brittany Martin, IPC/WHMA Marketing Coordinator

“Made in India” was a central phrase at EWPTE 2024. The wire harness event hosted the inaugural “India Pavilion” which showcased Indian wire harness companies on the exhibit floor. The Pavilion was opened with pomp and circumstance by the Wire Harness Manufacturer’s Association (WHMA) Board Chair, David Bergman on Wednesday, May 15 with a ribbon-cutting ceremony. The show shone the spotlight on 15 exhibiting companies from India entering the North American market.

India Pavilion Ribbon Cutting at EWPTE 2024

Gaurab Majumdar, director of IPC India, explained the impetus behind bringing Indian wire harness and cable assembly companies to EWPTE, “Due to geo-political trade issues and supply chain disruptions, we believe that these companies can play an important role for North America end-user sector.” According to Majumdar, strategic alliances and export leads were the major deliverables from these Indian exporters' participation at EWPTE 2024.

Anushka Jain, head of business development at Advance Cable Technologies Pvt. Ltd. was optimistic that exhibiting at EWPTE would provide a gateway into new markets, “We have taken what we’ve learned about the wire harness industry in India and we want to bring that knowledge to North America. EWPTE is the perfect place to start exploring that market.”

Jitender Singh from Jeet Enterprises was excited to be exhibiting at EWPTE for the first time. Singh noted, “We wanted to find a marketplace that would put us in direct contact with wire harness customers. We have found that market at EWPTE and it has helped us tremendously in building a contact list of customers.”

The wire harness industry in India is growing thanks to the expansion of aerospace, defense, automotive, and medical devices markets. The market size for cable assembly is expected to witness significant growth in the forecast period due to the increasing adoption of advanced technologies such as 5G, IoT, and AI, which require high-speed and reliable data transmission. Moreover, the growing trend towards miniaturization and modularization of electronic devices is expected to further boost the demand for cable assembly solutions and boost the bottom line of the companies.

The North American wire harness market is also expected to witness significant growth, driven by the increasing adoption of advanced technologies and the expansion of the healthcare and data center industries. There will be a need for supplies, components, and contract manufacturing and India can be the source. IPC India, through engaging with the wire harness manufacturers and suppliers through training and certification, has received interest in export and strategic alliances with U.S. OEMs.

ESC India, an agency of the Ministry of Commerce and Industry supported the following Indian companies to participate in EWPTE:

  • Nysha Mobility Tech Pvt Ltd
  • Paras Wires Pvt Ltd
  • JEET INTERPRISES/TECHVIVA
  • Katlax Enterprise Pvt Ltd
  • Advance Cable Technologies
  • Cable Solutions
  • Miracle Electronic Devices Pvt. Ltd
  • Sahasra Electronics
  • Siechem Technologies Pvt. Ltd
  • Avalon Technology And Services Pvt Ltd
  • Terminal Technologies
  • East West AutoMation Tech Pvt. Ltd.
  • Turbo India Interconnect Solutions LLP
  • UKB Electronics
  • Sigma Terminals

In 2025, EWPTE will return to Baird Center for its 23rd year, May 6-8. For more information, visit www.electricalwireshow.com.

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