Two Long-time IPC Volunteers Receive Dieter Bergman IPC Fellowship Award

The Dieter Bergman IPC Fellowship award was presented to two IPC volunteers at IPC APEX EXPO 2024. The award recipients have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts. Tiberiu Baranyi and Zhiman Chen were chosen as award recipients as they embody the work ethic and spirit of the late Dieter Bergman, an industry pioneer and icon. As part of the award, they bestowed Dieter Bergman Memorial Scholarships to the university or college of their choice.  

Tiberiu Baranyi, a technology group manager at Flex, is a valued member of more than 25 IPC standards committees, serving as co-chair on several of them, including 7-31B IPC A-610 Task Group, 5-22A- EU J-STD-001 Task Group,7-31A, D-33A EU IPC-A-600 and IPC 6012 Task Groups, 7-34 EU, and 7-31F WHMA A-620 EU Task Group. He is a member of more than 40 different A-Teams and working groups for IPC and currently serves as Chair of the European Standards Steering Committee and vice-chair of the task group responsible for IPC-9726, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies.

Baranyi has chosen the Politehnica University of Timisoara, Department of Electronics, Telecommunications and Information Technologies as his Dieter Bergman Memorial Scholarship selection.

Zhiman Chen, Zhuzhou CRRC Times Electric Co., Ltd., was also honored for her extensive knowledge and understanding of the industry and the development of standards. Chen participates in the global standardization activities of IPC, IEEE, and ISO/IEC. At IPC, she has served as a two-term member of IPC TAEC-Global, two-term chair of IPC Asian Standards Steering Committee and founding member of IPC’s China Intelligent Manufacturing Steering Committee co-chair of 7-24B, chair of 7-31F-Rail Transit Task Group and is active on many additional task groups.

Chen has also led the development of the first two IPC documents dedicated to rail transit: IPC-A-610GRail and IPC/WHMA-A-620CRail; guided the successful launch of new standards in advanced packaging: IPC-6921 for IC substrates, IPC-6931 for optical modules, and IPC-9541 for systems in package; and is dedicated to providing expertise for IPC webinars, and IPC EDGE, IPC’s e-learning platform.

Chen is committed to helping IPC Asian members better participate in and contribute to IPC’s global standardization and networks with leading players in industries and supply chains, enhancing influencer engagement, and promoting industrial associations, forums, and summits. In June, Chen will serve as a panelist on IPC’s Women in Engineering event, detailing her career journey and offering advice to emerging engineer participants. Chen has chosen Hunan Automotive Engineering Vocational College (HAEVC) to receive the Dieter Bergman Memorial scholarship.

“The recipients of this year’s Dieter Bergman Fellowship award epitomize the spirit of fellowship in leading and working with volunteers from around the world, and we are fortunate that they have chosen to share their considerable talent and expertise,” said John W. Mitchell, IPC president and CEO. “We are glad to be able to honor their volunteerism and assist future engineers with this award.”

IMAPS & IPC to Host Onshoring Workshop

April 29–May 1 in Arlington, Virginia

The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.

This workshop will bring together Government agencies, the DIB (Defense Industrial Base) and Advanced Packaging and Assembly stakeholders to discuss their ongoing efforts to develop advanced packaging capability onshore. The mission of this event is to engage the domestic semiconductor industry by providing updates on US Government and Defense initiatives that are critical to the onshoring of the microelectronic assembly and packaging supply chain.  Advanced packaging initiatives lead by numerous Government agencies, including the Department of Commerce/NIST (ME Commons, NAPMP and NSTC), DoD (RESHAPE, SHIP, STAM, STEAM PIPE, SCALE, IBAS, Title III), and DARPA (NGMM) will be presenting.

The workshop will feature three days of program focused sessions, informative keynote presentations, a work force development session, panel discussions and a variety of networking opportunities.  The event will kick-off on Monday April 29th with a pre-program day with 2-hour professional development courses and/or additional working groups addressing a variety of topics relevant to the onshoring of advanced packaging.  The 2024 workshop also features opportunities for sponsorship and tabletop exhibitors. 

Attendees can help shape another successful Onshoring Workshop by contributing their valuable insight!  A United States Passport is required for registration.

Keynotes include:

  • Ms. Adele Ratcliff, Director of Innovation Capability and Modernization (ICAM) Office
  • Dr. Dev Palmer, Next-Generation Microelectronics Manufacturing (NGMM) Program Managing Director, DARPA
  • Dr. Dev Shenoy, Office of the Undersecretary of Defense, Director of the Defense Microelectronics Cross Functional Team
  • Dr. Eric Lin, Deputy Director, CHIPS Research and Development Program
  • Dr. George Orji, Deputy Director, Chips NAPMP
  • Dr. Joshua Hawke, Navy, OUSD R&E RF/OE Initiatives, Technical Execution Area Lead
  • Ms. Molly Just, Director of CHIPS Coordination Cell, OUSD A&S

Comment from the Technical Program Chair:

 “With the exceptional engagement of our Technical Steering Committee members, we have assembled a comprehensive program for this year’s Workshop with representation from all of the US Government and Defense agencies that are tasked with driving the advanced packaging onshoring efforts and associated supply chain stakeholder enhancements.  During this event, attendees will be updated directly from DoD leaders and their industry performers on current and future programs that will address and inform U.S. Government advanced packaging roadmaps. This workshop also provides outstanding opportunities to interface with multiple levels of Government leadership, the Defense Industrial Base, and Commercial Suppliers, all of whom share a common goal to make the USA more self-sufficient in microelectronics manufacturing.”  ~ Ted Tessier, IBM

For more information or to register, visit: https://imaps.org/page/Onshoring2024.

 

Three Industry Leaders Receive IPC President’s Award

In recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, three IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, Calif., on April 9, 2024. Recipients were Nick Koop, TTM Technologies, Hiroyuki Watanabe, NEC Corporation, and Dieter Weiss, Weiss Engineering.

Nick Koop was instrumental in the creation of IPC standards that provide specifications for flex and rigid-flex, IPC-2223, and IPC-6013, along with material specifications and test methods. He also contributes to specifications for rigid PCBs, raw materials, final finishes, test methods, and common terminology. He serves as chair of the D-10 Flexible Circuits Committee and D-12 Flexible Circuits Specification Subcommittee and is a member of the Technical Activities Executive Council and the Chairman’s Committee Council.

Hiroyuki Watanabe serves as a member of the IPC Board of Directors and the IPC Thought Leader Program. A lecturer for the IPC engineering webinar series, he also presents webinars to Japan Regional Task Group members. An active participant in the IPC Asia Task Group meetings, Watanabe served as committee chair for the IPC-1792 standard and introduced the significance of that standard at an anti-counterfeiting symposium. He serves on the A-Team “Cyber Key Holder,” and participates in standards committee activities for 2-12A, 2-19A, 2-10, and 2-19C task groups.

Dieter Weiss provides market research on the European EMS industry under the brand in4ma. With IPC’s support, he built a unique database that provides the most qualified benchmarking data available for the EMS industry in Europe. He works on statistical disciplines that enable him to collect data, formulate statistical models, and predict and validate those models using algorithms that involve market segments, company size, and degree of vertical integration to best calculate revenue growth within the industry.

“The leadership and expertise of Nick, Watanabe-san, and Dieter are indispensable to our industry,” said John W. Mitchell, IPC president and CEO. “We show our appreciation for their significant contributions to IPC and the global electronics industry by presenting them with the IPC President’s Award.”

IFTEC’s Pierre-Jean Albrieux Inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024

In recognition of his extraordinary contributions to IPC and the electronics manufacturing industry, Pierre-Jean Albrieux, president of IFTEC-France, was inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.

Albrieux was honored for his enthusiastic support for IPC’s mission to serve the electronics industry as an advocate for IPC training and certification. Under Albrieux’s leadership, IFTEC has translated multiple IPC standards, training programs for IPC certifications, and Certified IPC Designer and Certified IPC Designer+ study guides into French. IFTEC has been involved in IPC hand soldering competitions in France since 2016, with staff serving as judges at competitions and championships throughout Europe. IFTEC staff members also participate in approximately 30 standards development and training committees. 

A winner of the IPC President’s Award in 2016, Albrieux was recognized for shaping IFTEC into a leading and model IPC Training and Certification Center and Distributor in Western Europe, growing IPC membership in France and promoting IPC services to industry and for overseeing the creation of the IPC Design Council Chapter in France. 

Albrieux is deeply involved in the industry in France, especially with SNESE, (National Association of French Electronic Subcontracting Firms, the representative body of electronic subcontracting trade in France since 1983.

IPC President and CEO John Mitchell notes Albrieux’s accomplishments, “Those who work closely with Pierre-Jean immediately recognize his expertise, strong leadership skills and the knowledge and experience he possesses to accomplish as much as he has. He is respected as a subject matter expert, always ready to move the industry forward as a strong advocate for the development and use of IPC standards in France and beyond.”

IPC Honors Summit Interconnect and Robert Bosch GmbH with Corporate Recognition Awards

IPC presented its highest corporate honors to two IPC member companies, Summit Interconnect and Robert Bosch GmbH during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2024. The Peter Sarmanian Corporate Recognition Award was presented to Summit Interconnect and the Stan Plzak Corporate Recognition Award was presented to Robert Bosch GmbH.

The Peter Samarian Corporate Recognition Award, named for a former IPC Board Chairman, recognizes an IPC-member company in the printed board industry (PCB) that has supported IPC through participation in technical and management programs while providing leadership for the industry.

Summit Interconnect is North America's largest privately held printed circuit board (PCB) manufacturer. Founded in 2017, four Summit locations are certified to the IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements standard, ensuring vetted and secure PCB supply to our nation's critical industries such as defense, aerospace, and medical electronics. Summit staff have been staunch supporters of IPC’s advocacy program, with staff serving on IPC’s North American Government Relations Committee, and USPAE Board of Directors, and attending numerous IPC IMPACT events in Washington, D.C.

More than 115 Summit staff members are Certified IPC Specialists (CIS), Certified IPC Trainers (CIT), or Certified IPC Designers (CID) to such standards as IPC-A-600 and IPC-6012.

Named for former IPC Board Chairman and founding member of the IPC Electronics Manufacturing Services Industry Management Council, the IPC Stan Plzak Corporate Recognition Award honors an IPC-member company in the electronics assembly industry (EMS) that actively contributes to the industry while supporting IPC technical and management programs.   

Robert Bosch GmbH Group is a leading global supplier of technology and services, employing approximately 428,000 associates worldwide. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Mobility is the largest Bosch Group business sector, making the Bosch Group one of the leading automotive suppliers.

More than 15 Robert Bosch GmbH staff members serve on IPC standards development committees, and 35 members have earned CID and CIT certifications.

“IPC benefits tremendously from Summit and Bosch’s leadership and expertise,” said John W. Mitchell, IPC president and CEO. “Both organizations have consistently contributed staff resources and knowledge to standards development and other IPC programs and initiatives. Their involvement has directly contributed to IPC’s global growth in the electronics industry, and we are privileged to have them in our membership.”

For more information on IPC’s Corporate Recognition Awards and other honors presented at IPC APEX EXPO, contact Sandy Gentry, IPC communications director, at SandyGentry@ipc.org or +1 847-597-2871.

IPC Publishes Comprehensive Strategy to Address Electronics Industry’s Global Workforce Challenge, Calls on Leaders in Government, Business and Education for Support

One of the most difficult and urgent challenges facing the electronics industry is a chronic shortage of adequately skilled workers. Today, IPC unveiled an expansion of its strategy to address the workforce challenges of the U.S. electronics manufacturing industry and called on its more than 3,000 member companies to join in the effort.

IPC sets out a solutions-focused workforce plan in a white paper written by David Hernandez, IPC vice president of education, Carlos Plaza, IPC senior director of education and Dr. John W. Mitchell, IPC president and CEO. The paper, “Building Electronics Better: A Plan to Address the Workforce Challenges Facing the Electronics Manufacturing Industry,” targets both immediate labor market needs and the long-term sustainability and growth of the industry by building a skilled, adaptable, and motivated workforce. IPC’s ambitious approach is focused on developing rewarding career pathways.

“IPC is the largest provider of education and workforce development in our industry,” said John W. Mitchell. “We credential more than 145,000 people per year, and we recently secured federal recognition for three registered apprenticeship programs. But we can’t do it alone – we’re calling on our partners in industry, academia, and government to join us on this critically important journey.” 

“Significant challenges, including the lack of a well-defined school-to-industry pipeline, have contributed to industry workforce shortages that constrain the industry's growth and lead to increased production costs,” said David Hernandez. “IPC is delivering a multifaceted approach to recruitment and training. This is essential if we are to turn current socioeconomic, demographic, and cultural trends into opportunities for growth.”

According to the white paper, rising demand for electronic devices across the commercial, healthcare, automotive, and industrial sectors will see the global electronics manufacturing services (EMS) market grow from about $534 billion in 2023 to $856 billion in 2030. Key elements of IPC’s plan include:

  • Talent Pipeline: Establishing partnerships between educational institutions, businesses, government agencies, and non-profit organizations to ensure a steady flow of skilled workers into the electronics manufacturing industry.
  • Career Pathways: Developing clear and structured career pathways that outline progression from entry-level positions to advanced roles, enhancing the visibility of career advancement opportunities within the industry.
  • Training and Education: Prioritizing the development of industry-defined training programs that equip individuals with the necessary skills and knowledge, including both technical and soft skills.
  • Dispelling Myths: Launching outreach efforts to improve the perception of manufacturing careers, highlighting the innovative aspects of the industry, and addressing misconceptions about manufacturing jobs.
  • Partnerships: Encouraging collaboration between government, academia, and industry to speed the transition of students and trainees into the workforce, including internships, apprenticeships, and mentorship programs.
  • Standardized Credentials: Supporting the adoption of universally recognized, stackable credentials that validate the competencies and skills of qualified job candidates.

The electronics industry is gathering this week at IPC APEX EXPO 2024. Held in Anaheim from April 6–11, IPC APEX EXPO features a world-class trade show, a cutting-edge technical conference, and impactful keynote speakers. This year’s event boasts the largest gathering of leading electronics manufacturers, suppliers, and product innovators, a high-quality technical conference with peer-reviewed paper presentations, and professional development courses focused on innovation to build electronics better.

IPC Announces New Board Members at IPC APEX EXPO 2024

At the 67th IPC Annual Meeting on April 9, held in conjunction with IPC APEX EXPO 2024, the IPC Board of Directors announced new officers and new and second-term members. Board officers serve a two-year term, board members serve a four-year term, and the student board member serves a one-year term.

The newly elected Board officers are:

  • IPC Board Chair: Tom Edman, President and CEO, TTM Technologies
  • IPC Board Vice Chair: Jeff Timms, CEO, ASMPT SMT USA LLC
  • IPC Board Secretary/Treasurer: Peter Cleveland, Senior Vice President, TSMC

First time Board members are:

  • Gerald Eckstein, Senior Vice President, Engineering Electronic Control Units & Head of Business Unit Mechatronics, Robert Bosch GmbH
  • Parker Garrett, CEO, EMSCO
  • Greg Maxwell, Vice President, Advanced & Strategic Global Supply Chain for Operations, Northrop Grumman Mission Systems
  • Jaesang Min, Research Fellow, LG PRI (Production Engineering Research Institute)

Second term Board members are:

  • Marc Peo, President, Heller Industries
  • Hiroyuki Watanabe, Executive Vice President and Member of the Board for New Business and Sales, NEC Corporation

Student Board member is:

  • Waad Tarman, Auburn University

"IPC is privileged to have these outstanding professionals on our current slate of Board members,” said John W. Mitchell, IPC president and CEO. “We look forward to working with them as we advance the global electronics industry and build electronics better.” 

In addition to Board election announcements, IPC honored six outgoing Board Members:

  • Henry Crandall, Ph.D. Candidate, University of Utah
  • Joe DeMan, President, Interconnect Dynamics — An Amphenol Global Solutions Provider
  • Robert Feuerstein, Chief Information Security Officer, Group Sector Automotive, Continental AG
  • Steve Pudles, Board of Directors and Advisor, Zentech Manufacturing, Inc.
  • Lisa Weeks, SVP, Chief Strategy Officer and Head of Investor Relations, Benchmark Electronics
  • Shane Whiteside, President and CEO, Summit Interconnect

Added Mitchell, “IPC expresses its sincere gratitude to Henry, Joe, Robert, Steve, Lisa and Shane for their dedicated service to the IPC Board. All have shared their expertise with IPC and industry – we thank them for imparting their knowledge and helping guide IPC to best serve our members and the global electronics community.”

IPC Releases “J” Revisions to Two Leading Standards for Electronics Assembly

IPC J-STD-001 and IPC-A-610 cover printed board assembly process controls, materials, and post-assembly acceptance criteria for the electronics industry

IPC announces the release of revisions for two leading standards for the electronics assembly industry. IPC J-STD-001J, Requirements for Soldered Electrical and Electronic Assemblies is recognized as the sole industry-consensus standard for soldering processes and materials. IPC-A-610J, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry. These two documents are often used together for the manufacture of electronic assemblies.

Revisions to these standards are completed every three years, with significant changes made to each one. Clear guidance on the use of the standard can be found in the first chapter of each document. Committee leaders addressed more than 1,350 comments for revision “J.” Some of the significant changes found in the standards are as follows:

Global changes implemented in both documents:

  • Removed redundant minimum electrical clearance references – covered in Chapter 1 of documents
  • Clarified the use and definition of wire, lead and conductor

Changes to IPC J-STD-001J (Representatives from 27 countries worked on the standard):

  • Added hardware installation requirements
  • Added graphics to address bubbles in X-ray images

Changes to IPC-A-610J (Representatives from 29 countries worked on the standard):

  • Chapter 10 has new images
  • Conformal coating – clarified voiding/bubbles

In addition to the new revisions for IPC J-STD-001J and IPC-A-610J, redline documents are also available. A white paper is available IPC-WP-028, Guidance on Objective Evidence for Validating the Acceptability of Bubbles in Conformal Coatings.

Canon Taiwan Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturer’s Listing

IPC’s Validation Services Program has awarded an IPC Qualified Manufacturers Listing (QML) to Canon Taiwan, a leader in the optical industry, producing single-lens reflex/mirrorless digital cameras, camera lenses, accessories and network surveillance monitors.

Canon Taiwan met or exceeded the requirements for the electronics industry's most rigorous classification, Class 3, which is intended for dedicated service electronics products. As a result of successfully completing an intensive audit, based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies, Canon Taiwan is now among a trusted source of electronics suppliers found on IPC's QML/QPL database at www.ipcvalidation.org.

“Through IPC training, we strengthened our capabilities in SMT processes, practiced KPI, and further developed our differential analysis abilities,” said Keita Sanada, president, Canon Taiwan. “After implementing internal education and training to reinforce quality management, we pursued QML recognition. With guidance from IPC auditors, Canon Taiwan had the opportunity for self-reflection and improvement based on IPC standards, ultimately achieving QML Class 3 validation.”

“Passing this audit demonstrates Canon Taiwan’s standards in quality control, process control, and production technology,” said Randy Cherry, director, IPC Validation Services. “It also upholds Canon’s tenets of ‘jihatsu’ (proactivity), ‘jichi’ (self-management) and ‘jigaku’ (self-awareness). By earning the QML, Canon Taiwan has shown its commitment to delivering the highest level of quality in electronics manufacturing.”

For more information about IPC’s Validation Services program in Asia, contact marketingchina@ipc.org.

Onshoring Advanced Packaging and Assembly 2024

Learn More
Date
-

The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a three-day workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, April 29 - May 1, 2024, at The Westin Arlington in Arlington, Va.  This workshop will bring Government agencies, the DIB (Defense Industrial Base) and advanced packaging and assembly providers together to discuss their efforts to onshore advanced packaging.  The mission of this workshop is to engage our workforce community to identify the newly created advanced packaging programs which address U.S. Government and Defense requirements critical to the onshoring of the microelectronic assembly and packaging supply chain.  Government agencies including the Department of Commerce/NIST, DoD (SHIP/IBAS/Title III/Printed Circuit Board Executive Agent), DARPA and SRC will be briefing on their advanced packaging programs.

The workshop will feature two days of focused sessions, keynote presentations, a panel discussion, and a variety of networking opportunities. The event will kick-off on Monday with a pre-program day filled with 2-hour professional development courses and/or additional working groups addressing a variety of topics relevant to the onshoring of advanced packaging.  The 2024 Workshop will also feature networking opportunities with sponsors and tabletop exhibitors. 

Workshop registration restricted to U.S. Passport Holders Only

The Westin Arlington

801 North Glebe Road
Arlington, VA 22203
United States

The Westin Arlington

The Westin Arlington
801 North Glebe Road
Arlington, VA 22203
United States

Learn More
Subscribe to