North American EMS Industry Shipments Up 0.2 Percent in November

IPC releases EMS industry results for November 2023

IPC announced today the November 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.23.

Total North American EMS shipments in November 2023 were up 0.2 percent compared to the same month last year. Compared to the preceding month, November shipments decreased 1.4 percent.

EMS bookings in November decreased 10.1 percent year-over-year and increased 4.3 percent from the previous month.

“Despite a small rise in new orders this month, the year-to-date trend deteriorated to its lowest point in 2023,” said Shawn DuBravac, IPC chief economist. “With one month remaining in the year, shipments should end the year higher compared to last year, despite weak order flow.”

November 2023 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

North American PCB Industry Shipments Down 22.5 Percent in November

IPC releases PCB industry results for November 2023

IPC announced today the November 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.97.

Total North American PCB shipments in November 2023 were down 22.5 percent compared to the same month last year. Compared to the preceding month, November shipments were down 16.3 percent.

PCB bookings in November were down 9.2 percent compared to the same month last year. November bookings were down 9 percent compared to the preceding month.

“PCB shipments were roughly five percent below our expectations for the month. The year-to-date trend fell to its lowest point of the year,” said Shawn DuBravac, IPC chief economist. “Weak order flow in November suggests the year will likely end on a flat note.”

PCB book to bill ratio chart November 2023
PCB book to bill ratio chart 2 November 2023

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

Overcoming the Challenges for Implementing IPC J-STD-001 in Your Factory

Date
-

Implementation of a new process, machine, or material triggers a qualification event for that change under the new H revision of IPC J-STD-001. 

When a change in specific materials is being considered, one must determine and provide objective evidence that the improvement does not increase the quality or functionality risk of the product. In order to quantify the risk, the CM and/or OEM are required to acquire quantitative data before implementing the process change. The methodology developed in this webinar is designed to assist the user in incorporating specific tools and analytical measurements to ensure the product’s reliability via objective evidence and controls. This webinar illustrates the challenges of a real-life implementation of a new material change and the subsequent qualification.

Speaker Bio

Denis Barbini, Ph.D.

Denis Barbini, Ph.D., is an esteemed electronics manufacturing and assembly professional. Formerly the Associate Director of the A.R.E.A. Consortium, he led the identification of critical needs in emerging technologies and assembly processes. With extensive hands-on experience, Denis has provided invaluable guidance and solutions to companies worldwide. His expertise lies in implementing cost-effective, reliable, and robust processes for electronic devices. Recently, he transitioned to the role of ZESTRON's Technical Solutions Manager, leveraging his 25 years of experience to drive the development of critical projects and explore new industry sectors. Denis's technical prowess, extensive experience, and commitment to innovation make him a respected authority in the field, shaping advancements and enabling excellence in manufacturing processes.

IPC Hand Soldering Competition 2024 Regional Qualification - United Kingdom

Date
-

Join the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) to take place at Farnborough International Exhibition Centre on 6-8 February 2024.

Skilled soldering experts (F/M) will be competing for 60 minutes on a complex circuit board assembly to win the 2024 National title, earn a cash prize , and compete for a coveted spot at the IPC Hand Soldering World Championship later this year.

Competition for Professionals

The professional competitors will be judged by IPC Master Instructors (MIT) on soldering a complex printed circuit board with a maximum time of 60 minutes under IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality of the assembly, and the speed at which the assembly was produced.

Prizes for Professionals

Cash prizes will be awarded to the professionals: the winner and two runners-up.

  • 1st place – 300€
  • 2nd place – 200€
  • 3rd place – 100€

IPC Hand Soldering World Championship: The winner at Instrutec will be invited by IPC (all expenses covered by IPC) to compete in the HSC World Final in November at Electronica tradeshow in Munich, Germany.

Hand Soldering Best Company Team Award: This year again, nominate a team to win the Hand Soldering Best Company Team Award. For any company enlisting 2 or 3 competitors, the highest combined scores of competitors from the same company will determine which company will receive the HSC Best Company Team Award.

Registration is free of charge.

You do not need to be an IPC member to take part.

You do not need to be IPC-certified to take part.

How to register?

Fill in the registration form and book your competition slot.

You will receive a confirmation email specifying your date and time to compete.

The deadline for registration is set to 02.02.2024.

 

For more information, please contact Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org).

Farnborough International Convention Center - Regional HSC Competition - UK

Show Centre, Etps Road
Farnborough
GU146FD
United Kingdom

Farnborough International Convention Center - Regional HSC Competition - UK

Farnborough International Convention Center - Regional HSC Competition - UK
Show Centre, Etps Road
Farnborough, GU146FD
United Kingdom

Test Methods to Validate Acceptable Levels of Flux and Other Process Residues on Production Assemblies

Date
- (12:00 - 1:00pm CST)

Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is the number of soldering process steps used to build the assembly. Selective soldering, wave soldering, manual, and rework soldering can spread flux residues across the assembly. Pockets of active residue can be present when the flux is not fully heat-activated. For high reliability, the best practice is to clean the assembly.

This webinar will teach best practices for qualifying and validating acceptable electrical hardware performance. The methods taught during this presentation can be used to meet the requirements of IPC J-STD-001H ~ Section 8: Cleanliness.

Mike Bixenman, DBA

Speaker Bio

Dr. Mike Bixenman, Chief Technology Officer (CTO) and co-founder of KYZEN Corp. and Magnalytix, LLC, has over 30 years of experience designing electronic assembly cleaning materials and process integration. Sharing his research, knowledge, and expertise is Mike’s passion. He believes in the power of collaboration by working with others to solve problems quickly. An active member of several industry associations, he has chaired and led many committees, symposiums, and task groups committed to understanding the cleaning and reliability challenges of today’s ever-changing electronics industry. Dr. Bixenman holds four earned degrees, including a Doctorate in Business Administration (DBA).

B2B Meeting Registration, India (Bengaluru)

Date
- (Jul 28, 2024 | 11:00pm - Jul 29, 2024 | 5:00am CDT)

This Form is for Indian Companies only

Please Provide Below Details

Status message

Sorry...This form is closed to new submissions.

Venue : Taj Yeshwantpur, Bengaluru
B2B Meeting Venue - Direction click here

 

Registrations are closed,
For more information,
Please contact Mr. Abhishek K. Upadhyay
contact no +91 9313224509

 

International Companies @ B2B Meeting

 

IPC

Printed Circuit Board Assemblies and Box Build Assemblies

 

IPC

Integrated Solutions for mobile devices

 

IPC

Industrial hazardous waste with  (ESM) facility

IPC

Manufacturing high technology Flexible PCBs (FPC) & IC substrates 

 

IPC

 

UAE Space Agency 

IPC

The #1 electronics supply chain AI-powered suite for EMS and OEMs

 

IPC

 

Electronics Manufacturing Services & PCB manufacturer  

IPC

Electronic consumables, wide range of machinery and materials to the PCB, Semiconductor, SMT, Robotics 

IPC

 

Soldering Products & Solutions 

IPC

 

Wire Harness, Material process, Engineering Support 

IPC

Production and distribution of metal jointing materials for electronics (solder, flux, brazing alloys, etc.) 

IPC

Printed circuit assembly (Sensor, box building, power, module, hermatic module), PCB manufacturer, Chip & wire bonding  

IPC

CNC, Tooling Design & Moulding Fabrication, Plastic Injection Moulding, Aluminium Die Casting 

IPC

 

Film Capacitors, CPM - Probes,  EEMB Battery, E-Xing - Probes, M&E Connectors 

 

IPC

ODM of Custom-Embedded Electronic Components and Products 

IPC

 

Cleaning Chemistry Manufacturer 

IPC

 

Repair service 

IPC

Distributor and Supplier - Electronics Components & Supplies  

IPC

 

Design Manufacturing of Cable, Wire Harnesses 

IPC

 

Soldering Robots 

IPC

 

Electronics Manufacturing Services

IPC

Industrial Quality Solutions, Research Microscopy Solutions, Medical Technology, Vision Care and Sports & Cine Optics 

IPC

 

Soldering Stations 

IPC

 

Soldering station, Rework station, Hand tools, ESD & Electronics supplies  

IPC

PCB Design and Embedded Technology  

IPC

Robotic Soldering Machine 

IPC

Manufacturing of Wire and Cable Harnesses 

IPC

 

Exporting and Investing in Australia

IPC

Producing Soldering Materials for Electronics Manufacturers 

IPC

 

Capacitor Applications 

B2B Meeting Registration, Penang ( MALAYSIA )

Date
- (Jul 23, 2024 | 9:00pm - Jul 24, 2024 | 3:30am CDT)

This Form is for Malaysian Companies only

Please Provide Below Details

Status message

Sorry...This form is closed to new submissions.

Venue : Setia Spice Convention Centre, Penang
B2B Meeting Venue - Direction click here

International Companies @ B2B Meeting

IPC Producing Soldering Materials for Electronics Manufacturers

IPC

Die Casting, Conduit Nuts, Pipe Plugs and Connectors

IPC

Distributor of Electronic Components - MLCC

IPC

 

Electronic Manufacturing Services, PCB assembly

IPC

 

Fluid Dispensing and UV Curing technology provider

IPC

Vision Technologies, processors, cameras, lens, lighting, and accessories

IPC

Surface treatment & nano-coating solutions; bonding, painting, printing or coating

IPC

 

Provide Advanced Gas Purification Technologies

IPC

 

Semiconductor Equipment Solutions

IPC

 

Distributor Electronics components

IPC

 

Electronics Tool Suppliers

IPC

Fabless chip design companies, Software Platform, Invests in high technology

IPC

Electronic Manufacturing Services, PCB assembly

IPC

 

Ultrasonic Cleaner

IPC

Soldering System with a complete tooling range. Rework any size of SMD components

IPC

Electronics tool suppliers Ultrasonic, Microbubble Device

IPC

 

Flux Chemicals

IPC

Manufacture Custom Printed Circuit Boards (PCB)

IPC

Robotic Soldering and Laser Soldering

IPC

Manufacturer in the Wire and Cable industry

IPC

 

Repair Solutions

IPC

Lead in innovative software solutions for the financial services industry

IPC

Manual Visual Inspection of complex semiconductor substrates, laminates and lead frames

IPC

 

Comprehensive Lighting Solutions

IPC

Fabless semiconductor company specializing in Reference Clocks and Timing ICs

IPC

 

Computer Communications

IPC

 

Innovative partner for customised solutions

 

IPC

 

EMS Companies 

Vacuum pads and holders, nozzles for electronics

 

 

 

Materials Costs Continue to Improve but Labor Costs Remain a Pain Point for Electronics Manufacturers

IPC Releases November Global Sentiment of the Electronics Supply Chain Report

Electronics industry sentiment improved during November with demand sentiment also taking a solid step up over the last 30 days per IPC’s November 2023 Global Sentiment of the Electronics Supply Chain Report.

And though materials costs continue to improve, labor costs remain a pain point. Three-fifths (62 percent) of electronics manufacturers say they are currently experiencing rising labor costs.

“In this month’s survey, we asked a special question about PCB and EMS production growth,” noted Shawn DuBravac IPC chief economist. “Electronics manufacturers believe the U.S. should adopt strong goals for production growth.” For the PCB sector, roughly 85 percent of respondents reported the five-year goal should be above current levels and the average suggested goal was 9.3 percent of global production. For the EMS sector, roughly 70 percent of respondents indicated a five-year goal above current levels. On average, respondents indicated the EMS industry should target 12.9 percent of global production by 2028 and 17.4 percent of production by 2033.  

Additional survey data show:

  • The New Order Index rose five points to 105 after hitting the lowest level for this index.
  • The Materials Cost Index fell to another new low, dropping four points to 118. The Labor Costs Index rose one point to 130 after declining for two consecutive months.
  • Shipments, orders, capacity utilization, backlogs and profit margins are expected to rise over the next six months, while all other key business indicators are expected to remain relatively stable.

For the report, IPC surveyed hundreds of companies from around the world, including a wide range of company sizes representing the full electronics manufacturing value chain.

View full report.

U.S. Partnership for Assured Electronics Awards Nearly $10 Million to 7 Microelectronics Firms

Seven microelectronics firms received nearly $10 million in combined funding to commercialize technologies of interest to the U.S. military services as winners of the Defense Business Accelerator (DBX) Microelectronics Challenge. This groundbreaking initiative is funded by the Department of Defense (DoD) and led by the U.S. Partnership for Assured Electronics (USPAE).

The challenge aims to revolutionize how the DoD drives the development of dual-use technology, which can be used for both civilian and military applications. The challenge is testing the hypothesis that the DoD can accelerate growth of a robust domestic industrial base by focusing its resources on commercialization of early-stage, hardware-intensive technologies and then scaling them into resilient businesses in partnership with private capital.

The DBX Microelectronics Challenge offered an unprecedented opportunity for advanced technology innovators to vie for funding of up to $2 million each to further commercialize their emerging technologies. The winning companies also will receive commercialization support through an ongoing accelerator program, which includes one-on-one coaching, access to resources and more. The accelerator program’s goal is to not only mature the technology but also scale the domestic business to fill critical gaps in the microelectronics supply chain.

After rigorous evaluation of 279 submissions received via an open solicitation, 25 finalists pitched their groundbreaking ideas at the Defense TechConnect Innovation Summit on November 28. A distinguished panel of industry experts, investors and a DoD representative judged the presentations, selecting the following seven challenge winners for a combined $9.6 million in funding:

  • Freedom Photonics LLC ($1,500,000)
  • Gigantor Technologies ($2,000,000)
  • Momentum Optics ($1,675,000)
  • Mosaic Microsystems ($1,000,000)
  • PseudolithIC, Inc. ($1,000,000)
  • SiliconCore Technology, Inc. ($1,675,000)
  • Soctera, Inc. ($750,000)

“Typically, the timeline from selection to contract award and receipt of funding is several months. DBX leverages the flexibility of Other Transactions Authority (OTA), along with some innovative structuring of the OTA agreement, to enable awardees to receive funding within 48 hours of their selection at the pitch event,” said Christopher Zember, senior fellow for Industrial Base Resilience who is supporting DoD as the architect and lead for this project.

The collaboration between USPAE, a non-profit organization with members spanning the electronics ecosystem, and the DoD’s Manufacturing Capability Expansion & Investment Prioritization Directorate (MCEIP) has been instrumental in driving this initiative forward. Tactical support from Advanced Technology International (ATI), and specifically its TechConnect division, has further fortified the success of the DBX Microelectronics Challenge. To help awardees advance their efforts, Fluent is providing each with key metrics from commercialization assessments and tools for business development.

“We’re honored to move the area of microelectronics forward with this funding and the ongoing accelerator program that we’ll make available to the winners over the next eighteen months,” said Nathan Edwards, executive director of USPAE. “The outcome will be faster access to dual-use technologies for which the military services already have a validated interest.”