IPC, First and Only Organization in the Electronics Industry to Earn ANSI/ANAB Accreditation for Its Workforce Training

IPC, the global leader in electronics education, announces a landmark achievement in professional education and training. Ten of IPC’s critical workforce training programs have been accredited by the ANSI National Accreditation Board (ANAB) under the stringent requirements of ANSI/ASTM E2659-18, Standard Practice for Certificate Programs. This accreditation marks IPC as the first and only organization in the electronics industry to attain this prestigious recognition for its workforce programs.

The accredited training programs include:

  • Advanced Design Concepts
  • Electronics Assembly for Engineers
  • Electronics Assembly for Operators
  • Introduction to PCB Design I
  • Introduction to PCB Design II
  • PCB Design for Manufacturability
  • PCB Design for Military & Aerospace Applications
  • PCB Design for Rigid-Flex Boards
  • PCB Troubleshooting and Defect Analysis
  • Wire Harness Assembly for Operators

This accreditation underscores IPC’s commitment to providing high-quality, relevant, and effective training that meets the needs of professionals in the electronics industry. It signifies that IPC’s programs have met rigorous standards for industry alignment, content, instructor qualification, and instructional design, ensuring they deliver valuable knowledge and skills to participants.

“Receiving ANSI/ANAB accreditation is a significant milestone for IPC and a testament to the excellence of our training programs,” said David Hernandez, IPC’s vice president of education. “This recognition not only validates the quality of our education offerings but also reflects our ongoing commitment to setting the highest standards for training in the electronics industry.”

The ANSI/ANAB accreditation is recognized internationally and is a benchmark for certificate programs that adhere to the best practices in instructional design and delivery. It assures employers, professionals, and stakeholders in the electronics industry that IPC’s training courses are among the best available, providing essential skills and knowledge to advance careers and enhance organizational performance.

For more information about IPC’s ANSI/ANAB accredited training programs and how they can benefit professionals and organizations in the electronics industry, visit https://education.ipc.org.

Creep Corrosion in Electronics – A Panel Discussion

WEBINAR REGISTRATION
Date
- (12:00 - 1:00pm CDT)

A group of industry experts will discuss the evidence of the root causes of creep corrosion, relevant testing, and effective mitigation strategies available to prevent creep corrosion failures in electronics. Fundamentally, creep corrosion is the product of the reaction of copper with sulfur, which may be mitigated with manufacturing processes, such as the printed circuit board solder mask and surface finish, conformal coating, and enclosure levels, as well as during end-use operation, such as filtration. Several types of harsh environmental test methods that are used to evaluate for product susceptibility to creep corrosion will also be reviewed.

Panelists include:
 • Randy Schueller, Ph.D., Dell, Director, Client Reliability & Durability
 • Christopher Genthe, Rockwell Automation, Senior Principal Engineer
 • Paul Leone, Rockwell Automation, Principal Engineer

Sean Clancy, Ph.D.

Lead Panelist Bio

Sean Clancy Ph.D. is the Director of Materials Science at HZO and an Adjunct Professor in the Materials Science and Engineering Department at the University of Utah. Sean has been associated with HZO for over ten years and is responsible for ALD and Parylene coating process development for advanced applications and assisting marketing and sales with new customer development. 

Before joining HZO, Sean led the electronics failure analysis group and managed projects at the US Navy’s Electronics Manufacturing Productivity Facility, administered by ACI Technologies. He has also worked in research fields involving carbon nanotubes, polymer supercapacitors, light-emitting materials, and medicinal chemistry. He received his Ph.D. in Chemistry from University of Southern California and his B.S. in Chemistry from the University of North Florida.

Panelist Bios

Randy Schueller, Ph.D., Dell, Director, Client Reliability & Durability
Randy has returned to Dell in 2021 to run the Reliability & Durability groups.  Before this, he was Director of Reliability at Osram/Vixar and before that he was a consultant for DfR Solutions.  He has also held product development and leadership roles at 3M, Extreme Devices and Dell Technologies.  Randy received his B.S. in physics from St. John’s U and his Ph.D. in Materials Science Engineering from the University of Virginia.

Christopher Genthe, Rockwell Automation, Senior Principal Engineer
Chris Genthe is a Senior Principal Engineer with Rockwell Automation’s Chemistry and Materials Engineering Group.  He has over 35 years of experience in materials, including metallurgy, corrosion identification, and control, material selection, failure analysis, processing, and accelerated testing, with 25 years at Rockwell. Chris has co-authored several publications, has three patents pertaining to corrosion control of electronic assemblies, received seven Rockwell innovation awards, and was a member of the 2018 Rockwell Team of the Year.  Chris was awarded the Rockwell Engineer of the Year in 2020 for his work on the development of gas phase accelerated corrosion test methods that target specific corrosion mechanisms in electronics. He earned a BS and MS in Materials Engineering from the University of Wisconsin – Milwaukee and is an adjunct professor teaching Environmental Degradation of Materials at the same institution.  

Paul Leone, Rockwell Automation, Principal Engineer, Quality & Reliability
Paul Leone is a Principal Engineer in Quality & Reliability at Rockwell Automation. He has over 25 years of industrial and manufacturing experience ranging from product design to end-user control system integration. He is the first to achieve the Principal Engineer title in Quality at Rockwell Automation. Paul is recognized as a subject matter expert in corrosion of electronics, failure analysis, and design for reliability (DfR). He has consulted with component manufacturers to develop corrosion-resistant components. He has been featured in multiple webinars and publications focused on the impact of corrosion in electronics and design for reliability in corrosive environments. He received his BS in EET from Penn State University.

WEBINAR REGISTRATION

On First Anniversary of Biden Action on Defense Electronics, Cautious Optimism

Mar 27, 2024

By Rich Cappetto, Senior Director, North American Government Relations

Today, March 27, is the first anniversary of U.S. President Joe Biden’s “presidential determination” (PD) on printed circuit boards (PCBs), advanced packaging, and IC substrates – a milestone action by the U.S. government that has paved the way to U.S. government investments in these technologies under Title III of the Defense Production Act (DPA).

One year out from the Biden action, there’s room for both optimism, and concern.

On the positive side, the PD was a concrete step in recognition of the electronics manufacturing industry and its critical role in powering defense technology. The FY24 budget proposal included a line item under the DPA for advanced packaging and PCBs; and the FY24 spending deal recently approved by Congress and signed into law by President Biden includes $587.9 million for all DPA purchases.

These funds had been on the chopping block, and IPC had swung into action to defend them. Specifically, we had dozens of meetings and communications with the Hill, and we co-organized a letter to Congress from more than 50 industry executives.

As a result, legislators were kept informed about the critical need to fund the Presidential Determination on PCBs, and the final result is $156 million more than the low end of the negotiation. Moreover, the negotiators issued an explanatory statement which says, “The Secretary of Defense is encouraged to prioritize Defense Production Act investments in support of domestic printed circuit board fabrication.”

IPC now calls on the U.S. Department of Defense (DOD) to proceed with allocating the full $85 million it had budgeted for PCBs and advanced packaging as it implements the FY24 spending package.

Also on the positive side, the DOD in 2023 awarded two IPC member companies a combined total of $86.1 million under the DPA. Calumet Electronics won $39.9 million to produce high-density build-up (HDBU) substrates; and Green Source won $46.2 million to enhance production of IC substrates, high-density interconnect (HDI), ultra-high-density interconnect (UHDI), and advanced packaging.  

Investment in IC substrates in the United States is a critical need, as highlighted in a 2023 report by IPC’s Chief Technologist Council on how to get the most benefit out of the CHIPS and Science Act.

But despite these welcome signs of progress, much more work remains to be done.

Specifically, the U.S. Government needs to make a clear, unambiguous commitment to a “silicon-to-systems” strategy, not a “chips-only” strategy. Semiconductor chips don’t operate on their own; they must be mounted on PCBs and interconnected with other components to function. More advanced chips require more advanced components and assemblies, and the United States has very limited capabilities and capacities in today’s most cutting-edge technologies.

Unless the U.S. makes a clear and continuing commitment to the “ecosystem” approach to electronics, the growing supply of advanced silicon chips made in newly minted fabs in Arizona, California or Ohio will still need to be sent abroad for packaging and assembly into finished products, leaving the nation vulnerable to supply chain disruptions.

Moreover, an even bigger challenge now looms to ensure that funding for the electronics ecosystem continues in FY25. The administration’s recent FY25 budget proposal contains a 33% reduction for the Defense Production Act below the FY24 enacted level. Even more troubling, no additional funds are requested for PCB and advanced packaging beyond those approved in FY23 and FY24. Unless these figures are corrected, it will undermine the initial progress made in expanding industrial capacity, resulting in stalled momentum in 2025 and beyond.

IPC marks today’s anniversary of the PD milestone with gratitude for the progress to date, while at the same remaining clear-eyed about the tall task remaining to ensure continuing investment in the U.S. electronics ecosystem.

 

Electronics Industry Sentiment Rises in March

IPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report

Sentiment among electronics manufacturers remains positive, with demand reaching the highest level in a year, according to IPC’s March Sentiment of the Global Electronics Manufacturing Supply Chain Report.

When asked about how the current interest rate environment impacts their businesses, firms that rely on borrowed capital indicated they are seeing an impact on material costs, inventories, and orders as a result of higher interest rates, which then filters down to reduced CAPEX spend and ability to grow and invest in other areas of the business.  Among firms operating in markets outside of the United States exchange rates can also be negatively impacted by higher U.S. interest rates.

In regards to outlook for next six months, electronics manufacturers expect labor costs to come down slightly, with material costs holding steady.  While profit margins and backlogs are expected to improve, ease of recruitment is likely to remain challenging. 

Additional survey data show:

  • Cost pressures remain consistent: The Material Cost Index rose three points but was offset by a three-point decline in the Labor Costs Index.
  • The New Orders Index rose to the highest level since July 2022.
  • Industry Outlook improves: The Demand Outlook Index approached an all-time high while the outlook for Profit Margin also hit an all-time high.
  • Orders, shipments and capacity utilization are all expected to rise significantly in the near-term.

These results are based upon the findings of IPC’s Current State of Electronics Manufacturing Survey, fielded between February 14 and February 29, 2024.

Read the full report here.

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Today’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.

As the industry evolves with new applications and architectures, complexity in design and manufacturing and the supporting infrastructures (e.g., metrology, standards, etc.) will be challenging.  iNEMI and IPC have recently published a white paper, “Complex Integrated Systems: The Future of Electronics Manufacturing,” intended to guide and focus cross-industry efforts and partnerships in the necessary research and development, as well as the manufacturing capability scale-up that will be critical to success.

The paper explores several issues, including:

  • Sample use-case applications needing CIS, such as:
    • Massive wireless broadband with 5G mmWave systems
    • High-performance computing applications in mobile equipment and data centers
    • XR (extended reality) devices, including augmented reality (AR) virtual reality (VR) and mixed reality (MR)
    • Advanced driver assistance systems for passenger vehicles
    • Integrated photonics
  • The CIS manufacturing ecosystem and the challenges of shifting roles within that ecosystem
  • The impact on the complete product life cycle, including design, test, manufacturing and end of life
  • Roadmap of technical needs along with gaps, challenges and potential solutions
  • Recommendations and calls to action

“CIS is driven by fast-growing market segments such as 5G mmWave communications, advanced assisted driving systems, and virtual and augmented reality,” said Grace O’Malley, iNEMI chief technology officer. “Electronics manufacturing is already investing tens of billions of dollars annually into manufacturing capabilities for CIS. This white paper grapples with the big technology issues that the industry should collectively address to ensure an adaptive, profitable CIS manufacturing ecosystem.”

“It’s great that INEMI and IPC were able to collaborate on such an important topic as complex integrated systems,” said Matt Kelly, IPC chief technology officer and vice president, technology solutions. “The concept of CIS is important to understand. It is an integral part of a 'silicon to systems’ approach that is needed for next-generation electronic products spanning HPC, AI, 5G/6G wireless, and EV automotive electronic applications.”

Download the White Paper

"Complex Integrated Systems: The Future of Electronics Manufacturing is now available. Visit https://go.ipc.org/complexintegratedsystems to download white paper.

Get Involved

The immediate cross-industry task is to define in detail the key technical issues and develop approaches to solve these issues in a precompetitive space. Follow-on activities will include creating tailored project-based learning programs, identifying and addressing standardization needs, and leveraging collaboration opportunities across different government-funded initiatives. If you are interested in getting involved in this effort, please sign up at https://forms.office.com/r/LRUnKDaxn0.

North American EMS Industry Up 4.1 Percent in February

IPC releases EMS industry results for February 2024

IPC announced today the February 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.22.

Total North American EMS shipments in February 2024 were up 4.1 percent compared to the same month last year. Compared to the preceding month, February shipments decreased 0.8 percent.

EMS bookings in February increased 26.4 percent year-over-year and increased 16.5 percent from the previous month.

“Strong order flow in February lifted EMS book-to-bill ratio to the highest levels since last summer,” said Shawn DuBravac, IPC’s chief economist.

February 2024 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

North American PCB Industry Sales Down 11.6 Percent in February

IPC releases PCB industry results for February 2024

IPC announced today the February 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.07.

Total North American PCB shipments in February 2024 were down 11.6 percent compared to the same month last year. Compared to the preceding month, February shipments were up 7.1 percent.

PCB bookings in February were up 25.6 percent compared to the same month last year. February bookings were up 47.5 percent compared to the preceding month.

“Very strong order flow in February pushed the PCB book-to-bill above one for the first time since September 2023,” said Shawn DuBravac, IPC’s chief economist. “This is likely not a permanent shift in the current market environment, but it will keep the book-to-bill ratio elevated in the coming months.” 

February 2024 book to bill ratio chart, number 1
February 2024 book to bill ratio chart, number 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

 

IPC Adds Apprenticeship Program Focused on PCB Design Engineers

Mar 21, 2024

By Dave Hernandez, IPC Vice President, Education 

I am proud to share that IPC’s Apprenticeship Program is growing! We have just added our third occupation to our National Standards of Apprenticeship – Printed Circuit Board Design Engineer.  

Last November, IPC was approved by the U.S. Department of Labor (DOL) as the first Registered Apprenticeship Program for the U.S. electronics manufacturing industry – a move designed to expand the skilled workforce for this strategically vital industry. The DOL’s recognition ensures that IPC’s Registered Apprentice programs align with the industry’s highest standards of proficiency in electronics manufacturing.   

PCB Design Engineers play a crucial role in overseeing the creation of printed circuit boards used in various electronic devices such as phones, computers, and more. Their responsibilities include library component creation, schematic capture, PCB layout, and documentation of fabrication and assembly drawings. They ensure that the manufactured products meet industry and company standards, serving as the backbone of modern electronic products. 

This third occupation joins the previously available registered occupations: Electronics Assembler and PCB Fabricator. All three occupation apprenticeship programs are integral parts of IPC's commitment to train a skilled workforce that participates in the entire value stream of electronics manufacturing. IPC’s apprenticeship standards provide valuable, hands-on experience with a defined pathway to secure, well-paying careers in electronics manufacturing.  

One of the most difficult challenges facing today’s electronics industry is a chronic shortage of adequately skilled workers. More than two-thirds of IPC’s U.S. members report that an inability to find and retain skilled workers is limiting their growth and competitiveness. Part of this challenge is due to the rapid rate at which technology evolves.  IPC’s National Program Standards and Registered Apprenticeship Programs (RAPs) are designed to support electronics manufacturers as they develop and retain their talent.  

Stay tuned as we continue to grow our apprenticeship offerings!  

For more information, visit: https://www.ipc.org/ipc-apprenticeships.

 

IPC Electronics Forum @ Global Industrie 2024

Learn More
Date
-

*French version below* *Version Français ci-après*

IPC Electronics Forum @ Global Industrie 2024
 
IPC is back at Global Industrie this year with a brand-new program to uncover the future topics for our industry. IPC Forum will be held every day at IPC stand #5S78 (Hall 5). The objective is to enable meetings and exchanges of information within the community of electronics manufacturing experts through interactive technical presentations and face-to-face discussions. Topics covered will include:

Technology Solutions (every day from 11 a.m. to 12 p.m.)
IPC works with the electronics industry to develop a strong and efficient manufacturing ecosystem and promote a resilient supply chain. The production of advanced semiconductor packaging requires IC substrate manufacturing and has a direct impact on the future of PCB manufacturing technologies and assembly processes (PCBA). In order to promote a successful transition from the supply chain to a silicon-to-systems approach, IPC promotes our industrial ecosystem by organizing the representation at European and international level of all technologies. Join us and discover our initiatives on subjects as varied as: Ultra-HDI, plastronics for e-mobility, 3D-MID plastronics, and many more.

Speakers will include Dr. Maël Moguedet, S2P, Dr. Peter Tranitz, IPC and Francisco Fourcade, IPC.

Electronics Design (Mon., Tue., Wed. from 2 p.m. to 3 p.m.)
A new electronic product cannot be successful without a truly effective design process. Such a design process requires close collaboration across the entire supply chain. Our IPC Design Initiative aims to build a global forum for exchange and discussion in which all stakeholders, OEMs, PCB manufacturers, EMS assemblers, advanced packaging experts and designers, friends and EDA software suppliers will be able to share, exchange, collaborate and advance together the next generations of design/design approaches for electronic circuits. Join us and discover our initiatives on PCB Design, Eco-Design and come meet the experts from the IPC Designers Council France.

Speakers will include Nicolas Feyfant, FEDD, Dr. Peter Tranitz, IPC and Francisco Fourcade, IPC.

CFX-Connected Factory Exchange (Tues. & Thu. from 12 p.m. to 1 p.m.)
IPC-CFX is a new, open and international standard, developed by the industry, for the industry aimed at easily enabling machine-to-machine dialogue and constituting the foundation of the factory of the future and its applications. A plug-and-play solution, CFX standardizes and simplifies machine-to-machine communications and facilitates machine-to-business exchanges and business-to-machine applications. Join us and discover how to implement CFX within your manufacturing lines and start benefiting now from its many technical and economic advantages.

The presentation will be delivered by Sanjay Huprikar, IPC.

Sustainability (Mon. from 12 p.m. to 1 p.m. & Wed. from 3 p.m. to 4 p.m.)
Companies in the electronics industry are currently under pressure and must identify levers to identify and achieve their sustainable development objectives and meet increasing regulatory and reporting obligations. Our IPC's Sustainability for Electronics Initiative focuses efforts on the use of specific tools developed by the industry, including norms and standards, training programs, specific lobbying programs and other solutions under development.

This presentation will be delivered by Francisco Fourcade, IPC.

EU Government Advocacy for the Industry - Silicon-to-System (Tues. from 3 p.m. to 4 p.m. & Wed. from 12 p.m. to 1 p.m.)
The European Union (EU) is currently defining a legal framework for businesses and production activities on EU territory. IPC mobilizes businesses and industry stakeholders to define the parameters and influence the policies and regulations proposed by the EU in order to foster the entire 'Silicon-to-System' ecosystem for a European electronics manufacturing industry stronger and more resilient. Join us, discover how this European framework works and how IPC defends your interests on a daily basis.

The presentation will be delivered by Alison James, IPC.
 

Wire Harness - WHMA (Mon. 3 p.m. to 4 p.m.)
WHMA is the international organization that represents cable harness and connector players for the electronics industry. Founded in 1993, WHMA brings together the entire supply chain, including manufacturers, their suppliers, and customers. Now affiliated with IPC, WHMA provides its members and the entire industry with technical support, norms and standards and educational programs as well as training techniques and certifications. Join us to discover the latest technologies and meet live with the industrial leaders in cable and electronic connectors.

The presentation will be delivered by Sanjay Huprikar, IPC.

For more information, please contact Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org)

 

IPC Electronics Forum @ Global Industrie 2024

 IPC est de retour à Global Industrie cette année avec un tout nouveau programme pour découvrir les sujets d’avenir pour notre industrie.  IPC Forum se tiendra chaque jour sur le stand IPC #5S78 (hall 5). L’objectif est de permettre des rencontres et échanges d’information au sein de la communauté des experts de la fabrication électronique grâce à des présentations techniques interactives et des discussions en présentiel. Les sujets abordés incluront: 

Technology Solutions (chaque jour de 11h à 12h)
IPC travaille avec l’industrie électronique afin de développer un écosystème de fabrication solide et performant et favoriser une supply-chain résiliente. La production de Advanced Semiconductor Packaging nécessitent des fabrication de IC substrate et ont un impact direct sur le futur des technologies de fabrication des PCB et des process d’assemblage (PCBA). Afin de favoriser une transition réussie de la supply-chain vers une approche silicon-to-systems, IPC promeut nos écosystème industriels en organisation la représentation au niveau européen et international de l’ensemble ds technologies. Rejoignez nous et découvrez nos initiatives sur des sujets aussi variés que : Ultra-HDI, plastronics for e-mobility, 3D-MID Plastronics, et bien d’autres encore…

Les orateurs incluront Dr. Maël Moguedet, S2P, Dr Peter Tranitz, IPC et Francisco Fourcade, IPC

Electronics Design  (Lun., Mar., Mer. de 14h à 15h)
Un nouveau produit électronique  ne peut pas être réussi sans un processus de conception vraiment efficace. Un tel processus de conception nécessite une collaboration étroite au sein de l’ensemble de la supply-chain. Notre IPC Design Initiative vise à bâtir un forum global d’échange et de discussion au sein duquel l’ensemble des acteurs, OEM, fabricant de PCB, assembleurs EMS, experts advanced packaging et designers, amis aussi fournisseurs de software EDA pourront partager, échanger, collaborer et faire avancer ensemble les prochaines générations d’approches design/conception pour les circuits électroniques. Rejoignez nous et découvrez nos initiatives sur PCB Design, Eco-Design et venez à la rencontre des experts du IPC Designers Council France.

Les orateurs incluront Nicolas Feyfant, FEDD, Dr Peter Tranitz, IPC et Francisco Fourcade, IPC

CFX-Connected Factory Exchange  (Mar. & Jeu. de 12h à 13h)
IPC-CFX est un nouveau standards, ouvert et international, développé par l’industrie, pour l’industrie visant a permettre facilement le dialogue machine-to-machine et constituant la fondation de l’usine du futur et de ses applications. Solution plug-and-play, CFX standardise et simplifie les communications machine-to-machine et facilite les échanges machine-to-business et les applications business-to-machine. Rejoignez nous et découvrez comment mettre en oeuvre CFX au sein de vos lignes de fabrication et commencez dès maintenant à bénéficier de ses nombreux avantages techniques et économiques…

La présentation sera délivrée par Mr Sanjay Huprikar, IPC

Sustainability  (Lun. de 12h à 13h & Mer. de 15h à 16h)
Les entreprises de l’industrie électronique sont actuellement sous pression et doivent identifier les levier permettant d’identifier et d’atteindre leur objectifs en matière de développement durable et de remplir des obligations réglementaires et de reporting de plus en plus nombreuses. Notre IPC’s Sustainability for Electronics Initiative concentre les efforts sur l’utilisation d’outils spécifiques développés par l’industrie, y compris des normes et standards, des programmes de formation, des programmes de lobbying spécifiques et autres solutions en cours de développement. 

La présentation sera délivrée par Francisco Fourcade, IPC

EU Government Advocacy for the Industry - Silicon-to-System  (Mar. de 15h à 16h & Mer. de 12h à 13h)
L’Union européenne (UE) définit actuellement un cadre légal pour les entreprises et les activités de production sur le territoire de l'UE. IPC mobilise les entreprises et les acteurs de l’industrie pour définir les paramètre et influencer les politiques et réglementations proposées par l’UE afin de favoriser l’ensemble de l’écosystème 'Silicon-to-System' pour une industrie de fabrication électronique européenne plus forte et plus résiliente. Rejoignez nous, découvrez le fonctionnement de ce cadre européen et comment IPC défends vos intérêts au quotidien.

La présentation sera délivrée par Mme Alison James, IPC

Wire Harness - WHMA  (Lun. de 15h à 16h)
WHMA est l’organisation internationale qui représente les acteurs du faisceuu de câbles et des connecteurs pour l’industrie électronique. Fondée en en 1993, WHMA regroupe l’ensemble de la supply-chain, y compris les fabricants, leur fournisseurs, et les clients. Désormais affiliée à IPC, WHMA fournit à ses membres  et à l’industrie toute entière, du support technique, des normes et standards et des programme éducatifs ainsi que des formations techniques et certifications. Rejoingez nous pour découvrir les dernière technologies et rencontrer en direct les leaders industriels du câble et de la connectique électroniuque

La présentation sera délivrée par Mr Sanjay Huprikar, IPC

Pour plus d’information, merci de prendre contact avec  Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org)

 

2024 Global Industrie IPC Forum Presentation Schedule
IPC Booth #5S78

Monday, March 25

  • Technology Solutions (11:00 am - 12:00 PM)
  • Sustainability (12:00 pm - 1:00 pm)
  • Electronics Design (2:00 pm - 3:00 pm)
  • Wire Harness - WHMA (3:00 pm - 4:00 pm)

Tuesday, March 26

  • Technology Ultra-HDI (11:00 am - 12:00 PM)
  • CFX - Connected Factory Exchange  (12:00 pm - 1:00 pm)
  • Electronics Design (2:00 pm - 3:00 pm)
  • EU Government Advocacy for the Industry - Silicon-to-System (3:00 pm - 4:00 pm)

Wednesday, March 27

  • MID Plastronics (11:00 am - 12:00 PM) 
  • EU Government Advocacy for the Industry - Silicon-to-System (12:00 pm - 1:00 pm)
  • Electronics Design (2:00 pm - 3:00 pm)
  • Sustainability (3:00 pm - 4:00 pm)

Thursday, March 28

  • Technology Printed Electronics, E-Textiles and Plastronics (11:00 am - 12:00 PM)
  • CFX - Connected Factory Exchange  (12:00 pm - 1:00 pm)
  • IPC Awards Ceremony (2:00 pm - 3:00 pm)

 

 

 

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Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC

Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.

Dr. Iyer comes to IPC after serving as senior vice president, power products business and technology R&D at Amkor Technology Inc. Before that, he spent 13 years as a corporate vice president at Texas Instruments. He was also previously at Infineon Technologies and several microelectronics research institutes. He has earned 24 patents and has authored or co-authored more than 150 technical articles.

“We are so pleased that Devan Iyer has joined Team IPC,” said IPC Chief Technology Officer Matt Kelly. “The future of advanced packaging directly affects the future of all aspects of electronics manufacturing. With Devan’s help, IPC will continue to be the leading advocate of a ‘silicon-to-systems’ approach, recognizing the importance of silicon fabrication as well as related capabilities such as advanced packaging, printed circuit boards (PCBs), and IC substrates.”    

“We are thrilled to have Dr. Iyer join the IPC team,” said IPC President and CEO, Dr. John W. Mitchell. “Adding his capabilities to our organization further cements IPC’s role as the leading industry association for advanced packaging.”  

Governments in North America and Europe are actively ramping up their support of advanced packaging via several policies and programs. For example, the CHIPS for America R&D Office recently issued a Notice of Funding Opportunity (NOFO) for research and development activities that will help expand domestic capacity for advanced packaging substrates and substrate materials. IPC seeks to play an active role in this program.

Meanwhile, the European Commission has also identified microelectronics and advanced packaging as areas requiring further government focus and support.

IPC’s influential 2021 report, North American Advanced Packaging Ecosystem Gap Assessment, found the U.S. has only just begun to invest in advanced packaging, while nations in Asia have sprinted ahead to develop the lion's share of capabilities and capacity. That report was referenced in the CHIPS Office’s guiding strategy document for the National Advanced Packaging Manufacturing Program. An IPC Symposium on Advanced Packaging in 2022 also helped propel government action. 

For more information, visit Advanced Packaging Semiconductors | IPC Industry Initiatives.

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