IPC, with the support of Research Fab Microelectronics Germany (FMD), is organizing the Workshop on Component-to-System Level Packaging – Addressing Integration Challenges for

IPC successfully convened its 2025 Q2 Executive Policy Roundtable on May 21 at Tokyo Kaikan. The event brought together senior government officials, corporate executives, and

The Interdisciplinary Center for Advanced Manufacturing Systems (ICAMS) at Auburn University is conducting its annual study on behalf of the Department of Defense to

On May 16, 2025, IPC hosted a high-level Industry Leaders Luncheon in Taipei, bringing together nearly 60 prominent representatives from government agencies, industry

One essential skill—especially for those working on printed circuit board (PCB) assembly lines—is the ability to identify a wide range of electronic components accurately and

This morning, the House Ways and Means Committee advanced a major tax package that includes several provisions supported by IPC.

For businesses across the electronics industry, U.S. federal tax policy is not just about accounting. Nor are tariffs solely about suppliers and logistics. These policies are

Last week, I had the opportunity to attend Circularity 25 in Denver—an inspiring gathering of professionals working to advance circular solutions across industries. With

Measuring the effectiveness of training requires a systematic approach to data collection and analysis. Here’s a step-by-step guide to calculating the ROI of your training