AI-Enabled Electronics Manufacturing: Applications in Quality and Root-Cause Analysis
How AI can help electronics manufacturing teams use data, knowledge, and experience to make more informed operational decisions

Electronics manufacturing teams are under increasing pressure to improve quality, reduce defect escapes, respond quickly to customer requirements, and make better day-to-day decisions across complex manufacturing operations. At the same time, the information needed to make those decisions is often distributed across inspection systems, process logs, equipment data, engineering specifications, FMEAs, corrective-action records, customer requirements, and other technical documentation. The challenge is not simply having more data; it is turning fragmented information and technical knowledge into practical, trustworthy decision support.

The IPC CEMAC (China Electronics Manufacturing Annual Conference), an exclusive event for IPC members, is dedicated to advancing the development and collaboration of the electronics industry.

The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place during APEX EXPO 2027 in Anaheim, Calif.

European industry leaders converged in Brussels to align on Chips Act 2.0, calling for an integrated electronics strategy spanning PCBs, EMS, AI, defence, and automotive.

2026 Electronics Day EMS Europe

More than 120 participants gathered onsite in Toulouse, with an additional 20 joining online, for the 2026 Electronics Day Design France, organised by Global Electronics Association in collaboration with IPC Designers Council France. Over two days, the event brought together PCB designers, manufacturers, aerospace engineers, technical experts, and industry professionals to exchange knowledge, discuss practical engineering challenges, and strengthen collaboration across the European electronics ecosystem.

This one-hour webinar presents an insight into the PCB Signal Integrity simulation and IBIS model characterization process. A review of what exactly signal integrity simulation does on the PCB and at the system level. A discussion on how the IBIS model is a default for analyzing IC Chips’ input/output waveform integrity. The IBIS model is broken down for easier understanding of its operation and integration into the SI simulation. In addition, a quick note on how to achieve accurate results for Signal Integrity simulation.

The Global Electronics Association, is pleased to announce that IPC Builds 2026 is now open for registration. IPC Builds 2026 is a week-long series of standards development meetings to be held in Europe for the second time, following the first Barcelona success in 2024. Over the years, volunteers worldwide have participated in IPC standards development committee meetings to bring the most trusted standards for electronics manufacturing to the industry. In 2026, we’re excited to head to Paris for this traditional and industry-driving event.

The 2026 Electrical Wire Processing Technology Expo (EWPTE) brought together the cable and wire harness manufacturing industry for another strong year of innovation, education, and business development, drawing 3,140 total participants to Milwaukee.

EV performance depends on more than chips. Discover how materials, packaging, and thermal management are redefining power electronics.