Hand Soldering Competition 2026, Regional Qualification Japan

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Skilled soldering experts (F/M) will compete for 60 minutes on a complex circuit board assembly to win the 2026 National title, earn a cash prize, and compete for a coveted spot at the Hand Soldering World Championship, to take place at electronica in Munich in November 2026.

INTEX OSAKA, Japan

1-5-102, Nanko-Kita
Suminoe-ku, Osaka
559-0034
Japan

INTEX OSAKA, Japan

INTEX OSAKA, Japan
1-5-102, Nanko-Kita
Suminoe-ku, 27 559-0034
Japan

Best Technical Paper Awards Showcased at APEX EXPO 2026

Award-winning research from Robert Bosch GmbH, AIM Solder, The Aerospace Corporation, Global Atotech and Taiwan Limited teams highlights advances in solder reliability, microvias, contamination control, and IC substrate integrity

The Global Electronics Association today announced the recipients of the Best Technical Paper Awards from the Advanced Electronic Packaging Conference at APEX EXPO 2026.

“The technical conference is the backbone of APEX EXPO, bringing forward the data, science, and engineering insights that move our industry ahead,” said Matt Kelly, CTO and vice president, standards and technology and APEX EXPO conference general chair, Global Electronics Association. “This year’s award recipients delivered research that advances fundamental understanding, while also providing practical guidance for improving reliability, performance, and manufacturing excellence in electronics.”

Student Best Paper

Connecting Microstructural Damage to Electrical Performance in Lead Free Solder Joints
Author: Dorottya Varga, Robert Bosch GmbH, Budapest
Co-authors: Gabor Belina and Gabor Jokai, Robert Bosch GmbH, Budapest 

This paper examines the relationship between microstructural degradation mechanisms and electrical performance in lead-free solder joints, providing critical insight into reliability performance in modern electronic assemblies.

NextGen Best Paper

Rethinking Area Ratio: A Physics-Based Model for Predicting Solder Paste Transfer Efficiency for Thin Stencils
Author: Gayle Towell, AIM Solder, Cranston, R.I., USA

This research challenges traditional stencil design assumptions by introducing a physics-based model to predict solder paste transfer efficiency, offering improved process predictability for ultra-thin stencil applications.

Best of Conference Awards

Evaluation of Microvia Direct Plated Copper in Comparison to Traditional Electroless Plating
Author: Nicole Carpentier, The Aerospace Corporation, El Segundo, Calif., USA

Co-authors: Scott Sitzman, In-Tae Bae, Martin Leung, Emily Tang, Patrick Edwards, Eric Frasco, Gabriel Cobos, Sam Kislevitz, Cale Lewis, Kathy Fajardo-Cha, James Parke, all of 
The Aerospace Corporation, El Segundo, Calif., USA

This comprehensive evaluation compares direct plated copper to traditional electroless plating for microvias, delivering performance data relevant to high-reliability and advanced packaging applications.

Use and Misuse of Ionic Contamination Measurements – 5 Years after Revision of IPC-J-STD-001, Chapter 8
Author: Lothar Henneken, Robert Bosch GmbH, Schwieberdingen, Germany
Co-author: Neil Patton, Atotech UK Ltd., West Bromwich, United Kingdom

Five years after the revision of IPC-J-STD-001, Chapter 8, this paper evaluates ionic contamination measurement practices, clarifying proper application and common misconceptions to support improved process control and product reliability.

Preserving Interface Integrity in IC Substrates: A Non-Etch Approach to Wedge and Sidewall Reliability
Author: Valentina Belova-Magri, Ph.D., Taiwan Limited, Taoyuan, Taiwan

Co-authors: Thomas Thomas, Ph.D., Thomas Huelsmann, Fabian Michalik, Ph.D., Martin Thoms, Christian Nothlich, Josef Gaida, Frank Bruening, Ph.D.., Christiane Le Tiec, Ph.D., Stefanie Ackermann, Ph.D., Constanze Donner, Ph.D., Christopher Seidemann, Thomas Fischer, Atotech Deutschland GmbH & Co. KG, Berlin; Andry Liong, Yuan Zou, Atotech China Chemicals Ltd., Guangzhou, China; and Toshio Honda, Atotech Japan K.K., Yokohama, Japan.

This global collaboration introduces a non-etch methodology designed to preserve interface integrity and improve wedge and sidewall reliability in IC substrates used in advanced packaging architectures. 

Technical Excellence in Advanced Electronic Packaging

Technical papers presented at the Advanced Electronic Packaging Conference are evaluated based on originality, technical depth, industry relevance, and overall quality. Selected by members of the Technical Program Committee, the awards recognize exceptional research, technical rigor, and meaningful contributions to electronics manufacturing and advanced packaging. The Conference serves as the premier forum for engineers, researchers, and subject-matter experts to share data-driven insights that shape the future of component- to system-level integration in electronics manufacturing.

For more information about APEX EXPO and the Advanced Electronic Packaging Conference 2026, visit www.electronics.org.

Test Bench: Fundamentals of PCB Testing

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Virtual classes held Tuesday and Thursday from 6:30 p.m - 8:30 p.m. ET

Taught by a certified industry expert and award-winning educator with 25+ years of experience in the field, this four-week program utilizes interactive webinars, on-demand recordings, and job-specific exercises to develop a solid grasp of the concepts necessary for success as a new electronics test technician. 

  • Electrical Fundamentals: Ohm’s Law – Voltage, Current, Resistance, Power
  • DC & AC Circuits • Passive Components: Resistors, Capacitors, Inductors
  • Semiconductor Components: Diodes and Transistors
  • Basic Circuit Configurations: Series, Parallel, and Combined
  • Test Tools: Multimeter and Oscilloscope
  • Inspection Tools: Overview, Purpose, and Identification

PCB Design for Military & Aerospace and Other Extreme Applications

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Description

This course addresses specific challenges encountered in military and aerospace applications, including the effects of vibration, shock, radiation, altitude, extended operating temperature range, and other design considerations for high-reliability applications. The class also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.  

Taught by an IPC-certified industry expert with 25+ years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required to design boards for military and aerospace applications. 

PCB Design for Military and Aerospace Applications is ideal for designers, engineers, technicians, and others who want to acquire or increase their ability to meet the design, manufacturing, packaging, and routing challenges posed by military, aerospace, and space applications. 

Before taking this course, it is recommended that participants complete the PCB Fundamentals courses (I and 2), OR be familiar with the following:

  • Schematic symbol creation
  • Schematic Generation
  • Documentation and Dimensioning
  • Standard Rigid Printed Board Design

Introduction to PCB Design I - Southeast Asia

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Tuesday and Thursday

 

Upon completion, participants will be able to:

  • Define and create schematic symbols and PCB footprints that comply with applicable IPC Standards
  • Create simple schematics for use in simulation and prototyping applications
  • Implement industry best practices for:
    • Schematic capture
    • Hierarchical design implementation
    • Documentation
    • Parts list generation
  • Recognize the trade-offs between the different schematic methodologies and when to use each type
  • Assess different component types and attachment methods
    • Differentiate when to use each type of component
  • Define standard schematic notes
    • Apply best practices in negotiating these terms with customers
Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

Global Electronics Association Appoints Martin Scaglione as COO to Drive Strategic Execution Across Standards, Education, and Technology

The Global Electronics Association today announced that Martin Scaglione has joined the organization as Chief Operating Officer (COO).

As COO, Scaglione is responsible for strategic execution and P&L management across the Association’s core business units — Standards, Education, and Technology — providing product and program leadership to ensure exceptional member value while driving operational excellence in partnership with the CEO, leadership team, and Board of Directors.

Scaglione is a global enterprise executive and operator with extensive experience leading complex organizations through growth, transformation, and operational reinvention across sectors including manufacturing, electronics, workforce, EdTech, SaaS, and nonprofits. He has served as COO, President & COO, CEO, founder, and enterprise P&L owner, with accountability for results at scale.

“Martin brings the rare combination of enterprise discipline, entrepreneurial drive, and mission alignment that will help us scale our benefits to members globally,” said John W. Mitchell, Global Electronics Association president and CEO. “He has repeatedly demonstrated the ability to translate strategy into execution, modernize operating models, and build high-performing teams. As we continue expanding our standards leadership, education portfolio, and technology initiatives, Martin’s experience will be instrumental in strengthening how we serve our members.”

Scaglione most recently served as Chief Mission Officer at Goodwill Industries International, where he directed mission strategy and operations across more than 700 Opportunity Centers and 4,300 retail locations. He managed a $54 million P&L and $325 million in public and private grants, launched national accelerator programs, and built partnerships with major employers including Walmart, Google, Microsoft, and Accenture.

Previously, Scaglione served as President & COO of ACT, where he led a $175 million enterprise and helped build the nation’s leading workforce credentialing platforms. He also served as COO of North America for Bosch Siemens Household Appliances, overseeing manufacturing, supply chain, and commercial operations within a global, electronics-driven organization.

In addition, Scaglione co-founded venture-backed EdTech platform Viridis Learning, leading the company from concept to commercialization and investor exit. 

Scaglione holds a Master of Arts in Public Policy & Administration from Northwestern University and a Bachelor of Science in Management from Drake University.