On January 22, 2025, this webinar introduced key PCB design principles—Design for Manufacturing (DFM), Design for Test (DFT), and Design for Assembly (DFA). Attendees learned how applying these practices can reduce costs, improve reliability, and streamline production. The session also covered relevant IPC standards like IPC-2221 and IPC-A-610, with real-world examples highlighting the impact of good design decisions.

This December 11, 2024 webinar showcased cutting-edge approaches for inspecting electronic assemblies using 3D X-ray microscopy, nanoscale imaging, and deep learning. Attendees learned how tools like DeepScout and advanced DL algorithms enhance image quality, support failure analysis, and streamline quality inspections across a wide range of electronic components and assemblies.

As cybersecurity threats continue to grow across global supply chains, the November 13, 2024, webinar offered a timely introduction to IPC-1792, the new standard addressing cybersecurity in the electronics industry. The session walked attendees through the structure and key elements of the standard, highlighting how it helps organizations assess risks and implement effective protection measures. Participants came away with practical guidance for applying IPC-1792 to strengthen cybersecurity within manufacturing operations and across their supply networks.

On October 31, 2024, this webinar explored the vital role of frontline response and preparedness in managing cyber threats within electronics manufacturing. Attendees learned how early detection on the production line, not just through IT systems, is key to minimizing disruption. The session covered best practices for Business Continuity and Disaster Recovery (BCDR), strategies for rapid recovery, and practical guidance aligned with—but going beyond—IPC-1792 to strengthen supply chain resilience.

In this informative session held on September 18, 2024, participants explored the latest revisions to IPC-6012 and IPC-A-600—essential standards for the qualification and acceptance of rigid printed boards. The webinar highlighted key updates, clarified inspection criteria, and discussed the implications for both manufacturers and inspectors working to ensure product reliability and compliance.

On August 14, 2024, IPC hosted an inspiring webinar celebrating the accomplishments of two outstanding women in the electronics industry—Cheah Soo Lan, Master IPC Trainer for CID/CID+, and Despina Davis, Ph.D. The session featured insightful interviews highlighting their career journeys beyond traditional engineering roles. The speakers also introduced new IPC online instructor-led courses, including A Technical Overview of the Semiconductor Chip Industry, designed for those new to semiconductor topics. Additionally, the webinar explored the fundamentals of Microvia Electroplating, sharing essential techniques and best practices for achieving reliable microvia fabrication in high-density interconnects.

In advance of his August IPC Counterfeit Electronic Parts Mitigation course, Anthony J. Bryant hosted a focused webinar on July 31, 2024, examining the critical issue of counterfeit documentation in high-reliability sectors. Using recent aircraft engine cases as a backdrop, the session explored the scope and impact of counterfeit materials in the aerospace industry. Attendees gained insights into the tactics used by counterfeiters, strategies and best practices for mitigation, and the latest industry initiatives and regulations aimed at addressing this growing threat.

On June 19, 2024, this webinar offered a comprehensive look into the PCB board fabrication process, following the journey of design artwork after it reaches the board shop. Tailored for Electrical Engineers, PCB Layout Professionals, Supply Chain personnel, and others interested in fabrication, the session covered key topics including design and layout, material selection, drilling, imaging, etching, plating, and finishing. It also addressed solder mask application, silkscreening, and major cost drivers, providing valuable insights into each stage of production.

On May 1, 2024, a panel of industry experts discussed the root causes of creep corrosion in electronics, along with relevant testing methods and effective mitigation strategies. The session explored how creep corrosion—primarily caused by the reaction of copper with sulfur—can be addressed through manufacturing choices such as solder mask, surface finishes, conformal coatings, and enclosure designs, as well as operational measures like filtration. The panel also reviewed various harsh environmental test methods used to evaluate product susceptibility to creep corrosion. Panelists included Randy Schueller, Ph.D. (Dell), Christopher Genthe (Rockwell Automation), and Paul Leone (Rockwell Automation).

On March 13, 2024, this webinar explored the critical role of solder paste printing in surface mount technology (SMT). The session covered key process factors, common defects, and best practices to ensure consistent, high-quality results in PCB assembly.