Modern Wire Bonding in Package Assembly

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Wire bonding remains the dominant chip-interconnection method—and it's not going anywhere soon. This webinar offers a practical overview of modern wire bonding processes, metrology challenges, and emerging materials. Learn about pitch shrinkage demands, direct bonding to Cu on ULK substrates, and innovations like silver and gold-coated palladium copper wires. Explore key bonding techniques including thermosonic, ultrasonic, and thermocompression, plus new options for Cu wire coatings.
 

Author(s)
Tom Dory
Resource Type
Webinar
Event
Webinar

Supply Chain Integrity: Protecting Your Business from Counterfeit Electronics

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Join SAE G19A subcommittee expert Anthony Bryant for an essential one-hour webinar focused on supply chain integrity and counterfeit electronics prevention. This session is specifically designed for non-technical personnel working in the electronics component supply chain including procurement professionals, supply chain managers, quality assurance staff, and business leaders.

Author(s)
Anthony Bryant
Resource Type
Webinar
Event
Webinar

Electronic Essentials: What You Think You Know - and More

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This webinar, titled "Electronic Essentials: What You Think You Know - and More", is a foundational session aimed at reinforcing the core knowledge that every technician, inspector, assembler, operator, and engineer in electronics manufacturing should possess. These are the essentials of quality and reliability in electronics manufacturing—the things you should know without flipping through an IPC standard. Whether you're new to the field or a seasoned pro, this session is your checklist for baseline competency. Knowing these terms without referencing IPC standards demonstrates professional readiness and process awareness and supports faster troubleshooting, better communication, and supports a better team culture.

Author(s)
Greg Merrill
Resource Type
Webinar
Event
Webinar

EMS Sector Shows Resilience: March Shipments Up, Demand Outpaces Supply

The Global Electronics Association releases EMS industry results for March 2026

The Global Electronics Association announced today the March 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.29.

Total North American EMS shipments in March 2026 were up 6.9% compared to the same month last year. Compared to the preceding month, March shipments were up 5.3%. March’s year-to-date (YTD) shipments increased by 4.3% year-over-year (YOY).

EMS bookings in March decreased 1.7% year-over-year and increased 7.0% from the previous month. March’s YTD bookings increased by 0.6% compared to the same period last year.

“The EMS industry posted a solid March, with shipments up for the fourth consecutive month.  Customer demand looks sustained headed into the second quarter,” said Dr. Shawn DuBravac, Global Electronics Association’s chief economist.

March 2026 EMS book to bill chart

Detailed Data Available

Companies that participate in the Global Electronics Association’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in the Global Electronics Association’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The Global Electronics Association’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. The Association publishes the EMS book-to-bill ratio by the end of each month.

PCB Design for Signal Integrity

Date
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Class meets Monday and Wednesday

Design high-speed PCBs that maintain signal integrity, reduce noise, and perform reliably under real operating conditions.
Develop the ability to control impedance, manage stackups, and apply routing and power distribution strategies that prevent signal degradation. Understand how materials, layout decisions, and transmission line behavior impact performance so your designs meet speed, reliability, and quality requirements from prototype through production.

Introduction to PCB Design II

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Tuesday and Thursday 

Apply layout strategies, material selection, and design rules that support signal integrity, reliability, and manufacturability. Build the ability to manage multilayer routing, control impedance, reduce EMI, and generate complete manufacturing documentation so your designs perform as intended and are ready for production without delays.

Global Electronics Association to Testify at the Office of the US Trade Representative Panel on Section 301 Structural Excess Capacity

Industry Expert Chris Mitchell Available for Interviews

Chris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8. He will emphasize that policymakers should carefully distinguish between unfair state-directed industrial overcapacity and the commercially necessary manufacturing capacity that underpins the global electronics industry — including production among U.S. allies and partners.

“The problem is not capacity but rather the source of that capacity. Capacity built through state-directed industrial policy that distorts markets is a genuine trade concern. Capacity built by the basic economics of electronics manufacturing, where firms must invest billions before the first product ships, is not. Conflating the two causes the finding to collapse into circular logic: if capacity exists, it is structural, and therefore it is distortive,” Mitchell shared ahead of his official testimony.

Mitchell will testify alongside more than 100 witnesses representing a wide variety of industries and national interests.

Media Availability: Mitchell will testify during Panel 21 on Friday, May 8, with the day’s testimonies beginning at 10:00 am ET. He is available for background briefings ahead of the hearing and on-the-record interviews afterward. To schedule an interview or request the full testimony, contact Daniel Baker (danielbaker@electronics.org), Director of Policy Communications & Public Affairs.

Mitchell’s full testimony will touch on the following topics:

  • Distinguishing allied production from state-directed competition.
  • The cyclical nature of electronics production.
  • Why specialization and geographic concentration occur in the sector.
  • The need for a rigorous evidentiary standard.
  • Why tariffs alone cannot solve domestic capacity constraints or limitations. 

About Chris Mitchell 

Chris Mitchell leads global government relations for the Global Electronics Association, representing the world’s leading electronics manufacturers and suppliers. He has more than 20 years of experience in international trade, technology, and supply chain policy.

 

 

Powering U.S. Electronics Talent with Apprenticeship

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The talent gap in U.S. electronics manufacturing continues to widen, making hiring and training major supply chain constraints.

Hiring is now a strategic supply chain issue—requiring stronger pipelines, more effective training, and closer collaboration with education and workforce partners.

This executive webinar brings together leaders from government and industry to share practical strategies for using apprenticeship to address workforce challenges and build a more resilient talent pipeline.

Featured Speakers

  • Dr. Nakeya Womack, U.S. Department of Labor 
  • Lea Tavani, VP of HR, Mack Technologies 
  • Victoria Hawkins, Director Workforce Funding and Partnerships, Global Electronics Association

What You’ll Learn

  • How to strengthen your talent pipeline for 2026 and beyond 
  • Available funding opportunities and apprenticeship programs 
  • Proven approaches to upskilling, training, and retention 
  • Insights on policy and industry collaboration 
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