by Tracy Riggan, senior director, business development, IPC Technology Solutions

Key Summary

• The workshop addresses growing packaging challenges driven by electric vehicles, autonomous systems, smart factories, and industrial automation.
• Modern electronics require higher levels of integration across chips, modules, boards, and full systems, making coordinated packaging strategies essential.
• Packaging now influences performance, thermal behavior, reliability, and manufacturability at every level, not just the chip level.
• Automotive and industrial applications face integration issues including heat management, mmWave systems, high voltage components, and long term reliability.
• The workshop aims to align industry stakeholders on guidelines, standards, and best practices to accelerate innovation.

As the automotive and industrial sectors undergo rapid technological transformation, the electronics industry finds itself at a critical inflection point. From electric and autonomous vehicles to smart factories and connected infrastructure, modern applications demand increasingly complex electronic systems that are smaller, faster, more efficient—and more reliable than ever.

To address these challenges head-on, IPC, with the support of Research Fab Microelectronics Germany (FMD), is organizing the Workshop on Component-to-System Level Packaging – Addressing Integration Challenges for Automotive and Industrial Applications. This timely event, held in collaboration with the APECS Pilot Line initiative, offers an essential forum for the global electronics community to explore next-generation packaging and integration strategies.

Why This Workshop Matters

1. Meeting the Demands of Tomorrow’s Mobility and Industry

The shift to electrified and autonomous mobility has ushered in a new era for automotive electronics. Similarly, the rise of smart homes, Industry 4.0, and AI-driven automation has elevated the complexity and criticality of industrial electronics. These advancements necessitate unprecedented integration of processors, sensors, memory, and power modules into increasingly miniaturized and thermally efficient systems.

This workshop focuses directly on these trends, emphasizing real-world solutions to integration challenges from both Component-Level Packaging (CLP) and System-Level Packaging (SLP) perspectives.

2. From Components to Systems – A Paradigm Shift

Historically, electronic packaging stopped at the chip or device level (Level 0/1). However, today’s challenges demand a more holistic approach. System functionality is now deeply intertwined with packaging decisions—not just for individual components, but at the board (Level 2) and system (Level 3) levels. Concepts like System-in-Package (SiP) and chiplet integration blur the traditional boundaries, pushing the board "inside the package."

This shift requires close collaboration across the value chain—from OSATs (Outsourced Semiconductor Assembly and Test) to EMS (Electronics Manufacturing Services)—to enable innovation in design, materials, thermal management, and reliability.

3. Real Challenges, Real Solutions

The integration of mmWave radar, LIDAR, high-voltage EV components, wireless modules, and optical communication systems poses tough questions:

1. How do we manage power and heat in ultra-compact designs?
2. What standards and testing protocols ensure long-term reliability in harsh automotive or industrial environments?
3. How can we accelerate the transition from research to mass production?

By focusing on these real-world issues, the workshop seeks to foster collaboration on standardization, guidelines, and best practices—all essential to bridging the gap between cutting-edge R&D and scalable manufacturing.

A Launchpad for Future Innovation

Beyond knowledge exchange, the planned outcome of this workshop is to initiate pre-competitive project proposals for Europe’s innovation ecosystem. These Research and Innovation Actions (RIA) or Innovation Actions (IA), ideally in connection with the APECS pilot line, will provide critical momentum to develop new packaging solutions that are both manufacturable and future-proof.

The emphasis on pre-competitive collaboration ensures that all players—large OEMs, mid-size manufacturers, startups, and academic partners—can contribute to and benefit from a shared innovation roadmap.

Be Part of the Solution

This workshop isn’t just another industry event. It’s a strategic touchpoint for everyone involved in the future of electronics—from IC designers and materials scientists to packaging engineers and production leaders. It is the first of several to be held globally with various focus points. 

If your business is part of the automotive or industrial value chain, your presence in Berlin this July isn’t just recommended—it’s essential.

Register Today. Shape the Future of Electronics
Let’s turn challenges into solutions and innovations into industry standards—together.

by Yusaku Kono, IPC Japan Representative

Key Summary

• IPC hosted its 2025 Q2 Executive Policy Roundtable in Tokyo with senior officials, executives, and industry leaders.
• The event centered on geopolitical risk, trade policy, and strategies to strengthen supply chain resilience.
• Discussions emphasized deepening U.S.–Japan cooperation in advanced technology and semiconductor ecosystems.
• Advanced Electronics Packaging was highlighted as a driver of competitiveness and supply chain stability.
• Speakers noted Japan’s strengths in materials, manufacturing equipment, and production expertise.
• Participants agreed on the need for stronger global value chains and cross-border collaboration.

IPC successfully convened its 2025 Q2 Executive Policy Roundtable on May 21 at Tokyo Kaikan. The event brought together senior government officials, corporate executives, and industry experts to explore strategies for building resilient and future-proof supply chains in an increasingly complex geopolitical and economic landscape.

With a focus on “Geopolitical Risk and Trade Policy: Supply Chain Disruptions and Countermeasures,” the roundtable facilitated open dialogue around international collaboration, strategic manufacturing capabilities, and innovation leadership.

Key highlights:

• Strengthening U.S.–Japan cooperation in advanced technology and semiconductor ecosystems
• Leveraging Advanced Electronics Packaging (AEP) to promote competitiveness and supply chain resilience
• Enhancing international collaboration beyond traditional industrial boundaries
• Recognizing Japan’s strategic strengths in materials, manufacturing equipment, and production expertise

Speakers included Mr. Akira Amari, former Secretary General of Japan’s Liberal Democratic Party, and IPC President and CEO John W. Mitchell. Additional insights were provided by Chris Mitchell (VP, Global Government Relations, IPC) and Matt Kelly (CTO & VP, Standards & Technology, IPC), who addressed trade developments, industrial policy, and technological priorities.

Participants agreed on the urgency of reinforcing global value chains, promoting cross-border cooperation, and supporting efforts to advance the electronics industry through shared knowledge and partnerships.