John Luddy Named Interim Executive Director of U.S. Partnership for Assured Electronics (USPAE)

The Global Electronics Association today announced that John Luddy has been appointed interim executive director of the U.S. Partnership for Assured Electronics (USPAE), bringing decades of experience in national security policy, government relations, and defense industry leadership to the role. Luddy replaces the previous executive director, James Will. 

USPAE is a subsidiary of the Global Electronics Association that focuses on partnerships with the U.S. Government to support a more robust defense electronics industrial base. 

As interim executive director of USPAE, Luddy will engage industry and government leaders on the strategic opportunities and vulnerabilities facing the defense electronics industrial base, while advancing federal investment in critical research and development. The role is centered on education, dialogue, and partnership, aligning industry and government around priorities that strengthen the nation’s electronics ecosystem.

Luddy joins USPAE from Vector Strategies, a consulting practice providing strategic advisory, business development, market analysis, and legislative advocacy services to clients ranging from aerospace firms to technology companies. Previously, he served as vice president for national security policy at the Aerospace Industries Association (AIA), where he led the development of AIA’s national security policy agenda and played a leading role in public and government advocacy on national security and defense industrial base issues.  

“I’m pleased to serve as Interim Executive Director of the U.S. Partnership for Assured Electronics,” said Luddy. “A secure and resilient electronics supply chain is critical to national security and to the strength of our defense industrial base. USPAE plays an important role in bringing together industry, government, and research partners to address these challenges, and I look forward to working with the board and our partners to strengthen this collaboration and advance practical solutions.”

“John brings a rare combination of policy expertise, industry insight, and leadership experience to this role,” said John W. Mitchell, USPAE Chairman of the Board. “His deep understanding of the intersection between government, national security, and advanced technology makes him exceptionally well-positioned to guide USPAE during this transition and continue strengthening its impact across the electronics and U.S. defense ecosystem.”

Luddy holds a master’s degree in international relations from Tufts University’s Fletcher School of Law and Diplomacy, a bachelor’s degree in history from Bates College, and is a graduate of the U.S. Army’s Ranger and Airborne Schools. He served on active duty as a Marine Corps infantry officer and in Reserve policy, operations, and public affairs assignments. 

From Local Expertise to Global Impact: Northstar Technologies and the Power of Community

Mar 20, 2026

KEY SUMMARY 

Northstar Technologies has grown from a Hong Kong startup into a global provider of semiconductor test solutions 

Expansion across the U.S., China, Italy, and the Philippines highlights its international footprint 

The Philippines serves as a key innovation hub, driving product development and engineering excellence 

Workforce training through Global Electronics Association certification programs improves quality, efficiency, and reliability 

Adoption of global standards strengthens Northstar’s role in the electronics manufacturing ecosystem 

Industry engagement and community connections enhance visibility, collaboration, and continuous improvement 

The company exemplifies how local expertise, supported by global networks, can drive innovation and growth 

 

By Arpita Das, manager, communications, Global Electronics Association India and Southeast Asia 

Founded in Hong Kong in 2008, Northstar Technologies began as a small team of circuit board repair experts with a singular mission: to help customers increase productivity and reduce costs through high-quality semiconductor test solutions. 

From those early beginnings, the company steadily expanded its global footprint, establishing facilities in the United States, China, Italy, and the Philippines. Its operations in the Philippines have become a standout success story in Northstar’s journey. 

By tapping into the country’s deep pool of skilled engineers and technicians, Northstar has elevated both the quality of its products and the Philippines’ growing role in the global electronics ecosystem. This dedication is embodied in innovations such as the Javelin J800 and Spartan NH8800, both designed and manufactured in the Philippines, reflecting the company’s commitment to local expertise and global excellence.  

A key pillar of Northstar’s success is training 

Since joining the Global Electronics Association in 2019, Northstar has leveraged IPC training and certification programs, including IPC/WHMA-A-620 (Cable and Wire Harness Assemblies), IPC-A-610H (Acceptability of Electronic Assemblies), and IPC-7711/7721 (Rework, Modification, and Repair of Electronic Assemblies). Nearly 100 employees have become Certified IPC Trainers. 

These programs have not only reduced errors and inefficiencies; they also helped build a culture of accountability, continuous improvement, innovation, and values that are core to the global electronics community. 

Today, the Philippines stands as one of Southeast Asia’s most important electronics manufacturing hubs, exporting integrated circuits and semiconductor devices that power countless products worldwide. Its strategic location, robust infrastructure, and highly skilled workforce have made it a preferred destination for multinational companies. 

Northstar plays an important role in this ecosystem by ensuring the reliability of those components through advanced test engineering solutions. Beyond technology, the company contributes to the country’s reputation as a trusted global partner through strict adherence to internationally recognized standards, a strong focus on research and development, and ongoing workforce training.  

Connections Made Through Global Electronics Association Membership 

Membership in the Global Electronics Association has connected Northstar to a broader industry community. Through access to training, certification programs, and international events, the company continues to strengthen its capabilities while engaging with peers across the global electronics ecosystem. Northstar consistently applies IPC standards across its production processes to maintain world-class quality. 

Participation in events such as the Cable and Wire Harness Competition has provided Northstar’s team with opportunities to demonstrate their technical expertise, build confidence, and raise their visibility in the global electronics marketplace. 

Looking ahead, Northstar Technologies remains focused on growth and innovation 

As company president, Roy Allen Bihag explains: 


“The Philippines still has a lot of untapped potential. By harnessing our technical expertise and resilience—and anchoring our ideas in the global standards set by the Global Electronics Association—we can bring more meaningful and impactful innovations to the global market.”    

Electronics Manufacturing: Demand Holds Firm, but Cost Pressures Intensify

Mar 19, 2026
KEY SUMMARY 

  • Global Electronics Association sentiment data shows electronics manufacturing demand remained strong in March 

  • Orders, shipments, and capacity utilization indices indicate sustained production activity and resilience 

  • Backlogs are easing slightly, signaling improved throughput or moderating demand growth 

  • Material costs are rising sharply, with widespread input cost pressures impacting margins 

  • Memory component markets are tightening due to AI-driven demand and data center expansion 

  • Manufacturers report increased lead times and significant price increases for memory components 

  • Limited near-term relief expected, with ongoing supply constraints and cost challenges 

  • Companies must balance procurement, pricing, and production strategies in a complex operating environment 


By Shawn DuBravac, Chief Economist, Global Electronics Association

The latest findings from The Current Sentiment of the Global Electronics Manufacturing Supply Chain show demand across the electronics manufacturing sector remained elevated in March following February’s sharp surge, signaling continued resilience in industry activity. Simultaneously, manufacturers are facing renewed cost pressures and tightening component availability, particularly in memory markets, creating a more complex operating environment. 

Demand Stabilizes After February’s Spike 

Order activity remained strong in March, though slightly below February’s peak.  

The Orders Index registered 120, down from February’s 12-month high of 122 but still well above January’s 113. More than half of manufacturers (51%) reported rising orders, indicating demand momentum remains intact. 

 

Production indicators reflect similarly steady conditions. The Shipments Index held at 117 for a second consecutive month, while Capacity Utilization also registered 117, suggesting that manufacturers continue to operate at a sustained pace to meet demand. 

 

The Backlog Index eased to 105, down from 108 in February. Although still in expansion territory, the narrowing gap between orders and backlogs could signal improving throughput as manufacturers work through accumulated orders or a slight moderation in incoming demand. 

 

Overall, the data suggest a relatively balanced environment, with demand remaining strong and production keeping pace. 

Material Cost Pressures Rise 

While demand conditions remain supportive, the cost environment is becoming more challenging. 

The Material Costs Index climbed to 139 in March, up from 129 in February, marking the highest level in more than a year. Nearly 78% of manufacturers reported rising material costs, pointing to broad-based input cost escalation across the electronics manufacturing ecosystem. 

For many companies, these increases are not being fully offset by higher prices or productivity gains, creating growing margin pressure. 

Memory Markets Tighten 

The survey also examined conditions in the global memory component market, where demand tied to AI infrastructure is reshaping supply dynamics. 

94% of manufacturers report they can still source memory components, though 62% say availability is limited or lead times have extended.  

 

Pricing pressures are widespread: 82% report rising memory prices, with 33% describing increases as significant. 

 

Fifty-eight percent of survey respondents identified AI-related workload growth as the primary driver of these shifts. Additional factors contributing to tighter supply include data center expansion (41%) and preferential allocation to higher-margin customers (20%). 

 

Limited Near-Term Relief 

Manufacturers do not expect immediate improvement. Only 14% of respondents believe memory sourcing conditions will improve within the next six months, while 36% say it is too early to assess. 

Looking ahead 

Taken together, the data suggest the industry is entering a period in which demand remains strong, but cost pressures and component constraints are becoming more pronounced. Navigating these dynamics will require careful management of procurement, pricing, and production strategies in the months ahead. 

Section 301 Investigations Signal New Phase in U.S. Trade Policy

Mar 12, 2026
Summary

  • The Trump administration has launched Section 301 trade investigations into 16 major trading partners, including China, the EU, Japan, India, and Mexico, with electronics identified as a sector of concern.

  • The investigations follow the Supreme Court ruling against IEEPA-based tariffs and use Section 301, which requires a formal process with public comments and hearings before any trade remedies.

  • No new tariffs yet, but potential future trade actions could affect the electronics supply chain; the Global Electronics Association will submit comments and encourage members to participate.

The Trump administration yesterday announced the launch of Section 301 trade investigations into 16 key trading partners, including China, the European Union, Singapore, Switzerland, Norway, Indonesia, Malaysia, Cambodia, Thailand, South Korea, Vietnam, Taiwan, Bangladesh, Mexico, Japan, and India.

The investigations, conducted by the Office of the United States Trade Representative (USTR), are aimed at addressing what the administration characterizes as unfair trade practices relating to structural excess capacity and production in manufacturing sectors. Electronics were specifically identified as an area of concern.

Jamieson Greer, the USTR, has also signaled that additional investigations will be launched related to digital services taxes and discrimination against U.S. technology companies, among other practices.

The backdrop: A new legal path after the IEEPA ruling

This action follows the Supreme Court of the United States’ February 20 ruling striking down the administration’s tariffs imposed under the International Emergency Economic Powers Act (IEEPA). The move represents a significant shift in the legal framework the administration is using to pursue its trade agenda.

Unlike tariffs imposed under IEEPA, investigations conducted under Section 301 of the Trade Act of 1974 require a formal investigative process. This includes public comment periods and hearings before tariffs or other remedies can be implemented. The administration has indicated it intends to move on an accelerated timeline.

Why it matters: Potential impacts across the electronics supply chain

While no new tariffs are being imposed today, the investigations lay the groundwork for potential future trade actions that could directly affect companies across the electronics value chain — from semiconductor sourcing to finished systems.

What members should do: Prepare comments and engagement

The Global Electronics Association will file comments with the USTR by the April 15 deadline and has submitted a request to testify at the May 5 hearings. The association encourages member companies to prepare their own comments as well.

What’s next: Monitoring developments

We will continue to monitor these investigations and provide updates as developments occur. In the meantime, members with questions are encouraged to reach out to the Global Electronics Association advocacy team.

 

From Cosmos to Courtrooms: Three Reads Worth Your Time

Mar 10, 2026
Key Summary

  • A look at three fascinating ideas shaping scientific and legal thinking—from the long-term fate of the universe to the surprising historical clues hidden in mosquito genetics.

  • The post also explores the emerging “Rights of Nature” movement, including legal protections for wild rice and ecosystems.

By David Bergman, vice president, international relations, Global Electronics Association

Every so often I come across a few pieces that make me pause, think, and occasionally reconsider how we look at the world, whether that world is the global electronics ecosystem, human history, or the universe itself. My reading list tends to wander across disciplines, but the common thread is perspective. Good writing, and good science, can stretch our sense of time, scale, and consequence in useful ways. Taken together, the pieces below range from cosmology to evolutionary biology to environmental law. What they share is a willingness to ask unconventional questions, and to find answers in places we might not normally think to look.

This Is the End. My Only Friend, the End.

Cosmologists have identified several ways the universe could eventually end, none particularly festive. 

The most likely scenario is heat death. As the universe expands, energy becomes increasingly spread out. Over trillions of years, stars burn out, galaxies fade, and the cosmos settles into a cold, dark state where no new structure forms. A more dramatic possibility is the Big Rip, in which dark energy becomes strong enough to tear apart galaxies, stars, planets, and eventually atoms.

Another idea is the Big Crunch, in which gravity reverses expansion and collapses the universe back into a dense state. Then there’s vacuum decay, a theoretical event where a new quantum state sweeps across the universe at light speed, rewriting the laws of physics.

But before you run out and start to party away your retirement fund, every known scenario unfolds billions to trillions of years in the future. So, we have that going for us.

Mosquito DNA May Track Early Human Migration

Often unofficially referred to as “State Bird” of Alaska, Minnesota, New Jersey, and others, mosquitoes may be unwelcome, but they may also be useful historians. It turns out these mini vampires have been dining on humans for almost 2 million years

A genomic study of Southeast Asian Anopheles mosquitoes investigated when certain species evolved a preference for human blood. By analyzing mosquito genomes, researchers reconstructed the evolutionary timeline of mosquitoes. The findings suggest mosquitoes began specializing in biting humans about 1.8 million years ago, well before modern humans reached the region.

The timing aligns with the spread of Homo erectus, an early human ancestor. As these hominins moved through Southeast Asia, mosquitoes that fed on them likely gained an evolutionary advantage, eventually becoming the human-biting species responsible for transmitting malaria today. Because the fossil record in the region is sparse, mosquito genetics offer an unexpected clue about early human presence.

In short: long before humans studied mosquitoes, mosquitoes were adapting to humans.

If Only Rice Could Vote: When Nature Gets Legal Standing

A growing legal movement argues that nature itself should have rights—and in some places, it already does.

The White Earth Band of Ojibwe in Minnesota has recognized the legal rights of manoomin, or wild rice, a plant central to Anishinaabe culture and food traditions. The law asserts that wild rice has the right to exist, flourish, and grow in clean water. Under this approach, environmental damage that threatens wild rice could be challenged in court on the plant’s behalf.

This idea is part of the broader Rights of Nature movement, which seeks to give ecosystems legal standing. Ecuador has embedded these principles in its constitution, and New Zealand has granted legal personhood to a river. The concept may sound unusual—but in a legal system where corporations are already treated as “people,” extending rights to ecosystems is becoming easier to imagine.

 

APEX EXPO 2026 Show Floor Sells Out – 416 Exhibitors – Largest Manufacturer Lineup in Six Years

Featuring 150+ product launches, live smart-factory demos, and new standards milestones; registration open for engineers, technicians, operations, and executives

The APEX EXPO 2026 show floor has officially sold out, with 416 exhibitors occupying the Anaheim Convention Center. The sold-out floor reflects strong demand across the global electronics manufacturing supply chain and sets the stage for a high-impact, business-focused event March 16-19, 2026.

Benefits to Attendees

  • Unmatched supplier access: 416 exhibitors representing the full electronics value chain – PCB fabrication, advanced electronics packaging, EMS, test/inspection/metrology, materials, automation, design software, and supply chain services under one roof.
  • Real-time technology validation: Side-by-side equipment and process comparisons, live smart-factory/IPC CFX interoperability demos, and hands-on sessions to benchmark yield, reliability, throughput, and cost.
  • Direct access to expertise: Face-to-face engagement with engineers, product developers, and decision-makers driving innovation.

What’s Happening at APEXEXPO 2026

  • Advanced Electronic Packaging Conference:
  • EMS Leadership Summit
  • Smart factory in action: Interoperability demos featuring IPC CFX and Hermes standards showing data flows you can replicate on your own lines.
  • Standards in focus: Working sessions and rollouts reflecting the latest in design, fabrication, assembly, and inspection standards delivering practical takeaways for compliance and quality teams.
  • Training that sticks: Professional development courses and certification pathways to upskill technicians and engineers.
  • Business impact: Content tracks for operations, procurement, and the C-suite covering capacity planning, supply assurance, sustainability, and workforce transformation.

Exhibitor Makeup

  • PCB fabrication and advanced electronics packaging
  • Assembly equipment and materials
  • Test, inspection, and metrology systems
  • Automation and smart factory solutions
  • Design software and digital manufacturing tools
  • Sustainability and supply chain services

“Strong exhibitor participation reflects the momentum we’re seeing across the industry,” said Alicia Balonek, senior director of tradeshows and events at the Global Electronics Association. “A sold-out show floor demonstrates that companies view APEX EXPO as a critical venue for launching innovations, strengthening partnerships, and driving business growth. For attendees, it means maximum exposure to the technologies and suppliers shaping the future of electronics manufacturing.”

For more information, to view the exhibitor list, or to register, visit the APEX EXPO website at https://www.apexexpo.org/.

 

Introduction to PCB Design I North American Time

Date
-

This course meets twice a week on Tuesdays and Thursdays for six weeks.

This introductory course will focus on front-end design concepts, including schematic capture, library part creation, basic electrical engineering, and documentation.

Upon completion, participants will be able to:

  • Define and create schematic symbols and PCB footprints that comply with applicable IPC Standards
  • Create simple schematics for use in simulation and prototyping applications
  • Implement industry best practices for:
    • Schematic capture
    • Hierarchical design implementation
    • Documentation
    • Parts list generation
  • Recognize the trade-offs between the different schematic methodologies and when to use each type
    • Assess different component types and attachment methods
  • Differentiate when to use each type of componentDefine standard schematic notes
    • Apply best practices in negotiating these terms with customers

Introduction to PCB Design I European Time

Date
-

This introductory course will focus on front-end design concepts, including schematic capture, library part creation, basic electrical engineering, and documentation.

Upon completion, participants will be able to:

  • Define and create schematic symbols and PCB footprints that comply with applicable IPC Standards
  • Create simple schematics for use in simulation and prototyping applications
  • Implement industry best practices for:
    • Schematic capture
    • Hierarchical design implementation
    • Documentation
    • Parts list generation
  • Recognize the trade-offs between the different schematic methodologies and when to use each type
    • Assess different component types and attachment methods
  • Differentiate when to use each type of componentDefine standard schematic notes
    • Apply best practices in negotiating these terms with customers

Connecting the Dots: From Component-Level to System-Level Packaging at the IEEE HIR Symposium

Mar 04, 2026

Key Summary:

  • At the IEEE Electronics Packaging Society Annual HIR Symposium, the Global Electronics Association addressed the transition from component-level to system-level packaging.
  • Contributions to the International Heterogeneous Integration Roadmap focus on assembly and reliability challenges in high-performance compute and analog/mixed-signal applications.
  • Advanced packaging is enabling silicon photonics, optical interconnects, and co-packaged optics for next-generation data center performance.
  • Liquid cooling is becoming foundational for high-performance computing architectures.
  • Expanded global collaboration, including engagement through HIR and international partners, strengthens industry alignment and roadmap-driven innovation.

By Devan Iyer, Chief Strategist, Advanced Electronic Packaging, Global Electronics Association

At the recent IEEE Electronics Packaging Society Annual HIR Symposium, I had the opportunity to speak about a topic at the center of advanced electronic packaging: bridging the gap between component-level and system-level packaging.

The International Heterogeneous Integration Roadmap (HIR)

HIR is a trusted compass for our industry, outlining projected technological needs and innovation opportunities over the next 10-15 years. Unlike commercial forecasts, HIR focuses on technical assessment, identifying challenges, research gaps, and the possible solutions required to integrate emerging devices and materials at scale. For many, it’s the first place we look to understand where the industry is heading.

As functionality integration intensifies, the transition between these stages becomes increasingly complex due to higher performance needs, decreasing form factors, and finer interconnect pitches. I presented on the assembly and reliability challenges that arise when moving from individual packaged components to fully realized system architectures. 

Through our Advanced Electronic Packaging Technology Leadership Council (ADEPT), the Global Electronics Association collaborates with industry leaders to address these issues. In 2025, our members contributed to two HIR chapters, including assembly and reliability, covering critical package-board interactions in high-performance compute and analog/mixed-signal applications. This work represents a major step forward in aligning component innovation with system performance and reliability.

Our presence at the symposium was important as it built on the work we have done in the past year. Following an invitation to host a special session together with HIR at the 2025 Electronic Components and Technology Conference (ECTC), widely regarded as the premier global conference in advanced packaging, we expanded the conversation internationally. Also in 2025, we organized a workshop and engaged with partners in Taiwan and Malaysia. Each stop strengthened our network and sharpened our understanding of where the opportunities are.  A blog entry on advanced electronic packaging in Malaysia can be found here.

Top Three Highlights from the HIR Symposium

  1. High-Speed Communication & Optical Interconnects
    Data center performance demands are accelerating the adoption of silicon photonics, optical interconnects, and co-packaged optics. Advanced packaging will be pivotal in enabling this architecture.
  2. Liquid Cooling is a Necessity
    For high-performance computing, liquid cooling is no longer optional; it is foundational. The Association is actively developing guidelines and standards to support implementation.
  3. Collaboration Drives Impact
    The partnership between the Global Electronics Association and IEEE’s HIR teams is increasing visibility and strengthening industry alignment. Collaboration ensures that roadmap insights translate into actionable progress.

What’s Next?

Looking ahead, we want to expand our technical contributions to the HIR Roadmap into the automotive, aerospace, and defense markets.  We have been invited to contribute to an extension of the automotive chapter, with a specific focus on electronics packaging for electric vehicles, and we will begin that work this year. 

We are proud to be part of a robust global community of companies that contribute insights, identify challenges, and collaborate on solutions. That visibility matters. Roadmaps only work when the full supply chain participates, all building toward shared technical goals.

Conflict and Consequence: The Electronics Industry Faces a Global Stress Test

Mar 03, 2026
Key Summary
  • The escalating Middle East conflict is creating cascading risks for global electronics manufacturing, raising energy and shipping costs, disrupting supply chains, and prompting countries like India, South Korea, and Malaysia to reassess growth, demand, and lead-time expectations.

By Sanjay Huprikar, Chief Global Officer, Global Electronics Association

The conflict in the Middle East will have a dramatic impact on electronics manufacturing both from a supply and demand perspective. Most countries around the globe are sure to face issues ranging from reduction in oil supply to increase in shipping costs to massive logistics related disruptions.   

This week I had the opportunity to read three articles depicting the views of the conflict from three very different manufacturing countries in Asia: India, South Korea, and Malaysia.  

The Iran-US-Israel war: A looming economic storm - Manufacturing Today India

Korea Inc. reviews Middle East plans, watches Strait of Hormuz closely after airstrikes on Iran

Oil, trade and uncertainty: What the Middle East conflict means for Malaysia’s economy

My quick takeaways on their key concerns:

  • India is anticipating a slowdown in growth that could affect their exports
  • South Korea is worrying about having to scale back development projects and a decrease in consumer demand
  • Malaysia is having to forecast longer lead times due to supply chain delays  

Please feel free to drop me a line at SanjayHuprikar@electronics.org if you saw value reading these pieces or if you disagreed with the stances taken by these authors; and feel free to highlight some additional articles on this subject that you have read and think I should be reading too!

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