Standardized Connectivity Drives Smart Manufacturing Upgrade

Phoenix Contact DIP Line Recognized as IPC HERMES Demo Line

IPC China has officially designated the “IPC HERMES Demo Line” as an DIP production line of Phoenix Contact Asia-Pacific  (Nanjing) Co., Ltd. during a ceremony held on April 21.

The recognition affirms the line’s full implementation of the IPC-HERMES-9852 standard and highlights a leading industry example of leveraging international standards to enable connectivity and intelligent transformation in electronics manufacturing.

Advancing Interoperability Through Open Standards

On the day of the ceremony, Sydney Xiao, President of East Asia at the Global Electronics Association, led a delegation of standards and technical team on a site visit and exchange. The delegation met with Lei Chen, Senior Vice President of Phoenix Contact China; Qing Ye, Director of the Power Reliability regional business unit and Industrial Electronics Operations; and members of Phoenix Contact’s management, engineering, and digitalization teams. Both sides exchanged views on demo line implementation, production line achievements, and future collaboration opportunities.

From Technical Challenge to Scalable Application

The IPC-HERMES-9852 standard addresses board-level data exchange and communication between manufacturing equipment.

The awarded DIP automatic line was jointly developed by Phoenix Contact and multiple equipment suppliers. During implementation, the project team adressed key technical challenges, particularly the integration of PLC systems with the HERMES protocol. By leveraging the PLCnext platform, Phoenix Contact achieved deep integration between communication protocols and control systems. 

Through standardized HERMES standard, the line now enables:

  • Automated program downloading 
  • Multi-product changeover 
  • Mixed-model production

These applications demonstrate the practical value of open communication standards in electronics assembly environments.

Quantifiable Results: Cost, Efficiency, and Flexibility

According to the project team, the implementation has delivered measurable benefits:

  • Cost optimization: Reduced the need for 15–17 barcode scanners per line, lowering hardware investment
  • Efficiency gains: Changeover time reduced by over 60%, with overall equipment effectiveness (OEE) improved by more than 10%
  • Enhanced flexibility: Plug-and-play equipment integration shortened system integration cycles by 50%, while enabling seamless interoperability with IPC-CFX-2591

Industry Validation and Strategic Outlook

Lei Chen noted that the recognition validates both the production line achievements and the broader importance of standardization in building a collaborative industrial ecosystem.

“As the industry faces challenges such as fragmented systems and inconsistent standards, establishing open, collaborative, and scalable standard frameworks is becoming essential. Phoenix Contact will continue to accelerate innovation based on unified standards and quality systems, while strengthening ecosystem collaboration to build a more resilient industrial landscape.”

Sydney Xiao also praised the project: “The Phoenix Contact Nanjing Demo Line is an excellent example of how manufacturers can apply international standards to break down data silos and enable equipment interoperability. Its successful implementation provides a scalable model for the industry, demonstrating that open standards are a critical pathway to improving efficiency, enabling flexible manufacturing, and advancing smart transformation.”

Scaling Standard Adoption Across the Industry

Looking ahead, IPC China will continue working with ecosystem partners across the value chain to accelerate the adoption of IPC standards in real manufacturing environments, supporting the intelligent upgrade of the electronics manufacturing industry.

 

Advanced Packaging: HDI Enabling Technology

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Course meets Monday and Wednesday

In today's rapidly evolving technological landscape, the demand for smaller and more powerful electronic devices continues to grow. From smartphones to tablets, the drive for miniaturization is evident. However, there are underlying factors that contribute to this trend, which may not be immediately apparent.

Industries such as Military-Aerospace, Medical, Telecom, and Industrial Electronics rely on fine-pitch packages (QFPs and BGAs) and increased package pin counts to support their interconnect designs. To meet these demands, High-Density Interconnect (HDI) and Ultra High-Density Interconnect (UHDI) technologies play a critical role. When properly integrated into the PCB structure, HDI improves both signal integrity and via reliability. The success or failure of product performance, reliability, and time to market is heavily influenced by the materials, processes, and designs of these enabling technologies.

This course is perfect for PCB fabricators and end users that require an understanding of the constraints with respect to blind and filled vias, fine-pitch designs, material and foil types, stack-ups and reliability. 

IPC Builds-Standards Development Committee Meetings

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The standards powering global electronics start here.

IPC Builds brings together the global electronics community for one week of standards development that shapes how the entire industry designs, builds, and tests, laying the groundwork for the next generation of electronics standards. September 19–24 in Paris. Register now.

WHAT IS IPC BUILDS?

Every standard your company works to, from IPC-A-610, J-STD-001, IPC-6012, IPC-A-600 to IPC/WHMA-A-620 and dozens more, are written, refined, and approved by working groups of industry professionals from across the global supply chain who show up, raise their hands, and make their expertise count.

That's IPC Builds. It's a week-long series of standards development meetings where the global electronics community comes together to do the actual work: updating existing standards to meet current trends, resolving emerging technical challenges, forecasting where the industry is heading, and building the next-generation frameworks that will define quality and reliability for the global supply chain.

The standards that will govern tomorrow's technologies are being developed right now, by people who show up. This year, they will be at IPC Builds in Paris, France, September 19-24, 2026.

WHY YOUR PRESENCE MATTERS

IPC standards don't write themselves. They reflect the real-world knowledge, hard-won expertise, and practical foresight from you and other professionals who shape them.

When you attend IPC Builds, your voice shapes the language of the standard. Your expertise influences the criteria. Your participation helps the industry anticipate what's coming and not just react to what's already here.

Whether you're attending your first committee meeting or you've been a task group chair for years, IPC Builds is where your contribution goes directly into the documents the entire industry trusts.

WHAT'S ON THE AGENDA

More than 60 meetings are scheduled across six days, covering the full range of electronics manufacturing disciplines, from established standards revisions to forward-looking work on emerging technologies:

  • Product Assurance — Printed boards, assemblies and wire harness
  • Assembly & Joining — Solderability, solder alloys, bottom termination components, SiP
  • Base Materials — Laminates, metallic foils, metal-based substrates
  • Rigid & Flexible Printed Boards — Design, fabrication, reliability
  • Cleaning & Coating — Conformal coating, flux residues, CAF, potting and encapsulation
  • Printed Electronics — 3D plastronics, additively manufactured electronics
  • Electronic Data & Traceability — Design data transfer, Connected Factory Exchange, Hermes, materials and process traceability, supplier declaration data flows, CO₂e reporting
  • High Speed / High Frequency — RF/microwave performance, high-speed base materials
  • Process Control & Reliability — SMT attachment reliability, inspection, microsection analysis

Committee Meetings
Saturday, 19 September - Sunday, 20 September | All Day
Monday, 21 September - Wednesday, 23 September | All Day
Thursday, 24 September | All Day

IPC Builds 2026 Saturday

IPC Builds 2026 Sunday

IPC Builds 2026 Monday

IPC Builds 2026 Tuesday

IPC Builds 2026 Wednesday

IPC Builds 2026 thursday
IPC Builds 2026 Saturday
IPC Builds 2026 Sunday
IPC Builds 2026 Monday
IPC Builds 2026 Tuesday
IPC Builds 2026 Wednesday
IPC Builds 2026 thursday

WHO SHOULD ATTEND

IPC Builds is for everyone with a stake in how electronics get made today and in the years ahead, including:

  • Engineers and technologists working to IPC standards daily
  • Quality, reliability, and compliance professionals
  • OEMs, EMS providers, board fabricators, designers, suppliers, and academia on the front lines of emerging technologies
  • Trainers and educators who teach to IPC standards
  • Forward-thinking professionals ready to help forecast and shape next-generation standards
  • Industry newcomers ready to collaborate and network with the best in the business
If IPC standards affect your work. IPC Builds 2026 is where you belong.
 

CLAIM YOUR SEAT IN PARIS – REGISTER NOW                                      

Advance Registration

Process: Advanced registration is mandatory for all attendees. 

There is no registration fee for this event. Lunch is included each day.

On-site Registration

On-site registration will be available for last-minute participants, but we do encourage advance registration.

HOTEL & VENUE

H4 Hotel Wyndham Paris Pleyel Resort | 149 Boulevard Anatole-France, 93200 Saint-Denis, France
A modern conference venue just outside central Paris, with dedicated meeting spaces, full hotel capacity, and easy access to the city. Use the dedicated room block link to secure your rate. Rooms are payable at check-in.

Hotel Room Block Expires 9 September 2026
The room block and special rates for IPC Builds 2026 attendees close on 9 September 2026. After this date, we cannot guarantee availability at the special rate or at the hotel.

Please reserve your room by 9 September 2026.

Book 19-24 September Accommodations >

Arriving before 19 September?

If you plan to arrive before 19 September, you will need to make two separate hotel reservations:

  1. Reserve your stay for 19–24 September using the IPC Builds hotel booking link above.
  2. Reserve your stay before 19 September using booking link below.

Book Accommodations Before 19 September >

Paris Pleyel Resort

QUESTIONS?

Philippe Léonard | Europe Director | PhilippeLeonard@electronics.org

Anatolii Kazmin | Europe Event Manager | anatoliikazmin@electronics.org

Chris Jorgensen | Senior Director, Standards | ChrisJorgensen@electronics.org


The Global Electronics Association is grateful to its partners who are making this event possible.

sponsor
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Global Electronics Association and FED Call for Abstracts for Pan-European Electronics Design Conference 2027

Europe’s key forum for next-generation electronics design and innovation

The German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the 3rd Pan-European Electronics Design Conference (PEDC).

Under the theme of "Advancing Electronics: From Silicon to Systems," experts from industry, academia, and development are invited to submit practice-oriented contributions. Abstracts for technical presentations can be submitted until June 30. The conference will take place on January 27–28, 2027, in Amsterdam, and will focus on the critical integration between advanced design and next-generation technologies.

Conference Focus and Topics

Designed to connect the European electronics industry with the scientific community, the conference highlights the latest developments in electronics design from “silicon to systems.” Submissions should provide in-depth insight into current industrial challenges and present viable, real-world solutions. This year’s core topics include:

  • Silicon-to-Systems Design: Package-to-PCB co-design (e.g., uHDI, IC-substrates), electro-mechanical optimization, and multi-physics simulations (e.g., SI/PI, thermal, mechanical).
  • High-Performance & Power Electronics: HPC and AI data Ccenters, EV power delivery, Battery management and cooling solutions.
  • Next-Gen Applications: Sense-Control-Communication for Space, Defence, and Autonomous Vehicles, High-speed digital and RF/microwave design.
  • Design for Excellence (DfX): Circularity, Compliance, Carbon Footprint, Manufacturability, and Reliability.
  • Design Software & Tools: Novelties in EDA software, AI implementation in design, Digital Twin, and data handshakes between design and production.
  • Sustainability & Lifecycle: Eco-friendly materials, cross-industry data management, and end-of-life/obsolescence management.
  • Process Orchestration: Design verification, testing of PCB assemblies, and development workflow management.

A Forum for the Expert Community

"Our primary goal is to provide maximum value for our participants," emphasizes Dieter Mueller, chairman, FED. "We are looking for presentations that offer clear orientation, provide a realistic assessment of technological trends, and deliver content that can be directly applied to daily operations. In Amsterdam, we will bring together international experts to shape the future of electronics at eye level."

Speakers will present their expertise to a high-profile audience of electronic designers, manufacturing specialists, process managers, and decision-makers from management, procurement and academia. Speakers benefit from high visibility through extensive media coverage before, during, and after the conference.

"PEDC is built by the design community, for the design community. We are looking for abstracts that push the boundaries of electronics design, particularly in emerging fields like silicon-to-systems, AI in electronics development, design for excellence and sustainability,” Dr. Peter Tranitz, senior director, Technology Solutions, Global Electronics Association, underlines. “Join us in fostering a truly pan-European exchange that supports the growth of Europe’s electronics ecosystem."

Call for Abstracts 2027

Detailed information regarding the submission process and the Call for Abstracts can be found at: www.pedc.eu.