North American PCB Industry Shipments Down 3.1 Percent in March

IPC Releases PCB Industry Results for March 2025

IPC announced today the March 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.24.

Total North American PCB shipments in March 2025were down 3.1 percent compared to the same month last year. Compared to the preceding month, March shipments were down 2.3 percent. March's year-to-date (YTD) shipments increased by 8.7% year-over-year (YOY).

PCB bookings in March were down 0.3 percent compared to the same month last year. March bookings were down 31.8 percent compared to the preceding month. March’s YTD bookings increased 19.3% compared to the same period last year.

“March marked the closest alignment between bookings and shipments that we’ve seen since October 2024—a signal that supply chains may be stabilizing, even as demand remains firm,” said Shawn DuBravac, IPC’s chief economist. 

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

 

Interpreting the Data

 

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

 

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

 

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

IPC Strengthens Global Leadership Team with Addition of Joe Schneider as Vice President of U.S/Canada

IPC announces the strategic appointment of Joe Schneider as vice president of U.S./Canada. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to this region’s innovation and economic growth. 

 

In this role, Schneider is responsible for ensuring that the needs of this vital region’s electronics industry are clearly understood and served by IPC and accomplished by developing strong relationships with regional membership, customers, and partners along with providing exceptional service delivery and identifying new business opportunities throughout the electronics eco-system.

 

With an impressive resume, Schneider brings more than two decades of executive experience with very successful roles and increasing responsibility in the EMS industry (Flex, Sparton) and the medical devices industry (Abbott, Siemens Healthcare). Immediately prior to joining IPC, he served as the vice president of commercial operations, health solutions for Flex in Buffalo Grove, Ill. While there, he led multi-site operations responsible for medical device, equipment and drug delivery for the healthcare industry.

 

“As our members, partners and other industry stakeholders meet Joe and see him in action, it will become very apparent that developing strong relationships with our targeted community and finding creative ways to address their challenges are part of his natural DNA. We look forward to him implementing the right strategies to better know the industry and in parallel fulfill our mission to serve the membership,” said Sanjay Huprikar, IPC’s chief global officer. 

           

IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data

IPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing. 

 

Version 2.0 provides substantial updates or expansions to support a broader range of shop floor operations. This includes capabilities added for hand soldering and wave soldering operations – expanding the total number of supported device types to 14 – and providing a pathway for gateway solutions providers to demonstrate their CFX capabilities via the CFX Validation and Qualification System. 

 

Additionally, CFX version 2.0 includes new capabilities, message additions, and structural changes to support smarter factory operations, including, for example:

 

  • New messaging to support Automated Guided Vehicle (AGV) and Autonomous Mobile Robot (AMR) technologies deployed in a CFX environment
  • Message field added to enable traceability of specific PCB differences (e.g., board vendor identification), which can be used to influence inspection outcomes and process optimization

  • SMT placement capabilities extended to include pick-and-place cycle information for each component to provide a detailed view of component placement and any failed pickup attempts on the machine and capture how many consecutive pickup attempts occurred before a placement error 

  • Improved handling of dynamic recipe changes during production by logging any on-the-fly modifications an operator makes to an active recipe at the equipment level

     

As with all previous IPC-2591 CFX releases, the CFX version 2.0 software development kit (SDK) is backward compatible with previous versions of the CFX SDK.

 

“Each of these enhancements in IPC-CFX 2.0 was driven by real-world manufacturing needs and vetted by the IPC task group to maintain compatibility with earlier versions,” said Thomas Marktscheffel, director of product management software solutions at ASMPT. “The result is a more expansive and detailed standard that covers a broader array of production processes and delivers richer data from machines, enabling smarter analytics and more efficient operations across the connected factory.”

 

To purchase IPC-2591, Version 2.0, visit the IPC Store. For more information on CFX, including access to the latest SDK and software development resources, visit www.ipc-cfx.org

Wiring the World Together: IPC and WHMA Unveil Global Wire Harness Competitions and Championship

IPC, in collaboration with the Wiring Harness Manufacturer's Association (WHMA), has organized the first-ever World Wire Harness Competitions and Championship. Regional country competitions will take place between March and December 2025 and final championship will be held at IPC’s Integrated Electronics Manufacturing & Interconnections (IEMI) event scheduled January 29–30, 2026, in Bangalore, India. The global initiative promotes industry’s best practices and strengthens the skilled workforce behind cable and wire harness assembly.           

 

Country wire harness competitions will take place in China (March 27-28), Sri Lanka (April 4), Australia (May 7), UAE (May 8), Vietnam (May 16 and September 10-12), Malaysia (July 23-25), Saudi Arabia (July), Thailand (August 20-22), Mexico (August), Philippines (October), and Egypt (November).                                                     

 

The global competition will bring together top talent from across the world to compete, collaborate, and showcase the highest standards of craftsmanship in wire harness assembly—an essential function in modern electronics manufacturing.

 

The competition will follow IPC/WHMA-A-620 Revision E, the industry benchmark for quality and reliability in the cable and wire harness industry. Participants will be evaluated on a wide range of competencies, including wire preparation, crimping, soldering, BOM verification, and final assembly workmanship. 

 

The World Wire Harness Competitions and Championship come at a time when the global wire harness market is poised for substantial growth. With a projected compound annual growth rate (CAGR) of 7.2 percent between 2024 and 2034, the sector is expanding across automotive, aerospace, defense, and industrial applications. 

 

“The wire harness competitions and subsequent championship are a global celebration of craftsmanship, collaboration, and excellence—bringing the best of each region together to inspire and celebrate the beauty inside of our craft and the people,” said Parker Garrett, EMSCO, chairman, WHMA.

 

Positioned as a centerpiece of IEMI 2026, the championship is expected to attract worldwide attention from leading manufacturers, industry stakeholders, and innovation-driven enterprises. For more information on regional rounds, sponsorship opportunities, or participation guidelines, visit: www.ipc.org/ipc-india-Wireharness-2025.

IPC Strengthens Electronics Industry Awareness with Appointment of Carrie Sessine as Global Communications Vice President

IPC announces the strategic appointment of Carrie Sessine as vice president of global communications. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to global innovation and economic growth. 

 

Sessine will spearhead IPC’s comprehensive communications strategy through high-impact industry partnerships, strategic media relations, social and digital engagement, and brand building initiatives. As the association’s chief reputation steward, she will collaborate with key stakeholders across IPC’s global ecosystem to develop powerful initiatives that positively impact the organization’s reputation and elevate the electronics industry’s profile and its most pressing issues.

 

With an impressive resume, Sessine has two decades of experience in corporate communications, reputation management, marketing, brand building and public relations. Prior to IPC, she served as the senior vice president of marketing & communications for In-Q-Tel, Inc., in Tysons, Va. While there, she led marketing and communications, directed a brand refresh, established crisis communications strategies, developed external content platforms and programming, and directed large-scale conferences.

 

Prior to her work at In-Q-Tel, Inc., Sessine led an independent strategic communications consultancy for clients in life sciences, pharma, biotech, corporate, and consumer packaged goods.

 

“Our decision to hire Carrie, above all, is a testament to her robust credentials. She has a demonstrated history of successfully working in the tech industry, protecting, and enhancing brand and corporate reputations,” said Dr. John W. Mitchell, IPC president and CEO. “Carrie is an immersive storyteller and stresses the importance of engaging audiences through fostering connections. Collaborating with her team, Carrie will help position IPC and the electronics industry as a driving influence in the world.”

Sessine is based in the Washington, D.C. area and can be reached at CarrieSessine@ipc.org.

IPC Welcomes Exemptions to Reciprocal Tariffs

IPC shared the following statement today on tariff exclusions and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO:

IPC, the global electronics association, welcomes the exclusion of key electronics components and technologies (laptops and smartphones) from recently imposed reciprocal tariff measures. These exclusions—covering components, computer parts, telecommunications equipment, and other critical inputs—reflect the importance of the interconnected nature of today’s global electronics supply chains.

The electronics industry depends on predictable trade policies to foster innovation, ensure supply chain resilience, and maintain the competitiveness of domestic manufacturing. These tariff exclusions will help avoid supply disruptions, control costs, and support continued investment in advanced technologies in the United States.

In addition to these tariff exclusions, IPC encourages the Administration to extend additional exclusions for materials, chemicals, and equipment essential to the manufacturing of electronics systems.

The United States is a leader in technology design and, once again, can be a leader in electronics manufacturing, so long as economic and trade policies promote the investment that is sorely needed in the domestic industry. IPC remains committed to working with President Trump to build a stronger, more resilient electronics industry.

Wired for Change: Electronics Industry Sentiment on Sustainability

Member Download (pdf)

In January 2025, IPC International, Inc., the global electronics association, conducted an industry-wide sentiment survey to assess the state of sustainability efforts. Responses came from a range of sub-industries, geographies, and company sizes, reflecting a broad industry perspective.
Key Findings
• Growing Sustainability Momentum – 59% of respondents expect their companies to increase sustainability efforts in 2025. Printed circuit board (PCB) and contract manufacturers anticipate the most growth.
• Sustainability as a Competitive Advantage – Regulatory compliance is a key driver for 66% of respondents, but companies are also motivated by efficiency gains (58%), technological advancements (56%), and long-term competitive positioning (55%).
• Implementation Challenges – Budget constraints, regulatory complexity, and limited expertise are the top three barriers to sustainability.
• Industry Collaboration Key – Respondents emphasized the need for greater industry-wide interaction, sharing of best practices, and access to resources to navigate sustainability challenges.
IPC supports the industry to take advantage of opportunities and overcome challenges identified in the survey through its sustainability program Evolve. Through Evolve, IPC brings together experts, ideas, and solutions from across the industry to drive progress toward a more sustainable future. Further tools and resources will be added in 2025 that will empower the industry to address financial and non-financial impact assessments, greenhouse gas reporting, safer and more sustainable chemical alternatives, and circularity for electronics.

Author(s)
Dr. John W. Mitchell
Resource Type
Technical Paper
Event
White Paper

NAVIGATING E-MOBILITY SUSTAINABILITY: EVOLVING COMPLIANCE AND ESG REQUIREMENTS FOR ELECTRONICS SUPPLIERS

Member Download (pdf)

This two-part paper will explore how electronics suppliers within the e-mobility transportation sectors can address the exploding sustainability requirements. Part 1 contains background about regulatory drivers that led to the creation of an automotive specific database for the entire supply chain to report material content. This reporting system has evolved over time to encompass multiple Environmental, Social, and Governance (ESG) topics with a comprehensive, harmonized set of requirements. We’ll detail these current topics’ data structure needs and connectivity to existing electronics material compliance. In Part II of this paper, we cover current and expected future regulatory efforts and automotive industry approaches to managing overall supply chain compliance, such as their focus on CarbonNet0 metrics as a measure. The focus will shift toward providing actionable recommendations for electronics suppliers aiming to meet the evolving demands of the automotive industry’s environmental compliance requirements. These recommendations will cover best practices in regulatory compliance, supply chain management, and product redesign, as well as strategies for building stronger partnerships with automotive OEMs to ensure smoother transitions toward future regulatory frameworks. The goal is to help electronics suppliers not only stay ahead of regulatory trends but also leverage sustainability initiatives as a competitive advantage.

Author(s)
Brenda B. Baney, BCubed Consulting, Inc.
Resource Type
Technical Paper
Event
White Paper