Global Electronics Association Appoints Martin Scaglione as COO to Drive Strategic Execution Across Standards, Education, and Technology

The Global Electronics Association today announced that Martin Scaglione has joined the organization as Chief Operating Officer (COO).

As COO, Scaglione is responsible for strategic execution and P&L management across the Association’s core business units — Standards, Education, and Technology — providing product and program leadership to ensure exceptional member value while driving operational excellence in partnership with the CEO, leadership team, and Board of Directors.

Scaglione is a global enterprise executive and operator with extensive experience leading complex organizations through growth, transformation, and operational reinvention across sectors including manufacturing, electronics, workforce, EdTech, SaaS, and nonprofits. He has served as COO, President & COO, CEO, founder, and enterprise P&L owner, with accountability for results at scale.

“Martin brings the rare combination of enterprise discipline, entrepreneurial drive, and mission alignment that will help us scale our benefits to members globally,” said John W. Mitchell, Global Electronics Association president and CEO. “He has repeatedly demonstrated the ability to translate strategy into execution, modernize operating models, and build high-performing teams. As we continue expanding our standards leadership, education portfolio, and technology initiatives, Martin’s experience will be instrumental in strengthening how we serve our members.”

Scaglione most recently served as Chief Mission Officer at Goodwill Industries International, where he directed mission strategy and operations across more than 700 Opportunity Centers and 4,300 retail locations. He managed a $54 million P&L and $325 million in public and private grants, launched national accelerator programs, and built partnerships with major employers including Walmart, Google, Microsoft, and Accenture.

Previously, Scaglione served as President & COO of ACT, where he led a $175 million enterprise and helped build the nation’s leading workforce credentialing platforms. He also served as COO of North America for Bosch Siemens Household Appliances, overseeing manufacturing, supply chain, and commercial operations within a global, electronics-driven organization.

In addition, Scaglione co-founded venture-backed EdTech platform Viridis Learning, leading the company from concept to commercialization and investor exit. 

Scaglione holds a Master of Arts in Public Policy & Administration from Northwestern University and a Bachelor of Science in Management from Drake University.

APEX EXPO 2026, Flagship Event for the Global Electronics Association, Showcases the Future of Advanced Electronic Packaging

First APEX EXPO following IPC’s transition to the Global Electronics Association features expanded technical program, industry-leading keynotes, and the largest electronics manufacturing show floor in North America

APEX EXPO 2026 will mark a defining moment for the global electronics industry as the first APEX EXPO since IPC’s rebrand as the Global Electronics Association, underscoring the organization’s expanded mission as the voice of the worldwide $6 trillion electronics industry.

The conference’s technical program has evolved significantly for 2026, debuting as the Advanced Electronic Packaging Conference 2026. The reimagined program reflects the industry’s accelerating shift toward end-to-end, component-to-system-level integration, linking materials, interconnects, architectures, and finished systems. More than 80 peer-reviewed technical papers across 25 sessions will deliver practical, real-world insights focused on performance, reliability, and leading-edge research across the electronics ecosystem.

“APEX EXPO 2026 reflects how rapidly our industry is evolving, from discrete manufacturing steps to fully integrated electronic systems,” said John W. Mitchell, Global Electronics Association president and CEO. “This year’s conference brings together the people, technologies, and ideas that are defining the future of electronics, and it does so at a scale and depth that’s unmatched anywhere in North America.”

The conference kicks off Monday, March 16 with two keynote presentations that set the technical and strategic direction for the week:

 

  • Dr. David Lokken-Toyli, IBM, will explore how packaging and SMT enable next-generation compute platforms, from heterogeneous integration to quantum systems. 

  • Dr. Ravi Mahajan, Intel, will follow with insights on advanced packaging as a critical enabler for interconnect scaling and industry–academia collaboration. 

On Thursday, two special sessions will spotlight sector-specific requirements driving advanced packaging innovation: Advanced Electronic Packaging for Aerospace & Defense Electronics and The Future of EV and Automotive Electronics. These sessions will examine how packaging technologies are engineered to meet extreme reliability, long product life cycles, and demanding thermal and environmental conditions. The 2026 program also features technical contributions from industry leaders including AMD, Collins Aerospace, Hyundai Mobis, IBM, Intel, Lenovo, Qualcomm, Raytheon Technologies Corporation, Robert Bosch GmbH, The Aerospace Corporation, and Toyota Motor Corporation.

Added Mitchell, “Together, the enhanced technical program, expanded show floor, and new on-site experiences make APEX EXPO 2026 the most comprehensive and integration-focused event in the conference’s history.”

The APEX EXPO show floor continues to expand as the largest electronics manufacturing event in North America, with hundreds of exhibitors showcasing next-generation equipment, materials, assembly, and test solutions. New for 2026 is the Design Village and Technology Pavilion, highlighting advances in design and simulation from advanced packaging through system-level integration. By popular demand, the Learning Lounge returns, offering expanded opportunities for practical education, expert-led discussions, and high-value networking.

Registration is now open. Learn more at www.apexexpo.org.

 

The Global Electronics Association and ISC3 Announce Strategic Partnership to Advance Circular and Sustainable Electronics

The Global Electronics Association Europe and the International Sustainable Chemistry Collaborative Centre (ISC3) announced a new strategic partnership today, which aims to accelerate innovation and collaboration to address circularity and sustainability challenges across the global electronics value chain.

The partnership will launch with a free, half-day, in-person workshop (registration is mandatory), Advancing Circular and Sustainable Electronics, on 24 April 2026, at the Tangla Hotel in Brussels, bringing together global electronics industry stakeholders to identify practical solutions that advance sustainable and circular electronics. The workshop will convene industry experts with diverse expertise, researchers and developers, policy thought leaders, and environmental, health, and safety (EHS) specialists for facilitated, solution-oriented discussions and information exchange towards increased collaboration.

“This partnership with ISC3 reflects our shared commitment to moving sustainability for electronics from theoretical discussion to practical implementation,” said Dr. Diana Radovan, director of sustainability policy, Global Electronics Association. “By convening diverse stakeholders across the electronics ecosystem, we can deliver scalable, real-world solutions for the industry we serve, particularly in design, including materials innovation, smart sustainability policy development, and circularity.”

Workshop participants will collaborate on key drivers shaping the future of sustainable electronics, including:

  • Current trends in technological solutions
  • Sustainability policies and regulatory developments
  • Research and development opportunities, with focus on innovation
  • Interlinkages of Sustainable Electronics and Sustainable Chemistry

Insights from the workshop will inform ongoing joint efforts by ISC3 and the Global Electronics Association to foster long-term collaboration across the electronics value chain — from research and development projects to emerging start-ups and established global players.

“In a competitive landscape where circularity is shifting from an optional requirement to a mandatory one for businesses in the EU, the United States, and other major markets worldwide, partnering with the Global Electronics Association — including through its Evolve program — allows us to align sustainability policy insights, technical expertise, and industry leadership. Electronics are essential to modern society, but they also present complex sustainability and chemicals management challenges. That is why electronics are one of our key focus areas, with many activities planned for 2026,” said Dr. Thomas Wanner, managing director of ISC3. 

“Through our cooperation with the Global Electronics Association Europe, we aim to drive innovation in Sustainable Chemistry and Circular Economy, enabling safe, clean, recyclable, and socially responsible electronic products and value chains.” 

The workshop will take place alongside the Enhesa/Chemical Watch hybrid event, “Chemicals Management for Electronics” held on 23 April 2026. Co-locating the workshop with this event is intended to enhance dialogue, networking, and impact, by connecting regulatory perspectives with innovation and industry-driven solutions for the electronics industry. Members of the Global Electronics Association can receive a 15% registration discount for Chemicals Management for Electronics by using GEA15 when registering.

For further information, contact Dr. Radovan, at DianaRadovan@electronics.org and Romina Laumann, at Romina.Laumann@isc3.org.

IEMI 2026 Delivers Strategic Outcomes for India’s Electronics Manufacturing Ecosystem

The Integrated Electronics Manufacturing & Interconnections (IEMI) 2026, the flagship industry platform of the Global Electronics Association, concluded on January 29–30, 2026, at Hotel Taj Yeshwantpur, Bengaluru, delivering tangible outcomes aligned with India’s electronics manufacturing, defence, and global supply-chain ambitions.

The two-day conference brought together over 1,800 business delegates from India and more than 100 international participants from Southeast Asia, Japan, the Middle East & Africa, Europe, the UK, and the USA, reinforcing India’s growing role as a trusted partner in the global electronics manufacturing ecosystem.

At IEMI 2026, the Global Electronics Association and the Directorate General of Quality Assurance (DGQA) signed a Memorandum of Understanding (MoU), marking a strategic step toward strengthening India’s defence and aerospace electronics ecosystem. This collaboration supports the alignment of JSS standards in tune with global requirements and strengthens coordination among experts and key stakeholders by providing a collaborative platform to work towards the national mission of Atmanirbhar Bharat. 

The Consumer Electronics & Mobile Manufacturing Survey Report was unveiled at IEMI 2026, capturing critical industry insights into the challenges of enhancing quality in the manufacturing processes of mobile and consumer electronics, with a strong focus on global competitiveness and export readiness. Published by the Global Electronics Association, with the support of the India Cellular & Electronics Association (ICEA) and ecosystem partners, and surveyed by Feedback Advisory, the report presents evidence-based recommendations to strengthen process discipline, elevate manufacturing quality, and align India’s electronics production with global standards.

Trade development was a central focus of IEMI 2026, with over 100 international delegates engaging directly with Indian manufacturers through structured B2B matchmaking and curated business interactions. In parallel, the conference featured focused forums across consumer electronics, EV, defence and aerospace, and supply chain resilience, facilitating conversations around sourcing partnerships, supplier qualification, and market access. 

Community building remained a core pillar of IEMI 2026, bringing together OEMs, EMS providers, PCB manufacturers, wire harness specialists, semiconductor companies, equipment suppliers, standards experts, and policymakers under one platform. A key highlight was the Global Wire Harness Championship, which showcased excellence in workmanship, precision, and process discipline aligned with global manufacturing benchmarks.

  • Winner: Mr. Siddaraju, Cyient DLM Limited (India)

  • Runner-Up: Ms. Sawinee Wongmart, Satys Electric (Thailand)

  • Consolation Prize: Mr. Amit Kumar from Vista Consoles Electronics Private Limited (India)

The event also featured the Member Awards Program, recognizing member companies, volunteers, Certified IPC Trainers (CITs), and partners for their contributions to standards adoption, workforce development, and ecosystem advancement.

“IEMI 2026 demonstrated how India’s electronics manufacturing ecosystem is maturing into a globally competitive platform. The emphasis on collaboration, standards alignment, and workforce readiness positions India not just as a manufacturing base, but as a long-term value creator in the global electronics industry,” said Dr. John W. Mitchell, President and CEO, Global Electronics Association.

With its strong post-show outcomes, IEMI 2026 has reinforced its role as a catalyst for collaboration, trade development, and quality-led growth, supporting India’s long-term position in the global electronics industry.