Using Technology to Increase Throughput and Reduce Errors in Wire Harness Production

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This technical webinar, held on June 27, 2023, explored technologies that help wire harness assemblers reduce errors and improve efficiency. Topics included guided insertion of seal plugs and wires, partial harness testing, rapid continuity checks, and troubleshooting. The session also introduced PinMate, an optically guided insertion tool that projects target cavities to prevent mis-wires. Real-world results from an aerospace wire shop were shared, demonstrating how in-process testing and visual guidance can boost quality and productivity in manual assembly.

Author(s)
Brent Stringham
Resource Type
Webinar
Event
Webinar

Voids in Solder Joints and Their Impact on Assembly Reliability

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This informative webinar, held on May 3, 2023, explained the significance of measuring both voiding and coverage of solder joints. The session explored the data behind IPC J-STD-001HA/-A-610HA that supports reliability concerns and highlighted the importance of understanding the distinction between coverage and voiding. It also touched on areas of the industry where these measurements are being adopted and implemented. Attendees gained valuable insights into this critical aspect of electronics manufacturing.

Author(s)
Norbert Holle, PhD
Resource Type
Webinar
Event
Webinar

CCA SMT Cleaning Processes and Solder-flux Effects For Mil/Aero Applications

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Held on April 18, 2023, this webinar explored how surface mount component and package design can impact the effectiveness of cleaning circuit card assemblies (CCAs), especially for Mil/Aero applications requiring conformal coating. The session introduced “Design for Rinse-Ability” guidelines based on observed residue entrapment and internal component degradation. It also presented findings from an evaluation of solder pastes, highlighting how alternative formulations can significantly reduce flux buildup in cleaning systems and improve long-term reliability and maintenance efficiency.

Author(s)
Norman Armendariz, PhD
Resource Type
Webinar
Event
Webinar

HDI and Ultra HDI - Critical aspects needed to support IC substrates and Advanced Packaging

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The webinar, presented by Mike Carano on March 29, 2023, delved into the essential considerations for implementing High-Density Interconnect (HDI) and Ultra HDI technologies in the context of integrated circuit (IC) substrates and advanced packaging. The session explored key factors such as material selection, process optimization, and reliability challenges that are pivotal for the successful adoption of these technologies in modern electronics manufacturing.

Author(s)
Mike Carano
Resource Type
Webinar
Event
Webinar

Introduction to Machine Data Analytics in the EMS Industry

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This webinar, held on March 15, 2023, covered a brief introduction to the types of machine data available in an EMS factory and how to set up an analytics environment using freely available, open-source tools. Key topics included:

  • What kinds of data are present in factory equipment?
  • How much data exists in an EMS factory, and is it feasible to collect and store it all?
  • Examples of analytics that can be performed with PNP, AOI, and tester data
  • Important considerations when setting up a data collection system for analyzing machine data
Author(s)
Tim Burke PhD
Resource Type
Webinar
Event
Webinar

Electronic Textile Evaluation Methods for Product Engineers and Designers

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On December 14, 2022, Madison Maxey, founder and technical lead of Loomia, shared highlights of her IPC APEX EXPO 2023 professional development course. The course provided a primer for electrical and mechanical engineers—as well as product designers—on how to engage with electronic textiles for new product development. Attendees walked away with a clear understanding of when electronic textiles may be relevant to their engineering work, which types of technology are ideal for their applications, and how to thoroughly evaluate a technology once selected.

Author(s)
Madison Maxey
Resource Type
Webinar
Event
Webinar

Gold-Aluminum Wire Bonding Process, Quality and Reliability

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This webinar, held on December 7, 2022, previewed the IPC APEX EXPO 2023 professional development course, “Gold-Aluminum Wire Bonding Process, Quality and Reliability.” Dr. Syed Sajid Ahmad, Ph.D., reviewed the historical timeline of research in this area and summarized key findings, including the means and actions proposed and tested to alleviate the adverse effects of Kirkendall voiding. The session addressed questions such as: What promotes purple plague? How can its formation and growth be controlled? The webinar also covered observation and measurement methods, interface analysis techniques, and methods of failure analysis.
 

Author(s)
Syed Sajid Ahmad, Ph.D
Resource Type
Webinar
Event
Webinar

Harnessing Connections: EWPTE 2025 Draws Nearly 3,000 Attendees

The 2025 Electrical Wire Processing Technology Expo (EWPTE), held May 6-8 at Baird Center in Milwaukee, Wis., provided 2,994 attendees the opportunity to meet, network and learn from the industry leading innovators and suppliers. Two hundred and eighteen (218) exhibitors -- marking the largest number of exhibiting companies in the event’s history -- showcased their products and services spanning an expanded 51,500 net square feet of show floor space.

“EWPTE has been recognized as a top 100 fastest growing show in the United States and is in a spectacular venue and a great city. My own colleagues who attended said this year’s show was an incredible place to learn and in such a specific way that directly applies to what we do,” said Parker Garrett, president, EMSCO and WHMA Board chair. “From my interactions this year, so many attendees highlighted that EWPTE provided them the unique opportunity to come together to find solutions to challenging wire processing problems, though training and education as well as to network and do business with industry leaders and subject matter experts all under one roof.”

Highlights this year included seven professional development courses and 30 technical conference sessions that offered new technical data, practical skills and techniques, and insights from research and case studies; and a keynote from Brian Schneider, Harley Davidson Motor Company, on the company’s wire harness integration into their motorcycles.

Attendees were pleased with the hands-on product experiences the show provided. “I was able to find a new supplier for tough-to-find materials, helping out just-in-time production needs. I was also able to source equipment and compare vendor options that met my company’s specific needs, live in-person and demo vendor prototype products not yet available to the public,” said Bill Givney, director of engineering, Elite Vehicle Solutions.

The exhibitor experience at EWPTE 2025 was equally beneficial. “As an exhibiting company, we enjoyed the opportunity to collaborate closely with the IPC/WHMA team at this year’s show,” said Tom Leach, business development director, Stratasys. “On the show floor, we showcased our wire harness additive manufacturing solutions and presented various customer use cases. These efforts helped us establish valuable new contacts in the electrical applications sector. Overall, the show was a major success, and we are committed to returning next year. We look forward to working with the new customers we met at the event and solving their challenges with a new advanced manufacturing approach.”                                                              

In 2026, EWPTE will return to Baird Center for its 24th year, May 5-7. For more information, visit www.electricalwireshow.com.

IPC White Paper Maps the Regulatory Terrain for Electronics Suppliers in E-Mobility Sector

Electronics suppliers supporting the rapidly growing e-mobility sector are facing a dramatic escalation in environmental and social governance (ESG) compliance expectations. A new white paper from IPC’s e-Mobility Quality and Reliability Advisory Group provides a comprehensive overview of the evolving regulatory landscape and outlines the data infrastructure needed to stay ahead.

Titled Navigating E-Mobility Sustainability: Evolving Compliance and ESG Requirements for Electronics Suppliers – Part 1, the paper is authored by Brenda B. Baney of BCubed Consulting, Inc. and highlights “the increasing regulatory pressure for environmental compliance” across the automotive electronics supply chain.

The white paper traces key milestones from the European Union’s End-of-Life Vehicle (ELV) Directive through RoHS and REACH, showing how “automakers were compelled to not only adjust their manufacturing processes but also implement robust systems for tracking and reporting materials and substances used in their vehicles.”

The paper also documents how electronics suppliers have had to adapt. It notes that “suppliers, many of whom had not previously dealt with such detailed reporting requirements, faced challenges in transitioning to compliant processes,” especially in response to lead-free solder mandates and expanded SCIP database requirements.

In addition to regulatory context, the white paper dives into practical impacts, like the evolving use of the International Material Data System (IMDS) and IPC-1752 reporting systems, shifts in internal business functions, and the growing role of supply chain transparency and responsible sourcing frameworks like IPC-1755. These developments, the paper explains, are not just operational: they are “a natural part of the evolution of data systems.”

“The goal of this white paper is to help electronics suppliers not only stay ahead of regulatory trends but also leverage sustainability initiatives as a competitive advantage,” said Baney.

Part 2 of the series, which is coming soon, will provide actionable recommendations for electronics suppliers, including strategies for lifecycle carbon reporting, future-proofing compliance infrastructure, and deepening OEM collaboration to meet emerging sustainability mandates.

Download Part 1 of the white paper here: http://go.electronics.org/e-mobility-sustainabilitypart1.