Tuesday and Thursday 6:30 – 8:30 p.m.

Description:

From concept to creation, explore each stage of the semiconductor lifecycle — design, manufacturing, assembly, and testing.

Upon completing this immersive course, you will gain comprehensive insights into:

• The fundamental components of microelectronics and how they power today's technology.
• Key terms and cutting-edge technologies shaping the future of semiconductors.
• The interconnected nature of the semiconductor supply chain and its impact on global markets.
• The step-by-step journey of semiconductor chip development, from initial design to market delivery.
• An overview of the critical manufacturing, assembly, and testing processes that ensure quality and performance.
• Essential principles of failure analysis, enabling you to identify and resolve potential issues in chip functionality.

Tuesday and Thursday 11:00 – 1:00 p.m.

Description:

In this course, we will review the data produced by factory machines such as SMT and test equipment and how AI tools can be leveraged to assist with the analysis and interpretation of the data. The course is designed around practical, interactive learning experiences with an anonymized real-world dataset and freely available analysis and visualization tools.  AI agents and copilots will be directly created live in the course using UI tools to visually illustrate the concepts and show what is possible with current technologies.

Topics include:

• What is machine data
• How to collect and analyze machine data
• Visualizing and analyzing machine data using Grafana
• What are AI copilots and agents?
• Applications of AI technologies to analyzing machine data
• IPC-CFX standard

Tuesday and Thursday 11:00 – 1:00 p.m.

Description:

Module 2 will focus on production defects associated with bare PCB, PCB fabrication, and components – causes, remedies, and preventive measures. In this 4-hour course, you will learn and be updated on the following topics:

1. Premise
2. BGA solder ball drop
3. PBGA crack
4. BGA/CSP interposer heat damage
5. BGA/CSP co-planarity issue
6. Large BGA rework challenge
7. Ceramic capacitor damage
8. SOT issue
9. Tome stoning
10. 01001 component issue
11. PCB board sagging
12. PCB-related issues
13. PCB pad-cratering
14. PCB pad lifting
15. PCB bare board issues
16. Thermal damages
17. Concluding summary

NEPCON NAGOYA is the exhibition held in the center of the manufacturing industry of Japan. Nagoya is a capital city of Aichi prefecture which has Japan's largest automotive-related manufacturing industry cluster. IPC Japan will have its booth and have Japan regional final of IPC hand soldering competition 2024.

This face-to-face opportunity intends for regional task group members in Japan such as 7-31BV-JP and D-33AA-JP. With the guests from IPC Global, we discuss and make proposals to the original task group.

This annual seminar is held mainly for IPC members, regional TG participants and its standards users in Japan with the collaboration of IPC Asia. In the morning of the day, we have guest speakers from IPC global such as TG chair and liaison to update on IPC standards and activities for them. Following this, in the afternoon, Japan regional task group meeting(s) will be held.

This competition is for choosing the Japanese champion to dispatch the world final 2025 with the cooperation of Japan Unix Co., Ltd. Preliminary details (mid-July & August) will be announced around June in their website. And then, only who pass the preliminary is invited to the final at NEPCON NAGOYA (Oct. 29 - 31).

With the cooperation of Japan Unix Co., Ltd., guests from Japanese companies will give presentations focused on the use of IPC standards and its activities. This time, the chair (from Tokai Rika Co., Ltd.) and vice-chair (from Toyota Motor Corporation) of a Japan regional task group are invited to give a talk. This webinar will be provided in Japanese only, mainly with the aim of increasing the number of IPC users in Japan.

In recent years, economic security has become an extremely important theme in the electronics industries worldwide, and it's no exception for Japanese companies. As part of IPC's efforts to strengthen its activities in Japan, we have decided to hold quarterly roundtable discussions with Japanese companies to deepen the discussion on economic security in cooperation with Bower Group Asia (BGA). This is the first meeting, and we will have a guest from well-versed ex Diet members.

An exclusive annual event in Korea, aims to promote Korean electronics industry development and global cooperation. ()