Global Electronics Association Unveils Powerhouse Tech and Innovation Keynote Speakers for APEX EXPO 2026

Industry leaders share bold insights on the future of quantum computing, AI, and electronics innovation

(Updated 11/25/2025 to include new speaker)

The Global Electronics Association announces its APEX EXPO keynote lineup, featuring industry titans who will explore the frontiers of quantum computing, artificial intelligence, and the electrification of global industries. Taking place March 16-19, 2026, in Anaheim, Calif., APEX EXPO offers attendees visionary insights into the technologies shaping the future of electronics and beyond.

Computing at the Quantum Advantage Frontier
David Lokken-Toyli, Principal Research Scientist, IBM Quantum

As quantum computing moves closer to realizing real-world applications, David Lokken-Toyli will examine IBM Quantum’s roadmap toward large-scale, error-corrected quantum computers and the hardware advances enabling this evolution. 

He will share how component manufacturers can play a pivotal role in the emerging quantum supply chain, offering a forward-looking perspective on collaboration opportunities for the electronics industry.

“Quantum computing represents one of the most exciting frontiers in modern technology—and the electronics community will be central to realizing its full potential,” said Lokken-Toyli. “Our progress depends on innovation at every level of the hardware ecosystem.”

Advanced Packaging: A Crucial Enabler for Heterogeneous Integration 
Ravi Mahajan, Intel Fellow and Director of Assembly and Packaging Technology Pathfinding

Heterogeneous Integration (HI) is a powerful and crucial enabler for the continued growth of computing and communication performance.  Advanced packaging technologies are critical enablers of HI because of their importance as compact, power-efficient platforms. 

Interest in HI research has increased in recent years, which opens up greater opportunities for collaboration between academia and industry.  A broad-scope roadmap of the future, generated as part of an industry-academic collaboration, will be discussed in this context to highlight the opportunities enabled by HI, with a focus on interconnect scaling and associated future directions and challenges.  

This talk will focus on the tremendous opportunities in various application environments and explore the projected evolution of advanced packaging architectures.  
 

The Next Renaissance 
Zack Kass, Futurist, Founder of ZK.AI Advisory & Former Head of Go-to-Market at OpenAI

AI is driving a new era of human and technological transformation. In this thought-provoking keynote, Zack Kass explores the parallels between the historical Renaissance and today’s AI-driven revolution, revealing how artificial intelligence is reshaping industries, workforces, and the human experience itself.

Kass offers an optimistic view of AI’s potential for innovation, opportunity, and human advancement, while providing actionable strategies to help organizations harness its power responsibly and effectively.

“AI isn’t just changing the tools we use—it’s redefining what’s possible for humanity,” said Kass. “Leaders who embrace this transformation will be best positioned to shape the next great chapter of innovation.”
 

The Electronics Revolution: Powering Every Industry’s Future 
John W. Mitchell, President & CEO, Global Electronics Association

The $6 trillion global electronics industry powers innovation across nearly every sector, from AI and autonomous systems to precision agriculture, aerospace, and healthcare. 

Drawing on exclusive data and market intelligence, Mitchell will share bold predictions for the future, including the implications of AI, design advancements, and smart infrastructure. His keynote will deliver actionable insights for navigating supply chain complexity, fostering strategic interdependence, and seizing new growth opportunities.

“Our industry doesn’t just enable innovation—it drives the global economy,” said Mitchell. “To sustain that momentum, we must collaborate across borders and disciplines to strengthen our collective resilience and ensure long-term viability.”

To register for APEX EXPO and view full event details, visit APEXEXPO.org.


 

Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience

Global Electronics Association urges policymakers to protect North American trade and nearshoring gains as 30% tariffs approach key decision deadlines

As negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association today released a new policy brief, "From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing." The report warns that proposed 30% tariffs on electronics imports from Mexico would fracture North American supply chains, raise costs for U.S. manufacturers, and undermine efforts to reshore production and strengthen domestic competitiveness.

Authored by the Association’s Chief Economist, Shawn Dubravac, and the Industry Intelligence team, the report concludes that Mexico has developed into a full-fledged production hub within the North American ecosystem, drawing on a diversified global network of suppliers Data shows that Mexico’s imports from China have declined significantly since 2017, with sourcing shifting to Vietnam, South Korea, Taiwan, and the European Union

“Electronics manufacturing today depends on cross-border collaboration,” said Lorena Villanueva, director of the Global Electronics Association’s Mexico office. “Mexico has become an essential partner in strengthening North American manufacturing. Our supply chains are not competitors; they are collaborators. Policies that recognize this partnership will ensure both nations remain competitive in a rapidly changing global market.”

The Association emphasized that maintaining a strong trade partnership with Mexico is a top priority for manufacturers on both sides of the border. Many of its members report that U.S.–Mexico trade is their single most important policy issue.

The release of the report comes at a critical moment: the current extension for U.S.–Mexico trade negotiations expires on October 29, and the Office of the United States Trade Representative (USTR) is accepting public comments on the United States–Mexico–Canada Agreement (USMCA) through November 3. The Global Electronics Association will submit formal comments on behalf of the industry and plans to testify at the USTR’s public hearing on November 17.

“U.S.–Mexico trade isn’t just important—it’s indispensable to a resilient North American electronics ecosystem,” said Chris Mitchell, vice president of global government relations at the Global Electronics Association. “Boosting U.S. manufacturing and supporting Mexico’s industrial growth are two sides of the same coin.”

The report underscores that many electronics systems and components cross the U.S.–Mexico border multiple times before final assembly, reflecting deeply integrated supply chains that support competitiveness, jobs, and security across the region. Disrupting these flows with tariffs would drive up costs, slow delivery times, and threaten the survival of small and medium-sized manufacturers.

The Association urges policymakers to finalize a bilateral trade agreement that preserves tariff-free access, strengthens enforcement, and reinforces Mexico’s role as a co-builder of North American manufacturing resilience.

“Mexico’s manufacturing evolution is one of the clearest examples of nearshoring success,” the report concludes. “Protecting that progress is essential to the region’s economic stability and to building truly resilient supply chains.”

The full report, "From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing," is available for download at https://go.electronics.org/-mexico-policy-brief.
 

Setting the Standards for AI-Era Packaging: Key Takeaways from IMPACT 2025

Oct 23, 2025

October 2025 — Taipei

Key Summary

• IMPACT 2025 focused on packaging innovations that enable energy efficient AI from cloud to edge.
• Experts from AMD, ASE, Kinsus, and Wistron examined how packaging supports system level integration.
• Presenters highlighted the need for updated and new guidelines and standards across materials, substrates, PCBs, design, assembly, and reliability.
• Packaging is shifting from a supporting role to a driver of AI system performance.
• The Global Electronics Association is collaborating with industry to build a shared standards framework for advanced packaging.
• The future of AI hardware depends on harmonized standards that enable seamless integration across the supply chain.

At IMPACT 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, discussions on component-to-system-level integration took center stage. Co-organized and supported by the Global Electronics Association, the event brought global industry leaders together to explore how packaging innovations are shaping the AI era. A special session, titled "Component to System-Level Integration," gathered experts from AMD, ASE, Kinsus, and Wistron to examine how packaging technologies are evolving to meet the growing complexity of AI systems—and why developing shared guidelines and standards has become a pressing priority.

This year’s conference theme, “Energy-Efficient AI: From Cloud to Edge,” reflects how the hardware behind AI is changing. As systems move toward a hybrid cloud-edge model, with edge computing taking on tasks such as real-time processing and inference, the challenge lies in creating high-performance, low-power solutions that can scale across diverse applications.

Semiconductor packaging, once seen primarily as a manufacturing step, has become a critical enabler of system integration and miniaturization. Integrating multiple chips and functions into compact, power-efficient packages and modules for high-performance computing, communication, and power applications demands a coordinated approach across the supply chain. That coordination, however, depends on a shared set of guidelines and standards that are still evolving.

The Component to System-Level Integration session, organized and chaired by the Global Electronics Association, was led by Devan Iyer, the Association’s Chief Strategist for Advanced Electronic Packaging. With more than 35 years of experience spanning Texas Instruments, Amkor, and Infineon Technologies, Iyer opened the discussion by emphasizing that electronic packaging acts as a key enabler at both the component and system levels—and highlighted critical gaps in today’s guidelines and standards.

The presentations underscored the needs, trends, and challenges shaping the future of packaging, as well as possible paths forward. Speakers discussed the need to update existing standards and develop new ones in the context of emerging technologies, covering materials, substrates, and PCBs through design, assembly, and reliability at both the component and system levels. 

Highlights included:

  • Raja Swaminathan (AMD) — discussed system-level architecture and its role in next-generation AI performance.
  • C.P. Hung (ASE R&D Center) — explored heterogeneous integration in data center applications.
  • Dennis Lin (Kinsus) — examined substrate and PCB innovations for chiplet packaging.
  • Ander Hsieh (Wistron) — shared strategies to improve large BGA assembly reliability.

Iyer summed up the issue succinctly: “As AI applications grow explosively, packaging technology has evolved from a supporting role to a critical driver of system performance. However, there are opportunities to update existing standards and develop new guidelines and standards at the component, module, and system levels.”

As one of the co-organizers of IMPACT 2025, the Global Electronics Association continues to play a pivotal role in driving the global conversation around advanced electronic packaging. The Association is collaborating with manufacturers, designers, and technology suppliers to define a standardized framework for packaging innovation. The goal goes beyond compliance—it’s about establishing a common technical language that enables efficient collaboration, shortens development cycles, and reduces duplication across the supply chain.

Through these efforts, the Association helps advance new technologies while maintaining the integrity of the global electronics supply chain. By providing data-driven insights and guidance, it supports informed decisions that enhance the quality, reliability, and consistency of electronic products worldwide.

The conversations at IMPACT 2025 underscored a broader industry shift: advanced electronic packaging is now central to how AI hardware evolves, and the pace of that evolution will depend on how quickly the industry aligns on common standards. By fostering open technical exchange and harmonization, industry groups and technology leaders are laying the foundation for a more connected and agile global supply chain.

As the conference continues alongside the TPCA Show (October 22–24), one message stands out: the next leap in AI performance won’t come from a single innovation—it will come from shared standards that make seamless integration possible at every level of the system.

Q:
Why was packaging a central theme at IMPACT 2025?
A:

Packaging has become a critical enabler of AI performance, system integration, and power efficiency as the industry moves toward hybrid cloud edge architectures.
 

Q:
What challenges are emerging in system level electronic packaging?
A:

Rapidly increasing complexity has created gaps in existing guidelines and standards, especially in materials, substrates, PCBs, design, assembly, and reliability.
 

Q:
Why are new standards needed for AI era packaging technologies?
A:

Evolving architectures such as chiplets, heterogeneous integration, and advanced substrates require updated rules to ensure consistency, collaboration, and performance.
 

Q:
How is Global Electronics Association contributing to packaging standards?
A:

The Association is organizing industry dialogue, identifying gaps, and working with manufacturers and designers to establish a common technical framework.
 

Evolve Moves the Needle at NY Climate Week

Oct 14, 2025
| By Kelly Scanlon

By Kelly Scanlon, lead sustainability strategist, Global Electronics Association

Key Summary

• Evolve, the Global Electronics Association’s sustainability initiative, marked its first Climate Week NYC appearance, highlighting circularity in electronics manufacturing.
• The panel “At Power On: Climate and Circularity in Electronics” brought together leaders from Jabil, Flex, Panasonic, and the Association to discuss challenges, early lessons, and real innovations.
• Discussions emphasized key barriers such as data quality, scalability, tariffs, and geopolitical tensions, and reinforced that progress requires collaboration and cross functional partnership.
• A central message was that real sustainability change must come from designers, builders, and workers closest to the products, not just top leaders.
• Evolve’s participation strengthened conversations, awareness, and momentum toward making electronics more repairable, recyclable, and sustainable.

Evolve, the Global Electronics Association’s Sustainability initiative, made an impact and crossed a milestone with its first-ever event at Climate Week NYC. I joined an incredible program that highlights circularity in electronics manufacturing, demonstrating our sector’s growing commitment to overcoming barriers and fostering a more sustainable future.

The electronics industry is at a critical juncture in terms of sustainability, and circularity is one of the key areas where we can make the most significant impact. I was honored to participate in the panel “At Power On: Climate and Circularity in Electronics,” alongside other sustainability leaders from Jabil, Flex, and Panasonic. Together, we explored how to:

  • Tackle the toughest challenges to scaling circularity
  • Learn from early adopters
  • Showcase real-world innovations making electronics more sustainable

Our discussion acknowledged the numerous barriers to circularity, including the need for high-quality data, scalability, tariffs, and geopolitical tensions, among others. What really stood out was our shared understanding that no single organization can solve these issues on its own. Progress depends on partnership, education, storytelling, and transparency.

For me, this panel helped move the conversation forward in a meaningful way. Sharing information and raising awareness are necessary, and collaboration is critical. We’re moving beyond the “low-hanging fruit” and into the complex problem-solving that sustainability demands. These are not challenges that can be solved in isolation; they require cross-functional teamwork and more open discussions like the one we had in New York.

One of my strongest convictions is that the people who design, build, and work directly on products will be the ones to drive true change. Sustainability solutions won’t come just from the top; they’ll come from those in the trenches who know the products inside and out.

 We face a choice as demand for electronics grows: reduce quantity or improve quality. I believe in the latter. We must focus on recycling, repurposing, repairing, and making better products. Our goal should be to create electronics that contribute positively to solving global challenges, rather than adding to them.

Attending Climate Week reinforced for me just how important communication is. When dealing with complex products, intricate supply chains, and diverse global players, conversations can become tangled. Many people are already doing the right things, yet they often fail to communicate those efforts effectively. Measurement is difficult, and data can be unclear.

That’s why our participation in Climate Week was so valuable. It provided Evolve with the platform to initiate more in-depth discussions and connect with others working toward the same goals. We left energized, informed, and ready to continue working together to make electronics more sustainable.

For a deeper dive into the Evolve program, visit: Evolve | electronics.org

NYCW 2025

 

Q:
What was the purpose of Evolve’s participation at Climate Week NYC?
A:

Evolve joined Climate Week to elevate conversations about circularity in electronics manufacturing and showcase the industry’s growing commitment to sustainability.
 

Q:
What topics were discussed during the panel session?
A:

The panel explored scaling circularity, learning from early adopters, and highlighting real world innovations that support more sustainable electronics.
 

Q:
What barriers to circularity were identified by panelists?
A:

Participants pointed to challenges including data quality, scalability, tariffs, and geopolitical pressures, all of which complicate progress.
 

Q:
Why is collaboration emphasized as essential for sustainability?
A:

Panelists agreed that no single organization can address circularity challenges alone. Effective progress depends on shared knowledge, partnership, and transparency.
 

Q:
What key message did Evolve share about driving sustainability?
A:

Evolve emphasized that meaningful sustainability improvements come from designers, builders, and workers who understand products deeply and can influence how they are made, repaired, and reused.

Global Electronics Association Statement: JURI Omnibus Position on Sustainability Reporting and Due Diligence

Oct 14, 2025

by Diana Radovan, Director, Sustainability Policy, Global Electronics Association

 

Key Summary

• The Global Electronics Association welcomes JURI’s adoption of the omnibus package position on sustainability reporting and due diligence.
• The position moves in a positive direction for electronics, especially the voluntary approach to sector specific standards and removal of EU civil liability.
• Timely adoption enables trialogue negotiations to begin at the end of October, supporting regulatory certainty and investment stability.
• The Association will continue advocating for simplified, effective rules that deliver real environmental and social impact rather than box ticking.

 

The Global Electronics Association welcomes the timely adoption (13 October) of the position on the omnibus package for sustainability reporting and due diligence by the European Parliament’s Legal Affairs Commitee (JURI). Overall, we think that this position is going in the right direction for electronics. We welcome the voluntary approach to sector-specific standards and the removal of EU civil liability. 

 

The timely adoption allows trialogue negotiations to start as planned, at the end of October. Regulatory certainty -- including a timely implementation of omnibus requirements by Member States -- is needed to ensure business continuity and investment certainty. 

 

The Global Electronics Association will continue to advocate for a simplification that is effective and useful for businesses and for achieving environmental and social objectives that aren’t just a box-ticking exercise but have a real impact. 

 

For more information, contact me at DianaRadovan@electronics.org. 

 

Q:
What did the JURI Committee adopt that affects the electronics sector?
A:

The Committee adopted its position on the omnibus package for sustainability reporting and due diligence, including elements relevant to electronics companies.
 

Q:
Why is the Global Electronics Association supportive of this position?
A:

The position takes a positive direction for electronics by keeping sector specific standards voluntary and removing EU civil liability.
 

Q:
How does this adoption affect the legislative timeline?
A:

It allows trialogue negotiations to begin at the end of October as planned, helping maintain regulatory momentum.
 

Q:
Why is timely implementation important for industry?
A:

Clear and predictable rules support business continuity, planning, and long-term investment certainty.
 

Q:
What will the Global Electronics Association focus on next?
A:

Global Electronics Association will continue advocating for simplified, practical requirements that genuinely advance environmental and social goals.

Electronics U Expands Global Workforce Training for the Electronics Industry

New Engineering Pro subscription delivers advanced technical training and professional development for engineers worldwide

Bannockburn, IL – October 14, 2025 – The Global Electronics Association today unveiled Electronics U, the new name and expanded vision for its workforce training and certification platform. Formerly known as IPC EDGE, Electronics U marks the Association’s bold step toward a global workforce development hub that empowers companies to thrive during rapid technological change.  

Electronics U delivers accessible, job-ready learning developed by industry experts and volunteers to address real-world challenges. From foundational courses for operators and technicians to advanced pathways for design and process engineers, the platform equips learners with the skills to drive innovation and sustain competitiveness.

“With the launch of Electronics U, the Global Electronics Association builds on more than 50 years of leadership in electronics training and certification,” said David Hernandez, vice president of education at the Global Electronics Association. “This new platform will shape the workforce of tomorrow, empowering professionals to sharpen their skills and advance their careers while enabling companies to strengthen their teams at scale.”

As part of this next chapter, the platform is launching the Engineering Pro subscription. This curated, scalable solution helps design, test, and process engineers access advanced technical training, professional development resources, and the specialized tools needed to keep pace with rapidly changing technologies.

Electronics U offers a growing range of programs designed to power the next generation of electronics talent, including:  

  • Apprenticeships and workforce pipeline programs tailored to regional industry needs.
  • Online instructor-led training that enables professionals to learn from subject-matter experts around the world.
  • Subscription-based learning paths, such as the new Engineering Pro program, featuring curated, role-specific resources for engineers and technicians.  
  • Multilingual courses, STEM kits for early learners, and flexible learning models that support professionals across the globe.

For learners, the benefits of Electronics U extend beyond technical skills. Graduates earn globally recognized certifications, greater employability, and long-term career stability. By increasing workforce capability, employers achieve measurable gains in quality and efficiency, providing a sustained competitive edge in a rapidly evolving industry.

 

Amsterdam Sets the Stage for Sustainability: Highlights from Sustainability Week Europe 2025

Oct 10, 2025

By Diana Radovan, Sustainability Policy Director, Global Electronics Association

Key Summary

• Sustainability Week Europe 2025 highlighted shared challenges across diverse sectors, emphasizing collaboration over polarization.
• Speakers stressed that circularity succeeds only when supported by systems thinking, scalable processes, and clearer business-focused terminology.
• A major theme was reframing sustainability as a business proposition, not just a moral one, especially amid regulatory complexity and competitiveness pressures.
• Participants called for smarter, more practical regulations and stronger alignment between sustainability goals and business outcomes.
• The event underscored the urgency of action to support Europe’s digital and green transition.

Diverse sectors came together in Amsterdam on Oct 6-7 to discuss hot topics around sustainability, at the intersection of regulation, strategy, and competitiveness. Despite the diversity of industries and stakeholders present in the room (AI startups, investors, electronics, clean energy, fashion, pharmaceuticals, philanthropies, etc.), sustainability challenges and opportunities shared a similar vocabulary, and it was easy to find common ground and learn from each other’s experiences. Following the interesting roundtable discussions at the Chief Sustainability Officers (CSO) club on Monday, October 6, plenary panels, interviews, and networking sessions took place the next day, including a talk by and a conversation with the Mayor of Amsterdam, Femke Halsema. 

My key takeaways from the event can be grouped into three main areas: 

Focus on collaboration and real impact

We cannot afford to quarrel over symbolic issues, we need to be pragmatic, by addressing the things that really matter, and avoid polarised speech. We have to work together in Europe and internationally

Circularity strategy and terminology

Circularity works if appropriate systems are put in place from the very beginning. In this context, systems thinking is key. Circularity fails in a linear world. Efficiency and scale up are possible if approached with a sustainability mindset. More secondary raw materials are necessary in the products we are building. In addition, those of us who are sustainability professionals may need to refine our terminology when pitching our circularity business case to CEOs, because ‘circularity’ does not necessarily sound like business growth: circularity can be seen and framed as an important business opportunity, involving less waste and less resources. 

Sustainability as a business proposition

Nowadays, in light of competitiveness challenges and geopolitical movements, sustainability professionals need to build a business case, not only a moral case, in their organizations, in order to be effective in their efforts. Many participants were of the opinion that smart regulations can be an opportunity for businesses to measure risks and build a better business. Nonetheless, sustainability isn’t always driven by regulation and sustainability regulations don’t always mean more sustainability, sometimes they just mean more reporting. Sustainability regulations often remain, however, impractical and fragmented, and more needs to be done on the path towards their improvement, which is what we, at the Global Electronics Association, continue to advocate for. 

Panelists and participants may have had, at times, different perspectives in their approach to sustainability and reaching sustainability goals, but ultimately, what I heard at this event was a very pragmatic call-to-action, and moving away from older, idealistic views on sustainability. We cannot be sustainable and support the digital and green transition if we ignore the high regulatory reporting burden and the acute need to link sustainability efforts to business outcomes. 

We need to act now, not later. 

To learn more about the event, contact me at DianaRadovan@electronics.org. 

 

Q:
What was the main theme of Sustainability Week Europe 2025?
A:

The event focused on pragmatic sustainability—collaboration, impact-driven strategies, and aligning environmental goals with real business outcomes.
 

Q:
Why was circularity a major focus?
A:

Panelists emphasized that circularity only works when supported by systems thinking, early design planning, and scalable infrastructure, enabling companies to reduce waste and resource use.
 

Q:
How is sustainability being reframed for businesses?
A:

Leaders stressed the need to present sustainability as a business opportunity by linking it to competitiveness, risk management, efficiency, and long-term value creation.
 

Q:
What challenges do companies face with sustainability regulation?
A:

Many regulations are fragmented or overly focused on reporting, making them difficult to implement; participants called for smarter, more practical policy design.
 

Q:
What was the overarching message from the event?
A:

A clear call to act now—companies must move beyond idealistic concepts and integrate sustainability into business strategy to support Europe’s green and digital transition.

Circularity Policies for Electronics – Where are we now?

Date
-

This webinar, co-hosted by the Global Electronics Association and Anthesis Group, will offer an update on the current state-of-play on emerging circularity policies for electronics to interested stakeholders, from an advocacy, compliance, and standards development perspective. 

Topics covered:

  •  Shifting sustainability policy and geopolitics landscape: impact on emerging circularity policies
  • Ecodesign for Sustainability Products Regulation (ESPR) and Extended Producer Responsibility (EPR) compliance requirements, including impact on EU and US companies
  • Global Electronics Association advocacy work related to emerging circularity policies (Circular Economy Act consultation and removal of substance of concern from ESPR)
  • Sustainability standards development, with focus on circularity standards
  • Discussion and concluding remarks: What can we expect in 2026?

Presenters:

Industry Intelligence Insights October 2025

Oct 08, 2025
| By Thiago Guimaraes

Key Summary

• The Fed cut rates by 25 basis points while inflation remains above target, signaling a slow path back to 2 percent.
• U.S. labor markets cooled further with weak manufacturing hiring and mixed demand indicators.
• Europe’s manufacturing PMI dipped into contraction and the ECB held rates steady as industrial output showed modest improvement.
• China posted mixed PMI results but strong industrial profit growth, supported by targeted financing.
• North American PCB sales increased 12.8 percent in August while EMS shipments declined slightly.
• September sentiment shows rising costs but expectations for improving productivity and utilization.
• New reports examine electronics manufacturing software ecosystems and the transatlantic tariff agreement’s competitiveness impact.
 

 

Welcome to Industry Intelligence Insights, your monthly guide to the trends shaping global electronics manufacturing. I’m Thiago Guimarães, Director of Industry Intelligence at the Global Electronics Association.

This month’s market analysis from Chief Economist Shawn DuBravac, unpacks new rate cuts and shifting monetary paths in Europe and Asia.

We also highlight new Book-to-Bill data showing steady EMS demand and mixed PCB activity, and the latest Global Sentiment Report, where firms report persistent cost pressures but improving productivity and utilization ahead.

Plus, explore two new reports: The Software Ecosystem Powering Electronics Manufacturing and The New Transatlantic Trade Agreement, which examine how technology and trade are reshaping competitiveness across regions.

Read on for the insights driving the industry forward.

Thiago Guimarães 
Director of Industry Intelligence, Global Electronics Association

Market Analysis from Global Electronics Chief Economist Shawn DuBravac

The Fed’s long-anticipated rate cut finally arrived. Policymakers trimmed rates by 25 basis points in September, taking the federal funds range to 4.00% to 4.25%. Chair Jerome Powell said risks look more balanced and more cuts are likely in the months ahead. The aim is to give growth a nudge while keeping inflation expectations anchored. But that inflation fight is not over. August CPI ran at 2.9% year over year, with core at 3.1%. Both ticked up from July, a reminder that getting all the way back to 2% will take time.


The labor market cooled further in August, with nonfarm payrolls adding just 22,000 jobs and the unemployment rate climbing to 4.3%. Manufacturing was particularly weak, shedding 12,000 jobs during the month. Survey data confirmed the slowdown, with the S&P Global flash Manufacturing PMI easing to 52 in September from 53 in August. Still, some resilience remains: durable goods orders surged 2.9% in August, though shipments dipped 0.2%, suggesting uneven demand momentum.


Across the Atlantic, the European Central Ban kept rates unchanged in September, leaving the deposit rate at 2% and the main refi at 2.15%. With euro area inflation at 2.1% in August, officials sounded comfortable but noncommittal about what comes next.
Manufacturing conditions showed renewed weakness in Europe as the HCOB flash Manufacturing PMI slipped back below the 50 mark in September to 49.5, signaling contraction. Production data painted a more nuanced picture. Industrial output in July rose 0.3% month-over-month, driven by durable goods.


China’s manufacturing sector continued to show divergent signals. The official NBS manufacturing PMI came in at 49.8 in September, a sixth straight contraction but slightly better than August. The private Caixin gauge told a different story, rising to 51.2, its quickest pace since March. The PBOC left loan prime rates unchanged in September, while Beijing mapped out roughly ¥500 billion in targeted financing to speed up investment projects. One clear positive was profits. Industrial earnings jumped 20.4% year over year in August, lifting year-to-date profits to a small gain after earlier declines.


Around the rest of Asia, the Asian Development Bank nudged its 2025 growth outlook for developing economies down to 4.8%, citing tariffs and trade uncertainty. Japan struggled, with August industrial output down 1.2% and the au Jibun Manufacturing PMI slipping to 48.4 in September. The Bank of Japan held its policy rate at 0.5% and kept a close eye on wages and prices. India remained the regional standout. GDP grew 7.8% year over year in the April to June quarter, and manufacturing stayed strong even as the HSBC/S&P Global PMI eased to a still-hearty 58.5 in September.
 

Book to Bill

PCB: North American PCB Industry Sales Up 12.8 Percent in August

The Global Electronics Association has announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.

EMS: North American EMS Industry Shipments Down 1.4 Percent in August

The Global Electronics Association has announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.

Global Sentiment

The Current Sentiment of the Global Electronics Manufacturing Supply Chain September 2025

According to the September 2025 Global Sentiment Report, firms report rising material and labor costs that are straining margins and slowing hiring, even as demand and order flow remain solid. Over the next six months, executives expect cost pressures to persist but anticipate gradual improvement in activity, utilization, and margins as pricing resets and productivity gains take hold.

Recent Reports

The Software Ecosystem Powering Electronics Manufacturing

In November 2024, the Global Electronics Association surveyed EMS and OEM companies to gain a deeper understanding of the software tools that shape their operations. The findings reveal a complex landscape: there is no one-size-fits-all approach, with priorities varying by tool type and function.

The New Transatlantic Trade Agreement

The future of Europe’s electronics industry is being reshaped by a single deal: the new transatlantic tariff agreement. Starting August 1, 2025, most European electronics exports to the U.S. will face a unified 15% tariff, adding an estimated €9.8 billion in annual duties. This new paper from the Global Electronics Association examines how the agreement alters competitiveness,  raising costs for U.S. importers and consumers, disadvantaging European firms, and tilting the field toward competitors in Mexico and Asia.
 

Upcoming Events:

  • October 22-24, 2025 – Evertiq Expo Warsaw 2025 – Christoph Solka will present on the European EMS industry


 

Q:
What was the key monetary policy development in October 2025?
A:

The Federal Reserve cut rates by 25 basis points, moving the federal funds range to 00 to 25 percent while noting that inflation remains above target.
 

Q:
How is the U.S. manufacturing sector performing?
A:

Manufacturing showed weakness with a decline of 12,000 jobs in August and mixed PMI results suggesting uneven demand.
 

Q:
What trends are emerging in Europe’s manufacturing data?
A:

Europe’s manufacturing PMI slipped to 49.5, indicating contraction, despite modest growth in industrial output driven by durable goods.
 

Q:
How did China’s manufacturing indicators compare?
A:

China’s official PMI remained in contraction at 49.8, while the private Caixin PMI rose to 52 and industrial profits increased 20.4 percent year over year.
 

Q:
What do the latest Book to Bill numbers show?
A:

PCB sales in North America rose 18 percent in August with a book to bill of 0.98, while EMS shipments fell 4 percent but maintained a strong book to bill of 26.

Turning Supply Chain Security into Business Value

Date
-

Turning Supply Chain Security into Business Value: How Non-IT Personnel Achieve It. IPC-1792 Implementation Guide

Join us for a practical, business-first approach to supply chain security. This webinar explores how involving non-IT stakeholders early in the process leads to smarter investments, fewer missteps, and clearer requirements for IT and security teams.

Learn how to align security measures with business goals, avoid costly blind spots, and implement strategies grounded in the IPC-1792 white paper. We'll cover:

・Brochure for Management: “Promoting Awareness of Necessity”

・Value of IPC-1792 Compared to Regulatory Compliance like EU-CRA

・Business Risk Assessment

・Pre-incident business risk assessment

・Impact segmentation considerations

・Self-assessment and record-keeping methods

・Incident determination

・Recommended security measures for intrusion scenarios

・Specific procedure example-1: Pre-incident preparations for business continuity considering potential risks

・Specific procedure example-2: Preparing for immediate risk assessment upon occurrence (CIQA)

・Training

・Cost considerations

・Comparison with other standards

Whether you're in operations, management, or technical leadership, this session will help you turn security into a strategic advantage—for your career and your company.

 

Hiroyuki

Speaker Bio:

Hiroyuki Watanabe is engaged in activities to disseminate and enlighten the future of the manufacturing industry from the perspective of security and the international economy. He has published two Japanese books and one English book to support security measures in small and medium-sized factories. He presents logical findings leading to know-how and necessity of security measures for factories and supply chains at the Counterfeit Symposium and APEX. He publishes his cybersecurity findings under IPC's Technical Leadership Program.

 

Since 2018, he has been a visiting researcher at the Center for Rule Formation Strategy, Tama University. Hiroyuki Watanabe is currently the Executive Director of Global Security at NEC Corporation. In 2020, he joined the IPC Board of Directors and is a chair of IPC-1792 Cybersecurity Standard.
 

 

 


 

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