Product Assurance
8:00 am - 5:00 pm
5-22A and 7-31B IPC-J-STD-001 and IPC-A-610 Joint Task Groups
The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001, and will support revision activities as necessitated by industry or technology developments.
The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.
Product Assurance
8:00 am - 5:00 pm
5-22A and 7-31B IPC-J-STD-001 and IPC-A-610 Joint Task Groups
The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001, and will support revision activities as necessitated by industry or technology developments.
The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.
7-31A and D-33A IPC-A-600 and IPC-6012 Joint Task Group Meeting
The 7-31A task group is responsible for maintaining the IPC-A-600, Acceptability of Printed Boards, as a visual supporting document to the IPC-6010 specifications for printed board qualification and performance.
The D-33A task group is responsible for the development/update of IPC-6011, Generic Performance Specification for Printed Boards and the IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Product Assurance
8:00 am - 10:00 am
7-31A and D-33A IPC-A-600 and IPC-6012 Joint Task Group Meeting
The 7-31A task group is responsible for maintaining the IPC-A-600, Acceptability of Printed Boards, as a visual supporting document to the IPC-6010 specifications for printed board qualification and performance.
The D-33A task group is responsible for the development/update of IPC-6011, Generic Performance Specification for Printed Boards and the IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
7-32C Electrical Continuity Testing Task Group
This task group is responsible for the development of electrical continuity testing concepts and guidelines through the maintenance of IPC-9252, Requirements for Electrical Testing of Unpopulated Printed Boards.
8:00 am - 12:00 pm
7-31F IPC WHMA-A-620 Task Group
This task group is responsible for maintaining IPC/WHMA-A-620
1:30 pm - 3:00 pm
4-14F Final Finishes for Printed Boards – ENEPIG Task Group
This Task Group is responsible for the development of technical information, guidelines and testing techniques to evaluate electroless nickel / electroless palladium / immersion gold (ENEPIG) as a surface finish for printed boards and interconnecting substrates. It is responsible for developing and maintaining the IPC-4556 standard.
7-31FT IPC WHMA-A-620 Training Committee
The WHMA-A-620 Training Committee provides industry expertise to the development, evaluation, and revision of training materials for the IPC WHMA-A-620 Certification Program.
3:15 pm - 5:00 pm
7-31FHV IPC WHMA-A-620 High-Voltage Cable Task Group
This task group is looking at high voltage cable applications in the electric mobility industry.
1:30 pm - 5:00 pm
7-31J Electronic Box Assemblies Task Group
The 7-31J task group is responsible for the maintenance of IPC-HDBK-630.
Assembly and Joining
8:00 am - 12:00 pm
5-21R Die Attach and Wire Bond for Automotive Applications
Base Materials
8:00 am - 10:00 am
3-11A IPC-4101 Task Group
The 3-11A task group is responsible for maintaining the IPC-4101.
10:15 am - 12:00 pm
1-10D Material Selection for Design Task Group
The 1-10D task group is responsible for the development and maintenance of IPC-2201 Material Selection Guide for Printed Boards
1:30 pm - 3:00 pm
3-12D Woven Glass Reinforcement Task Group
The objective of this task group is to determine the consistency of woven glass fabrics and their effect on laminate and prepreg manufacture and to develop meaningful performance standards. It is responsible for the maintenance of IPC-4412.
3:15 pm - 5:00 pm
3-12E Base Materials Roundtable Task Group
This roundtable task group serves as an idea-generating forum for other 3-10 Printed Base Materials Subcommittees and Task Groups that are actively involved with maintaining and developing IPC standards. The task group itself will not be responsible for generating or maintaining any documents.
Cleaning and Coating
8:00 am - 12:00 pm
5-32G Residue Assessment Task Group
This task group is responsible for the evaluation and assessment of residues found on PB and PBAs. The group will maintain the test methods, guidelines and handbooks relating to cleanliness and residues. The group will ensure synergy and provide guidance to other task groups as they relate to cleanliness and residues.
1:30 pm - 3:00 pm
5-31D Cleaning Handbook Task Group
This task group is responsible for the maintenance of IPC-CH-65.
Process Control
8:00 am - 12:00 pm
7-31M Fiber Optic Cable Acceptability Task Group
This task group is responsible for the management of IPC-A-640, Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies and IPC-D-640, Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies. Theses complementary standards provide acceptance and design requirements for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology.
Rigid Printed Boards
10:15 am - 12:00 pm
D-33-AP Ultra HDI Subcommittee
The D-33-AP Subcommittee is responsible for developing design and fabrication guidelines for printed boards utilizing conductors and spacings below 50 µm and dielectric spacings below 75 µm (defined as Ultra HDI within the Subcommittee) that are manufactured with semi-additive and modified semi-additive processing.
Printed Board Design Technology
10:15 am - 12:00 pm
1-10D Material Selection for Design Task Group
Development and maintenance of IPC-2201 Material Selection Guide for Printed Boards.
Embedded Devices
1:30 pm - 3:00 pm
D-55 Embedded Devices Process Implementation Subcommittee and D-55A Embedded Circuitry Guideline Task Groups Joint Meeting
The D-55 subcommittee is responsible for IPC-6017, Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry.
The D-55A task group is responsible for IPC-7092, Design and Assembly Process Implementation for Embedded Circuitry and Devices, a guideline document to provide supplemental information to IPC-6017, the reliability specification for embedded circuitry.
Fabrication Processes
3:15 pm - 5:00 pm
4-14B Final Finishes for Printed Boards – ENIG Task Group
This Task Group is responsible for the development of technical information, guidelines and testing techniques to evaluate electroless nickel / immersion gold (ENIG) as a surface finish for printed boards and interconnecting substrates. It is responsible for developing and maintaining the IPC-4552 standard.
Product Reliability
3:15 pm - 5:00 pm
6-10D SMT Attachment Reliability Test Methods TG
This task group is responsible for the maintenance and development of specific test and performance levels for solder attachment of surface mount devices to rigid, flexible and rigid-flex circuit structures which are based on the guidelines furnished in IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments.
Data Generation & Transfer/Documentation
8:00 am - 12:00 pm
2-18 Supplier Declaration Subcommittee
This subcommittee will Develop and maintain a framework for the IPC-175x series of standards on supplier declaration. The framework includes a specification for common data elements shared across the sectional standards related to the supply chain partners and the product.
1:30 pm - 5:00 pm
2-18A Generic Requirements for Declaration Process Management Task Group
This task group has the responsibility for developing the format and XML characteristics for material and substance declaration intended to meet European legislation requirements.
10:15 am - 5:00 pm
2-40 Electronic Documentation Technology Committee
This committee is responsible for the development of strategies and recommendations for the conversion of design and manufacturing information into electronic formats representing final product. Various graphic drivers as well as methodologies for information capture are addressed by this committee in order to establish intelligent electronic documentation that can be communicated between design and manufacturing. This committee also includes concepts for configuration management.
Terms and Definitions
3:15 pm - 5:00 pm
2-30 Terms and Definitions Committee
This committee is responsible for the generation of terms and definitions applicable to the electronics interconnect industry through the updating and maintenance of IPC-T-50, Terms and Definitions for Interconnecting and Packaging Electronic Circuitry.
Product Assurance
7:30 am - 9:30 am
V-ESDS ESDS Control Plan
This group will discuss Electrostatic Discharge and develop an ESDS Control Plan.
8:00 am - 10:00 am
7-34 Repairability Subcommittee
This subcommittee oversees all repair and modification standards activity.
7-31F IPC WHMA-A-620 Task Group
This task group is responsible for maintaining IPC/WHMA-A-620
9:30 am - 12:00 pm
7-35 Assembly and Joining Handbook Subcommittee
This subcommittee is responsible for maintaining the IPC-AJ-820 handbook by incorporating and updating the best parts of IPC-AJ-820, IPC-HDBK-001, IPC-HDBK-610 and other documents.
10:00 am - 12:00 pm
7-31BT IPC-A-610 Training Committee
The IPC-A-610 Training Committee provides industry expertise to the development, evaluation, and revision of training materials for the IPC-A-610 Certification Program.
1:00 pm - 3:00 pm
5-22F IPC-HDBK-001 Task Group
This task group is responsible for the handbook that explains accepted industry practices for users of J-STD-001. The handbook details the process techniques, equipment, materials, and process controls needed for the production of acceptable hardware.
7-34T IPC-7711 7721 Training Committee
The IPC-7711/7721 Training Committee provides industry expertise to the development, evaluation, and revision of training materials for the IPC-7711 7721 Certification Program.
2:00 pm -3:00 pm
5-24C Solder Alloy Task Group
This task group is responsible for the development or revisions and amendments to J-STD-006.
Base Materials
8:00 am - 10:00 am
3-12A Metallic Foil Task Group
This task group is responsible for maintaining IPC-4562
Cleaning and Coating
8:00 am - 10:00 am
5-33B Solder Mask Performance Task Group
This task group is responsible for the maintenance of the IPC-SM-840 Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials and the associated test methods.
10:00 am - 12:00 pm
5-33C Conformal Coating Handbook Task Group
This task group is responsible for the maintenance of the IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings.
Process Control
10:00 am - 12:00 pm
7-24B Printed Board Assembly Process Handbook Task Group
This task group is responsible for the management of IPC-9111, Printed Board Assembly Process Handbook. IPC-9111 provides updated problems, process causes and the possible corrective action that may be taken.
1:00 pm - 3:00 pm
7-24A Printed Board Process Effects Handbook Task Group
This task group is responsible for the management of IPC-9121, Printed Board Process Effects Handbook. IPC-9121 provides updated problems, causes and possible corrective actions related to printed board manufacturing processes.
Rigid Printed Boards
8:00 am - 12:00 pm
D-31B IPC-2221 and 2222 Task Group
This task group is responsible for the development/update of IPC-2221, Generic Standard on Printed Board Design, and IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards.
Product Reliability
10:00 am - 12:00 pm
5-32E Conductive Anodic Filament (CAF) Task Group
This task group is responsible for the determination of electrochemical migration (ECM) activity within Printed Boards. Surface ECM issues are addressed by the 5-32b SIR and Electrochemical Migration Task Group. The focus of the 5-32e Task Group is exploring Conductive Anodic Filament (CAF) growth and other ECM failure mechanisms within the board.
Data Generation & Transfer/Documentation
8:00 am - 12:00 pm
8-80 Lead Free Electronics Risk Management (PERM) Council
The Lead-Free Electronics Risk Management (PERM) Council is comprised of members representing industry, Government and Academic organizations who have a common interest in managing and mitigating the risks of lead-free electronics assemblies in Aerospace, Defense, and High Performance (ADHP) electronics systems (e.g. Medical, Telecom, Automotive, etc.)
9:30 am - 3:00 pm
2-18A Generic Requirements for Declaration Process Management and 2-18B Materials Declaration Task Groups Joint Meeting
The 2-18A task group has the responsibility for developing the format and XML characteristics for material and substance declaration intended to meet European legislation requirements.
The 2-18B task group has the responsibility of maintaining the IPC-1752 materials declaration standard. This standard defines an XML data structure to facilitate the exchange of data regarding the material content of products. This data can be used by the supply chain to assess compliance with product-related regulations such as RoHS and REACH.
Electronic Product Data Description
8:00 am - 9:30 am
2-15F Obsolete and Discontinued Product Task Group
This task group is working jointly with JEDEC and ECIA on J-STD-048, which outlines the standard for announcing product discontinuance throughout the supply chain.
10:00 am - 12:00 pm
2-19B Trusted Supplier Task Group
This task group is developing IPC-1791, Trusted Electronic Designer, Manufacturer, and Assembler Requirements. This standard will provide minimum requirements, policies and procedures for printed board designers, manufacturers and assemblers to become a trusted manufacturer/designer. Trusted manufacturers, assemblers and designers ensure supply chain management, security, chain of custody and the protection of intellectual property (IP).
High Speed/High Frequency Interconnections
1:00 pm - 3:00 pm
D-22 High Speed High Frequency Board Performance Subcommittee
This subcommittee is responsible for the development of IPC-6018, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards.
Printed Electronics
1:00 pm - 3:00 pm
D-67A and D-67B Acceptability of Additively Manufactured Electronics Specification and Additively Manufactured Electronics Performance Specification Joint Task Group Meeting
D-67A is developing IPC-6911, Acceptability of Additively Manufactured Electronics (AME).
D-67B is developing IPC-6905, Qualification and Performance Specification for Additively Manufactured Electronics (AME).
Testing
1:30 pm - 3:00 pm
7-12 Microsection Subcommittee
The 7-12 committee is responsible for the maintenance and development of concepts, guidelines, and tutorials for manual and automated microsection preparation (test method 2.1.1) which are used to evaluate the printed board and assembly quality.
Product Assurance
8:00 am - 10:00 am
7-31FS IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
The 7-31FS Task Group is responsible for maintaining an addendum to IPC/WHMA-A-620 to enable users to specify a standardized set of acceptance criteria unique to cable and wire harness assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.
10:15 am - 12:00 pm
7-31AT and D-33AT IPC-A-600 and IPC-6012 Training Joint Task Group Meeting
The IPC-A-600 Training Committee provides industry expertise to the development, evaluation, and revision of training materials for the IPC-A-610 Certification Program.
The IPC-6012 Training Committee provides industry expertise to the development, evaluation, and revision of training materials for the IPC-6012 Certification Program.
7-31K and 7-31H Wire Harness Design and IPC-HDBK-620 Handbook Joint Task Group Meeting
The 7-31K will develop a standard to be used for the design of cable and wire harness assemblies.The 7-31h is responsible for the handbook that explains accepted industry practices for users of IPC/WHMA-A-620. The handbook details the process techniques, equipment, materials, and process controls needed for the production of cable and wire harness assemblies.
3:00 pm - 5:00 pm
7-34B IPC-7731 Task Group
This task group is responsible for the development and continued updating of IPC-7731.
3:15 pm - 5:00 pm
7-31N Manual Magnification Aides Task Group
This task group is responsible for IPC-9904 providing guidelines for manual magnification.
Assembly and Joining
8:00 am - 10:00 am
5-22BT J-STD-001 Training Committee
The IPC J-STD-001 Training Committee provides industry expertise to the development, evaluation, and revision of training materials for the IPC J-STD-001 Certification Program.
5-24B Solder Paste Task Group
This task group is responsible for maintaining J-STD-005.
10:00 am - 12:00 pm
5-24A Flux Specifications Task Group
This task group is responsible for developing and accessing revisions to J-STD-004.
1:30 pm - 3:00 pm
5-22AS J-STD-001 Space and Military Electronic Assemblies Task Group
The 5-22AS Task Group is responsible for maintaining an addendum to J-STD-001 to enable users to specify a standardized set of acceptance criteria unique to electronic assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.
3:00 pm - 5:00 pm
5-24G Polymerics Standard Task Group
This task group is responsible for the management of IPC-5262, Design, Critical Process and Acceptance Requirements for Polymeric Applications.
Base Materials
10:15 am - 12:00 pm
3-11J Metal Based Laminates for Printed Boards
This task group is responsible for maintaining IPC-4105.
Cleaning and Coating
8:00 am - 12:00 pm
5-33A Conformal Coating Task Group
This task group is responsible for maintaining IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies and the associated test methods.
1:30 pm - 3:00 pm
5-33F Potting and Encapsulation Task Group
This task group is responsible for the maintenance of the IPC-HDBK-850 Guidelines for Design, Selection, and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
Process Control
1:30 pm - 3:00 pm
7-25 AOI Subcommittee
The 7-25 Subcommittee includes the 7-25A and 7-25B task groups.
The 7-25A task group is developing IPC-9716, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies.
The 7-25B task group is developing IPC-9712, Requirements for Automated Optical Inspection (AOI) Process Control for Integrated Chip Substrates.
Printed Board Design Technology
1:30 pm - 3:00 pm
1-14 DFX Standards Subcommittee
This subcommittee is developing guidelines for the application of industry standards in DFM (design for manufacturing), DFR (design for reliability) DFA (design for assembly), etc.
Rigid Printed Boards
8:00 am - 10:00 am
D-33-AP Ultra HDI Subcommittee
The D-33-AP Subcommittee is responsible for developing design and fabrication guidelines for printed boards utilizing conductors and spacings below 50 µm and dielectric spacings below 75 µm (defined as Ultra HDI within the Subcommittee) that are manufactured with semi-additive and modified semi-additive processing.
Product Reliability
1:30 pm - 3:00 pm
3-11G Corrosion of Metal Finishes Task Group
This Task Group will gather data on corrosion of metals used in electronic assemblies with the intent to establish a long-term predictive test method and model. The conditions of the current 'mixed flowing gas' corrosion resistance test method are unable to predict product life and reproduce failure mechanisms in real world environments. The need for a new or modified test method is also prompted by the increasingly corrosive environments to which electronics are being subjected.
Data Generation & Transfer/Documentation
8:00 am - 5:00 pm
2-18B Materials Declaration Task Group Joint Task Group and 2-18K Process Chemical Declaration Task Group
The 2-18B task group has the responsibility of maintaining the IPC-1752 materials declaration standard. This standard defines an XML data structure to facilitate the exchange of data regarding the material content of products. This data can be used by the supply chain to assess compliance with product-related regulations such as RoHS and REACH.
The 2-18K group has the responsibility of maintaining the IPC-1754 materials declaration standard for Aerospace and Defense industries.
Electronic Product Data Description
8:00 am - 10:00 am
2-16D IPC-2581 Users Task Group
The IPC-2581 Consortium is an independent group working on facilitating the use of IPC-2581 in the industry.
10:15 am - 12:00 pm
2-16 Digital Product Model Exchange (DPMX) Subcommittee
This subcommittee is responsible for the maintenance and further development of IPC-2581.
High Speed/High Frequency Interconnections
1:30 pm - 3:00 pm
D-23 High Speed High Frequency Base Materials Subcommittee
This subcommittee is responsible for the development/update of IPC-4103.
Printed Electronics
8:00 am - 10:00 am
D-15 Flexible Circuits Test Methods Subcommittee
This Subcommittee is responsible for generating, verifying and revising test methods which relate to all aspects (design, base materials and performance) of the D-10 Flexible Circuits Committee. All changes to existing test methods and additional test methods formulated by the D-15, Flexible Circuits Test Methods Subcommittee will be submitted to the 7-11, Test Methods Subcommittee for inclusion into the IPC-TM-650, Test Methods Manual.
Flexible and Rigid-Flex Printed Boards
10:15 am - 12:00 pm
D-12 Flexible Circuits Specifications Subcommittee
This subcommittee is responsible for maintaining IPC-6013, Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards.
1:30 pm - 3:00 pm
D-11 Flexible Circuits Design Subcommittee
This subcommittee is responsible for maintaining IPC-2223, Sectional Design Standard for Flexible and Rigid-Flexible Printed Boards.
3:15 pm - 5:00 pm
D-13 Flexible Circuits Design Subcommittee
This subcommittee serves as a forum for the discussion and development of new base materials for use in the manufacture of flexible PWBs. This subcommittee is responsible for the maintenance of flexible circuits base materials standards covering flexible base dielectrics (IPC-4202), adhesive-coated dielectric films (IPC-4203), flexible metal clad dielectrics (IPC-4204) and assembly guidelines for pressure sensitive adhesives (IPC-FC-234).
Electronic Packaging Design
3:15 pm - 5:00 pm
1-13 Land Pattern Subcommittee
This subcommittee is responsible for land pattern design concepts through the development of IPC-IPC-7352 - Generic Guideline for Land Pattern Design.
Packaged Electronic Components
3:15 pm - 5:00 pm
B-10A Plastic Chip Carrier Cracking Task Group
This task group was formed based on concerns raised at the Surface Mount Council regarding cracking observed in plastic chip components. They developed technical document IPC-SM-786 (Recommended Procedures for Handling of Moisture Sensitive Plastic IC Packages) to address this. Subsequently, they joined with JEDEC to develop replacements for IPC-SM-786 to reflect current technology. J-STD-020A.
Data Generation & Transfer/Documentation
8:00 am - 12:00 pm
2-18J Lab Report Declaration Task Group
This task group will develop a standardized lab report format for gathering and communicating information on testing data for chemicals in products. This project will facilitate the exchange of lab reports between supply chain members by having a standardized lab report format and way to exchange the information contained in lab reports. The goal is to have a common format for industry to use and standardize the data so it could be entered into the data stream for easier analysis and transfer between companies within the supply chain.
1:30 pm-5:00 pm
2-18H Conflict Minerals Data Exchange Task Group
This task group will develop a standard in the IPC 175x family that supports the electronic exchange of data needed by companies complying with regulations and customer requirements for information about conflict minerals contained within a company's products.
