IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.” 

The white paper explores the packaging and integration needs for several key application areas:

  • High Performance Computing (HPC)
  • 5G/6G Wireless Communications
  • Autonomous Driving and Electric Vehicles (EV)
  • Medical Electronics
  • Aerospace & Defense Electronics

The paper then analyzes the following aspects of advanced packaging to board-level integration:

  • Design challenges and co-design approaches
  • Power delivery requirements
  • Thermal management challenges
  • Materials innovation needs for package assembly and PCB integration
  • Printed Circuit Board Assembly (PCBA) challenges
  • Reliability considerations for heterogeneously integrated   systems
  • Metrology requirements for the characterization of advanced packaging to board level assembly

The white paper emphasizes the importance of a “silicon to systems” approach in developing next-generation chiplet-based advanced packages and their integration into complex systems. The paper also recommends the development of a 5-10 year outlook on trends, challenges, and gaps in advanced electronic packaging and PCB/subsystem integration across various application domains. This roadmap will enable the electronics industry supply chain to better prepare for and address the complex challenges in system-level packaging and integration.

“IPC is committed to identifying the gaps and challenges in design, materials, assembly, test, and reliability as applied to advanced packaging integration with printed circuit boards, assemblies, and subsystems,” said Devan Iyer, chief strategist advanced packaging and white paper co-author. “Along with our industry partners, IPC will continue to be the leading advocate of a ‘silicon-to-systems’ approach as the evolution of advanced packaging directly affects the future of all aspects of electronics manufacturing,” emphasized Matt Kelly, IPC chief technology officer and white paper co-author. 

This white paper provides valuable insights for anyone involved in electronics manufacturing, helping them stay ahead of technological trends and address future integration challenges effectively.

Download the White Paper.

IPC Day Italy, Maranello (Ferrari Museo)

Date
- (2:00 - 9:00am CDT)

Shaping the Electronics of the Future: Ensuring Quality & Long-Term Reliability through Standards

Join us for the 2024 IPC Day Italy taking place on Thursday 3 October 2024 at the Ferrari Museo in Maranello. 
IPC DAY Italy will focus on ensuring quality & long-term reliability of electronic devices through standards as well as sustainability, especially in the automotive industry. The IPC Day is organised in a partnership with Gestlabs & Phoenix Contact with industry sponsors TTI, NCAB, & JBC. Table-top exhibitions will be available on the day. 

Stay up-to-date on IPC Standards, discover the latest advancements in electronic assembly design & production & learn sustainable practices to protect the environment & create value for future generations.

Why Attend IPC Day Italy 2024?

Join & connect with experts & industry professionals to exchange & learn best practices in IPC standards. Direct interaction with Italian industry experts and IPC will allow you to stay up to date on standards to adopt & learn guidelines for identifying methods & procedures to create reliable & cutting-edge products.
Participation fee is 100,-EUR per person, including a VIP PASS to the Ferrari Museo, a dedicated guided tour & networking lunch.

Where: Convention Center, Ferrari Museo, Maranello, Italy 

When: Thursday, 3 October 2024, 09:00 - 16:00 h

Who should attend: 

  • Manufacturing, quality & design engineers
  • Members of Academia
  • Senior & junior engineering students
  • Specialists or practitioners in manufacturing (especially automotive & related)

Programme: 

IPC Day Italy Maranello programme_update 02 Oct 2024


Participation Fee: 100,- EUR per person, including the VIP pass to the Ferrari Museum

Please register by 16 September 2024. Follow the link to access the registration form and FAQ section: https://gestlabs.phoenixcontact.it/ipc-day-italy-2024

Please note that registration is limited to two participants per company. For more information you can email Ms. Francesca Sambero or phone +39 039 855 1014 ext. 2. 
 

Electrical Wire Processing Technology Expo 2025

Date
-

Why Attend the Electrical Wire Processing Technology Expo (EWPTE)?

Produced by WHMA/IPC, the ONLY trade association exclusively representing the cable and wire harness manufacturing industry including manufacturers, their suppliers and customers, EWPTE is where the industry comes together with more than 3,000 attendees and nearly 200 exhibitors to find solutions to challenging wire problems through training and education and for the opportunity to network with industry leaders and subject matter experts.

Attendees at all career stages can expect to Harness the Future through:

Education & Training
Professional Development Courses with content designed to deliver new information, skills, and techniques related to the cable and wire harness industry. 

Technical Conference Sessions presented by engineers, researchers, academics, technical experts, and industry leaders who will share new technical data, significant results from experiments and case studies, emphasizing new techniques and discussing trends of interest with appropriate technical test results.

Networking Opportunities by connecting with industry leaders and subject matter experts.

Accessing New Technologies and finding new suppliers to find solutions to your challenging wire problems on the show floor from nearly 200 exhibitors.

Who Should Attend?

Anyone who designs, specifies, purchases, installs, sells, maintains or manufactures electronic cable assemblies, cord sets, wiring harnesses and other related products for the following industries:

  • Aerospace
  • Automotive/Transportation (Automobiles, Rail, Buses. Trucks)
  • Consumer Technology (Business Equipment and Appliances)
  • Defense/Military
  • Medical Instruments
  • Off Highway (Constructions, Agriculture and Mining)
  • Recreational (RV, Marine OPE & RTV)
Baird Center

400 W Wisconsin Ave
Milwaukee, WI 53203
United States

Baird Center

Baird Center
400 W Wisconsin Ave
Milwaukee, WI 53203
United States

Learn to Design PCBs with Leading-Edge IPC Courses

Sep 06, 2024

Introduction to PCB Design I and II are two online IPC courses dedicated to PCB design, scheduled for the next few months. The courses are held by Pietro Vergine, co-president of Leading Edge and IPC instructor.

Vergine, an expert in the sector and Master IPC Trainer, will hold two courses organized by IPC in the coming months and aimed at engineers, technicians, hobbyists and anyone interested in PCB design. Held in Italian, the courses will be available online through interactive webinars and session recordings. The lessons also include specific exercises to master the key concepts of PCB design. Let's see them in detail.

Introduction to PCB Design I – 6 weeks

The course is scheduled September 30 to November 8 and includes lessons on Mondays and Fridays from 9:00 am to 11:00 am CET. After an initial overview of the fundamentals of PCB design and review of passive components, the course addresses the following topics in the following weeks: component library concepts, concepts for creating simple schematics, advanced concepts for creating complex schematics, and schematic documentation. In the last week of the course there will be a review of the contents and the final exam. To obtain the course completion certificate you will need to obtain a score of 70 percent or higher.

Register by October 8: https://education.ipc.org/product/introduction-al-pcb-design-i

Introduction to PCB Design II – 8 weeks

The course will be held from January 13 to March 7, 2025. Classes are scheduled on Mondays and Fridays from 9:00 am to 11:00 am CET. The first session will focus on the basic concepts of a PCB layout. We will then move on to more advanced concepts, such as multilayer routing, stackup design, impedance control, and then delve deeper into: materials, signal integrity, transmission lines, flexible circuits and documentation. In the last week a final review will be carried out and the final exam will be held.

Register by January 21: https://education.ipc.org/product/introduction-al-pcb-design-ii

For more information on the contents, methods and costs of the courses, visit www.education.ipc.org or 

contact Pietro Vergine, at pietrov@leading-edge.it or +39 335-5783220.

“IPC is the leading international training and certification body in the electronics industry, which aims to standardize assembly and production requirements for electronic equipment and assemblies,” explains Pietro Vergine, Co-President of Leading Edge. Leading Edge has been operating in Europe for nearly 20 years, providing consultancy for the electronic design of integrated circuits, FPGAs and PCBs, and is also an IPC Master Training Center.

Calling All California Employers: Harness State Funding for Workforce Training with IPC and ETP

IPC announces a pivotal opportunity for California employers under the Employment Training Panel (ETP) program. This initiative provides significant financial support for customized job skills training, reducing costs and enhancing the competencies of the workforce in today's challenging market.

Why Partner with IPC and ETP?

The collaboration between IPC and ETP offers a host of benefits:

  • Offset Costs: IPC receives reimbursements from ETP for training expenses, which drastically cuts or even eliminates your training costs.
  • Flexibility: Employers can select training programs that align perfectly with their workforce needs.
  • Customization: Tailored training that caters to specific industries and job roles, ensuring relevant and impactful learning experiences.

Who Stands to Gain?

  • Any employer with one or more full-time employees
  • Businesses contributing to the State Unemployment Insurance system
  • Particularly small businesses, with 74% of ETP-supported enterprises being small-scale operators.

Maximizing Business Potential

Employers are encouraged to act swiftly to leverage this advantageous program and drive business growth through enhanced skills and innovation. For more information on how IPC and ETP can provide assistance, contact Victoria Hawkins, IPC director of workforce grants and funding, at VictoriaHawkins@ipc.org.

IPC New England EMS Leadership Roundtable: Leveling Up Your Business

Date
- (3:00 - 7:00pm CDT)

October 22, 2024 | 4:00 pm – 8:00 pm
Location: Cirtronics Corporation
528 Rte 13 S, Milford, NH 03055
(603) 249-9190
www.cirtronics.com

Hosted by: Cirtronics Corporation

Join fellow EMS leaders in the region to share industry pain points and solutions. Our focus for this meeting is how companies profitably reach the next level of revenue and employee retention, and how AI may impact the business in the future. Following a presentation on the current EMS market and revenue tiers in the industry, participants will discuss how to reach the next level and grow their business. Discussion will pull from direct experience, questions, and ideas. From there, the conversation goes where you, the leaders, take it. Every roundtable ends in unique takeaways. 

Complimentary registration includes: 
•    Peer-led roundtable discussions
•    Updates on relevant EMS industry studies/reports
•    Recap of business resources available
•    Reception and dinner
•    Peer networking, partnership building 

Have questions? Email Mark Wolfe at MarkWolfe@ipc.org.

Cirtronics Corporation

528 Rte 13 S
Milford, NH 03055
United States

Cirtronics Corporation

Cirtronics Corporation
528 Rte 13 S
Milford, NH 03055
United States

WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2025

Deadline for proposals: November 8, 2024

WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 6-8, 2025 at Baird Center in Milwaukee, Wis.

Expert technical conference presentations and professional development courses are being sought in the following topic areas:

  • Case Studies on A-620 Success
  • Quality Requirements
  • ESD Impacts on Harness
  • ESD Transmission through Harnesses
  • Hi Frequency Cabling
  • X-ray Inspection Techniques
  • Crimping Challenges/Dos and Don’ts
  • Crimp Cross Sectioning
  • Wire Harness Troubleshooting
  • Reliability Issues and Failure Analysis
  • Wiring Harness Education and Training
  • Coil Winding
  • Connector Advances
  • Tooling
  • Process Equipment/Productions
  • Calibration
  • Ultrasonics Splicing and Terminating
  • Harness Design Drawings Engineering
  • Overmolding
  • Testing – Electrical/Environmental/
    Mechanical
  • Electric Vehicles (EV)/Electric Mobility
  • Cleanliness and FOD
  • Wiring Harness Rework

Proposals must include an approximate 300-word abstract/summary of the presentation and description of what the audience will learn, and who will benefit from attending the presentation. Technical conference paper abstracts and course proposals are due November 8, 2024. For more information or to submit a proposal, visit https://app.oxfordabstracts.com/stages/75906/submitter. For questions regarding the technical conference at EWPTE, contact Julia Flynn, IPC/WHMA conference and events manager, at JuliaFlynn@ipc.org.

For additional information on attending or exhibiting, visit www.electricalwireshow.com, or contact Alicia Balonek, IPC/WHMA senior director of trade shows and events at AliciaBalonek@ipc.org.

WHMA's Annual Global Leadership Summit 2025

Date
-

The wire harness industry is constantly evolving with new technology and practices. The 2025 WHMA Annual Global Leadership Summit offers the tools you need to help your business succeed in this fast-changing landscape. WHMA's Annual Global Leadership Summit (formerly the WHMA Annual Conference) is a networking event for executives representing wire harness manufacturers, OEMs and suppliers for companies that build wiring harnesses and cable assemblies.

  • Peer-to-peer networking provides countless opportunities for you to improve your business as you learn, share, and discover new approaches to the wire harness industry.
  • Learn from industry leaders at best-practices roundtables, technical education workshops, and keynote speakers.
  • Get the first look at cutting-edge technology in the Exhibit Hall featuring industry leading suppliers.

Invest in your business and your future at WHMA's Annual Global Leadership Summit!

Luminary Hotel & Co. - Caloosa Sound Convention Center

2200 Edwards Drive
Fort Myers, FL 33901
United States

Luminary Hotel & Co. - Caloosa Sound Convention Center

Luminary Hotel & Co. - Caloosa Sound Convention Center
2200 Edwards Drive
Fort Myers, FL 33901
United States

Registration Open for the 2025 WHMA Annual Global Leadership Summit

Registration is now open for the 2025 WHMA Annual Global Leadership Summit, the industry’s only annual executive networking event for the cable and wire harness manufacturing industry including manufacturers, their suppliers, and customers.

Taking place January 28-30, 2025, in Fort Myers, Fla., the summit is geared to help global leaders connect with other industry leaders, gain valuable knowledge, and drive their businesses forward. Influential thought leaders and forward thinkers will take to the keynote stage to deliver their valuable perspectives on topics that are important to executives. The lineup of keynote presentations include:

  • Wednesday, January 29 opening keynote – “China and Transnational Supply Chains in an Era of War and Deglobalization,” presented by Gordan C. Chang, author and Newsweek columnist
  • Wednesday, January 29 keynote – “Beating Inflation,” presented by Adam Echter, partner, Simon-Kucher
  • Thursday, January 30 keynotes – “Emerging Trends Reshaping the Electronics Industry,” presented by Shawn DuBravac, chief economist, IPC; and “Creativity Unleashed: Generative AI and Your Future,” presented by Sam Richter, CEO and founder, SBR Worldwide, LLC.

In addition to two days of inspiring keynotes and featured speakers, the conference will offer two workshops. On Tuesday, January 28, IPC’s Lead Sustainability Strategist Dr. Kelly Scanlon will delve into the critical sustainability topics impacting electronics manufacturers, including wire and cable manufacturing companies, in her presentation titled “Navigating Sustainability Challenges in Electronics.” On Wednesday, January 29, Science of Business President Dr. Lisa Lang will guide workshop participants on how to leverage existing resources using the “Theory of Constraints” (TOC) to maximize profitability in her presentation, “Maximizing Profitability.”

For more information on the leadership summit including schedule, exhibition, speaker profiles, sponsorship opportunities, or to register for event, visit https://annualconference.whma.org. Advance discount on registration ends on December 13, 2024.

IPC’s Road to Reliability Webinar Series Covers New e-Mobility Technologies

Starting September 12, IPC’s Road to Reliability Webinar series will bring industry leaders together to discuss the hurdles in achieving reliability for new e-mobility technology. Speakers will examine reliability drivers, technology applications, and target lifecycles in each free webinar.

  • On September 12, 10 am CDT, Habib Mustain, Hereaus, will discuss power electronic substrate types, requirements, and challenges for today's EV applications and will address essential topics related to the use of power substrates in power electronic applications with an emphasis on EVs. Stan Rak, SF Rak Company, will serve as webinar moderator. Learn more and register.
  • On October 17, 10 am CDT, Brian O'Leary, Indium Corporation, will discuss the impact of the software defined vehicle on hardware design and manufacture. In addition, he will cover how automakers and system designers are addressing future features in their hardware design, the impact of these strategies on the manufacturing of these parts, how safety is rated and reliability targeted and tested. Moderator: Stan Rak, SF Rak Company. Learn more and register.
  •  And rounding out the series, on November 14 at 10 am CDT, Brenda Baney, BCubed Consulting, will serve as webinar moderator, guiding expert panelists Yusuf Williams, Harman Automotive Division; Bing Xu, iPoint-systems Gmbh; and Leanne Mallini, Analog Devices, in a discussion on what automakers, startups, and T1s are demanding from their supply chains in terms of sustainability. Panelists will weigh in the top three challenge areas beyond current regulatory reporting and what may be coming next and will touch on recycling, PFAS, carbon neutrality, and the changeover of electronics assembly reporting. Learn more and register.

“These free webinar sessions will allow participants to better understand technology gaps, broaden their professional connections, and uncover strategies for meeting reliability objectives,” said Tracy Riggan, IPC senior director, business development, Solutions. “IPC would like to thank all speakers and moderators for lending their expertise and especially to Indium Corporation for sponsoring the webinar series.”

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