Top of the Class: IPC APEX EXPO Named One of Trade Show Executive’s Fastest 50, Class of 2023

IPC APEX EXPO 2023 was recognized as one of the top 50 fastest-growing trade shows in the United States for the number of exhibiting companies and attendance by Trade Show Executive, the foremost magazine for the trade show industry.

IPC APEX EXPO, the largest trade show for electronics manufacturing in North America, welcomed a 50 percent increase in event participants and a 33 percent increase in exhibitors in 2023.

“With more than 13,000 tradeshows held annually each year in the United States, this is such an honor for IPC APEX EXPO to be named as one of the Top 50 tradeshows, and we couldn’t be prouder,” said Alicia Balonek, IPC senior director, trade shows and events. “This year’s event, just weeks away is also seeing positive growth, proving IPC APEX EXPO is the industry’s premier event to make new connections and to build relationships. We can’t wait to welcome everyone to Anaheim next month.”

According to Trade Show Executive, the Fastest 50 are ranked in three categories: By Net Square Feet, By Exhibiting Companies, and By Total Attendance. The Class of 2023 represents more than 15 million net square feet of paid exhibit space, 48,517 exhibiting companies, and more than 1.4 million attendees.

This year, IPC APEX EXPO will feature more than 400 exhibitors from every step in the electronics manufacturing supply chain including the industry’s leading equipment manufacturers, suppliers and product innovators who provide services to help attendees gain greater efficiency while improving their bottom lines.

To view a complete list of companies exhibiting at IPC APEX EXPO, visit www.IPCAPEXEXPO.org/exhibitors. For more information about the show or to register, visit www.IPCAPEXEXPO.org. Event essentials registration is free to individuals who pre-register online ($50 on-site). To maximize event experience, individuals can take advantage of the All-Access Package which includes all technical conference sessions; five half-day professional development courses; the EMS Leadership Summit, IPC luncheons, and more.

 

 

IPC WorksAsia China- Automotive Electronics Workshop

Date
- (12:30 - 4:00am CDT)

With the rapid development of electronic information technology and the continuous drive towards electrification, intelligence, and connectivity in the automotive industry, the landscape of automobile manufacturing is undergoing constant changes. The proportion of automotive electronics within the entire vehicle is rapidly increasing. The demand for traceability of production data, high-quality and highly reliable products, and the continuous elevation of requirements for intelligent manufacturing are propelling advancements and growth in the automotive industry. The development of automotive electronics is accelerating the transition of the electronic manufacturing industry towards intelligent manufacturing.

How can the entire vehicle manufacturing ensure that the upstream and downstream of the supply chain meet the constantly increasing requirements for high quality and reliability? How should the electronic manufacturing industry respond to the opportunities and challenges presented by the development of automotive electronics?

IPC WorksAsia China will focus on topics such as automotive electronic materials and printed circuit board applications, process technology, intelligent manufacturing solutions, specific requirements and development trends of entire vehicle manufacturers, as well as the application of IPC automotive supplementary standards. We invite representatives from leading companies in the industry to engage in face-to-face discussions and share insights. Industry colleagues are welcome to register and participate.

Agenda:

13:30-13:40 Opening Session, Introduction of Speaker
By IPC

13:40-14:10 Analysis of Printed Circuit Board Standards in the Automotive Sector
By Jiong Dai, Quality Department Standards Manager at Shennan Circuits Co., Ltd., Member of IPC Asia Standards Steering Committee

14:10-14:40 Application of Flexible Printed Circuits (FPC/FPCA) in the Automotive Field
By Huiqin Zheng, Chief Engineer at Xiamen Long-Shine Flex Co., Ltd

14:40-15:10 Reliability Analysis of PCBA for New Energy Vehicle Electric Drive Controllers
By Zupei Tan, Supervisor of Electronics and Electrical Control Processes at Zhuzhou CRRC Times Electric Co., Ltd.

15:10-15:30 Tea Break

15:30-16:00 Innovative Soldering Techniques for Automotive Electronics
By Xuan Ma, Application Technology Expert in Automatic Soldering at TSUTSUMI China Agency

16:00-16:30 Identification and Control of Latent Defects in Electronic Components
By Zhitang Chen, Senior Expert in Supplier Quality Electronic Information at SGMW & Member of IPC China Automotive Electronics Committee

16:30-17:00 Embracing the Challenges of Automotive Electronics: Steering Towards Success with IPC Standards
By Chuck Li, Standards Director, IPC Asia Pacific

17:00-17:10 Q&A Session

Premier Sponsors

ONG SHINETSUTSUMI

Supporting Sponsor

 

 

 

 

For more information or event sponsorship, please contact marketingchina@ipc.org

 

 

Shenzhen Dengxilu International Hotel - 2nd Floor, Shenzhen Hall

12 Baotian 1st Road
Bao'an Qu
Shenzhen Shi
Guangdong Sheng, 518102
China

Shenzhen Dengxilu International Hotel - 2nd Floor, Shenzhen Hall

Shenzhen Dengxilu International Hotel - 2nd Floor, Shenzhen Hall
12 Baotian 1st Road
Shenzhen Shi, GD 518102
China

Electronics Industry Praises U.S. Government Notice of Funding Opportunity for “Advanced Packaging” Technologies

IPC praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.

“IPC applauds this very important milestone in the work to build a more resilient semiconductor manufacturing supply chain in North America,” said Richard Cappetto, Senior Director of North American Relations at IPC. “Today’s action is a welcome milestone following years of education and advocacy work by IPC and our partners. It will help ensure that the United States can bridge current gaps in its semiconductor supply chain and position itself to be a leader in the global marketplace with the ability to manufacture cutting-edge technologies.”

Advanced packaging is driving semiconductor innovation by introducing greater electronic interconnection within semiconductor packages. Electronic interconnection is key to U.S. semiconductor leadership, and industry leaders call advanced packaging the “new king” of innovation in the chips sector

The NOFO makes $300 million available for multiple awards of up to $100 million each for up to five years. Investments will be focused on projects that achieve ambitious targets for one or more of the program’s chief objectives:

  • Accelerate domestic R&D and innovation in advanced packaging materials and substrates;
  • Translate domestic materials and substrate innovation into U.S. manufacturing;
  • Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and
  • Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry.

IPC is the leading advocate for a “silicon-to-systems” approach to the CHIPS and Science Act, recognizing the importance of silicon fabrication but also the need for related electronics manufacturing capabilities—including advanced packaging, printed circuit boards (PCBs), and IC substrates.   

IPC’s influential 2021 report, North American Advanced Packaging Ecosystem Gap Assessment, found the U.S. has only just begun to invest in advanced packaging, while nations in Asia have sprinted ahead to develop the lion's share of capabilities and capacity. That report was referenced both in today's NOFO and in the CHIPS Office’s guiding document for the National Advanced Packaging Manufacturing Program. An IPC Symposium on Advanced Packaging in 2022 also helped propel government action.   

For more information: Advanced Packaging Semiconductors | IPC Industry Initiatives

Electrical Wire Processing Technology Expo (EWPTE) Named in Trade Show Executive’s Top 100 List of Fastest Growing Shows

IPC/WHMA and Baird Center announce that Electrical Wire Processing Technology Expo (EWPTE) 2023 has been recognized as a top 100 fastest growing show in the United States for net square footage and number of exhibiting companies by Trade Show Executive.

EWPTE, the cable and wire harness industry’s exclusive trade show, drew in a total of 3,049 attendees in 2023, an 18 percent increase over 2022. The EWPTE 2023 experience was equally positive for the 185 exhibitors (up 19 percent from 2022) who showcased their products and services spanning 43,400 net square feet of show floor space (up 17 percent from 2022) and generated a total of 12,063 leads according to the lead data count, a 35 percent increase over leads in 2022.

According to the Center for Exhibition Industry Research (CEIR), there are approximately 13,000 tradeshows held annually in the United States each year. “It’s an honor for EWPTE to be recognized as a top U.S. tradeshow,” said Alicia Balonek, IPC senior director of trade shows and events. “In the past two years that IPC/WHMA have managed the show, EWPTE has seen both exhibitor growth and overall net-square footage growth. Being ranked in the top 100 is a tremendous accomplishment not only for the show, but for IPC, WHMA and Baird Center and we couldn’t be more proud.”

With an even larger show floor than 2023, EWPTE 2024 will feature the industry’s leading suppliers and product innovators, giving attendees exclusive access to new technologies and new suppliers to help find solutions to challenging wire problems. “Baird Center is about to debut a $456 million expansion, doubling the square footage of the convention center in May 2024. The show has even more room for growth when it moves to this space in 2025,” said Megan Seppmann, vice president of sales for the Wisconsin Center District, owners and operators of Baird Center. “My colleagues and I cannot wait to welcome attendees, exhibitors and guests into the beautifully renovated and expanded facility.”

At EWPTE 2024, there will also be a range of professional development courses with content designed to deliver new information, skills, and techniques related to the cable and wire harness industry. Technical conference sessions presented by engineers, researchers, academics, technical experts, and industry leaders will provide new technical data, significant results from experiments and case studies, and share new techniques and trends of interest.

EWPTE 2024 will be held at Baird Center May 14-16, 2024, in Milwaukee, Wis. For more information, visit www.electricalwireshow.com.

Electric Vehicle and Smart Car Technology Workshop

Date
- (12:00 - 4:00am CDT)

Electric vehicles and smart cars have become one of the fastest-growing markets in the electronics industry. With demands for automation, electrification, connectivity, and safety, vehicles are not only integrating more electronic products from various industries, but their quality and reliability must also be enhanced.

This workshop encourages attendees to interact, discuss, and share research and experiences related to the following topics:

• Material and technology trends in electric vehicles

• Reliability issues of electronic equipment in electric vehicles, including PCBs, solder joints, components, and assemblies

• Electronic component characteristics, failure analysis, reliability modeling, standards, and specifications

• Knowledge gaps and collaborative opportunities to address common issues faced by the supply chain of materials and parts for electric vehicles

This workshop will be organized during TPCA SHOW from October 23-25, 2024.

For more information or event sponsorship, please contact Ms. Winny Lin at WinnyLin@ipc.org

Nangang Exhibition Center

No. 1, Jingmao 2nd Road
Nangang District, Taipei City 11568
Taiwan

Nangang Exhibition Center

Nangang Exhibition Center
No. 1, Jingmao 2nd Road
Nangang District, TPE 11568
Taiwan

IPC-2951-CFX Future Factory Applications & Real Scene Demonstrations

Date
- (12:00 - 4:00am CDT)

This event will be organized during 2024 Taiwan Robot and Intelligent Automation Exhibition \ 2024 Taipei International Industrial Automation Exhibition from August 21-24, showcasing the research and experience on industry pain points:

-Introduction of IPC-HERMES-9852 & Basic Architecture & Transmission Mechanism & Interchangeable Messages

-Introduction of IPC-2951-CFX & Basic Architecture & Transmission Mechanism & Basic Specifications (Table 6-1, 6-2) & Interchangeable Messages & Application Scene Introduction & Factory of the Future Applications & Real Scene Demonstrations

- AMR Automated Loading and Unloading (CFX)

- First Station Data & Batch Completion Data & Rework Station PCB Placement & Command Stop Board

- Integration System Manufacturer – Enlight Technology for CFX Equipment Integration

For more information or event sponsorship, please contact Ms. Winny Lin at WinnyLin@ipc.org

Nangang Exhibition Center

No. 1, Jingmao 2nd Road
Nangang District, Taipei City 11568
Taiwan

Nangang Exhibition Center

Nangang Exhibition Center
No. 1, Jingmao 2nd Road
Nangang District, TPE 11568
Taiwan

CIT Club Networking Event

Date
- (Mar 7, 2024 | 11:00pm - Mar 8, 2024 | 3:00am CST)

IPC cordially invites you to attend the 2024 CIT Networking Event and the main meeting on EMS Digital Smart Factory, which will be held in Taipei on March 8, 2024. This event will showcase the new policies and standard updates for the 2024 IPC certification training, and together we will discuss how to deal with the standardization and dynamic uploading of data from rapidly growing manufacturing stations, standardizing data formats, centralized analysis, closed-loop feedback control, as well as quality and reliability requirements and challenges of the plan.

For more information or event sponsorship, please contact Ms. Winny Lin at WinnyLin@ipc.org

Sunjsong Technology

6th Floor, No. 649, Zhongzheng Road
Xinzhuang District, New Taipei City 242051
Taiwan

Sunjsong Technology

Sunjsong Technology
6th Floor, No. 649, Zhongzheng Road
Xinzhuang District, NWT 242051
Taiwan

The Importance of a Good PCB Design Package

Date
- (12:00 - 1:00pm CDT)

My colleague Happy Holden famously stated that only about 10% of design packages received by PCB fabricators are complete and accurate out of the gate. This means unnecessary time and cost are going into the other 90% of jobs. What it also means is that design success and product reliability are in jeopardy if these issues are not identified and addressed. 

Early engagement between a PCB fabricator and a PCB designer is essential to avoid common design issues that will impact the success of any PCB design. Getting the PCB fabricator's engineers together with the PCB designers to understand manufacturing capabilities and collaborate on the optimum design solution for a particular application is mission-critical to the success of the project. This webinar will cover: 
•    Customer service representatives are not engineers; why all technical questions cannot be addressed during the quoting stage.
•    What happens when the customer's netlist does not match the customer's Gerber/3d data.
•    Customer impedance requirements don't match the drawings/data. 
•    Picking the appropriate material set for a given design application.
•    Customized CAM adjustments for manufacturability. 
•    The impact of a PCB designer not understanding fabricator capabilities.
•    Unmanufacturable designs.
•    Inheriting designs from another PCB fabricator.
•    Overdesigning a project from a complexity and cost standpoint. 
•    Early and often engagement; it's all about time and cost.

 

Steve Williams

Speaker Bio

Steve Williams is a 40+ year executive veteran in the electronics industry, having gained prominence and recognition as an authority on quality, management, and leadership. The former Sourcing Manager for global EMS provider Plexus Corp., he is currently the President of The Right Approach Consulting. Steve has authored numerous books, including Lean, Quality, and Leadership, has published more than 150 business articles & white papers, and is a columnist for The PCB Magazine at i-Connect007. He also was a professor for the MBA program at numerous universities and a John Maxwell Group Certified Independent Leadership Speaker, Teacher, and Coach.