By Diana Radovan, sustainability policy director, Global Electronics Association

Key Summary

• The Global Electronics Association submitted consolidated industry input to the European Commission on the upcoming Circular Economy Act.
• The consultation covered seven areas including WEEE, EPR systems, secondary raw materials, and waste management.
• The Association supports balanced, innovation-focused approaches that scale secondary-material markets and provide proportionate obligations for SMEs.
• Recommendations emphasized collaboration, digitalised reporting systems, and predictable policy timelines.
• The Association welcomes continued dialogue as the Circular Economy Act develops.

The Public Consultation initiated by the European Commission (EC) on the upcoming Circular Economy Act, expected at the end of 2026, closed November 6. The Global Electronics Association consolidated and submitted industry input on November 3, in the survey format provided by the EC and in the form of an initial position paper (to be refined with additional industry input throughout 2026). The Association thanks all those who responded to the detailed survey. 

The public consultation included the following parts:

•    Part 1 – Information about the organisation submitting comments
•    Part 2 – General Questions on the Circular Economy
•    Part 3 – Waste from electronic and electric equipment (WEEE)
•    Part 4 – Single-Market Barriers and Extended Producer Responsibility (EPR) Systems
•    Part 5 – Demand and Supply of Secondary Raw Materials
•    Part 6 – Improving Waste Management and Circular Processes
•    Part 7 – Open Comments and Trade Implications  

The Association strongly supports the EC’s efforts to accelerate the transition toward a circular economy through the upcoming Circular Economy Act, specifically:

•    The Association calls for balanced, innovation-driven approaches that enable scaling of secondary-material markets, harmonised regulatory frameworks, and proportionate obligations for small to medium-sized enterprises (SMEs). 
•    Key ingredients for long-term investment identified by the electronics industry: cross-sector collaboration, digitalisation of reporting systems, and predictable policy timelines. 
•    The Association additionally encourages Members of the European Commission to integrate competitiveness, supply-chain resilience, and climate-neutrality among the key objectives. 

We included recommendations in the following areas: EU-level coordination with a flexible national implementation scheme; handling waste from electronic and electrical equipment (WEEE), as well as waste and circular processes in general; overcoming single market barriers and dealing with EPR systems; proposals for the demand and supply of secondary raw materials.

The Association continues to advocate for and embody the international alignment of electronics standards and wide participation of the industry in rulemaking.

We remain open to dialogue as the Circular Economy Act continues to develop and welcome continued industry feedback on this topic. Contact me (DianaRadovan@electronics.org) for more information. 

Read our full position on the Circular Economy Act.
 

Key Summary

• The Global Electronics Association signed an MOU with KTL to strengthen cooperation in standardization and certification
• The partnership aims to improve reliability, quality, and global certification capabilities for electronic components and systems
• Collaboration will include joint standards development, training programs, and integrated reliability testing
• The agreement supports SMEs in improving product reliability and accessing international markets
• KTL will expand its role in validation, standard compliance, and professional training through this partnership

The Global Electronics Association on November 4 signed a Memorandum of Understanding (MOU) with the Korea Testing Laboratory (KTL) to strengthen cooperation in standardization, validation, certification, and professional training across the electronics industry. This partnership aims to enhance the reliability, quality, and global certification capabilities of electronic components and systems.

The signing ceremony took place in Seoul and was attended by Tae-Seung Song, head of KTL’s digital industry division; Jongwon Kwon, head of the Industrial AI Innovation Center; Sydney Xiao, president, East Asia, Global Electronics Association; and Tina Choi, Korea representative, Global Electronics Association.

Strengthening Industry Reliability and Global Competitiveness

South Korea has identified advanced manufacturing as a national priority—driving growth in sectors such as semiconductors, batteries, and automotive electronics. As manufacturing technologies evolve, the demand for reliability and consistency in electronic assemblies has intensified. Even minor process variations can affect performance and safety, underscoring the need for rigorous inspection standards and quality frameworks.

Through this partnership, the Global Electronics Association and KTL will help small and medium-sized enterprises (SMEs) improve product reliability, streamline certification, and expand access to international markets.

Key Areas of Collaboration

The collaboration will focus on:
•    Joint development of de facto standards for electronics manufacturing
•    Co-hosting training and education programs based on Global Electronics Association standards
•    Integrating reliability testing with international quality frameworks
•    Organizing standardization forums and industry knowledge exchanges

KTL will leverage this cooperation to advance reliability validation, strengthen global standard compliance, and cultivate industry professionals through certification and training initiatives.

Leaders’ Perspectives

“This collaboration marks an important step toward aligning the electronics industry’s quality, reliability, and testing technologies with international standards,” said Tae-Seung Song, head of KTL’s digital industry division. “KTL will continue to serve as a trusted standardization and certification body, supporting domestic enterprises in building global competitiveness.”

Sydney Xiao, president, East Asia, Global Electronics Association, added, “We are delighted to partner with KTL to promote international standardization and reliability across the global electronics industry. By combining our strengths in standards development and testing, we can help manufacturers enhance quality, optimize supply chains, and drive innovation.”

Next Steps

Following the MOU signing, KTL hosted the 2025 De Facto Standardization Forum and Conference on November 6 at the Grand InterContinental Seoul Parnas. In addition, the KTL Academy will hold an IPC-A-610 (CIS) certification course from November 11–14, offering limited free participation for industry professionals.
 

by Diana Radovan, sustainability policy director, Global Electronics Association

Key Summary

• The Global Electronics Association joined a broad industry call urging EU policy makers to adopt the Omnibus package without delay.
• Businesses need regulatory clarity on the Corporate Sustainability Reporting Directive and Corporate Sustainability Due Diligence Directive.
• The compromise proposal from the European Parliament’s JURI Committee is viewed as the most viable path forward for simplifying sustainability rules.
• The Association encourages the European Parliament to secure the compromise and allow swift conclusion of the legislative process.
• The electronics industry looks forward to constructive trilogue negotiations that will finally deliver legal certainty for companies.

The Global Electronics Association recently joined a multi-stakeholder industry call to European policy makers for implementing an impactful omnibus package without delays. Businesses need legal certainty to operate effectively. We echo the recent call by EU political leaders for the swift conclusion and adoption of the Omnibus package on the Corporate Sustainability Reporting Directive and Corporate Sustainability Due Diligence Directive. The compromise proposal reached by the European Parliament’s JURI Committee on the Omnibus represents the most viable approach, at this stage of the process, with regards to the key aspects of the simplification of sustainability rules.

We encourage the European Parliament to take the necessary steps to secure the compromise in a stable manner, paving the way for a timely conclusion of the legislative procedure. We look forward to an efficient and constructive trilogue negotiation process that will deliver the legal certainty that companies are waiting for.

View the full statement.

Key Summary

• Global manufacturing is stabilizing unevenly, with Europe improving, Asia gaining mixed momentum, and U.S. factories hesitant amid data gaps.
• U.S. indicators show cooling labor markets, mixed regional manufacturing activity, and subdued consumer demand.
• Europe’s PMI data signals early recovery supported by easing inflation, steady employment, and improving sentiment.
• China shows tentative industrial stabilization with strong profits, rising high-tech output, and easing deflationary pressure.
• North American PCB and EMS markets remain resilient, with strong year-to-date shipments and healthy book-to-bill ratios.
• New reports examine U.S. electronics manufacturing’s economic impact and U.S.–Mexico supply chain integration.
• Perspectives from the new European Director of Industry Intelligence highlight regional benchmarking, disruptions, and opportunities.

Welcome to Industry Intelligence Insights, your monthly guide to the trends and data shaping the global electronics manufacturing landscape. I’m Thiago Guimarães, Director of Industry Intelligence at the Global Electronics Association, and I’m pleased to share this November edition.

Global manufacturing is showing signs of stabilization, but it’s far from uniform. In this issue, Chief Economist Dr. Shawn DuBravac explores a “patchwork recovery,” where Europe edges toward growth, Asia diversifies its momentum, and U.S. factories tread cautiously amid data disruptions.

You’ll also find the latest Book-to-Bill results, revealing continued resilience in North America’s PCB and EMS markets, as well as new insights from our Global Sentiment Survey and policy research on U.S.–Mexico manufacturing integration. Finally, don’t miss perspectives from our new European Director of Industry Intelligence, Christoph Solka.

Read on for a data-rich view of how the electronics sector is adapting to an uncertain, but opportunity-filled, global landscape. 

Thiago Guimarães 
Director of Industry Intelligence, Global Electronics Association

Market Analysis from Global Electronics Chief Economist Shawn DuBravac

Global manufacturing data released in the last month suggests a patchwork recovery taking shape. While signs of stabilization are emerging in parts of Europe and Asia, momentum remains fragile in the United States, where data gaps from the government shutdown have clouded the near-term outlook. Across major economies, the story is one of divergence: domestic demand is sustaining production in South and Southeast Asia, Europe is inching toward recovery, and China’s industrial base appears to be stabilizing, even as U.S. factories remain cautious. 

The labor market cooled further in August, with nonfarm payrolls adding just 22,000 jobs and the unemployment rate climbing to 4.3%. Manufacturing was particularly weak, shedding 12,000 jobs during the month. Survey data confirmed the slowdown, with the S&P Global flash Manufacturing PMI easing to 52 in September from 53 in August. Still, some resilience remains: durable goods orders surged 2.9% in August, though shipments dipped 0.2%, suggesting uneven demand momentum.

Recent U.S. manufacturing data paints a split picture, one of gradual stabilization beneath the surface but little clear momentum heading into year-end. The two headline national surveys diverged once again. The Institute for Supply Management’s (ISM) Manufacturing PMI fell to 48.7 in October, down from 49.1 in September, signaling contraction. New orders and employment components remained soft, though the prices index moved into expansion, a sign that input costs are on the rise. By contrast, the S&P Global (formerly IHS Markit) U.S. Manufacturing PMI held at a healthier 52.5, pointing to modest growth and hinting that smaller, more export-oriented firms may be faring somewhat better. The split between the ISM and S&P Global measures underscores an uneven manufacturing landscape, where demand and production remain under pressure even as pricing power and output in select industries improve.

At the regional level, the signals were equally mixed. The Chicago PMI remained firmly in contraction at 43.8, consistent with sluggish Midwest factory activity. The Philadelphia Fed’s Manufacturing Business Outlook index dropped to –12.8, indicating continued weakness. The Richmond Fed composite index came in at –4 and the Dallas Fed’s Texas Manufacturing Outlook registered –5.0, both showing modest declines. In contrast, the New York Fed’s Empire State Manufacturing index rebounded to 10.7, marking expansion, and the Kansas City Fed’s Tenth District index rose to 6, suggesting stabilization across parts of the Plains region. Together, the regional surveys imply that the industrial economy remains uneven but not deteriorating, with manufacturing conditions varying sharply by geography and industry.

Measures of consumer demand remain subdued: October consumer confidence (94.6) and final University of Michigan sentiment (53.6) both showed limited improvement, reflecting cautious household spending on durable goods.

Housing-related indicators, which feed directly into materials and equipment demand, are showing tentative stabilization. September existing home sales rose 1.5% month-over-month, and October housing starts, due November 19, will reveal whether construction activity is regaining traction. Broader growth indicators remain steady, with third-quarter GDP expanding modestly and inflation gradually aligning with the Federal Reserve’s target.

The backdrop to these releases is complicated by the ongoing U.S. government shutdown, which has delayed or disrupted several major economic reports. Many data series from the Census Bureau and Bureau of Economic Analysis have not been updated on schedule, including durable goods, retail sales, and portions of trade and construction spending. This lack of visibility creates additional uncertainty gauging trends in demand, pricing, and inventories. The data gap also makes it harder to confirm whether the manufacturing sector’s apparent stabilization reflects real improvement or simply missing information.  Factories appear to be operating in a holding pattern, waiting for clearer signals from consumer spending, input costs, and inventory restocking before committing to a stronger production rebound.

Europe’s October data offered a cautiously improved picture for manufacturing, with signs of stabilization emerging after months of weakness. The Eurozone’s manufacturing PMI for October came in right at 50, marking a return to neutral territory after persistent contraction earlier in the year. Output edged higher while new orders remained flat and employment continued to decline, suggesting that recovery is fragile but underway. The country-level breakdown showed clear divergence: Spain (52.1) and Greece (53.5) led with solid expansions, the Netherlands (51.8) and Ireland (50.9) maintained modest growth, while Germany (49.6) and France (48.8) stayed in mild contraction. Germany’s flash composite PMI for October confirmed that overall growth was driven mainly by services, even as manufacturing lagged slightly below the 50 mark.

Inflation and production data from earlier months continued to highlight the subdued industrial backdrop. The euro area’s August producer price index fell 0.3% month-on-month and 0.6% year-on-year, pointing to easing cost pressures for manufacturers but also weak pricing power. Industrial production for August, released in mid-October, remained soft, suggesting that the sector entered September with limited momentum. Still, broader macro indicators provided modest reassurance. Preliminary GDP for the third quarter rose 0.2% quarter-on-quarter, and headline inflation in October slowed to 2.1% year-on-year, with core inflation steady near 2.4%. Unemployment across the euro area also held at a historically low 6.3%, indicating that labor markets remain resilient despite sluggish factory activity.

Sentiment data echoed the theme of cautious optimism. The European Commission’s October surveys showed the Economic Sentiment Indicator climbing to 96.8 across the euro area, with improving employment expectations. In Germany, the ifo business climate index rose to 88.4 in October and the ZEW investor sentiment index jumped to 39.3, reflecting better expectations for the months ahead even as current conditions remain subdued. The European Central Bank held rates steady at 2% in its October 30 meeting and kept its forward guidance unchanged, signaling confidence that inflation is continuing to normalize without derailing growth.

In the United Kingdom, manufacturing activity offered one of the brighter notes. The October manufacturing PMI hit a one-year high as output returned to growth, helped by the restart of Jaguar Land Rover production and improved supply conditions. European manufacturing readings suggest that while the sector remains uneven across countries, the combination of easing inflation, firmer sentiment, and steady employment is helping the region move closer to a fragile but tangible industrial recovery.

China’s manufacturing sector sent a mixed but increasingly nuanced message in the last month. The latest official manufacturing PMI from the National Bureau of Statistics slipped to 49.0, down from 49.8 in September, signaling renewed contraction. Beneath the headline, production and new orders both edged lower, while new export orders dropped sharply to 45.9, underscoring how weaker global demand and tariff uncertainty continue to weigh on factory activity. Supplier delivery times held steady at 50.0, suggesting little immediate pressure on supply chains.

In contrast, the private RatingDog China General Manufacturing PMI (S&P Global) painted a somewhat brighter picture. It held in expansion territory at 50.6, though that was down from 51.2 a month earlier. Employment in smaller firms ticked up slightly, even as new export orders softened, suggesting domestic conditions might be stable even while external headwinds persist.

Hard activity data released in the last month reinforces the sense of tentative recovery beneath the surface. Manufacturing value-added rose 7.3% year-over-year, outpacing the 6.5% gain in total industrial production. High-tech manufacturing led the way, climbing 10.3% from a year earlier, while the export delivery value increased 3.8%, signaling that some sectors continue to find traction abroad despite global uncertainty. Price indicators pointed to easing deflationary pressure, with the Producer Price Index down 2.3% year-over-year but unchanged month-to-month, an early sign that factory margins may be stabilizing after months of being squeezed.

Profitability data added to that more constructive tone. Industrial profits rose 3.2% year-to-date and an even stronger 9.9% within manufacturing. September alone saw a 21.6% surge in profits compared with a year earlier, the best monthly result in nearly two years, driven by gains across several manufacturing subsectors. Fixed-asset investment in manufacturing increased 4% in the first nine months of the year, buoyed by robust spending on equipment and instruments, which jumped 14%, and especially strong investment in autos and general-purpose machinery.

External demand provided another layer of support. September’s trade figures showed exports rising 8.3% in U.S. dollar terms. Meanwhile, capacity utilization in manufacturing remained relatively stable at 74.8%, highlighting persistent slack but no worsening in overcapacity. In a key upstream segment, the steel industry PMI improved to 49.2 from 47.7, and new export orders hit a 20-month high of 54.3, pointing to firmer momentum in heavy industry.

Taken together, the October data portray a manufacturing sector still feeling the weight of global uncertainty but showing early signs of underlying stabilization. Output and profits are improving, deflationary pressures are easing, and investment is holding steady, suggesting that while growth remains uneven, China’s industrial base is gradually regaining its footing after a prolonged period of strain.

Across Asia, October’s manufacturing and inflation data reveal a region moving at multiple speeds, with stronger domestic demand in Southeast Asia offsetting a softer backdrop in the major North Asian economies. Japan’s manufacturing PMI fell further into contraction at 48.2, signaling ongoing weakness in factory sentiment. Yet industrial production in September surprised to the upside, rising 2.2% month-over-month and 3.4% year-over-year, driven by autos and electronic components. The Ministry of Economy, Trade and Industry described conditions as “fluctuating indecisively,” reflecting the uneven recovery. Retail sales grew just 0.5% from a year earlier, underscoring tepid consumer spending, while Tokyo’s October CPI came in at 2.8%, serving as an early indicator that inflation remains above target but stable. South Korea’s picture was similar: its October manufacturing PMI slipped back into contraction at 49.4, even as exports jumped 3.6% year-over-year, led by a 25% surge in semiconductors and a dramatic 131% increase in ship deliveries. Industrial production in September climbed 12.1% in manufacturing and 6.7% overall, pointing to solid underlying momentum. Inflation accelerated modestly to 2.4%, slightly higher than expected but still manageable.

Elsewhere in North Asia, Taiwan’s manufacturing PMI improved slightly to 47.7, indicating that contraction is easing. The island’s September industrial production surged 16.9% year-over-year, confirming that the technology rebound remains a key growth engine. Inflation data for October are pending, though price pressures remain contained. In South and Southeast Asia, momentum was notably stronger. India’s manufacturing PMI rose to 59.2, among the highest globally, supported by robust domestic demand. The Reserve Bank of India kept its policy rate at 5.50% in its October meeting and raised its FY26 GDP forecast to 6.8% while projecting inflation to moderate to 2.6%. Industrial production was up 4% in August, with September’s report due mid-November, and inflation remains at multi-year lows. In Singapore, October’s manufacturing PMI held at 50.0, with the electronics index slightly stronger at 50.4. Industrial production surged 16.1% year-over-year and 26.3% month-over-month, boosted by biomedical manufacturing, while inflation remained subdued at 0.7% headline and 0.4% core.

Thailand, Vietnam, Indonesia, and the Philippines provided the brightest spots. Thailand’s PMI jumped to 56.6, its fastest pace in nearly two years, as output rebounded and new orders strengthened. Vietnam’s PMI rose into the 54–55 range, signaling strong expansion and improved business sentiment, supported by rising exports and a projected annual trade turnover above $900 billion. Indonesia’s PMI registered 51.2, marking its third straight month of expansion, reflecting resilient domestic demand. The Philippines returned to growth as well, with its PMI at 50.1. Across the region, inflation dynamics were diverse: Korea saw a mild re-acceleration, Japan’s Tokyo core remained near 3%, and Thailand continued to post deflation at –0.7% year-over-year.

Taken together, the global picture is one of tentative balance rather than synchronized strength. Manufacturing activity is no longer uniformly contracting, but neither is it expanding with conviction. Divergent regional trends, including North Asia’s subdued output, Europe’s early stabilization, and Southeast Asia’s domestic-led growth, highlight how uneven the industrial landscape has become. Until global demand strengthens and data disruptions clear, the manufacturing recovery will likely remain fragile, characterized more by resilience and adjustment than acceleration. 
 

Book to Bill

PCB: North American PCB Industry Posts Double-Digit Year-to-Date Gains in Shipments and Bookings 

North American PCB production remained strong in September, with year-to-date shipments up 10.5% and bookings up 13.1% compared to last year. The book-to-bill ratio held at 0.92 as manufacturers cleared backlogs and met sustained demand from AI-driven data center investments, signaling steady momentum heading into Q4. 

EMS: EMS Market Steadies in September, Setting Stage for Continued Growth 

North America’s EMS sector stabilized in September, with shipments edging up 1.1% month over month and the book-to-bill ratio holding strong at 1.31. Year-to-date bookings rose 0.7%, signaling healthy, sustained demand as production and supply conditions continue to normalize heading into Q4.

Global Sentiment

The Current Sentiment of the Global Electronics Manufacturing Supply Chain

The Global Electronics Association’s October 2025 survey reveals a sector navigating mixed signals as it enters the final quarter of the year. 

Recent Reports

Powering the U.S. Economy: The Economic Reach of Electronics Manufacturing 

Even as global growth cools and trade patterns shift, this new analysis from the Global Electronics Association shows that U.S. electronics manufacturing remains one of the most powerful drivers of economic resilience. 

Policy Brief — From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing 

The United States and Mexico share one of the world’s most productive and strategically aligned manufacturing partnerships. This report explores how deeply integrated electronics supply chains between the two nations drive U.S. industrial strength, job growth, and national security.  

Articles 

How Insight Becomes Impact by Chris Mitchell and Christoph Solka

Christoph Solka, the Global Electronics Association’s new Director of Industry Intelligence in Europe, is bringing data to life by connecting research with real-world outcomes. Through market analysis, strategic insight, and engagement across Europe, he’s helping manufacturers benchmark performance, adapt to disruptions, and seize new opportunities in a rapidly evolving industry.  

Cut to the Chase by Dr. Shawn DuBravac

As the Fed begins easing interest rates, manufacturers are entering a new phase of normalization that will demand tighter financial discipline, smarter capital allocation, and careful risk management. DuBravac outlines ten strategies, from recalibrating hurdle rates to hedging rate risk, to help firms navigate higher-for-longer conditions and position for growth in 2026. 
 

Upcoming Events:

• November 18–21, 2025 — Productronica, Munich, Germany: Visit the Global Electronics Association at Stand A1.321, where IPC International Inc. (IPC) will be presenting in forums and hosting its annual hand-soldering competition, and Christoph Solka will deliver industry insight at its booth.
• December 5, 2025 — EMS & Beyond 2025, Tallinn, Estonia: The Global Electronics Association’s Christoph Solka and Anastasia Ederer will deliver key presentations on “The Difficult Developments in the EMS Industry in Europe” and “The EMS Industry in the Baltic States,” offering data-driven insight into regional market dynamics and emerging challenges.
• March 16–19, 2026 — APEX EXPO, Anaheim, California: The Global Electronics Association’s flagship event will feature keynote addresses from IBM Quantum’s David Lokken-Toyli, futurist Zack Kass, and Association President & CEO John W. Mitchell, offering bold insights on quantum computing, artificial intelligence, and the future of global electronics innovation. Register HERE 

By Devan Iyer, Chief Strategist, Advanced Electronic Packaging, Global Electronics Association

Key Summary

• AI is accelerating major changes in component and system-level packaging across advanced electronics.
• Component-level and system-level packaging are parallel domains that must evolve together for next-generation miniaturization.
• AI and data centers require very large packages that integrate GPUs, CPUs, HBM, and co-packaged optics with strong power and thermal solutions.
• Automotive applications rely on wide bandgap semiconductors and specialized substrates for high voltage power module packaging.
• 5G and 6G systems need advanced high frequency device packaging with integrated antenna and low-loss PCB technologies.
• IMPACT highlighted rising packaging complexity, the need for new guidelines, and the critical role of the full supply chain.
• Taiwan’s ecosystem plays a central role in driving packaging innovation and collaboration for global industry needs.

At IMPACT 2025 in Taiwan, a key highlight was the growing influence of AI in electronics packaging design, assembly, and manufacturing. I had the opportunity to lead the session titled “Component to System-Level Integration” alongside experts from AMD, ASE, Kinsus, and Wistron. We explored how packaging technologies are evolving to meet the complexities of today’s AI systems and the future. Additionally, we discussed the critical need for shared guidelines and standards within the industry. 

This discussion captured the goals of the Global Electronics Association’s Technology Solutions team: to collaborate across the industry and identify advanced electronics packaging needs, trends, challenges, and potential paths to solutions, including developing guidelines and standards, highlighting innovations, and driving best practices to keep the industry moving forward. 

There are more than 200 Association members in Taiwan, representing one of Asia’s most advanced packaging ecosystems, and IMPACT is one of Asia’s most influential conferences for advanced packaging dialogue. For the Global Electronics Association, the event provided an opportunity to listen, collaborate, and co-develop solutions that bridge regional innovation with global needs. We supported IMPACT 2025 as a co-organizer, as well as in my role as chair of the session. 

The Pairing of Component + System-Level Packaging

When people discuss component and system-level packaging, they often frame it as a transition from one to the other, as though one replaces the other. These are two parallel domains that must evolve together to enable the next generation of electronic systems miniaturization.

Component-Level Packaging (CLP) focuses on package design, chip-to-package assembly, and testing, which are the foundational building blocks of packaging semiconductor devices ranging from analog and mixed-signal to power and high-speed logic ICs.

System-Level Packaging (SLP) encompasses printed circuit boards (PCBs), printed circuit board assemblies (PCBAs), and subsystems to final system assembly, all of which are essential for high-performance computing, AI data centers, and complex communication and power systems.

Each application area brings unique demands:

• AI /data center applications require large-format packages (as it stands in the range of 120x120- 150x150 mm) that integrate GPUs, CPUs, high-bandwidth memory (HBM), and Co-packaged optical devices and interconnects to transfer data quickly and efficiently. Appropriate power delivery and thermal management solutions are also needed.
• Automotive electronics where power electronics miniaturization plays an important role (along with compute and communication modules), rely on wide bandgap semiconductors (GaN, SiC, and IGBTs), special substrates (Direct Bonded Copper, Anodized Metal Braze, Insulated Metal Substrate, etc.) and die attach processes like sintering, advanced cooler plate attachments, to provide the required high voltage power modules packaging solutions.
• 5G/6G Systems necessitate high frequency (sub THz) device (GaN, GaAs ) packaging and system-level solutions with advanced integrated antenna,  Transmission lines, EMI shields, substrates, and PCBs with low losses.
• Both CLP and SLP technologies are vital for advancing performance, reliability, and system miniaturization. 

For further information on system-level packaging, please consult the Technology Solutions whitepaper, “Advanced Packaging Board Level Integration,” which highlights the technical challenges from a system-level packaging perspective as advanced heterogeneous integrated packages are assembled on the board. 

Takeaways from IMPACT

At this year’s IMPACT conference, three key themes stood out:

1. New guidelines and standards are needed, particularly for large-body package assembly with Co-packaged optics and advanced packages to board assembly supporting AI datacenter architecture.
2. Advanced Packaging complexity continues to rise, driven by system integration across AI & data center applications, and this necessitates advanced co-design methodologies and system-level co-optimization.
3. The supply chain, including EDA, OSATs, PCB, and EMS companies, materials, and equipment suppliers, has a very critical role in these technological and manufacturing advancements, and Taiwan’s ecosystem has a very active participation in pushing the boundaries of system integration. 

At the Global Electronics Association, we play a strategic role in guiding the global transition towards more integrated, scalable packaging ecosystems. Our efforts focus on:

• Developing guidelines and standards for emerging technologies in AI/ Datacenter 5G/6G, and automotive applications.
• Facilitating collaboration across the value chain from OEMs and IDMs to OSATs, EMS, and PCB manufacturers.
• Promotion of updates of existing standards and development of new guidelines/standards, thereby minimizing customization and enabling manufacturing scalability and the industry to achieve scalability and efficiency.

IMPACT was a key platform for the Association to continue a dialogue on advanced electronic packaging in Asia, allowing us to engage directly with regional supply chains, understand local challenges, and share global perspectives. 

We can use this opportunity to co-develop design, assembly, and reliability guidelines with industry partners, which can evolve into formal standards. Taiwan’s strategic role in electronics manufacturing makes it an ideal location for collecting feedback and fostering innovation and collaboration.

Key Summary

• Membership gives companies access to standards, training, research, and advocacy that strengthen competitiveness.
• Members help shape global policy, technical programs, and industry initiatives through active participation.
• Educational resources support workforce development with on-demand training and expert insights.
• A global network provides collaboration opportunities and trusted connections across the electronics ecosystem.
• Company-wide membership ensures all locations benefit from tools that enhance quality, sustainability, and growth.

Across the world, electronics power progress, connecting people, enabling medical technologies, driving defense systems, and advancing smart, sustainable industries. Behind this innovation is a global community ensuring quality, reliability, and responsible growth. The Global Electronics Association unites this community, providing members with tools, training, insights, and connections to stay competitive and shape the future of the industry.

“The Global Electronics Association is more than a name; it’s a reflection of our evolution and our commitment to lead on behalf of a diverse ecosystem,” said Meredith LaBeau of Calumet Electronics. “Innovation today demands collaboration, and the Association is uniquely positioned to foster partnerships across industry and globe.”

Shape the Future of Electronics

Membership empowers your organization to guide industry direction and gain recognition as a leader. Members can:

• Help develop standards, training, and certification programs
• Access exclusive market research and data
• Influence policy and advocacy efforts
• Join advisory committees to shape new products and programs

“As members, we tell the authentic story of how policies affect our business,” said Stephanie Austin of Zentech. “Without the Association’s presence in Washington and globally, our industry risks being underrepresented.”

James Hofer of Accurate Circuit Engineering added, “The Association offers training, guidance, and insight that just can’t be found anywhere else. Being a member is a must.”

Gain Knowledge and Build Skills

In a fast-moving industry, members gain timely insights and educational advantages:
• Exclusive updates on global policy, environmental issues, and advocacy
• On-demand technical education, webinars, and training
• Connections to trusted partners through the Member Directory

“When we needed better workforce training, the Global Electronics Association was the natural choice,” said Michele Winchcomb of Milwaukee Electronics. “Their courses provided essential foundational knowledge.”

A Global Network at Your Fingertips

Membership extends company-wide, giving every location access to tools that strengthen quality, sustainability, and competitiveness.

“The Association supports the industry through critical standards, certifications, workforce development, advocacy, and sustainability,” said Paul Baldassari of Flex. “Its name reflects its international scope and commitment.”

Join Today

Join a worldwide network committed to excellence, innovation, and progress. Learn more at www.electronics.org/membership. With your involvement, we can advance the future of electronics.

By Alison James, senior EU director, government relations

Key Summary

• The European Commission is accelerating its evaluation of the Chips Act to prepare for a potential Chips Act 2.0.
• The Global Electronics Association hosted a workshop to provide industry insights from European PCB and EMS companies.
• Industry leaders emphasized the need for broader support that includes PCBs, PCBAs, substrates, and advanced assembly.
• Participants called for an industrial strategy that recognizes electronics as a critical sector and an enabler of other European industries.
• Companies urged the EC to adopt a European origin threshold and expand funding to modernize factories and increase capacity.

At the request of the European Commission (EC), the Global Electronics Association hosted a workshop this week with European PCB and EMS companies on the European Chips Act. The workshop is part of the EC’s official evaluation of the Act and preparation for consideration of a Chips Act 2.0.

The European Chips Act is scheduled for review in 2026. Amid ongoing geopolitical shifts, the EC is accelerating its evaluation and review process towards an Instrument that meets today’s needs. 

The Global Electronics Association has been advocating in Brussels for a Chips Act 2.0 approach that would better address the needs of critical European industries, including PCB and EMS, during these turbulent times. 

The workshop, introduced by European Commission Chips Act Head of Unit Pierre Chastanet, evidences a potentially new approach by the Commission to better address demand from European critical sectors.  The Commission’s engagement with the PCB and EMS industries in the evaluation suggests that the Commission may be looking to a broader approach in a Chips Act 2.0.

At this week’s meeting, Christoph Solka, the Association’s director of Industry Intelligence, provided an economic overview of the European PCB and EMS industries. Peter Tranitz, senior director of Technology Solutions, highlighted the technical requirements of system-level packaging – the next frontier in electronics, requiring a silicon-to-systems holistic approach. Matthias Pirs, AT&S authorised officer and director of Corporate Affairs, spoke to the role of advanced PCBs and IC substrates as enablers for critical industries. Xaver Feiner, vice president of Zollner Elektronik, presented on Europe’s EMS industry and its crucial role in the electronics ecosystem. 

The Global Electronics Association thanks the European PCB and EMS companies, as well as our partner national trade associations, for their participation and insights at the meeting. Participants provided a clear message on their needs: 

• Recognition of the European electronics ecosystem as a critical industry on its own merits, as well as the realisation that it is the key enabler of most other European critical industries.
• An industrial strategy for the European electronics ecosystem that responds to the requirements and demands of European critical industries.
• Expanded scope of the Chips Act (Chips Act Plus) and/or introduction of new legislation that enables funding and other support for PCBs, PCBAs, and advanced electronics assembly and other parts of the electronics ecosystem to meet the needs of critical European industries. The funding should also enable factory modernization and include expansion to build needed capacity.
• Introduction of a European origin threshold for electronics to meet the needs of the European critical industries. This also functions as a lever to build European industrial capacity where needed most. 

The EC evaluation of the Chips Act is open for response by public consultation until November 28 at the following link https://digital-strategy.ec.europa.eu/en/news/commission-launches-public-consultation-and-call-evidence-evaluation-and-review-chips-act

The EC is seeking feedback from European PCB and EMS companies in this process. In addition, the Global Electronics Association will provide a response to the consultation. For more information, contact AlisonJames@electronics.org