On January 10, 2024, this webinar covered best practices for minimizing and managing flux residues in electronics manufacturing. It addressed risks associated with low standoff components, multiple soldering steps, and incomplete flux activation. The session also outlined methods for qualifying and validating electrical hardware performance to meet IPC J-STD-001H Section 8 cleanliness requirements.

On December 6, 2023, this webinar provided non-professional cybersecurity specialists with essential information and awareness to better understand today’s cybersecurity landscape—no extensive technical background required. The session explored the likelihood of being targeted by a cyberattack and addressed why countermeasures can feel distant from the realities of the production floor. It also highlighted the efforts and limitations of IT engineers, explained the core principles of Zero Trust Architecture, and emphasized the critical role of shop floor personnel in cybersecurity. Additionally, the webinar examined the balance between cybersecurity costs and profitability in manufacturing, and concluded with a discussion of IPC-1792.

On November 15, 2023, we provided an overview of Additively Manufactured Electronics (AME)—a technology that enables 3D printing of functional circuit boards and advanced electronic devices. The session covered key differences between AME and printed electronics (PE), the inkjet manufacturing process, materials, embedded components, applications, and current D-67 standards activity.

Held on October 31, 2023, this webinar featured Dr. Bev Christian presenting "Delivering Engaging Technical Presentations." The session offered practical strategies for improving the clarity, delivery, and audience engagement of technical talks. Attendees learned how to make their presentations more impactful and effective in professional and industry settings.

On September 28, 2023, Stanton Rak, Ph.D., presented a webinar titled "Technical Paper Writing: Industry Best Practices for Conference Manuscripts." In this session, Dr. Rak shared expert guidance on crafting effective technical papers for industry conferences. The webinar covered essential elements of manuscript preparation, including structure, clarity, and adherence to industry standards, providing attendees with valuable insights to enhance their technical writing skills.

On August 30, 2023, IPC hosted a webinar titled "Inspection and Failure Analysis of Bottom Termination Components", presented by William Graver. The session delved into the challenges associated with inspecting and analyzing failures in bottom termination components (BTCs), such as QFNs and LGAs. Attendees gained insights into effective inspection techniques, common failure modes, and best practices for ensuring the reliability of BTCs in electronic assemblies.

This technical webinar, held on June 27, 2023, explored technologies that help wire harness assemblers reduce errors and improve efficiency. Topics included guided insertion of seal plugs and wires, partial harness testing, rapid continuity checks, and troubleshooting. The session also introduced PinMate, an optically guided insertion tool that projects target cavities to prevent mis-wires. Real-world results from an aerospace wire shop were shared, demonstrating how in-process testing and visual guidance can boost quality and productivity in manual assembly.

This informative webinar, held on May 3, 2023, explained the significance of measuring both voiding and coverage of solder joints. The session explored the data behind IPC J-STD-001HA/-A-610HA that supports reliability concerns and highlighted the importance of understanding the distinction between coverage and voiding. It also touched on areas of the industry where these measurements are being adopted and implemented. Attendees gained valuable insights into this critical aspect of electronics manufacturing.

Held on April 18, 2023, this webinar explored how surface mount component and package design can impact the effectiveness of cleaning circuit card assemblies (CCAs), especially for Mil/Aero applications requiring conformal coating. The session introduced “Design for Rinse-Ability” guidelines based on observed residue entrapment and internal component degradation. It also presented findings from an evaluation of solder pastes, highlighting how alternative formulations can significantly reduce flux buildup in cleaning systems and improve long-term reliability and maintenance efficiency.

The webinar, presented by Mike Carano on March 29, 2023, delved into the essential considerations for implementing High-Density Interconnect (HDI) and Ultra HDI technologies in the context of integrated circuit (IC) substrates and advanced packaging. The session explored key factors such as material selection, process optimization, and reliability challenges that are pivotal for the successful adoption of these technologies in modern electronics manufacturing.