IPC Announces New Board Members at IPC APEX EXPO 2022

At the 65th IPC Annual Meeting on January 25, held in conjunction with IPC APEX EXPO 2022, the IPC Board of Directors announced new officers and members. Board officers serve a two-year term; board members serve a four-year term, and student board member serves a one-year term.  

The newly elected Board officers are:

  • IPC Board Chair: Bob Neves, chairman and CTO, Microtek Laboratories
  • IPC Board Vice Chair: Tom Edman, president and CEO, TTM Technologies
  • IPC Board Secretary/Treasurer: Jeff Timms, CEO and General Manager, ASM Assembly Solutions of America

The newly elected Board members are:

  • First-term Board Member: Lisa Weeks, Senior Vice President, Chief Strategy Officer, and Head of Investor Relations, Benchmark Electronics
  • First-term Board Member: Joe DeMan, President, Interconnect Dynamics – An Amphenol Global Solutions Provider
  • Second-term Board Member: Jay Hill, Chief Technology Officer, Molecular Imaging and Computed Tomography, GE Healthcare
  • Student Board Member: Hannah Nelson, Valparaiso University

"IPC is privileged to add these outstanding professionals to our current slate of Board members, said John W. Mitchell, IPC president and CEO. “We look forward to working with them as we advance the global electronics manufacturing industry and build electronics better.”                   

For additional information on IPC's Board of Directors including bios on newly elected Board members, contact Sandy Gentry, IPC communications director, at SandyGentry@ipc.org. For information on IPC APEX EXPO, visit www.ipcapexexpo.org.

Flaws in U.S. Approach to Electronics Manufacturing Require Urgent Changes, or Nation Will Grow More Reliant on Foreign Suppliers, New Report Says

U.S. circuit board sector is in worse trouble than semiconductors, with potentially dire consequences

The United States has lost its historic dominance in a foundational area of electronics technology – printed circuit boards (PCBs) – and the lack of any significant U.S. Government support for the sector is leaving the nation’s economy and national security dangerously reliant on foreign suppliers.  

These are among the conclusions of a new report published by IPC, the global association of electronics manufacturers, which outlines steps that the U.S. Government and the industry itself must take if it is to survive in the United States.

The report, written by industry veteran Joe O’Neil under IPC’s Thought Leaders Program, was prompted in part by the Senate-passed U.S. Innovation and Competitiveness Act (USICA) and similar legislation being prepared in the House. O’Neil writes that for any such measures to achieve their stated goals, Congress must ensure that printed circuit boards (PCBs) and related technologies are covered by it. Otherwise, the United States will become increasingly unable to manufacture the cutting-edge electronics systems it designs.

“The PCB fabrication sector in the United States is in worse trouble than the semiconductor sector, and it’s time for both industry and government to make some significant changes to address that,” writes O’Neil, the principal of OAA Ventures in San Jose, California. “Otherwise, the PCB sector may soon face extinction in the United States, putting America’s future at risk.”

Since 2000, the U.S. share of global PCB production has fallen from over 30% to just 4%, with China now dominating the sector at around 50%. Only four of the top 20 electronics manufacturing services (EMS) companies are based in the United States.

Any loss of access to China’s PCB production would be “catastrophic,” with computers, telecommunications networks, medical equipment, aerospace, cars and trucks, and other industries already dependent on non-U.S. electronics suppliers.

To fix this problem, “the industry needs to intensify its focus on research and development (R&D), standards, and automation, and the U.S. Government needs to provide supportive policy, including greater investment in PCB-related R&D,” O’Neil says. “With that interconnected, two-track approach, the domestic industry could regain the ability to meet the needs of critical industries in the coming decades.”

Adds Chris Mitchell, vice president of global government relations for IPC, “The U.S. Government and all stakeholders need to recognize that every piece of the electronics ecosystem is vitally important to all the others, and they must all be nurtured if the government’s goal is to re-establish U.S. independence and leadership in advanced electronics for critical applications.”

IPC’s Thought Leaders Program (TLP) taps the knowledge of industry experts to inform its efforts on key change drivers and to offer valuable insights to IPC members and external stakeholders. TLP experts provide ideas and insights in five areas: education and workforce; technology and innovation; the economy; key markets; and environment and safety  

This is the first in a planned series by the IPC Thought Leaders on gaps and challenges in the PCB and related electronics manufacturing supply chains.  

Calumet Electronics Earns IPC-1791 QML Recertification

Calumet Electronics further positions itself as an industry leader in printed circuit board and IC substrate engineering for the defense industry with its recent IPC-1791 Qualified Manufacturers Listing (QML) recertification. This designation affirms Calumet's commitment to securing trusted domestic supply chains within the U.S. electronics industry, a critical component of rebuilding and restoring the U.S. industrial base. Calumet Electronics was one of three pilot companies to earn the accreditation when the standard was first introduced.

"Trust is an absolutely critical component of our partnerships with defense OEMs and the Department of Defense," said Todd Brassard, Calumet Electronics VP/COO. "The IPC-1791 QML offers additional evidence of our readiness and ability to handle the most sensitive information and technologies."

IPC standards such as IPC-1791 QML help ensure superior quality, reliability, and consistency in electronics manufacturing. To achieve the status of a trusted supplier, manufacturing facilities are rigorously vetted and undergo an intensive audit process. Stringent requirements for this certification include reviews of a company’s systems, including product and quality, supply chain risk management, facility security, cybersecurity (NIST 800-171), and compliance to export control laws such as ITAR and EAR.

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize Calumet Electronics for continuing to be a member of IPC's network of trusted QML suppliers with their re-qualification as a IPC-1791 trusted fabricator."

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.  

"APCT Inc. Earns IPC-1791, Qualified Manufacturers Listing (QML) as Trusted Electronics Fabricator "

IPC's Validation Services Program has awarded an IPC-1791, Trusted Electronics Fabricator Requirements Qualified Manufacturers Listing (QML) to APCT Inc.'s printed circuit board (PCB) manufacturing facilities in Anaheim and Orange County, Calif.  

Following initial audits by IPC, both facilities passed stringent Type 2 fabricator requirements, helping to optimize product quality, reliability, and consistency across the entire manufacturing operations, earning both facilities a spot on IPC’s global network of rigorously vetted, trusted sources.

Requirements for certification and QML listing to IPC-1791 includes product and quality system, supply chain risk management system (SCRM), security system including compliance to NIST SP 800-171, Export Control Laws (ITAR and EAR), and a chain of custody system (ChoC) review.

Steve Robinson, CEO of APCT Inc. commented on the accomplishment, “APCT is dedicated to the protection of CUI data and the trusted printed circuit board manufacturing needs of our customers. We strive to deliver best in class solutions with our industry leading cycle times, technology and service, as we support the current and future needs of our highly diversified and expanding customer base.”

IPC's Validation Services QPL/QML Program was developed to promote supply chain verification and recognition. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards. The IPC-1791 QML verifies security systems and recognizes companies for either trusted electronic designer, fabricator, or assembler ensuring a high level of integrity.

"IPC's Validation Services Audit Programs uniquely provide technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize the APCT Inc. facilities in Anaheim and Orange County, California on becoming members of IPC's network of trusted QML suppliers."        

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.   

IPC Hand Soldering Competition - Regional Qualification - UK

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IPC would like to invite you to join the United Kingdom regional qualification for the IPC Hand
Soldering Competition (HSC) to be held at Southern Manufacturing and Electronics, Hall #1 –
Stand# M100 from 8 to 10 February 2022. Skilled soldering experts (F/M) will be competing
during 60 minutes on a complex circuit board assembly to win the 2022 United Kingdom
National title, earn a cash prize and a coveted spot at the IPC Hand Soldering World
Championship.

Farnborough International Convention Center - Regional HSC Competition - UK

Show Centre, Etps Road
Farnborough
GU146FD
United Kingdom

Farnborough International Convention Center - Regional HSC Competition - UK

Farnborough International Convention Center - Regional HSC Competition - UK
Show Centre, Etps Road
Farnborough, GU146FD
United Kingdom

Best Technical Papers at IPC APEX EXPO 2022 Selected

Expanded technical conference award categories include NextGen and Student Research

The best technical conference papers of IPC APEX EXPO 2022 have been selected. Voted on by members of the IPC APEX EXPO 2022 Technical Program Committee (TPC), the paper authors will be recognized during show opening remarks on Tuesday, January 25.

“The TPC is absolutely focused on providing highest quality content to the technical conference,” said Matt Kelly, IPC chief technologist. “This commitment to quality is reflected in this year's selection of Best of Conference, NextGen, and Best Student Research papers. We extend our congratulations to all the award winners."

Taking top honors in the Best of Conference category, the winning papers are:

  • “Analysis of a Dynamic Flexed Flat Cable Harness” by Bhanu Sood, Ph.D., NASA Goddard Space Flight Center. His co-authors are Mary E. Wusk, Eric Burke, Dave Dawicke, George Slenski, NASA Langley Research Center; and Stephen Lebair, NASA Goddard Space Flight Center. This paper will be presented during Technical Conference Session 7 on Tuesday, January 25.
  • “Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice” by Kevin Kusiak, Lockheed Martin. This paper will be presented during Technical Conference Session 2 on Tuesday, January 25.
  • “A Critical Analysis of CAF Testing—Temperature, Humidity, and the Reality of Field Performance” by Kevin Knadle, TTM Technologies, Inc. This paper will be presented during Technical Conference Session 11 on Tuesday, January 25.

The NextGen best paper is awarded to:

  • “Bio-based Encapsulation Resins: Good for the Environment, Good for Your Environment” by Beth Turner, Electrolube. Turner will present her paper during Technical Conference Session 28 on Thursday, January 27.

Selected for the Student Research award, the best paper is:

  • “Reliability and IMC Layer Evolution of Homogenous Lead-Free Solder Joints During Thermal Cycling” by Mohamed El Amine Belhadi, Ph.D. Candidate, Auburn University. His co-authors are Xin Wei, Palash Vyas, Rong Zhao, Sa’d Hamasha, Haneen Ali, Jeff Suhling, Pradeep Lall, Barton C. Prorok, all with Auburn University. The paper will be presented at Technical Conference Session 32 on Thursday, January 27.

In addition to the “best of” categories, eight papers were selected in the honorable mention category. Honorable mentions go to:

  • “Towards Artificial Intelligence in SMT Inspection Processes” by Mario Peutler, Continental Automotive GmbH; co-authors Michael Boesl, Johannes Brunner and Thomas Kleinert, Ph.D., Continental Automotive GmbH.
  • “A Multiphase Model of Intermittent Contact in Lubricated Electrical Contacts” by Robert Jackson, Auburn University; co-author Santosh Angadi, Nitte Meenakshi Institute of Technology.
  • “Electro-thermal-mechanical Modeling of One-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc and Indium” by Robert Jackson, Auburn University; co-author Erika R. Crandall, TE Connectivity.
  • “Design and Testing of Three Levels of Microvias for High-Reliability PCBs” by Maarten Cauwe, Ph.D., imec-CMST; co-authors Jason Furlong, PWB Interconnect Solutions; Stan Heltzel, ESA-ESTEC; Marnix Van De Slyeke, ACB; Bob Neves, Microtek Changzhou Laboratories; Kevin Knadle, TTM Technologies.
  • “Recrystallisation and the Resulting Crystal Structures in Plated Microvias” by Roger Massey, Atotech GmbH; co-authors T. Bernhard, K. Klaeden, S. Zarwell, S. Kempa, E. Steinhaeuser, S. Dieter, F. Brüning, all with Atotech GmbH.
  • “Defluxing of Copper Pillar Bumped Flip Chips” by Ravi Parthasarathy, ZESTRON Corporation; co-author Umut Tosun, ZESTRON Corporation.
  • “Reliability SoH Degradation and Life Prediction of Thin Flexible Batteries Under Flex-to-Install Dynamic Folding, Dynamic Twisting and Battery Lamination” by Pradeep Lall, Ph.D., Auburn University; co-authors Ved Soni, Jinesh Narangaparambil, Hyesoo Jang, Auburn University; Scott Miller, NextFlex Manufacturing Institute.
  • “Electromechanical Testing of Flexible Hybrid Electronics” by Mark Poliks, Ph.D., Binghamton University; co-authors Mohammed Alhendi, Behnam Garakani, Udara S. Somarathna, Gurvinder Singh Khinda, all with State University of New York at Binghamton.

All technical conference papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.

To register for the IPC APEX EXPO 2022 technical conference or for more information on all the activities taking place, including professional development courses, exhibition, standards development committee meetings, keynote presentations, networking activities and more, visit www.IPCAPEXEXPO.org.

F2 Webinar Series: Opportunities and Benefits of Digitalization for Small and Mid-Sized Electronics Manufacturers

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Many small to medium size companies are drowning in poorly tracked cost of poor quality, struggling to understand parts and labor and not able to always see the full or real-time picture. Without full, live data, it is nearly impossible to make decisions that can make an outsized impact on cost of poor quality (COPQ). In this session, David Rendel, Quality Business Consultant with QAD, Inc. leads a discussion on how the industry treats quality and the benefits of electronic prevention-based quality systems over reaction-based, siloed quality systems in solving manufacturing problems.

IPC’s Wage Rate and Salary Survey for North American Electronics Assembly Companies Open Until January 28

IPC's biennial wage rate and salary survey for the North American electronics assembly industry is open with a response deadline of January 28. The confidential survey covers compensation for hourly and salaried technical, manufacturing and sales positions at original equipment manufacturers (OEMs) and contract electronics manufacturing services (EMS) companies in North America. It also covers salary budget growth, planned increases for 2022, and employee benefits and policies.                                                      

Companies can use this study to assess their competitiveness in today’s labor market. The data will be segmented by company type, size and region, enabling companies to assess their competitive position as employers within their region and company-size tier. The study also enables companies to benchmark their compensation, benefits and policies against industry norms, and update their human resource management strategies. It is unique in its focus on the North American electronics assembly industry.                                                                                   

The survey is intended for HR professionals and executives who can provide data on a range of positions and policies. Survey participants will receive the report on the findings at no cost. The survey can be accessed at https://survey.alchemer.com/s3/6505112/0e5497220d70. IPC publishes only aggregate numbers and maintains strict confidentiality. The report will not identify participating companies.

For additional information on IPC’s industry intelligence services, visit   www.ipc.org/advocacy/industry-intelligence.