IPC HSC Regional Competition - InnoElectro Budapest

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IPC, in cooperation with InnoElectro, brings the regional hand soldering competition to Budapest, Hungary. Hand soldering competitors will be competing for cash prizes, a team competition and a chance to advance to the World Championships later this year in Munich, German. Here is your opportunity to show off your hand soldering skills at InnoElectro.

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InnoElectro Budapest, Hungary

Budapest
Dozsa Gyorgy ut 1
1146
Hungary

InnoElectro Budapest, Hungary

InnoElectro Budapest, Hungary
Dozsa Gyorgy ut 1
Budapest, 1146
Hungary

Eco-design for a Circular Economy: Best Practices in the Electronics Industry

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The iNEMI/IPC/Fraunhofer Eco-Design Team recently hosted a series of interactive webinars featuring experts from leading electronics companies doing innovative, beyond compliance eco-design. The series provided an avenue for these experts to showcase their thought leadership, identify strategies for success, and their best practices.

Join us for a webinar on March 17 to learn about these best practices, learn from your peers, and get a grip on realistic and achievable eco-design action items.

We expect webinar attendees to be ready to talk about eco-design and to get motivated to take action.

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

Winners of IPC Hand Soldering Competition at Southern Manufacturing & Electronics Announced

In cooperation with Southern Manufacturing & Electronics, IPC hosted its popular Hand Soldering Competition (HSC), on February 8-10. Skilled competitors demonstrated their expertise in hand soldering printed circuit boards while competing for cash prizes.

The first-in-person trade show held in the United Kingdom since the onset of the COVID pandemic, and the first time IPC held a competition at Southern Manufacturing and Electronics, the HSC welcomed 15 competitors, representing 11 electronics companies from the United Kingdom. A technically challenging competition board was introduced this year which resulted in only two of the 15 competitors successfully completing a functioning circuit board assembly.

On the winner’s podium at Southern Manufacturing & Electronics were:

First Place: Justyna Mikolajczyk, ZETTLEX (United Kingdom), completing her board in 57 minutes and 50 seconds, scoring 549 points out of 558 possible points. She received a first-place certificate, cash prize of £300 and a gift from HSC sponsor Almit.

Second Place: Przemyslav Marszalek, TVC-The Validation Center Ltd. (United Kingdom), completing his board in 57 minutes and 56 seconds with 524 points out of 558 possible points. He received a second-place certificate, a cash prize of £200 and a gift from HSC sponsor Almit.

IPC thanks Polygone CAO, who designed this year’s competition board in accordance with IPC-A-610H criteria and featured 116 components that provided a significant challenge to competitors,

IPC-A-610 Master Instructors from ART-Advanced Rework Technologies, an IPC licensed master training center in the United Kingdom, served as competition judges for this year’s competition.

IPC thanks HSC sponsors for their generous support:

  • Gold Sponsors: Hakko, Atelier Systems and Thalès
  • Silver Sponsors:  Almit GmbH, Optilia, SFM-Société Française de Microscopie, and Polygone CAO
  • Local Sponsors: Southern Manufacturing & Electronics and ART-Advanced Rework Technologies.

Upcoming HSC competitions in Europe include:

  • Regional Competition in Hungary -- InnoElectro in Budapest from March 29-31, 2022
  • Regional Competition in Germany -- SMTconnect in Nurenberg from May 10-12, 2022
  • Regional Competition in France -- Global Industrie in Paris from May 18-20, 2022.

For more information on participating in HSC competitions in Europe, contact Philippe Leonard, IPC Europe director, at PhilippeLeonard@ipc.org. Registrations forms will be available on the IPC’s HSC-dedicated page, soon.

Raising Awareness about PFAS Policies Affecting the Electronics Industry

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The evolving global regulatory landscape on per- and polyfluoroalkyl substances (PFAS) continue to affect the electronics industry’s uses of these chemicals in manufacturing processes and final products. To provide information on the complex nature of the emerging chemical and product regulations and the complex nature of the uses of PFAS in electronics, IPC is hosting a free 30-minute webinar.

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

Registration Open for Electrical Wire Processing Technology Expo (EWPTE)

Free of charge, EWPTE offers unique educational and networking opportunities

The Electrical Wire Processing Technology Expo, (EWPTE), to be held in person at the Wisconsin Center in Milwaukee, Wis., May 10-12, is the exclusive showcase for the electrical wire harness, wire, and cable processing industries. Produced by the Wiring Harness Manufacturer’s Association (WHMA), IPC, and the Wisconsin Center District, EWPTE connects buyers with local, national, and international manufacturers and distributors. Registration for EWPTE is free.

In addition to a trade show with leading industry suppliers, EWPTE will host training and education opportunities for attendees, focused on continuous learning in cable and wire harness, with workshops, seminars, and conference sessions.

“EWPTE is a conference and exhibition geared toward decision makers who design, specify, purchase, install, sell, maintain or manufacture electronic cable assemblies, cord sets, wiring harnesses and other related products,” said David Bergman, WHMA executive director. “The 2022 in-person event will provide attendees with a new trade show experience with expanded networking opportunities and increased access to industry solutions.”

Free educational offerings include:

Tuesday, May 10

  • Workshop:  Quality in Wire Processing – Troubleshooting Techniques and Tools Schleuniger
  • Workshop: Beyond Continuity & HiPot Measurements CAMI Research Inc.
  • Seminar: Technological Solutions for the Post-COVID Labor Gap Komax
  • Workshop: Basics of Ultrasonics and Ultrasonic Metal Welding Telsonic Solutions, LLC
  • Workshop: Improving Reliability of Continuity & HiPot Testing CAMI Research Inc.

Wednesday, May 11

  • Seminar: High Voltage Harness Automation – Trends, Challenges and Solutions Schleuniger
  • Seminar: From Design to Test in Minutes: Fast Setup of Cable and Harness Testing Equipment Cirris Inc. and adaptronic, Inc.
  • Seminar: Making Customer's Designs Work for Your Manufacturing Team Cadonix Ltd.
  • Seminar: Islands of Automation: Charting a Course for Design-to-Manufacturing Automation Zuken USA, Inc.

Thursday, May 12

  • Workshop: IPC/WHMA-A-620, Meet the Industry’s Standard WHMA/IPC and Precision Manufacturing Company Inc.
  • Conference Session: Common Misconceptions in Testing - Limits of Fault Detection CAMI Research Inc.
  • Conference Session: Solutions for Final Assembly and Test in Large Installed Applications, Cirris Inc. and adaptronic, Inc.
  • Workshop: WHMA's Wire Harness Operator Program WHMA/IPC

EWPTE will also feature IPCSummerCom, IPC’s standards development committee meetings, to be held May 7-12. For more information on EWPTE, including full descriptions of educational content and to register, visit www.electricalwireshow.com. To learn more about IPCSummerCom, visit www.ipc.org/event/ipc-summercom.

Four Industry Rising Stars Recognized at IPC APEX EXPO 2022

In recognition of their leadership roles and support of IPC standards, education, advocacy, and solutions to industry challenges, four of the industry’s best and brightest were presented with an IPC Rising Star Award at IPC APEX EXPO 2022. Award recipients were Tim Burke, Francisco Fourcade, Thomas Marktscheffel, and Christina Rutherford.

Burke, CTO and co-founder, Arch Systems, was honored for his active membership on the IPC-CFX committee A-team, advancing the ability of factories to collect and analyze machine data using “big data” and machine learning techniques. Burke works on implementing CFX in the field, helping to develop equipment for manufacturing facilities.

Fourcade, a master IPC trainer, was honored for his integral role in several IPC standards development committee A-Teams. A participant in the J-STD-001 A-Team, IPC-A-610 A-Team, Shock and Awe A-Team, Team Kangaroo, Team Iron, Team Bones, and the IPC/WHMA-A-620 Training Committee A-Team, his commitment enabled all teams to fully participate in discussions.

Marktscheffel, a product manager at ASM Assembly Systems, Germany, was honored for his expertise in smart factory implementation, supporting global industry standards such as IPC-CFX and HERMES to provide plug and play connectivity for SMT smart factories. Marktscheffel currently serves on 13 IPC standards development committees.

Rutherford, a materials and process engineer at Honeywell Aerospace, was honored for her leadership of Team Bones, a sub-team developing x-ray guidelines for IPC/WHMA-A-620 for cable and harness. Rutherford, a third-year IPC emerging engineer, serves as a member of the IPC-A-610 A-Team committee, is an IPC scholarship reviewer, and was recently named vice-chair of the 5-24G Polymerics Standard Task Group developing IPC-5262, Design, Critical Process and Acceptance Requirements for Polymeric Applications.

“The leadership shown by our Rising Star recipients has made a significant impact on IPC and will do so for years to come,” said John W. Mitchell, IPC president and CEO. “We are privileged that Tim, Francisco, Thomas and Christina have chosen to share their knowledge and expertise with us and with the entire global electronics manufacturing industry.”

IPC Design Competition Winner Announced at IPC APEX EXPO 2022

Rafal Przeslawski, Xilinx, takes top prize

The inaugural IPC Design Competition at IPC APEX EXPO 2022 resulted in a win for Rafal Przeslawski, Xilinx, whose printed circuit board design earned him the top prize.

In late 2021, printed board design engineers from around the world were invited to compete in IPC’s inaugural PCB Design Competition. Intended to be accessible for anyone with a design tool and an internet connection, this new competition would challenge designers in two heats: an at-home, 30-day full board build, and an ‘in-person’ four-hour routing challenge at IPC APEX EXPO 2022.

In the preliminary heat, 14 designers from all corners of the globe – from India to the Netherlands; Oregon to the United Kingdom – were provided with a schematic, a component BOM, and scope of work document, and were asked to design a board that was compliant with IPC’s various board design standards. The given schematic was representative of a motor control board that included features intended to test the competitors’ understanding of various design methodologies.

Out of 14 preliminary competitors, three finalists were chosen to compete at the finals: Elliot Wakefield, a hobbyist based in the United States, Nick Wallis, an electronics engineer at Tribosonics in the United Kingdom, and Rafal Przeslawski, a hardware development engineer at Xilinx based in Germany.

The finals heat took place at IPC APEX EXPO 2022. The competitors were challenged to complete the design of a nearly complete board – missing only design rules, routing, and a few components left in the margins. “With only four hours to do so, completing the board was a careful balance of thoughtful component placement optimization and design rule definition, and brass-tacks routing,” explained Patrick Crawford, manager, design standards and related industry programs. “The board design was that of a functional, programmable blinky-badge that was actually fabricated and on display at IPC APEX EXPO. In other words, unlike the preliminary heat, the final design was representative of a real-world, functional application.”

At the end of the four hours, each competitor delivered their project file to the judges, who deliberated for two hours, ultimately crowning Rafal Przeslawski as the IPC Design Competition 2022 champion.

European CHIPS Act: Key Implications for the Electronics Manufacturing Industry in Europe

Says action must be paired with rebuilding the broader European electronics manufacturing ecosystem

The electronics manufacturing industry is welcoming the release of the European Commission’s European Chips Act with its strong support for advanced packaging and calling for its swift implementation as part of a broader and equally important strategy to rebuild the European electronics manufacturing ecosystem.

In its proposal, the Commission proposes robust public and private investment in chip fabrication as well as semiconductor packaging. Today, in a post-Moore’s Law environment, electronic interconnection within the package is key to realizing more advanced functionality and economic efficiencies in chip designs. Pairing investments in advanced packaging with investments in chip fabrication is necessary to technological innovation and greater supply chain resiliency.    

“The Chips Act is critically important in ensuring a sustainable supply of cutting-edge chips for Europe’s electronics manufacturers and strategic industries,” said IPC President and CEO John W.  Mitchell. “However, chips don’t function in isolation; they require interconnection with other components via printed circuit boards and PCB assemblies, which are mostly built outside of Europe. To meet the goals of the Chips Act, Europe needs to take a comprehensive approach to bolstering the region’s electronics manufacturing ecosystem.”

IPC has been a leading European voice for a “silicon-to-systems” approach that recognizes the strategic importance of printed circuit board (PCB) fabricators and electronics manufacturing services (EMS) companies. Last April, IPC released a detailed analysis of Europe's strengths and vulnerabilities in these critically important sectors as well as policy recommendations to boost the resilience and competitiveness of the industry in Europe.

Electronic systems are essential to every industrial sector across Europe’s economy and key to delivering on Europe’s digital and green transitions. And yet, the Chips Act perpetuates a far too narrow, triage-like approach to technological innovation focused almost singularly on one segment of the electronics manufacturing ecosystem to the exclusion of the ecosystem upon which it depends. A viable, long-term strategy for innovation and economic growth requries a strong foundation of European electronics manufacturing which largely remains marginalized in the region’s industrial policies.

Alison James, IPC’s Senior Director for European Government Relations notes, “The European electronics value chain has strategic gaps and vulnerabilities which include, but are not limited to, semiconductors. Now more than ever, it is vital that chip investments are made within the framework of a broader strategy designed to strengthen the region’s electronics industry through all its constituent parts.” 

IPC has been making the case to European policymakers that there is a real opportunity now for the EU to deliver on the full potential of the Chips Act by also fostering needed investments in the crucial supply chain including R&D, Packaging, specific equipment, new PCB and EMS facilities and a skilled and educated workforce across the chain. A holistic approach to the sector is needed to ensure future innovation, resiliency, and security. 

IPC looks forward to working with the European Institutions and Member State Governments to implement the Chips Act and to augment it with much needed support for the related industries upon which semiconductor manufacturers rely. IPC calls attention to building Europe’s capacities throughout the electronics value chain, the importance of technological sovereignty without losing sight of working closely with strategic partners to obtain the required resiliency in all supply chains dependent on electronics.