F2 Webinar Series: Leverage A.I. and Predictive Analytics Toward Zero-Downtime, Zero-Defects Manufacturing

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A few percentages of scrap reduction can yield millions of dollars in savings for manufacturers. This has led manufacturing firms to embrace Digital Transformation and leverage the Industrial Internet of Things (IIoT) and Artificial Intelligence (AI) technologies and metrics to achieve greater efficiency and productivity on the shop floor. 

Join Dr. Mo Abuali, CEO and Managing Partner at IoTco, the internet of things company as he steps through the principles of Digital Transformation, the Industrial Internet of Things (IIoT) and Industry 4.0 initiative. We will discuss the “digital tools of the trade” to realize Industry 4.0 in a systematic approach, with focus on the business case ROI, real time connectivity, and predictive AI-enabled technologies for Maintenance 4.0 and Quality 4.0.

Key Takeaways:
• Act now, demonstrate leadership, build the business case for Industry 4.0 and Predictive Analytics, and get started.
• Data first! Digitalization is from the past; predictive analytics and artificial intelligence is the future.
• Industry 4.0 is all about process, technology, and people. Empower your maintenance and quality personnel with predictive and prescriptive insights.
• Experience case studies in electronics and semiconductor industry that leverage Industrial A.I. for improving maintenance and quality significantly.
• A Systematic Approach to “Think Big, Start Small, and Win ROI with AI”

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

Winners of IPC Hand Soldering Competition at productronica in Munich, Germany Announced

New award for best company team presented

In cooperation with productronica 2021, IPC hosted the popular Hand Soldering Competition (HSC), on November 16-19. Skilled competitors demonstrated their expertise in hand soldering while competing for cash prizes. The first-in-person trade show held in Germany since the onset of the COVID pandemic, IPC and productronica welcomed 21 hand soldering experts representing 14 electronics companies.                                                                                                      

On the winner’s podium at productronica 2021: First: Allison Guermond, Safran Fougères (France), completing her board in 59 minutes with 552 points out of 558 possible points. She received the IPC first place certificate, a cash prize of €300, a soldering station from sponsor Hakko, and a gift from sponsor Almit.

Second: Nathalie Foubert, Safran Fougères (France), completing her board in 59 minutes and 10 seconds with 552 points out of 558 possible points. She received the IPC second place certificate, a cash prize of €200, a soldering station from sponsor Hakko, and a gift from sponsor Almit.

Third: Stéphanie Devy, Thalès Six GTS, Cholet (France), finishing her board in 51 minutes, 45 seconds scoring 545 points out of 558 possible points. She received the third-place certificate from IPC, a cash prize of €100, and a gift from sponsor Almit.

New this year – The IPC award to the best company team

IPC and its partner productronica presented a new award, recognizing the best company team in hand soldering. Companies with two or three competitors were automatically entered in the best company competition. The best company award was determined by the best scores of the contestants from that company. This year, 6 companies competed, with the top prize going to: Safran Fougères (France), with the combined score of 1,104 against a maximum possible score of 1,116, completed within the total combined time of 118 minutes and 10 seconds (maximum time allowed 120 minutes).

IPC would like to thank Polygone CAO, who designed this year’s competition board in accordance with IPC-A-610H criteria and feature 116 components providing a significant challenge to contestants, resulting in only ten of 36 competitors completing the assembly within the time allotted.

IPC-A-610 Master Instructors from IPC licensed master training center in France (IFTEC) and in the Nertherlands (PIEK and ETECH), served as competition judges for this year’s competition.

IPC would like to thank Hand Soldering Competition sponsors for their generous support this year:

  • Gold Sponsors: Hakko, Atelier Systems and Thalès.
  • Silver Sponsors:  Almit GmbH, Optilia, SFM-Société Française de Microscopie, and Polygone CAO
  • Local Sponsors: IFTEC, PIEK and ETECH.

The Next HSC competition in Europe will be:

  • Regional Competition in Germany will take place at Smtconnect in Nurenberg, Germany from May 10-12, 2022.

For more information on European hand soldering competitions, contact Philippe Leonard, IPC Europe director at PhilippeLeonard@ipc.org.

North American EMS Industry Down 4.4 Percent in October

IPC Releases EMS Industry Results for October 2021

IPC announced today the October 2021 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.48.

Total North American EMS shipments in October 2021 were down 4.4 percent compared to the same month last year. Compared to the preceding month, October shipments fell 0.8 percent.

EMS bookings in October rose 40.0 percent year-over-year and rose 22.2 percent from the previous month.

“Supply chain constraints and parts availability continue to hamper electronics manufacturing. Order flow grew strongly during the month, while shipments declined,” said Shawn DuBravac, IPC’s chief economist. “I estimate shipments were roughly 12 percent below where they would be in a well-functioning market.”

October 2021 EMS book to bill graph

View chart in pdf format

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

North American PCB Industry Sales Up 6 Percent in October

IPC Releases PCB Industry Results for October 2021

IPC announced today the October 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.15.

Total North American PCB shipments in October 2021 were up 6 percent compared to the same month last year. Compared to the preceding month, October shipments fell 8.9 percent.

PCB year-to-date bookings in October were up 19.8 percent compared to last year. Bookings in October fell 4 percent from the previous month.

“PCB orders fell slightly in October but remain well above 2020 levels and are 2.3 percent higher than 2019 levels,” said Shawn DuBravac, IPC’s chief economist. “Shipments continue to be constrained by supply chain dislocations. Shipments should be roughly 15 percent higher than they were given recent order volume,” DuBravac added.

October 2021 PCB book to bill graph 1
October 2021 PCB book to bill graph 2

View graphs in pdf format

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

New Study Finds Semiconductor Supply Chain Will Remain Vulnerable Without Robust Federal Investment in Advanced Packaging

Stronger IC substrate and OSAT capabilities are needed to realize U.S. semiconductor goals

A new study about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen domestic packaging ecosystem to meet increased production of semiconductor chips, without which the semiconductor supply chain is likely to remain weak and vulnerable. 

The study from IPC is a thorough, data-driven analysis of the global semiconductor and advanced packaging ecosystem. The study highlights the role of advanced packaging in driving innovation in semiconductor designs.

The IPC report makes the case for congressional appropriations of more than $50 billion to support U.S. semiconductor manufacturing, while also underscoring the need to expand advanced packaging capabilities to support the increased production of chips. At a time when the semiconductor supply chain is facing immense pressure, increasing silicon production without bolstering domestic advanced packaging capabilities is likely to lengthen the semiconductor supply chain, as chips will still have to be sent abroad for packaging and assembly into finished products.

“Semiconductor chips are critically important, which is why IPC supports full funding for the CHIPS for America Act. But chips can’t function on their own. They need to be packaged and interconnected with other electronic components in order to power the technology we all rely on, from cell phones to automobiles and beyond,” said John Mitchell, IPC president and CEO. “The data in this report shows that North America is well behind Asia in the advanced packaging of chips and in other key parts of the electronics manufacturing ecosystem.

“The U.S. must adopt a silicon-to-systems approach that strengthens the entire electronics manufacturing ecosystem, including chips, printed circuit boards, and hardware assembly,” Mitchell added. “Addressing electronics manufacturing more holistically is the only way to ensure a more resilient, innovative supply chain that can withstand external shocks in the future.”

Among other conclusions, the study finds that:

  • After more than two decades of outsourcing, the United States can design the most cutting-edge electronics but cannot manufacture them.
  • The offshoring of manufacturing spans the entire electronics ecosystem, including the critically important advanced packaging of semiconductor chips, for which the North American share of global production is just 3 percent.
  • Most urgently, the US needs to invest in development and production of advanced integrated circuit substrates – the base layers used in the packaging of integrated circuit chips – for which there are only nascent capabilities domestically.

“A healthy, capable assembly ecosystem is needed to bring a wide variety of technologies together to manufacture the finished electronics products that make modern life possible. Any disruptions or bottlenecks within this end-to-end ecosystem ultimately leads to delays in new products and innovations, which underscores how critical it is to have a resilient, reliable system,” said Matt Kelly, IPC chief technologist and co-author of the report. “The United States needs to invest across this value chain, from silicon to systems, to successfully meet consumer demands and re-establish the United States as a global leader in electronics manufacturing.”

“The findings of this report make clear that, as a result of decades of offshoring, the United States’ semiconductor supply chains remain vulnerable, even with the new federal funding that’s expected,” added Jan Vardaman, president and founder of TechSearch International and co-author of the report. “It’s critical that the U.S. government recognizes and responds to industry needs on these systemic vulnerabilities, particularly integrated circuit substrates, where domestic capabilities are severely lacking.”

CMMC 2.0 is Here: An Update on the DoD's Cybersecurity Requirements

Date
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Do you do business with the U.S. Department of Defense (DoD)? Have you heard about the latest update to the Cybersecurity Maturity Model Certification (CMMC)?

To help IPC member companies cut through the noise and confusion surrounding the CMMC update, IPC is hosting a free, one-hour webinar on Thursday, December 9 at 1:00 pm EST.

In this webinar, CMMC expert Leslie Weinstein, U.S Army Reserve, will review:

• A detailed breakdown of the changes that have been announced from CMMC 1.0 to CMMC 2.0
• Updated timelines for compliance
• Getting prepared: Steps you need to take now
• Resources available to you

You will leave with an understanding of the changes introduced by CMMC 2.0 and be better equipped to navigate the evolving CMMC landscape.

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

Cybersecurity Maturity Model Certification: Key Benefits

Nov 09, 2021

By Leslie Weinstein, Specialist Leader for Cybersecurity, Deloitte, Member of the IPC Thought Leaders Program

On November 4, the U.S. Department of Defense (DoD) unveiled a much-anticipated update to its Cybersecurity Maturity Model Certification (CMMC) program — called CMMC 2.0 — and electronics manufacturers will want to take note of the changes.

The CMMC program is the DoD's effort to bolster supply chain cybersecurity by requiring vendors to undergo third-party cybersecurity assessments. Under the original CMMC program, launched in 2020, every defense contractor was required to successfully undergo a third-party assessment of their cybersecurity program no later than November 1, 2025.

However, in an IPC survey and report released last June, 24 percent of electronics manufacturers said the costs of compliance with the CMMC could force them out of the DoD supply chain – potentially weakening the defense industrial base (DIB) while seeking to bolster security within it. 

According to the DoD, CMMC 2.0 is designed to minimize barriers to compliance by reducing costs, particularly for small businesses, and by clarifying and aligning cybersecurity requirements to other federal requirements and commonly accepted standards. To achieve this, companies within certain compliance levels will be able to conduct self-assessments in place of a third-party audit. Some companies may also be able to conduct self-assessments if there is a time-bound and enforceable plan in place to remediate any compliance gaps.

Below are the some of the notable differences between the original CMMC program and CMMC 2.0:

CMMC 1.0

CMMC 2.0

5 compliance levels

3 compliance levels:

  • Level 1 remains the same
  • Level 2 is previous level 3
  • Level 3 is previous level 5
  • Elimination of Levels 2 and 4

Level 3 required for Controlled Unclassified Information (CUI)

Level 2 required for CUI

All levels require third-party assessment

Assessment requirements vary by compliance level:

  • Level 1: Requires annual self-assessment
  • Level 2 (no information critical to national security): Requires annual self-assessment
  • Level 2 (handles information critical to national security): Requires triennial third-party assessments
  • Level 3: Requires DoD assessment

Level 3 equivalent to National Institute of Standards and Technology (NIST) 800-171 plus 20 CMMC practices and maturity processes (.999, .998, .997)

No CMMC practices or maturity processes; Level 2 will be equivalent to NIST 800-171

No gaps allowed

(100% compliance required)

  • Some gaps allowed if a Plan of Action and Milestones (POA&M) is in place
  • DoD will establish a minimum score requirement to support certification with POA&Ms
  • 45 critical controls can’t have gaps

 

So, what does this mean for manufacturers within the DIB?

Although many manufacturers may process and handle Controlled Unclassified Information (CUI), most do not handle information that is most critical to national security. As such, manufacturers will be asked to perform and submit only an annual self-assessment of their NIST 800-171 implementation.

However, this does not mean that the manufactures are off-the-hook for cybersecurity compliance. Instead, manufactures must ensure they have a plan to close those compliance gaps. While the threat of an on-site auditor to "kick the tires" has lessened, manufactures should still be ready to answer any questions regarding their compliance posture. As a reminder, the False Claims Act still applies here, and minimum scores are still required to be maintained regardless of self-assessment status. This means that the DoD will have the right to request documentation and proof of compliance at any time during the performance of a contract.

Given the many concerns that were raised about CMMC 1.0, these common-sense changes are a big improvement. IPC’s industry research report and input to a congressional hearing apparently had an impact. The DoD took IPC’s input and that of others seriously, and compliance burdens will be lessened for some of the most at-risk SMEs working within the DIB.

IPC will continue to advocate for the industry's interests in the CMMC program and will continue to help with industry compliance efforts. 

 

 

Biden Administration Implements Vaccine Mandates

Nov 05, 2021
| By Ken Schramko

by Ken Schramko, IPC senior director, North American Government Relations

In a bid to get more people in the United States vaccinated against COVID-19 and decrease the spread of the virus, the Biden administration has announced that it will enforce a new mandate on vaccinations for U.S. companies with over 100 employees.

The new mandate comes in the form of an Emergency Temporary Standard (ETS) issued on November 5, 2021 by the U.S. Occupational Safety and Health Administration (OSHA). To comply, employers must ensure all requirements of the ETS, other than testing for employees who have not completed their entire primary vaccination, are met by December 5, 2021, 30 days after publication. And employers must ensure compliance with testing requirements for employees who have not received all doses required for a primary vaccination by January 5, 2022, 60 days after publication. Employers who violate the rule can face fines of up to $13,653 per violation for serious violations and 10 times that for willful or repeated violations.

It is estimated that the requirement will apply to over 84 million employees at 1.9 million private-sector employers. OSHA estimates that 31.7 million of covered workers are unvaccinated and 60 percent of employers will require vaccinations, up from 25 percent today, resulting in another 22.7 million employees getting vaccinated.

In a related decision, U.S. President Joe Biden, on September 9, 2021, issued Executive Order (EO) 14042 that requires federal contractors to be vaccinated, but without the option of weekly COVID-19 testing. The EO is separate from the OSHA ETS, but in an EO fact sheet it noted that the OSHA ETS deadline for federal contractors to meet the vaccination requirements has also been extended until January 4, 2022.

The EO defines "federal contractor” very broadly and much is still unclear about the rule, but it directs federal agencies to ensure that contracts include a clause requiring contractors and their subcontractors to comply with all guidance for workplace locations, including vaccination of employees except in limited circumstances. The order does not apply to subcontracts solely for the provision of products, and yet, under guidance issued by the Safer Federal Workforce Task Force, federal agencies are being encouraged to make contractors flow down the vaccine requirement to all subcontractors regardless of the exemption.

IPC supports industry vaccination initiatives, among other efforts by government to protect public health. However, we are concerned about the potential overreach and lack of clarity associated with the mandates on federal contractors. 

EPA Extends PIP (3:1) Compliance Date, IPC Member Feedback Needed

Nov 05, 2021
| By Kelly Scanlon

By Kelly Scanlon, director of environmental policy and research

EPA published a new Proposed Rule to further extend the risk management compliance date for PIP (3:1)-containing articles to October 31, 2024. The prohibition on processing and distribution of PIP (3:1) and PIP (3:1)-containing articles will be effective on that date unless we can make a strong case otherwise.

Because the proposed rule highlights electronics, including wiring harnesses, cables, wiring sleeves, casings, and cords, we want to make sure that the electronics manufacturing industry is aware of the likely relevance of the 2024 prohibition.

We encourage you to review our Request for Information for a detailed list of data and documentation needed to prepare a response to EPA. IPC will continue to collaborate with CTA and ITI to gather the electronics industry’s feedback. We do not plan to oppose the newly proposed extension, but we will request to EPA that it be based on a “manufactured by” compliance date. Also, we will reiterate to EPA our earlier requests to establish an adequate de minimis concentration and to provide specific exemptions including for spare and replacement parts.

We anticipate that the electronics industry will have new or additional data and information based on its efforts to identify PIP (3:1) in its supply chain since the January 2021 final risk management rulemaking.  Also, we anticipate industry members will have more economic impact information to support a request for an exemption for spare and replacement parts. We welcome your feedback in response to the Request for Information by December 1, 2021.

Please see our earlier blog posts regarding PIP (3:1). I welcome your questions about this proposed rule and the recent history of PIP (3:1)-related policy actions.  KellyScanlon@ipc.org

IPC Issues Industry Alert on Prohibition of PIP (3:1), March 1, 2021

USEPA Announces Request for Public Input on PIP (3:1) Final Risk Management Rule, March 12, 2021

Electronics Industry Submits Comments on EPA’s PIP (3:1) Request for Public Input, May 17, 2021

PIP (3:1) Compliance Deadline Extended…At Least Two More Rules Expected, September 8, 2021

 

WHMA 29th Annual Wire Harness Conference Offers Technical Education Workshop on Federal Contract Opportunities

Participants to learn how to do business with the federal government

Representatives from the U.S. Small Business Association (SBA), Arizona District Office, will present a technical education workshop, “Selling to the Federal Government,” on February 15, from 3:00-4:30 pm, at the 2022 WHMA 29th Annual Wire Harness Conference in Tucson, Arizona. 

Speakers at the workshop will provide information about SBA resources and certification programs that help small businesses successfully identify and compete for federal contract opportunities. 

“According to the SBA, the federal government spends approximately $500 billion in contracts every year, with 23 percent of those dollars required to be awarded to small businesses,” said David Bergman, WHMA executive director.  “We look forward to learning how the SBA can help company owners in the cable and wire harness industry do business with the federal government.”

For more information on the conference including schedule, exhibition, speaker profiles, sponsorship opportunities, or to register for event, visit https://annualconference.whma.org.

 

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