IPC E-Textiles 2023

Date
- (10:00am - 7:00pm CST)

IPC E-Textiles 2023, the international conference for the e-textiles industry, will be back live and in person Monday, January 23, 2023 in San Diego, California, in conjunction with IPC APEX EXPO 2023! Professional Development Courses about e-textiles and wearable electronics are also welcome for Sunday, January 22, 2023.

Collaborate with industry leaders in e-textiles technologies in fashion design, health and medical, sports and athletics, automotive, and military/aerospace. Every aspect of the e-textiles supply chain will be represented. This global e-textiles industry event allows product designers, technical experts and company executives from around the world to collaborate on new ideas, view and get hands-on access to the latest innovations, and learn how to build reliable products.

By aligning the conference with IPC APEX EXPO, the premier event for the electronics manufacturing industry, speakers and attendees will also have the opportunity to participate in IPC E-Textiles Committee standards meetings and take advantage of all events and education offered during IPC APEX EXPO.

San Diego Convention Center

111 W Harbor Dr
San Diego, CA 92101
United States

San Diego Convention Center

San Diego Convention Center
111 W Harbor Dr
San Diego, CA 92101
United States

Fill The Void V - Mitigation of Voiding for Bottom Terminated Components

Member Download (pdf)

Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables, but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).

When voiding is an issue, it is often not possible to change the solder paste or circuit board design due to end user requirements and time constraints. It is much easier to change the stencil design and the reflow profile in an effort to reduce voiding, and this can be done in a timely manner. Stencil design and reflow profile can be used to minimize voiding for BTCs like Quad Flat No Lead (QFN) components. Optimization of the windowpane size and web width can help with voiding. Changing the volume of solder paste on the I/O perimeter pads of QFNs also has an effect on voiding. Use of linear ramp-to-spike (RTS) reflow profiles reduces voiding with some solder pastes, while ramp-soak-spike (RSS) profiles work better for other solder pastes. Stencil design and reflow profile were optimized for a variety of QFN components in order to minimize voiding. The results of this testing were quantified, summarized and recommendations given for ideal voiding performance.

Author(s)
Tony Lentz, Greg Smith
Resource Type
Technical Paper
Event
IPC APEX EXPO 2020

North American PCB Industry Sales Up 2.1 Percent in April

IPC releases PCB industry results for April 2022

IPC announced today the April 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.03.

Total North American PCB shipments in April 2022 were up 2.1 percent compared to the same month last year. However, compared to the preceding month, April shipments fell 20.4 percent.

PCB year-to-date bookings in April were down 14.3 percent compared to last year. Bookings in April fell 5.4 percent from the previous month.

“PCB shipments have been marginally stronger than bookings through the first four months of the year. Shipments are up 6.7% compared to a decline in bookings of 2.6%,” said Shawn DuBravac, IPC’s chief economist. “The disconnect between shipments and orders is likely driven by backlogs for other components. Companies are disinclined to place PCB orders if they are waiting on other components. Despite strong shipments, the book-to-bill remains above 1.”

April 2022 PCB btb chart 1
April 2022 PCB btb chart 2

View charts in pdf format

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

EMS North America Industry Report, April 2022

IPC releases EMS industry results for April 2022

IPC announced today the April 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.36.

Total North American EMS shipments in April 2022 were up 4.3 percent compared to the same month last year. Compared to the preceding month, April shipments fell 10.7 percent.

EMS bookings in April fell 7.2 percent year-over-year and 2.4 percent from the previous month.

“EMS shipments continue to be constrained by supply chain disruptions and have been unable to keep pace with orders,” said Shawn DuBravac, IPC’s chief economist. “Shipments are 2.7% below last year's pace through the first four months of the year, while bookings are up 9.7% over the same time horizon.”

April 2020 EMS book to bill ratio charts

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

AirBorn Inc. Requalifies for IPC/WHMA-A-620 Qualified Manufacturers Listing

IPC's Validation Services Program has awarded a requalification of the IPC/WHMA-A-620 Qualified Manufacturers Listing (QML) Class 3, to AirBorn Inc. for two U.S. locations: Georgetown, Texas and Lake City, Pa. AirBorn Inc. continues to be a trusted source and supplier to original equipment manufacturers (OEMs), meeting the stringent requirements of one of IPC's foremost standards: IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.

During the IPC Validation Services QML audit, AirBorn Inc. fulfilled or exceeded the requirements for the electronics industry’s most rigorous classification, Class 3, which is intended for high-performance electronics assemblies. The company continues to be recognized as an IPC trusted source capable of manufacturing in accordance with industry best practices. “AirBorn Inc. is very proud to have their Georgetown, Texas and Lake City, Pennsylvania facilities requalified to IPC/WHMA-A-620,” said Jen Nelson, AirBorn Inc.’s vice president of operations and supply chain management.

IPC's Validation Services QPL/QML Programs were developed to promote supply chain verification and recognition. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize AirBorn Inc. for maintaining their participation in IPC's network of trusted suppliers.”

EWPTE, the Cable and Wire Harness Industry’s Exclusive Trade Show Returns as In-person Event and Draws More than 2,500 Attendees

From revolutionary advancements in electrical wire processing technology displayed on the show floor to expert insights conveyed in reimagined training and educational offerings, the Electrical Wire Processing Technology Expo (EWPTE), provided expanded networking and increased access to industry solutions that helped 2,574 attendees address business challenges and prepare for the future. The 2022 event was produced for the first time by the Wiring Harness Manufacturer’s Association (WHMA), IPC and the Wisconsin Center.

“We were thrilled to reconvene and reconnect after a two-year hiatus,” said Joe DeMan WHMA Board Chair, “but we were back and better than ever!” Our goal was for attendees and exhibitors to leave ‘wired and inspired’ and take their ideas and innovations developed on-site and turn them into real-world solutions and business opportunities.”

In workshop, seminar and technical conference sessions, attendees had access to new research on troubleshooting techniques, reliability, design, testing, and harness automation.

From attendee survey responses, attendees clearly achieved their business objectives while at the event. “EWPTE provides a great opportunity to see machines, suppliers, and tools in person to get a better understanding of the changing technology in wire processing. It allows me as a spectator to see new technology and machines in action that you can't see on a website or in a brochure. The variety of exhibitors and their products and services inspired me to think about other areas of my production and how I can improve them,” said Luke Morrill, manufacturing engineer, Peterson Engineering.

The EWPTE 2022 experience was equally positive for the 156 exhibitors who showcased their products and services on 37,100 square feet of show floor space. Total leads generated for exhibitors in 2022 was 8,929 according to lead count data.                       

“The overall show experience met and, in some cases, exceeded our expectations,” said Greg Wasko, executive vice president-partner, Mecal by Starn. “We could list many things that made the show great. What really matters… We more than doubled our leads from any show previously. Thank you IPC/WHMA staff for a job well done!”                                                          

Added Darren Teasck, president/managing director, Schleuniger, “The Schleuniger team was excited to return to Milwaukee and very pleased with the level of activity. After the events of the last couple years, it was more important than ever to reconnect face to face with customers, colleagues, and attendees. We enjoyed the opportunity to engage in person and look forward to seeing everyone again next year.”         

In 2023, EWPTE will return to the Wisconsin Center, May 16-18. For more information, visit www.electricalwireshow.com.

 

IPC Establishes European Subsidiary

To better support our European members’ interests, IPC announces the formation of IPC Electronics Europe GmbH. The subsidiary was officially registered with the German government on May 4, 2022. The new entity’s main office is located in central Munich.                   

John W. Mitchell, IPC president and CEO commented, “While we have been actively engaged and successful in Europe for more than 30 years, having a legal entity here now enhances our ability to serve the regional electronics industry and our membership in newer and bolder ways with renewed vigor.”

“We are very excited about the prospects of actively participating in significant consortiums and working groups in the EU to help drive newer standards, education, and advocacy solutions that will be vital in transforming the continent’s factories of the future,” said Sanjay Huprikar, president of IPC in Europe and South Asia.                     

IPC has plans in place to expand staff in Europe in addition to Francisco Fourcade who joined IPC in April as electronics standards manager to liaise with the growing number of new standards development committees forming in Europe. The organization will be adding talent to the certification, marketing, and industry intelligence teams over the next 18 months.

For more information on IPC Electronics Europe GmbH and the new office location, contact Philippe Leonard, senior director of operations, at PhilippeLeonard@ipc.org.

New IPC Initiative Focuses on E-mobility Quality & Reliability

From battery fires to non-functional charging stations, from dendrites to poor cable connections, electronic system failures have caused massive recalls. Failures are increasing significantly, not because of quality, but because of usage and implementation of technology. As the expected lifetime usage of parts increases and technology applications change, materials, approaches, and test parameters must change as well.

Inspired by the opportunities to collaborate on solutions, a representative group of suppliers to the automotive industry formed the IPC EV (Electric Vehicle) Quality and Reliability Advisory Group to assure design, materials, and process optimization and qualification to achieve reliability and quality in electronics for e-mobility and advanced driver assistance systems (ADAS) applications while protecting innovation. Issues under discussion include current surface insulation resistance (SIR) standards, higher voltage, board density, cleaning, bare board materials, and power.

“A failure in a consumer electronics product like a game console or control board on a dishwasher is an inconvenience. A failure in a critical system in an EV can be catastrophic,” said Brian O’Leary, global head of e-mobility and infrastructure, Indium Corporation and Chair of the EV Quality and Reliability Advisory Group.

The newly formed advisory group is already preparing presentations for upcoming automotive industry events, including The Battery Show in Novi, Mich. on September 14, 2022. As part of these presentations, the group will share current problems and best practices toward higher reliability and protection against future field failures. Through presentations and panel discussions the group aims to create open discussions about process issues and further improve supply chain communication to allow a solid base for solution creation as new issues arise.

“IPC has a long history of helping deliver quality, reliability, and consistency in the design and manufacturing of products and we’re excited to be able to work with the industry to do the same for automotive, especially with the new demands of electrification,” said Tracy Riggan, IPC senior director, Solutions. “We look forward to growing the community of people invested in high-reliability electronics.”

In addition to Indium Corporation, companies on the EV Quality and Reliability Advisory Group include Robert Bosch, Continental Automotive, Kyzen, TCLAD, Aqueous Technologies, Semikron Elektronik GmbH, MicroTek Laboratories, Custom Interconnect, Dow Chemical, and HumiSeal. To learn more about the group, its activities or how to join, contact Tracy Riggan at TracyRiggan@ipc.org.

WHMA Announces New Hall of Builders Award at EWPTE 2022

Tom Andrasek, Pressmaster U.S., first recipient of award

The Wiring Harness Manufacturers Association (WHMA) introduced a new industry award, the WHMA Hall of Builders Award, during the Electrical Wire Processing Technology Expo (EWPTE) in Milwaukee, Wisconsin on May 11, 2022.

The Hall of Builders Award was created to honor individuals from WHMA-member companies who have made significant contributions toward advancing the cable and wire harness industry. Hall of Builders inductees are industry veterans, leaders, and mentors retiring from active employment, but whose legacies live on in the wire and cable industry, today.

Tom Andrasek, sales manager at Pressmaster U.S., the first recipient of the WHMA Hall of Builders Award, epitomizes service and contribution to the cable and wire harness industry. Andrasek was personally involved in the development and introduction of more than 500 discrete hand tool crimp solutions for the North American market, promoting quality crimp solutions for 37 years.

“Tom is known by colleagues as the godfather of connector crimping and educated connector manufacturers on how to achieve a ‘quality crimp’ while continuing to build the North American Market,” said Joe DeMan, WHMA Board chair. “We’re thrilled to present him with the first Hall of Builders Award, and to thank him for his outstanding contributions to the cable and wire harness industry.”                               

“We are privileged that Tom has chosen to share his knowledge and expertise with the wire harness manufacturing industry,” added David Bergman, WHMA executive director. “His leadership has made a significant impact and will do so for many years to come.”             

To nominate candidates for future WHMA Hall of Builders award, visit https://whma.org/recognition/ for award criteria and nomination form.