North American PCB Industry Sales Begin 2021 Up 4 Percent

IPC Releases PCB Industry Results for January 2021

IPC announced today the January 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.14.

Total North American PCB shipments in January 2021 were up 4 percent compared to the same month last year. Compared to the preceding month, January shipments decreased 16 percent.

PCB bookings in January increased 17.6 percent year-over-year. Bookings in January decreased 9.2 percent from the previous month.

“PCB shipments fell in January a bit more than expected given recent order trends,” said Shawn DuBravac, IPC’s chief economist. “The slowdown in shipments is driven in part by constraints on semiconductor availability which in turn is exerting pressure on other parts of the supply chain.”

PCB Book to Bill Chart 1 January 2021
PCB Book to Bill Chart 2 January 2021

View charts in pdf format

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

 

 

Best Technical Paper at IPC APEX EXPO 2021 Selected

The best technical conference paper of IPC APEX EXPO 2021 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will be recognized during show opening remarks on Tuesday, March 9.

Taking top honors, the winning paper is, “Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction” by Sarah Czaplewski, IBM Corporation. Her co-authors were: Roger Krabbenhoft and Junyang Tang, IBM Corporation. This paper will be presented during Technical Conference Session 14 (BF5-PCB Design - HDI and Signal Integrity Considerations) on Thursday, March 11.

This year, two papers were selected in the honorable mention category. Honorable mention goes to, “Board Thickness Effect on Accelerated Thermal Cycle Reliability” by Joe Smetana, Nokia. His co-authors included: Richard Coyle, Nokia; Eric Lundeen, BAE Systems; Iulia Muntele, Sanmina; Scott Danko, TTM; Neil Hubble, Akrometrix; and Bev Christian, HDPUG. This paper will be presented during Technical Conference Session 9 EE3 (HDP Projects Progress) on Wednesday, March 10.

Honorable mention also goes to “Analyzing Printed Circuit Board Voiding and other Anomalies when Requirements Covering the Anomalies are Vague” by Wade Goldman, The Charles Stark Draper Laboratory, Inc. His co-authors were: Hailey Jordan and Curtis Leonard, The Charles Stark Draper Laboratory, Inc. This paper will be presented during Technical Conference Session 3 EE1 (PCBA Quality, Reliability, and AI-based Inspection) on Wednesday, March 10.

The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.

To register for the IPC APEX EXPO technical conference or for more information on all the activities taking place, including professional development courses, online exhibition, keynote presentations, networking activities and more, visit www.IPCAPEXEXPO.org.

EMS North America Industry Report, January 2021

IPC Releases EMS Industry Results for January 2021

IPC announced today the January 2021 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.18.

Total North American EMS shipments in January 2021 were up 9.7 percent compared to the same month last year. Compared to the preceding month, January shipments fell 6.4 percent.

EMS bookings in January fell 5.4 percent year-over-year but increased 10.2 percent from the previous month.

EMS book to bill ratio chart January 2021

View chart in pdf format

“The EMS sector carried last year's momentum into 2021,” said Shawn DuBravac, IPC’s chief economist. “Strong January orders should help drive shipments in the coming month.”

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

IPC Commends President Biden for Executive Order on Industrial Supply Chains

IPC commends President Biden for ordering a review of industrial supply chains critical to U.S. economic growth, innovation, and security.

The crippling shortage of semiconductor chips underscores the economic and national security importance of restoring U.S. leadership in electronics manufacturing.       

The U.S. printed circuit board industry, which once accounted for more than 30 percent of total global production, today accounts for less than 5 percent. Only four of the top 20 electronics manufacturing services (EMS) companies are based in the United States.                                                                                  

Since around 2000, the drive for low-cost electronics has pushed hardware manufacturing offshore, often to countries that understood the strategic importance of electronics manufacturing and heavily promoted and subsidized the growth of their domestic industries.                                                                                 

But this drawdown in American manufacturing has increased volatility and undermined the supply chains that are critical for electronics manufacturing and other sectors to operate smoothly. And this isn’t the first time that we’ve experienced shortages as a result. During the pandemic, a shortage in printed circuit boards slowed the production of ventilators when hospitals around the world were in desperate need.    

As the Biden administration undertakes its review of U.S. supply chains, IPC urges it to recognize two important realities about electronics manufacturing:

  1. Electronics manufacturing is a foundation for the manufacturing sector across the U.S. economy. Virtually every other sector relies on electronics to greater or lesser extent.
  2. U.S. leaders must see the electronics supply chain as an ecosystem. All segments of the electronics industry must be strong for the entire ecosystem to thrive. Semiconductor fabrication is just one segment in a sophisticated, global supply chain for electronics.

The good news is that the time is ripe for greater U.S. government support of manufacturing. The industry is on the cusp of transformation, powered by artificial intelligence, automation, quantum computing, and blockchain technologies. With U.S. government support, American companies will find new opportunities to compete in the global marketplace while creating new, skilled jobs for American workers.                             

The review ordered by President Biden should assess electronics manufacturing holistically. Praiseworthy investments in semiconductor manufacturing (including those envisioned in the CHIPS for America Act) also require investments in other segments of the industry. The government should support the industry’s migration to the factory of the future by creating and sustaining programs to drive capital expenditures, workforce education and credentialing, research and development of core technologies, and more robust domestic availability of raw materials. 

IPC MITs to Utilize IPC APEX EXPO Professional Development Courses to Earn Continuing Education Points Toward Recertification

Master IPC Trainers (MITs) working to renew certification through continuing education now have an additional 29 opportunities via professional development courses offered at IPC APEX EXPO 2021.    

An MIT certificant seeking to renew their certification must obtain a minimum of 25 points during their two-year period of certification. All 29 IPC APEX EXPO professional development courses offered both live and on-demand provide one point per one contact hour and are applicable toward continuing education requirements.         

Certificates of attendance will be e-mailed to all registered professional development course participants who complete one or more courses.                        

“Professional development is an integral component to IPC certification, as it allows a certificant to enhance their professional education while keeping them up to date on key topics within the industry,” said Dave Hernandez, IPC vice president of education. “IPC APEX EXPO’s professional development course offerings are perfect for a Master IPC Trainer who wants to take an advanced course on assembly processes, PCB fabrication, circuit design and component technologies, and more.”

For more information on professional development courses at IPC APEX EXPO 2021, visit www.ipcapexexpo.org.         

IPC Releases IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)

The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs) is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.              

IPC-7093A includes a step-by-step process on how to design and incorporate BTCs into any card layout. Comprehensive descriptions on how to successfully implement robust designs and assembly processes and troubleshooting guidance for common anomalies which can occur during BTC assembly are included.               

Revision A adds state-of-the-art guidance on critical elements for thermal pad design, thermal via usage, stencil design, assembly recommendations, reliability considerations, known issues/ defects to avoid. The standard’s multiple design point options enable reliable BTC designs.                                                                               

The standard is ideal for anyone involved with physical design, process and reliability engineers or managers who are responsible for design, assembly, inspection, and repair processes.                                                                                                          

“BTCs are in integral part of electronic designs today,” stated Matt Kelly, IPC chief technologist. “With increased product functionality, device miniaturization, and increased power consumption the need for optimized thermal management has never been higher.”                                           

For more information or to purchase IPC-7093A, visit the IPC Online Store.

Executives to Discuss Managing Challenges in Periods of Transition at IPC APEX EXPO 2021 Managers Forum

New and experienced managers will gather at the Managers Forum at IPC APEX EXPO on March 8 to discuss strategies for thriving during times of crisis.

Internationally recognized executives and technologists will offer lessons learned during past disruptions such as transportation interruption, trade restriction, labor shortages, lockdowns, and technology innovation. Attendees will gain insight into how to solve problems with applications that lead to factory of the future implementation, including information on employee upskilling, materials, analytics, artificial intelligence, and robotics.

Industry experts and innovators will lead discussions on a wide range of topics for managing in times of transition, and emerging stronger. Representatives from FTG Corporation, Rogers Corporation, Cirtronics, Atotech Group, American Standards Circuits, Germany Industry 4.0 Campus, Luminovo GmbH, General Dynamics, GreenSource Fabrication & GreenSource Engineering, Schweitzer Engineering Laboratories, Vicor Corporation, Green Circuits, and IPC will provide critical insight on how best to move forward when presented with industry’s toughest challenges.

“Our industry has weathered many tough periods and learned from them every time,” said Tracy Riggan, senior director, business development at IPC. “This past year has yielded more than its share of disruption with the pandemic complicating existing geopolitical tensions, labor shortages and speeding up already increased technology advancement and causing logistics interruption and part shortages. These challenges continue and our early responses inform our success at meeting them now and being better prepared for the next big impact.”

“The purpose of the Managers Forum is to give managers of all experience levels the opportunity to gain new insights and learn firsthand how peers are achieving their goals and strengthening their organizations to ensure growth, especially during periods of uncertainty,” said Gene Weiner, president, Weiner International Associates and IPC Hall of Fame Council Program Chair, responsible for Managers’ Forum programming.

To register for the Managers’ Forum, or for more information on all the activities taking place at IPC APEX EXPO, including the technical conference, professional development courses, networking activities and online exhibition, visit www.ipcapexexpo.org.