Virtual classes held Tuesday and Thursday from 3:30 p.m - 6:30 p.m. ET

Description

This course provides the skills necessary to effectively implement designs requiring flex and rigid-flex circuits in accordance with product requirements. The class also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation. 

Taught by an IPC-certified industry expert with 25+ years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required to design flex and  rigid-flex boards. 

PCB Design for Flex & Rigid-Flex Boards This course is ideal for designers, engineers, technicians, and other individuals who want to develop the skills required to create flex and rigid-flex designs.

LEARNING AND PERFORMANCE OBJECTIVES 

This program is designed to provide circuit board designers with a balanced foundation of theoretical knowledge and practical skills in flex/rigid-flex circuit board design.

Upon completion, participants will be able to:  

• Design flexible / rigid-flex board designs.
• Understand the trade-off of flexible PCB materials.
• Define a board stackup that implements flexible and rigid-flex structures.
• Import and / or define board outline geometry for complex flexible board shape.
• Understand and mitigate signal integrity issues with flexible circuits.
• Understand and define effects of mechanical retention on flexible substrates.
• Define and implement component packaging methodologies to mitigate effects of bending on component stresses.
• Understand and mitigate effects of bending stresses on conductive patterns in flexible circuits. 

Tuesday and Thursday 8:00 am – 11:00 am

Description:

Taught by an industry expert with more than 40 years of experience in the field, this 3-week online program is designed to provide the knowledge and skills necessary to reduce or eliminate design, documentation, and capability issues that often arise when completed PCB designs are sent to the fabricator for production.  

Course Content

• DfM Course Introduction, Fabricator Capability and Materials
• Panelization, Stackups and Surface Finishes
• Conductive Features, Holes/Vias and Other Mechanical Features
• Masks and Inks, Impedance and Signal Loss, and Electrical Test
• FPC, Documentation and Specifications

Participants receive the following helpful documents developed by Korf Consultancy LLC.

PCB Fabrication Design Rules
This editable document is designed to help PCB designers avoid many of the issues identified during the fabricator’s initial DFM review. It provides an extensive list of sample design rule parameters that designers can use to ensure that their designs are compatible with fabricator capabilities before the fabricator’s initial review. These globally representative design parameters are based on the most recent PCB design requirements.

Rigid PCB Fabrication Acceptance Specification 
This editable document provides recommended qualification and performance specifications for all IPC-6012 requirements defined as AABUS (As Agreed Between User and Subscriber). Designers can use this document to inform fabricators of their company’s specific manufacturing, documentation, and quality requirements, inclusive of those that do not appear in IPC Standards.

Aug 9, 2022 - Sep 15, 2022
Tuesday, Thursday
6:30 pm ~ 8:30 pm America/New_York

Enrollment Period
Dec 16, 2021 - Sep 29, 2022

Description

This course provides the skills necessary to effectively implement designs requiring flex and rigidflex circuits in accordance with product requirements. The class also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation. 

Taught by an IPC-certified industry expert with 25+ years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required to design flex and  rigid-flex boards. 

PCB Design for Flex & Rigid-Flex Boards This course is ideal for designers, engineers, technicians, and other individuals who want to develop the skills required to create flex and rigid flex designs.

LEARNING AND PERFORMANCE OBJECTIVES 

This program is designed to provide circuit board designers with a balanced foundation of theoretical knowledge and practical skills in flex/rigid-flex circuit board design.

Upon completion, participants will be able to:  

• Design flexible / rigid-flex board designs.
• Understand the trade-off of flexible PCB materials.
• Define a board stackup that implements flexible and rigid-flex structures.
• Import and / or define board outline geometry for complex flexible board shape.
• Understand and mitigate signal integrity issues with flexible circuits.
• Understand and define effects of mechanical retention on flexible substrates.
• Define and implement component packaging methodologies to mitigate effects of bending on component stresses.
• Understand and mitigate effects of bending stresses on conductive patterns in flexible circuits. 

Aug 8, 2022 - Sep 14, 2022
Monday, Wednesday
11:00 am ~ 1:00 pm America/New_York

Enrollment Period
Apr 4, 2022 - Sep 28, 2022

Description

This course provides the skills necessary to effectively implement designs requiring embedded components in accordance with product requirements. The class also focuses on PWB/PBA designs that require advanced or complex packaging, have reduced available board area, reduced physical component count, and require improved signal integrity performance. Participants will also consider the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation. 

Taught by an IPC-certified industry expert with 25+ years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required to design boards containing embedded components. 

Jun 6, 2022 - Jul 18, 2022
Monday, Wednesday
11:00 am ~ 01:00 pm America/New_York

Enrollment Period
Dec 16, 2021 - Jun 20, 2022

Description

This course provides the skills necessary to create PWB/PBA designs that require advanced or complex packaging. These include boards with limited board area that must comply with IPC standards and require non-orthogonal placement and routing, non-standard board outline geometry, non-standard board mounting, and advanced board materials.  

Taught by an IPC-certified industry expert with 25+ years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required by circuit board designers. 
This course is ideal for individuals who need further experience with packaging and routing challenges involved with modern high density, reduced board area, and complex geometry designs.

 LEARNING AND PERFORMANCE OBJECTIVES 

This program is designed to provide circuit board designers with a balanced foundation of theoretical knowledge and practical skills in printed circuit board design.

Upon completion, participants will be able to:  

• Compress circuit topology while maintaining circuit performance.
• Understand the trade-off of advanced PCB materials. 
• Define a board stackup that take implements micro-vias. 
• Import and / or define board outline geometry for circular or other non-standard shape.
• Define and implement non-standard (non-orthogonal) parts placement and routing.
• Define non-standard PCB mechanical retention and keep-outs.
• Define and implement non-standard component packaging. 

Wednesday, May 18, 2022

4.00 PM – 5.00 PM