There has been increasing interest in the development of capillary ion chromatography (IC) systems and methods for determination of ionic species. The practice of ion chromatography in capillary format offers a number of advantages. Because the eluent consumption is very low,capillary IC systems can be operated continuously and thus are always on and always ready for analysis. Capillary IC systems offer improved compatibility with applications where amount of sample is limited. Capillary IC systems provide improved performance for determination of target analyses at trace levels. The use of capillary columns can improve separation efficiency and/or speed. The operation of capillary IC systems at low flow rates improves the system compatibility with a mass spectrometer. In addition,the use of capillary separation columns opens the door for the possibility of offering new selectivity for difficult applications using new columns packed with stationary phases which are more costly and difficult to prepare.

TLPS materials are an attractive alternative to PbSn for IC power device packaging. They provide a low VOC composition,lead free die attach solution that meets the RoHS guidelines. TLPS materials also demonstrate the desired electrical and thermal reliability properties demanded by these devices. Industry changes to green compositions and cleaner assembly materials normally draw great cost increases due to change of operation. TLPS materials are managing the technical properties for conductivity and thermal drain at lower costs than the precious metal-containing materials being offered today as Pb-free die attach options for IC power device packages.

Recent advances in polymer science and nanomaterials have fueled a frenzy of scientific activity in multifunctional coatings and films. This rich subject area encompasses several scientific disciplines,ranging from chemistry,physics and engineering,to biology and medicine. We present a polymer composite large-area coating method designed to impart desirable surface functionalities (such as super-repellency to liquids,or electrical conductivity) to substrates ranging from glass and metals,to porous or flexible materials. The wet-based approach relies on combining a polymer matrix in solvents with other materials to enhance adhesion and allow micro/nanoparticle filler dispersion. The advantage of the technique lies in its inherent ability to impart multiple functionalities by adding the proper ingredients to the solution,which is deposited on the target surface by spray,ink jet or other techniques. The approach combines tunable surface energy with micro-to-nano scale roughness,a necessary condition for super-repellent behavior towards water,oils and alcohols. In some coatings,super-repellency is combined with self-cleaning ability,which is effected by low droplet roll-off angles. We demonstrate thin coatings with controllable micro/nanostructure,liquid repellency,and electromechanical properties,combined with good mechanical or environmental durability. Several examples (including elastomeric,electrically conducting and icephobic coatings) demonstrate the potential of the method. We also discuss patterning of such coatings with spatial resolution approaching the micrometer regime. The present multifunctional nanocomposite coating technology appears well suited for the electronics industry; the coatings can be tuned for different functionalities and processed using large area deposition processes (e.g. ink jet and atomized spray). The coatings can be chemically designed to provide optimal adhesion to both rigid and flexible printed wiring boards.

The purpose of this presentation is to provide considerations for selection of conformal coatings into electronics assembly operations. The types of testing required for selection and use of coating will be presented. Challenges and difficulties of implementation will be discussed. The overall impact of conversion from coating types will be presented.

Lead-free assembly has introduced many challenges and non-conformances. One of the more troubling non-conformances is “Pad Cratering”. Pad cratering is when the copper pad completely separates from the laminate. The separation may occur outright at assembly or as the result of the field failure scenario detailed above. Pad cratering is the result of the technology exceeding the
capabilities of the materials.
To date there has been no solution to the problem of pad cratering,until now. Integral Technology has developed a solution that has the potential to minimize if not eliminate pad cratering. Integral’s solution is a material called Zeta Cap®. Zeta Cap® is a high performance polymer film that is capable of withstanding high temperatures. It has no woven fiber-glass thus making it CAF resistant.
It can be used in combination with current technology as an additional material layer between the outer layer foil and outer most dielectric. Zeta® has a high mechanical strength and flexibility compared to other lead-free compliant laminate materials.
Integral Technology’s Zeta® Lam,Zeta® Bond and Zeta® Cap (patents pending) are breakthrough materials for the PCB industry. The portfolio of Zeta products was spawned as a direct result of conversations with OEM’s and suppliers about how to expand product lines and solve problems. The original idea was to solve the problem of pad cratering (http://en.wikipedia.org/wiki/Pad_cratering). This silent and increasing threat to the electronics business can be eliminated by using Zeta® Cap on the PCB. The industry is enthusiastically embracing Zeta® Cap and its growth in the marketplace is a direct result of all stakeholders focusing on a solution to an emerging industry problem. Integral has evolved the product portfolio from Zeta® Cap alone to include Zeta® Lam and Zeta® Bond,giving Zeta customers’ new opportunities with High Density Interconnects. Zeta® Cap,Zeta® Lam,and Zeta® Bond are fiberglass free laminate and bonding materials that meet the needs of the next generation of electrical,mechanical and thermal demands due to the fact they are thin,high Tg,Low Dk and Low Df materials.

QFN’s offer advantages in reducing size and weight and have excellent thermal and electrical Conductivity related to the ground plane. QFN’s also present printing and assembly challenges including package floating during reflow and the very small stencil aperture area ratio’s resulting from the narrow and short pad design of the packages. This presentation will review stencil design aimed at improving the QFN printing and assembly process,QFN repair options will also be presented

The presentation will discuss the problems that many QFN users are dealing with by having flux trapped under the component that is still gooey and conductive and the effect on circuit performance of sensitive circuits. The reason why the QFN traps show much flux and why the need for a standoff to lift the component off the board surface using soldermask and via plugging. This comparison will be evaluated using localized C3 steam extractions and Ion Chromatography analysis of the two conditions.

Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge for OEMs is to quantify safe residue levels and gain insight into how residues impact long term reliability and functionality of hardware. To compound this problem,the question of “how clean is clean enough” is more challenging as conductors and circuit traces are increasingly narrower. Highly dense bottom termination components decrease conductor pitch,spacing and standoff heights. The problem is that current spacing trends can yield spacing between printed circuit traces as small as 2 mils. As electrical fields rise,contamination at these narrower traces becomes more problematic due to voltage swings,high frequencies,leakage currents,and high impedance. The objective of this research is to advance the understanding of chemical and electrical effects on reliability of high dense interconnects Phase 1 of the research focused on designing a new test vehicle to measure electrical responses to high voltage,rate of current change and frequency. Phase 2 studied the effects of high voltage effects on leakage currents in the presence of flux residue and environmental conditions under bottom termination components. Phase 3 will study the effects of frequency on leakage currents in the presence of flux residue and environmental conditions under bottom termination components.

Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology. Advanced printing is a relatively new technology and needs more
characterization and optimization for practical applications. In the present paper,we examine the use of different materials in the area of
printing technology. A variety of printable nanomaterials for electronic packaging have been developed. This includes nano
capacitors and resistors used as embedded passives,nano laser materials,optical materials,etc. Materials can provide high
capacitance densities,ranging from 5 nF/inch2 to 25 nF/inch2,depending on composition,particle size and film thickness. The
electrical properties of capacitors fabricated from BaTiO3-epoxy nanocomposites showed a stable dielectric constant and low loss over a frequency range from 1MHz to 1000MHz. Reliability of the nanocomposites was ascertained by IR-reflow,thermal cycling,pressure cooker test (PCT),and solder shock. Change in capacitance after 3X IR-reflow and after 1000 cycles of deep thermal cycling (DTC) between -55oC and 125oC was within 5%. A variety of printable discrete resistors with different sheet resistances,ranging from ohm to Mohm,processed on large panels (19.5 inches x 24 inches) have been fabricated. Low resistivity materials,with volume resistivity in the range of 10-4 ohm-cm to 10-6 ohm-cm depending on composition,particle size,and particle loading can be used as conductive joints for high frequency and high density interconnect applications. The CITC (Current Induced Thermal Cycling) life at 245C is greater than 10 cycles and life at 220C is over 25 cycles to fail, which is at least equivalent to copper PTH (plated through hole) performance. Thermosetting polymers modified with ceramics or
organics can produce low k and low loss dielectrics.

• Summary of some new and existing technologies for printed electronics outside of traditional membrane switch manufacturing
• Discussion of requirements for understanding the technology of these applications in order to capitalize on them