As electronics manufacturing,design and after market services evolve into as a strategic option for today’s electronics original equipment manufacturers (OEM),opportunities for further growth exist. Where outsourcing has been used significantly over the past decade by OEMs in computer systems,mobile communications,and consumer electronics,many possibilities exist within other growing industry segments for Electronic Manufacturing Service (EMS) companies.
Such include medical,industrial,aerospace,defense,and homeland security (HLS) products. We have conducted significant research in market growth,outsourcing trends,OEM selection criteria,business opportunities,and challenges for these expanding segments. In addition to statistical analysis,this research has utilized extensive interviews with industry executive in both OEM and EMS companies. This is an overview of this research,the executive interviews,and the conclusions reached regarding today’s outsourcing of the medical,industrial and aerospace/defense/homeland security sectors.

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Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common solutions for routing Metric Pitch and Fine Pitch BGA components.

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It is clear that the future belongs to the ever shrinking component. Micro Lead Frame (MLF) components,and specifically the Quad Flat No-lead (QFN) packages have gained wide scale acceptance. They tend to appear in densely populated boards where real estate is at a premium.

The design,size and assembly process of QFN’s present some unique rework challenges not seen with other components. The challenge is only greater with the use of lead-free solders. This paper/presentation will focus on the complete rework process,including component removal,site preparation,component paste printing,and finally new component soldering.