Solving the Metric Pitch BGA & Micro BGA Dilemma

Member Download (pdf)

Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common solutions for routing Metric Pitch and Fine Pitch BGA components.

Author(s)
Tom Hausherr
Resource Type
Slide Show
Event
IPC Midwest 2007

QFN Rework Challenges in a Lead Free World IPC Midwest - Sept. 2007

Member Download (pdf)

It is clear that the future belongs to the ever shrinking component. Micro Lead Frame (MLF) components,and specifically the Quad Flat No-lead (QFN) packages have gained wide scale acceptance. They tend to appear in densely populated boards where real estate is at a premium.

The design,size and assembly process of QFN’s present some unique rework challenges not seen with other components. The challenge is only greater with the use of lead-free solders. This paper/presentation will focus on the complete rework process,including component removal,site preparation,component paste printing,and finally new component soldering.

Author(s)
Neil O’Brien
Resource Type
Slide Show
Event
IPC Midwest 2007
Subscribe to