At present there are a large number of materials that have been proposed as replacements for lead containing solder for reflow and wave and selective soldering.
Unlike solder paste in a reflow process,solder in automated processes changes in composition and impurities with time as the solder is utilized. There currently are no contamination limits for lead-free solder in J-STD-001D. The contamination limits listed in J-STD-001D only apply to tin/lead solders.
Given the limited amount of data available at present,the IPC SPVC members have undertaken a study to determine the “Take Action Limits” (TAL) of solder pot contamination for SAC305 lead free solder. (As the number of lead free alloys currently in use for automated soldering processes is too large for a comprehensive study in any reasonable time frame,the IPC SPVC members,after deliberation,decided to limit the initial work to the SAC 305
(96.5%Sn,3.0% Ag,0.5% Cu) alloy.)

Although lead free assembly is now widely adopted the industry is still exploring a variety of options for lead free alloys. Attempts to standardize on a single alloy for either reflow or wave solder assembly have not been successful. Indeed,if anything,the proliferation of new lead free alloy types has increased.
For OEMs and EMS this poses a problem. All lead free alloys in general use,e.g. SAC 305,have a mix of desirable and not-so-desirable properties. It is the “not-so-desirable” properties,especially in contrast with the well known Tin-Lead systems,that make lead free assembly a process that poses unique
difficulties and has a small process window. Solder suppliers,responding to these assembly problems,have proposed a large number of new materials that specifically address many of the vexing manufacturing properties of the first lead free alloys on the market. However,many of the first alloys introduced,e.g. SAC 305,are,if not completely characterized,better understood in terms of reliability properties than the new alloys being introduced. So while it is tempting for assemblers to look to the new alloys as solutions to the manufacturing issues of the “older” materials the lack of reliability characterization of these new materials introduces an element of uncertainty when compared to the current lead free materials in general use.
To address this problem the IPC Solder Products Value Council (IPC SPVC) in cooperation with several leading OEMs and EMS providers is developing a set of test protocols for evaluation of new lead free
alloys on the basis of their physical properties,e.g. creep,and their performance in the assembly of a standardized test vehicle. This talk will focus on the physical testing aspect covering the genesis of this effort,input received from industry experts and the current status of the draft standard. The goal of this new test standard is to reduce the time and effort required to characterize an ally and thus help manufacturers improve their assembly processes without jeopardizing reliability.

Cracking and delamination defects in printed circuit boards (PCBs) during elevated thermal exposure have always been a concern for the electronics industry. However,with the increasing spread of Pb-free assembly into industries with lower volume and higher complexity,these events are occurring more frequently. Several telecom and enterprise original equipment manufacturers (OEMs) have reported that the robustness of their PCBs is their number one concern during the transition from SnPb to Pb-free. Cracking and delamination within PCBs can be cohesive or adhesive in nature and can occur within the weave,along the weave,or at the copper/epoxy interface. The role of moisture absorption and other
PCB material properties on this phenomenon is still being debated.
This presentation details research initiated to better understand the influence of moisture on delamination using capacitance measurements. Measurable changes in capacitance were recorded in the PCBs after each reflow. Discrimination between different test structures and MSL exposures strongly suggests the capacitance approach measures true material degradation rather than an increase in resistance at contact pads due to oxidation. However,contact resistance should be quantified in a next round of testing. Strong differences in shield-over-shield capacitance between test structures are interesting and should also be further characterized.

- History & Importance of PCB - Environmental Initiatives - Reliability Consideration With High Temp Processing - Reliability Considerations for Materials to withstand Lead-Free Assembly - Plated Through Hole Failure Modes - Considerations for PCB laminate materials - Printed Circuit Materials Overview - PCB Material Properties - What is “FR4”, Laminate Composition - Overview of other laminates

This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether the reason for seeking alternative finishes is RoHS compliance or assembly process enhancement,there are factors one must consider in switching.
We will address benefits and impacts of ENIG (electro-less nickel/immersion gold),Immersion Sn (tin) and Immersion Ag (silver),electrolytic Ni/Au (nickel/gold),as well as what is commonly known as “lead-free” solder. The benefits range from ease of processing – bare flex and assembly – to a more robust interconnect concept for specific applications. Impacts are the “gothchas” - potential pitfalls – and can include electrical test
failures and significantly increased part cost.
The attendee will leave with an appreciation for the careful nature of making such a significant change in part configuration.

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In this presentation,numerous examples of counterfeited parts are provided along with the means of identification for the respective technique utilized in production.

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This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the development of life predictive models and acceleration factors. Common gaps in property and test database are identified (e.g.,lack of creep data at low to medium stress and cold temperature,insufficient data under mildly accelerated test conditions). The importance of variations in temperature variables (cold and hot
temperatures) as well as dwell times is also discussed. Examples of thorough test conditions and test databases that have been used for the development of SAC305,SAC387/396 acceleration factors are presented. It is concluded that the “winning” alloys - i. e. alloys that end-users can work with – are those that are fully characterized in terms of metallurgy (including at interfaces) and mechanical / physical properties & their evolution; are robust enough under both thermal and mechanical loading conditions; and come with an extensive reliability test database and validated reliability models & acceleration factors.

Constitutive and failure descriptions of SnAgCu solder alloys are of great interest at the present. Commonly,constitutive models that have been successfully used in the past for Sn-Pb solders are used
to describe the behavior of SnAgCu solder alloys. Two issues in the characterization of lead-free solders demand careful attention: (i) Lead-free solders show significantly different creep strain
evolution with time,stress and temperature and (ii) The building of valid constitutive models from test data derived from tests on solder joints must de-convolute the effects of joint geometry and its influence on stress heterogeneity. In the first part of the talk I will review the common approaches to modeling solder behavior,along with their limitations and then describe our efforts in developing constitutive models of SnAgCu solders that are valid across a wide range of strain rates.
The problem of solder joint fatigue is essentially one of fatigue crack growth. However,there is little work that has been done to arrive at fatigue life estimations by means of tracking of the crack front and its growth. Common fatigue life models such as the Coffin-Manson rule are empirical and therefore,limited in their applicability and in the insight they provide. There are several challenges to employing a fracture mechanics approach to accurately track the growth of a fatigue crack in a solder joint. Key
among these,are the facts that the problem involves large-scale yielding,viscoplastic solder behavior and complex geometries. In the second part of the talk,I will describe the various approaches to
modeling solder joint fatigue and present our efforts at developing Cohesive Zone Model inspired approaches to predicting crack propagation at solder interfaces.