North American PCB Industry Sales Up 35 Percent in August

IPC releases PCB industry results for August 2024

IPC announced today the August 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.99.

Total North American PCB shipments in August 2024 were up 35 percent compared to the same month last year. Compared to the preceding month, August shipments were down 10.3 percent.

PCB bookings in August were up 44.2 percent compared to the same month last year. August bookings were up 22.3 percent compared to the preceding month.

"August saw strong bookings and shipments, leaving the book-to-bill ratio unchanged. While the surge in new orders marked the best performance since February, it did little to reverse the decidedly negative trend for the year,” said Shawn DuBravac, IPC’s chief economist. 

August 2024 PCB book to bill ratio chart 1
August 2024 PCB book to bill ratio chart 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

 

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

 

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

 

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

North American EMS Industry Shipments Down 4.4 Percent in August

IPC releases EMS industry results for August 2024

IPC announced today the August 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.27.

Total North American EMS shipments in August 2024 were down 4.4 percent compared to the same month last year. Compared to the preceding month, August shipments decreased 1.3 percent.

EMS bookings in August increased 16.4 percent year-over-year and increased 24.3 percent from the previous month.

“A strong recovery in orders this month pushed the book-to-bill ratio higher. While orders had been weak in recent months, August's performance helped reverse the trend,” said Shawn DuBravac, IPC’s chief economist. “However, it remains to be seen whether this is a correction of recent weakness or a one-off event.”

August 2024 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

 

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

 

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

 

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

Winners of IPC Hand Soldering and Rework Competition Vietnam 2024 Announced

In conjunction with NEPCON Vietnam 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam, September 11-13.  Thirty-nine competitors from 16 electronics companies and one university in Vietnam vied for top honors.

Skilled contestants competed against each other to rework a functional electronics assembly within a 50-minute time limit. Assemblies were judged on soldering in accordance with IPC-A-610H, IPC J-STD-001H, IPC-7711/21C - Class 3 criteria, the speed at which the assembly was produced, and overall electrical functionality of the assembly.

On the winner’s podium at NEPCON Vietnam 2024 were:

  • First Place: Nguyen Van Nhi, Spartronics Vietnam Co., Ltd. He received a certificate, a cash prize of $USD300, and a soldering station from Premier sponsor QUICK. As the winner, Nguyen Van Nhi qualified for the IPC Hand Soldering World Championship in Munich, Germany, in November.
  • Second place: Nguyen Van Tuan, Spartronics Vietnam Co., Ltd. He received a certificate and a cash prize of $USD200.
  • Third Place: Nguyen Minh Doan, a lecturer at VNU University of Engineering and Technology (VNU-UET). He received a certificate and a cash prize of $USD100.

This year, we had one extra recognition prize which was based on the overall results of the competition. A Special Mention Prize was awarded to Nguyen Duc Manh from Canon Vietnam.

IPC would like to thank Hand Soldering and Rework Competition sponsors and partners for their generous support this year.

  • Premier Sponsor: QUICK INTELLIGENT EQUIPMENT
  • Gold Sponsors: NIHON SUPERIOR and SOLDERINDO
  • Supporting Sponsor: LORIOT INDUSTRIAL
  • Co-Organizer: RX TRADEX VIETNAM

For more information on upcoming hand soldering and rework competitions, contact Henry Ton, Senior Business Development Manager - Southeast Asia, at HenryTon@ipc.org

IPC Day Slovakia, Žilina

Date
- (1:30 - 8:45am CDT)

IPC Day Slovakia, Žilina

IPC & Realtime Technologies (IPC-Licensed Training Centre in Slovakia) are holding the IPC Day Slovakia & ESD Seminar in Žilina, Slovakia on Thursday 19 September 2024. 

IPC Day Slovakia will cover various aspects of electronic manufacturing standards & practices. Industry expert speakers will exchange about ESD requirements, IPC Standards & PCB & PCBA production processes. Plenty of interactions will be offered to participants during breaks, lunch, a quiz game & a raffle with ample networking opportunities. 

To have a look at the programme please click here

Where: Education Centre KIA Slovakia, Hlavná 400/1, 01301 Gbeľany (near Žilina)

When: Thursday 19 September 2024, 08:30 - 15:45 h

Who should attend:

  • Engineers & managers from electronics production & quality
  • Specialists or practitioners in manufacturing
     

IPC Day Türkiye, Istanbul

Date
- (12:00 - 10:00am CDT)

IPC Day Türkiye, Istanbul


IPC, Yıldırım Elektronik, EMT Elektronik, the manufacturer of the X-Treme Series & DNZ, IPC-Licensed Training Center in Türkiye will be holding the 4th IPC Day Türkiye - Electronics Manufacturing Days Conference in Istanbul on Tuesday 8 October 2024. 

This one-day Conference will focus on "Future Factories and Traceable Electronics Manufacturing" & will feature presentations on management & engineering approaches enhancing efficiency & traceability in electronics manufacturing & soldering processes.

Covering a wide range of topics, including IPC Standards, the IPC Design Initiative, traceable dry cabinets, traceable soldering & manufacturing processes, new developments in solder pastes or innovations in solder wires for selective soldering & robot soldering systems, the programme will offer some substantial knowledge for all electronics engineers & professionals willing to expand their professional horizon and network with their peers. 

Where: Marriott Hotel Pendik Istanbul, Türkiye

When: on Tuesday, 8 October 2024, 08:00 - 18:00 h

Who should attend: 

  • Engineers & managers from electronics production & quality
  • Specialists or practitioners in manufacturing


 

Cyber Disaster Recovery Exercises for Electronics Manufacturers

Date
- (5:00 - 6:00am CDT)

When a cyber break-in occurs, the IT team alone will not be able to respond to the attack. The detection is limited to what is available from the IT and network equipment, as opposed to the normal day-to-day behavior that is available to the IT team. Differences from the normal behavior of the production line can only be detected on the production line. No matter how good the IT system is, if the initial response of the people on the production line is slow, the impact of a cyber incident will be much greater. Today, the electronics manufacturing industry is shifting from China, Europe, and the United States to Southeast Asia, including Vietnam, India, and Thailand. Local education and onsite practice is essential.

In this webinar, participants will learn about exercises and best practices for Business Continuity Disaster Recovery (BCDR). This knowledge will help understand what needs to be accomplished at their local factories.

The weakest link in the supply chain can be a target, as demonstrated by the Japanese auto plant that was forced to shut down due to an attack on a single supplier. By applying the lessons from this webinar, participants will be well-prepared for potential cyber attacks, minimizing the risk to their entire, interconnected supply network and the broader electronics manufacturing industry. It is an action that will not be specified in the requirements of the IPC standard for cybersecurity (IPC-1792), but will be mandatory for implementation. The following topics will be covered:

-Practice Demands
-Recognition of current and goal setting
-Preparation (awareness creation)
-Business Continuity Disaster Recovery (BCDR)
-Characteristics of the factory 
-Criteria for detection and judgment (risk extraction method)
-Differentiation between failure and attack
-Process of early recovery
-Guidance for BCDR measures policy (BCDR viewpoints, characteristics of factories, requirements for BCDR)
-Overview of BCDR measures
-Conduct incident response practice
-IPC-1792 and practice

Speaker Bios

Hiroyuki Watanabe October 31

Hiroyuki Watanabe is engaged in activities to disseminate and enlighten the future of the manufacturing industry from the perspective of security and the international economy. He has published two Japanese books and one English book to support security measures in small and medium-sized factories. He presents logical findings leading to know-how and necessity of security measures for factories and supply chains at the Counterfeit Symposium and APEX. He publishes his cybersecurity findings under IPC's Technical Leadership Program.

Since 2018, he has been a visiting researcher at the Center for Rule Formation Strategy, Tama University. Hiroyuki Watanabe is currently the Executive Director of Global Security at NEC Corporation. In 2020, he joined the IPC Board of Directors and is a chair of IPC-1792 Cybersecurity Standard.

 

 

The Engineering Webinar Series provides FREE, live, monthly educational experiences and videos discussing key design issues surrounding aspects of quality, defect detection & remediation, and design finalization & fabrication. All sessions are recorded and registered attendees will receive a link to the video to watch on-demand. 
 

IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.” 

The white paper explores the packaging and integration needs for several key application areas:

  • High Performance Computing (HPC)
  • 5G/6G Wireless Communications
  • Autonomous Driving and Electric Vehicles (EV)
  • Medical Electronics
  • Aerospace & Defense Electronics

The paper then analyzes the following aspects of advanced packaging to board-level integration:

  • Design challenges and co-design approaches
  • Power delivery requirements
  • Thermal management challenges 
  • Materials innovation needs for package assembly and PCB integration
  • Printed Circuit Board Assembly (PCBA) challenges
  • Reliability considerations for heterogeneously integrated   systems
  • Metrology requirements for the characterization of advanced packaging to board level assembly

The white paper emphasizes the importance of a “silicon to systems” approach in developing next-generation chiplet-based advanced packages and their integration into complex systems. The paper also recommends the development of a 5-10 year outlook on trends, challenges, and gaps in advanced electronic packaging and PCB/subsystem integration across various application domains. This roadmap will enable the electronics industry supply chain to better prepare for and address the complex challenges in system-level packaging and integration.

“IPC is committed to identifying the gaps and challenges in design, materials, assembly, test, and reliability as applied to advanced packaging integration with printed circuit boards, assemblies, and subsystems,” said Devan Iyer, chief strategist advanced packaging and white paper co-author. “Along with our industry partners, IPC will continue to be the leading advocate of a ‘silicon-to-systems’ approach as the evolution of advanced packaging directly affects the future of all aspects of electronics manufacturing,” emphasized Matt Kelly, IPC chief technology officer and white paper co-author. 

This white paper provides valuable insights for anyone involved in electronics manufacturing, helping them stay ahead of technological trends and address future integration challenges effectively.

Download the White Paper.