From System Safety Requirements to Rugged PCB Decisions: A Practical Requirements-to-Evidence Workflow

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From System Safety Requirements to Rugged PCB Decisions: A Practical Requirements-to-Evidence Workflow

High-reliability electronic products often fall short of their safety and mission objectives because critical assumptions are lost as system requirements are translated into board-level implementation. This virtual event presents a practical workflow for converting mission profiles and hazardous failure effects into measurable requirements, cross-domain allocations, PCB design constraints, embedded diagnostic behaviors, and objective evidence for verification. An anonymized 48-V smart power distribution unit for an autonomous platform will be used as a running example to demonstrate the chain from a channel fault through hardware protection, firmware response, fault containment, reporting, controlled recovery, and verification. 

This webinar is intended for systems engineers, PCB and electronic hardware designers, embedded software and firmware engineers, reliability and functional safety engineers, verification and test professionals, technical leads, and engineering managers involved in high-reliability electronic products. It will be particularly relevant to professionals working in aerospace and defense, automotive and e-mobility, robotics, autonomous systems, industrial electronics, and other harsh-environment applications.

This virtual event is methodology-driven and will not provide clause-by-clause instruction on a specific IPC standard. Where relevant, we may briefly reference IPC-2221C, Generic Standard on Printed Board Design, and IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards, to connect the requirements-to-evidence workflow with established printed-board design and performance considerations.

Speaker Bio: 

Nuri Başer Üstün November 11

Nuri Başer Üstün, CSEP, FSCP, is the founder of DNB Engineering, where he develops systems, rugged embedded electronics, and software for defense and autonomous applications. He has more than fourteen years of experience in systems engineering, functional safety, electronic architecture, embedded software, and verification and validation. He is an INCOSE Certified Systems Engineering Professional and a TÜV SÜD Functional Safety Professional. His work focuses on translating mission and safety requirements into practical hardware, firmware, manufacturing, and verification decisions. His paper on human-in-the-loop safety for advanced driver-assistance systems received the Best Paper Award at the INCOSE International Symposium 2026.

 

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North American EMS Orders Outpace Shipments in August as Bookings Rise 53.5% Year-Over-Year

The Global Electronics Association releases EMS industry results for August 2026

The Global Electronics Association announced today the August 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.39.

Total North American EMS shipments in August 2026 were up 1.0% compared to the same month last year. Compared to the preceding month, August shipments were up 5.5%. August’s year-to-date (YTD) shipments increased by 1.0% year-over-year (YOY).

EMS bookings in August increased 53.5% year-over-year and were down 29.2% from the previous month. August’s YTD bookings increased by 15.5% compared to the same period last year.

“EMS manufacturers are working to fulfill strong order flow that continues to outpace shipments, building a pipeline of future production. Tight availability of certain components and extended supplier lead times may be limiting how quickly some manufacturers can convert those orders into deliveries,” said Dr. Shawn DuBravac, the Global Electronics Association’s chief economist. “Strong bookings support the production outlook, but securing the materials needed to fulfill those orders remains a challenge.”

3-Month Book-to-Bill

1-Month Book-to-Bill

Shipments  

3-Month MA

Bookings  

3-Month MA

Shipments YTD

Bookings YTD

1.39

1.33

2.4%

9.0%

5.5%

15.5%

Detailed Data Available

Companies that participate in the Global Electronics Association’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in the Global Electronics Association’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The Global Electronics Association’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. The Association publishes the EMS book-to-bill ratio by the end of each month.

North American PCB Shipments Jump 23.5% in August, Extending Strong 2026 Growth

The Global Electronics Association releases PCB industry results for August 2026

The Global Electronics Association announced today the August 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.29.

Total North American PCB shipments in August 2026were up 23.5% compared to the same month last year. Compared to the preceding month, August shipments were up 5.2%. August’s year-to-date (YTD) shipments increased by 15.5% year-over-year (YOY).

PCB bookings in August were down 35.0% compared to the same month last year. August bookings were down 78.1% compared to the preceding month. August’s YTD bookings increased 38.7% compared to the same period last year.

“PCB shipments continued to strengthen in August, though the month also brought a pullback in new orders following July’s surge. The results this month likely represent a quick pause after several months of strong order flow,” said Dr. Shawn DuBravac, the Global Electronics Association’s chief economist. 

3-Month Book-to-Bill

1-Month Book-to-Bill

Shipments 3-Month MA

Bookings

3-Month MA

Shipments YTD

Bookings YTD

1.29

.45

3.5%

-23.19%

15.5%

38.7%

Detailed Data Available

Companies that participate in the Global Electronics Association’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in the Global Electronics Association’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The Global Electronics Association’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. The Association publishes the PCB book-to-bill ratio by the end of each month.

MIT’s Yossi Sheffi to Headline Global Electronics Association APEX EXPO 2027

Largest North American electronics trade fair welcomes Dr. Sheffi to drive conversations on AI, resilience, geopolitics and their impact on current and future state of electronics

The Global Electronics Association today announced Yossi Sheffi, Ph.D., best-selling author, entrepreneur and Massachusetts Institute of Technology (MIT) professor, will deliver the opening keynote address at APEX EXPO 2027 on Tuesday, April 6, focused on the forces reshaping the global electronics industry.

Dr. Sheffi’s keynote, “The Future of Electronics: Navigating AI, Geopolitics and Global Disruption,” will examine how AI and high-performance computing demand, semiconductor and advanced-packaging capacity, geopolitical pressures, regional manufacturing, resilient sourcing, automation and workforce transformation are changing electronics supply chains and manufacturing strategy.

“APEX EXPO brings together the people building the future of electronics,” said Matt Kelly, chief technology officer and vice president of technology solutions, Global Electronics Association. “Dr. Sheffi’s perspective on supply chain resilience, AI and global disruption will give attendees timely insight into how electronics leaders can prepare for what comes next.”

About Dr. Sheffi

Dr. Sheffi is the Elisha Gray II Professor of Engineering Systems at MIT, Director of the MIT Center for Transportation & Logistics, and Founder of the MIT SCALE Network. A globally recognized expert in supply chain management, systems optimization and risk analysis, he has advised governments and global enterprises on resilience, innovation and the future of work.

Dr. Sheffi is a successful entrepreneur who has founded or co-founded five technology and logistics companies, including Logistics.com and Syncra Systems. He is also the author of nine award-winning books, including The Magic Conveyor Belt: Supply Chains, A.I., and the Future of Work, which explores the impact of technology on supply chains and the global workforce.

“Few industries sit more directly at the intersection of AI, manufacturing, geopolitics and supply chain risk than electronics,” said Dr. Sheffi. “I look forward to joining APEX EXPO 2027 to discuss how leaders can build resilience, adapt to disruption and position their organizations for the next wave of global technology growth.”

APEX EXPO 2027 will bring together the global electronics manufacturing supply chain for technical education, professional development, standards development, networking and an exhibition featuring the latest technologies, materials, equipment and processes. The event will include the Advanced Electronic Packaging Conference (AEPC), professional development courses, standards committee meetings and networking opportunities for OEMs, EMS providers, PCB manufacturers, designers, suppliers and other industry leaders.

APEX EXPO will take place April 3-8, 2027, at the Anaheim Convention Center. For additional information including the schedule at a glance, visit www.apexexpo.org. 

Global Electronics Association and Fraunhofer Group for Microelectronics Sign MoU to Support Advanced Packaging Industrial Adoption

MoU will connect APECS pilot line innovation with the guidelines, standards, training and digital tools needed for industry adoption

The Global Electronics Association has signed a Memorandum of Understanding (MoU) with the Fraunhofer Group for Microelectronics to help accelerate the path from advanced packaging innovation to industry-scale manufacturing.

The collaboration focuses on the APECS pilot line, the European pilot line for advanced packaging and heterogeneous integration for electronics components and systems under the EU Chips Act. APECS is coordinated by the Fraunhofer-Gesellschaft and implemented by Research Fab Microelectronics Germany (FMD), a research collaboration of 13 Fraunhofer institutes and the Leibniz institutes FBH and IHP. The MoU draws on APECS pilot line capabilities and the Global Electronics Association’s expertise in standards, industry engagement and knowledge transfer to support the transition of new technologies toward industrial implementation.

As the electronics industry works to deliver smaller, faster, more powerful and more reliable products, advanced packaging is becoming increasingly important. But promising technologies developed in pilot line environments can be difficult to scale without common practices for design, manufacturing, testing, reliability and data exchange. The MoU is intended to help close that gap.

“The strategy of pairing pilot line capability development with industry-wide standardization and enablement will help supply chain readiness ahead of product qualification and manufacturing,” said Devan Iyer, chief strategist for advanced electronic packaging, Global Electronics Association.

APECS provides access to capabilities for advanced packaging and heterogeneous integration, including chiplet-based modules and 2.5D/3D integration. The pilot line also emphasizes System-Technology Co-Optimization (STCO) – an approach that helps align product design, materials, assembly integration choices and manufacturing processes earlier in development.

At a kick-off meeting on September 24, representatives from the Global Electronic Association and the Fraunhofer Group for Microelectronics launched the collaboration and discussed its priorities with a focus on supporting industry adoption of advanced packaging and heterogeneous integration technologies.

“Our silicon to systems approach, spanning design, materials to system-level packaging, maps to the reality that advanced packaging changes the rules for everyone, not just one segment of the supply chain,” said Matt Kelly, chief technology officer, Global Electronics Association. “Collaborations like this are about building the practical scaffolding – guidelines, standards, tools and training – that helps suppliers qualify, customers specify, factories operate and regulators trust.”

The MoU supports broader industry priorities, including stronger supply chain resilience, improved interoperability and compliance, and the development of next-generation guidelines and standards for advanced electronics packaging. For APECS, this means ensuring that technology development takes these industry requirements into account from an early stage.

“APECS connects design, advanced packaging, assembly, testing and reliability across a European pilot line infrastructure. For these capabilities to translate into industrial use, technical development also needs to reflect standards, manufacturing practices and common interfaces early in development,” said Dr. Dirk Schumann, director of the APECS pilot line. “The collaboration with the Global Electronics Association adds a direct industry perspective on the requirements that matter as technologies move toward scalable manufacturing.”

The goal is to turn validated pilot line capabilities into industry-ready approaches that can be adopted at scale.

For more information, visit https://www.electronics.org/technology-solutions.

REPORT: Closing the European Gap in Data Centre, Cloud, and AI Infrastructure Manufacturing

Europe’s success will hinge on rebuilding the electronics manufacturing base.

Today, the Global Electronics Association released From Chips to Systems: Building an End-to-End EU Strategy for Data Centre, Cloud Infrastructure and AI, a joint report with DECISION Études & Conseil. Europe is one of the world’s three largest markets for AI data centres. However, most of the value created by that demand accrues to companies and supply chains outside of the EU. This report quantifies that gap, layer by layer, and offers a practical policy roadmap to close it. 

“EU-headquartered companies are earning six cents on every euro spent on data centre semiconductors in their own market, seven cents on server manufacturing and assembly, and eight cents on cloud infrastructure. Europe is building the most strategically important electronics vertical, but only capturing a small fraction of the value,” said Sanjay Huprikar, Chief Global Officer, Global Electronics Association. “Fixing this gap requires a bold, end-to-end strategy, one that connects chips to systems, demand to manufacturing, and European policy ambition to real industrial outcomes. That means scaling up European companies and leveraging the manufacturing know-how that global leaders bring to production facilities right here in Europe.” 

Key Data 

  • DECISION forecasts servers to become the largest electronics segment before 2030, ahead of smartphones or automotive electronics, predominantly driven by demand for AI applications. 
  • Since 2021, following the COVID-19 pandemic, EU demand for server systems has been growing at an annual rate of 36%, compared with 20% for domestic manufacturing of those systems. 
  • EU-headquartered companies earn just:  
    • Six cents of every euro spent on data centre semiconductors. 
    • Seven cents of every euro spent on server manufacturing and assembly. 
    • Eight cents of every euro spent on cloud infrastructure in the European market. 

Alison James, the Association’s Senior Director for European Advocacy, added, “The European Commission’s Technological Sovereignty Package, anchored by the Chips Act 2.0 and the proposed Cloud and AI Development Act, can help rectify this imbalance by catalyzing investment in Europe by both European and international manufacturers.” 

The report lays out the scale of the challenge, and importantly, the economic opportunity if the EU can transform domestic demand for high-performance computing into the EU-built physical infrastructure needed to power the data centre, cloud, and AI revolution.

Global Electronics Association Updates Sustainability Reporting Resource for the Electronics Industry

Toolkit helps companies address double materiality expectations under CSRD and ESRS

The Global Electronics Association today announced the relaunch of its Double Materiality Assessment (DMA) Toolkit for the Electronics Industry, an updated resource designed to help organizations navigate double materiality assessment planning amid changing sustainability and corporate reporting expectations.

The revised Toolkit reflects recent Corporate Sustainability Reporting Directive (CSRD) and European Sustainability Reporting Standards (ESRS) developments, including updated context around the EU Sustainability Omnibus package and simplified guidance. It also supports both top-down and bottom-up double materiality assessment approaches and adds guidance for organizations that may only be required to assess impact materiality.

The Toolkit is designed for sustainability, ESG, compliance, corporate reporting, risk, supply chain, procurement and operations professionals across the electronics manufacturing ecosystem, including EMS providers, PCB and semiconductor manufacturers, OEMs, component and wire harness manufacturers, electronics suppliers, and organizations in industrial, automotive, aerospace and defense, and medical electronics sectors.

As sustainability and corporate reporting expectations continue to advance, particularly for organizations with European operations, customers or value-chain exposure affected by CSRD-related requirements, double materiality has become an increasingly important planning and reporting issue. For many organizations, the challenge is not understanding why double materiality matters. It is knowing how to apply it in a practical, structured and business-relevant way.

“The double materiality assessment process can feel overwhelming, especially as reporting expectations continue to shift,” said Dr. Kelly Scanlon, senior director, sustainability strategy, Global Electronics Association. “The updated DMA Toolkit gives sustainability, risk, compliance, reporting and operations teams a structured approach they can apply whether they are beginning the process, refining an existing approach or focusing specifically on impact materiality.”

The updated Toolkit helps organizations:

  • Translate double materiality concepts into a practical assessment process.
  • Identify and evaluate sustainability impacts, risks and opportunities across operations and the value chain.
  • Prioritize the most significant topics to support strategy, reporting readiness and internal decision-making.
  • Use Sustainability Context Reports to explore relevant sustainability topics, value-chain considerations and potential impacts.

For organizations required to assess only impact materiality, the Toolkit’s core process and resources remain applicable. Companies can use the Toolkit to build a structured, evidence-based view of their most significant sustainability impacts without conducting a full financial materiality assessment.

The Toolkit demonstrates the Association’s broader commitment to helping the electronics industry advance practical sustainability action and navigate emerging reporting, risk and stakeholder expectations across the global value chain.

Global Electronics Association members can access the DMA Toolkit for free through December 31, 2026. Non-members can purchase the Toolkit at the Association’s online store.  

For more information about the DMA Toolkit, visit https://www.electronics.org/evolve/materiality/dma-toolkit.

WHMA Announces 2027 Annual Global Leadership Summit for Wire Harness Industry Leaders

Registration now open for WHMA’s premier event focused on workforce, automation, AI and the economic forces shaping the wire harness industry

The Wiring Harness Manufacturer’s Association (WHMA), a council of Global Electronics Association, will host its 2027 Annual Global Leadership Summit, February 3–5, 2027, bringing together executives from wire harness manufacturers, OEMs and suppliers serving the wire harness and cable assembly industry. Registration is now open at annualconference.whma.org.

WHMA’s Annual Global Leadership Summit is designed to help business leaders navigate a wire harness industry that continues to evolve amid workforce pressures, rising customer expectations, technology shifts and changing market conditions. The event will offer peer-to-peer networking, best-practice roundtables, technical education workshops, keynote presentations and access to leading suppliers in the exhibit hall.

The 2027 program will focus on the forces shaping the future of the wire harness industry, including customer experience, artificial intelligence, global economics and manufacturing, reshoring, workforce development, automation and business strategy.

“WHMA’s Annual Global Leadership Summit gives industry executives a forum to step back from daily operations and focus on the trends, technologies and strategies that will shape their businesses in the year ahead,” said David Bergman, WHMA executive director. “From workforce development and AI to automation, pricing strategy and economic outlook, the 2027 Summit is built around practical insights leaders can take back to their organizations.”

Featured sessions include:

  • “Build Your Workforce from Within: Apprenticeship Strategies for Wire Harness Employers,” led by Global Electronics Association workforce leaders Victoria Hawkins and Cami Marcom. The session will introduce the Association’s newly launched Wire Harness Assembly Registered Apprenticeship occupation and explain how employers can use apprenticeship to train new hires, upskill employees, strengthen retention and build a reliable talent pipeline.
  • “Fearless Pricing: How to Command the Prices You Deserve,” presented by pricing expert Casey Brown.
  • “Closing the Automation Gap in Harness Manufacturing: A Practical Look at Tactile Robotics,” presented by Kavan McEachern, CEO and cofounder of Ontologen.
  • “AI Demystified: A Practical Playbook for Building Competitive Organizations,” presented by AI strategist Austin Ambrozi.
  • “The Economic Forces Defining 2027,” presented by Global Electronics Association/WHMA Chief Economist Shawn DuBravac.

The Summit begins Wednesday, February 3, with a golf outing, peer-to-peer session, workforce workshop, first-timers session and welcome reception with exhibitors. Thursday’s programming will feature keynote sessions on pricing, tactile robotics and AI, along with best-practice roundtables and an evening networking event. The Summit concludes Friday with the WHMA Annual Meeting, an Innovation Advisory Committee update, the economic outlook keynote from DuBravac, additional roundtables, tours and a closing wine and cheese reception.

For more information or to register, visit annualconference.whma.org.