Global Electronics Association Names Dominik Grau Vice President of Europe

Standards and technology leader brings global business experience to key European role

The Global Electronics Association today announced that Dominik Grau has joined the Association as vice president of Europe. Reporting to Sanjay Huprikar, chief global officer, Grau will lead the Association’s regional strategy and operations, strengthen relationships with European members and stakeholders, and represent the needs of the region’s electronics industry across the Association’s initiatives, products, and services.

“Dominik brings the optimal mix of executive leadership, standards experience, technology expertise, and pan-European knowledge to this vital role,” said Huprikar. “His track record of building high-performing teams and advancing digital innovation will help us deepen relationships with members and better serve Europe’s electronics industry.”

“Europe’s electronics industry is navigating a period of significant transformation, from digitalization and sustainability requirements to supply chain resilience and global competitiveness,” said Grau. “I’m excited to work with members across the region to better understand their priorities, elevate their voice, and help connect them with the Association’s global expertise, solutions, and advocacy.”

Grau brings more than two decades of leadership experience across technology, standards, digital transformation, media and business development. Most recently, he served as Managing Director at DIN e.V., Germany’s national standards organization, where he led DIN Media GmbH, overseeing a €95 million standards media and services business with more than 200 employees, and DIN Solutions GmbH, the AI, technology and innovation arm of DIN. He also served as the Managing Director of DIN’s Committee of Standards Users, coordinating more than 300 experts from Germany’s top corporations and SMEs. Earlier in his career, he held executive roles with Ebner Media Group, including Chief Innovation Officer and Managing Director USA, and roles with Holtzbrinck Group, IDG Communications, and Burda.

Grau has pioneered industrial AI and smart standards with activities in international regulation and technology communities, including ISO and CEN; he also served at BITKOM, the German Magazine Publishers Association, and the German Government’s Accelerator program in the United States. He has given keynotes at global conferences and institutions including Content Marketing World, the European Newspaper Congress, Rotary International, and the World Magazine Conference.

He is fluent in German and English and has studied at Munich University, Wismar University, and Harvard University’s Extension School. He is an alumnus of Stanford’s Strategic Decision and Risk Management Program, and the Yale Publishing Course. 

IPC CEMAC 2026

Date
- (Sep 16, 2026 | 8:00pm - Sep 18, 2026 | 7:00am CDT)

With the theme "Driving a New Era of Electronics," this year's conference brings together senior executives, technical experts, and representatives from research institutions across the electronics manufacturing supply chain to explore technology evolution, standards application, and innovation pathways for the industry's new cycle, focusing on four core topics: Advanced Packaging and Electronic Interconnect Technologies, Electronics Assembly and High Reliability, Digitalization and Smart Manufacturing, Green Manufacturing and Sustainability.

Shanghai Tower-5F

5F, 501 Yincheng Rd (M)
Lujiazui
Pudong Xinqu
Shanghai Shi, 200120
China

Shanghai Tower-5F

Shanghai Tower-5F
5F, 501 Yincheng Rd (M)
Pudong Xinqu, SH 200120
China

Call for Participation Now Open for the Global Electronics Association’s Advanced Electronic Packaging Conference at APEX EXPO 2027

Advanced Electronic Packaging Conference 2027 Component-to-System-Level Integration

The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place during APEX EXPO 2027 in Anaheim, Calif. AEPC is the electronics industry’s premier technical conference for component-to-system-level integration, advanced PCB and assembly manufacturing, and next-generation electronics technologies. The Global Electronics Association invites engineers, researchers, manufacturers, and technology leaders from around the world to submit technical presentation abstracts for this distinguished event.

AEPC 2027 brings together the brightest minds across the electronics ecosystem to share peer-reviewed technical content, practical solutions, and emerging technologies that are advancing the industry. The conference serves as a vital platform for exchanging innovations that span electronics design, materials, assembly and test, reliability, manufacturing, and system integration.

Presenting at AEPC 2027 offers speakers a unique opportunity to showcase their work to a global audience of engineers, researchers, manufacturers, and technology decision-makers. Selected speakers gain industry recognition, valuable peer feedback, opportunities to build new professional connections, and the chance to influence the future direction of electronics packaging, manufacturing, and system integration.

AEPC 2026 attracted more than 170 conference participants from 20 countries and featured 78 peer-reviewed technical papers representing over 100 companies, universities, and research organizations, demonstrating the conference's role as a leading forum for technical exchange and industry collaboration.

The Association seeks abstract proposals for:

  • Technical Presentations that demonstrate innovation, practical application, and measurable industry impact
  • Technical Posters showcasing emerging research and applied solutions
  • Professional Development Courses that advance the knowledge and skills of industry professionals

Submissions are encouraged across the full spectrum of electronics design, materials, assemblyand  test, reliability, manufacturing, and system integration.

Submission  Deadlines

Technical Presentations: September 18, 2026

Professional Development Courses: September 18, 2026

Technical Posters: December 4, 2026

Shape the Future of Electronics

"AEPC 2027 offers an unparalleled opportunity to contribute to the advancement of electronics technology and manufacturing," said Matt Kelly, Conference General Chair and CTO, VP, standards and technology solutions at the Global Electronics Association. "We invite innovators from around the world to share their work and help shape the future of our industry."

Prospective participants can view conference technical topics and submission requirements and submit their proposals at https://www.apexexpo.org/event-info/call-participation

About the Advanced Electronic Packaging Conference (AEPC) – Component-to-System-Level Integration

The Advanced Electronic Packaging Conference (AEPC) is a premier technical forum dedicated to advancing electronics packaging and system integration. Held during APEX EXPO, AEPC unites engineers, researchers, manufacturers, and technology leaders to exchange peer-reviewed research, practical solutions, and emerging technologies driving the future of the electronics industry.

Conference sessions: April 5-7, 2027
Professional Development courses: April 4, 5, and 8, 2027
Posters available on the APEX EXPO show floor: April 6-8, 2027

May EMS Shipments Rise as North American Book-to-Bill Signals Ongoing Strength

The Global Electronics Association releases EMS industry results for May 2026

The Global Electronics Association announced today the May 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.36.

Total North American EMS shipments in May 2026 were up 5.2% compared to the same month last year. Compared to the preceding month, May shipments were up 3.4%. May’s year-to-date (YTD) shipments increased by 9.6% year-over-year (YOY).

EMS bookings in May increased 28.7% year-over-year and decreased 42.9% from the previous month. May’s YTD bookings increased by 3.8% compared to the same period last year.

“EMS book-to-bill has now held above parity for nine consecutive months. The monthly numbers are choppy, but the direction is steady, shipments are growing, and the industry continues to benefit from broader investment in the tech sector,” said Dr. Shawn DuBravac, Global Electronics Association’s chief economist.

3-Month Book-to-Bill

1-Month Book-to-Bill

Shipments  

3-Month MA

Bookings  

3-Month MA

Shipments YTD

Bookings YTD

1.36

1.08

1.6%

-0.8%

9.6%

3.8%

Detailed Data Available

Companies that participate in the Global Electronics Association’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in the Global Electronics Association’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The Global Electronics Association’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. The Association publishes the EMS book-to-bill ratio by the end of each month.


NOTE: Starting with the May 2026 Statistical Program report, book-to-bill ratio calculations incorporate updated survey methodologies. Because of this change, May ratios may vary substantially from previously reported monthly figures, and comparisons with prior periods should be made with caution. The updated methodology is intended to provide a more accurate reflection of current market activity. For questions, please reach out to industryintelligence@electronics.org.

 

North American PCB Market Gains Momentum with 1.60 Book-to-Bill Ratio in May

The Global Electronics Association releases PCB industry results for May 2026

The Global Electronics Association announced today the May 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.60.

Total North American PCB shipments in May 2026were up 11.9% compared to the same month last year. Compared to the preceding month, May shipments were up 10.1%. May's year-to-date (YTD) shipments increased by 12.8% year-over-year (YOY).

PCB bookings in May were up 102.8% compared to the same month last year. May bookings were up 22.3% compared to the preceding month. May’s YTD bookings increased 28.6% compared to the same period last year.

“The AI build-out continues to fuel strong bookings that have driven the PCB book-to-bill to historic levels. Shipments are keeping pace, up 11.9% over last year and 10.1% from April, while year-to-date orders run 28.6% ahead,” said Dr. Shawn DuBravac, Global Electronics Association’s chief economist. 

3-Month Book-to-Bill

1-Month Book-to-Bill

Shipments 3-Month MA

Bookings

3-Month MA

Shipments YTD

Bookings YTD

1.60

1.66

2.0%

13.8%

12.8%

28.6%

Detailed Data Available

Companies that participate in the Global Electronics Association’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in the Global Electronics Association’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The Global Electronics Association’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. The Association publishes the PCB book-to-bill ratio by the end of each month.


NOTE: Starting with the May 2026 Statistical Program report, book-to-bill ratio calculations incorporate updated survey methodologies. Because of this change, May ratios may vary substantially from previously reported monthly figures, and comparisons with prior periods should be made with caution. The updated methodology is intended to provide a more accurate reflection of current market activity. For questions, please reach out to industryintelligence@electronics.org.