BETTER ELECTRONICS BY DESIGN: NEXT GENERATION DESIGN NEEDS

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In an ever-more automated, digitized, and connected world, electronic system design has evolved from a former novel concept to an absolute necessity; it now encompasses several highly skilled and valued professions and provides a source of inspiration for many creative and ingenious people. Striving for excellence is a deeply ingrained human trait, and since the world of electronic design is still a human endeavor, the encompassing term “Design for Excellence” is used. This term, however, continues to provoke lively discussion and debate about its scope and meaning in every professional forum. The purpose of this paper is to explore and elaborate on several elements of the Design for Excellence methodology, with the goal of re-thinking how it might be further defined, applied, and achieved in the full ecosystem of electronic design. This whitepaper provides a high-level
exploration of the full “Silicon-to-Systems” ecosystem, examines the justification and implications of an Authoritative Source of Truth (ASOT), discusses the need for synergy between building blocks of electronic systems, takes a deeper dive into the subject of Design Rules, and emerges back to the surface by discussing the paradigm of true Design for Manufacturability.

Author(s)
IPC Chief Technologist and Design Leadership Councils
Resource Type
Technical Paper
Event
White Paper

Complex Integrated Systems - The Future of Electronics Manufacturing

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Complex integrated systems (CIS) combine different types of functions—e.g., digital, analog, optical, micro-mechanical, power-related, structural—in a single system to ensure the best solution for the product and its end market. These are systems where:
1. For any given function, the specialized implementation technology and/or material system that provides the best performance at the right cost point is chosen. 
2. The different function implementations are integrated using the most appropriate interconnect and packaging solutions. 
3. Multiscale, holistic approaches are essential for design, simulation, assembly and test across the complete, sustainable product lifecycle, including manufacturing.
4. The resulting supply chains intelligently integrate the capabilities, expertise, and business practices used across wafer fabrication, chip/die packaging, module assembly and final system assembly. 

Many critical CIS applications that are now scaling into mass adoption, require increasing levels of integration across heterogeneous technologies. In aggregate, the market opportunities associated with CIS solutions have significant annual growth rates and companies are investing tens of billions of dollars to address these. Examples of new market opportunities include massive wireless broadband with 5G mm Wave systems, augmented/virtual/mixed reality (AR/VR/MR) devices, and advanced driver assistance systems (ADAS) in passenger vehicles. 
These demands are inspiring product designers to seek innovative designs, materials, and assembly processes to manufacture CIS-enabled products. These products are designed by leveraging a rich portfolio of active components, mechanical elements, and functional materials from optics to electronics to micro-mechanics.
 

Companies that offer CIS design engineering and manufacturing services have developed or acquired the necessary capabilities and equipment to offer complete product assembly, potentially at one facility. Manufacture for CIS-based products often require precision placement, high tolerance control, scalable manufacturing, and/or a cleanroom processing environment. The logistics for assembly of CIS products minimizes the handling and shipping of unfinished modules from location to location, thereby minimizing supply chain disruption and potentially reducing the product carbon footprint. 

The impacts of realizing CIS products extends beyond manufacturing into other aspects of the product 
life cycle, including design, test, sustainability and smart manufacturing. 

Author(s)
iNEMI
Resource Type
Technical Paper
Event
White Paper

OUTLOOK FOR DATA ANALYTICS IN THE ELECTRONICS MANUFACTURING INDUSTRY

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The electronics manufacturing industry finds itself today in a moment of change driven by the convergence of multiple independent factors that all conspire to greatly challenge the status quo of how electronics factories are managed:


- The increasing complexity of electronics manufacturing (and decreasing feature sizes) pushing the limits of what is feasible with current process controls
- The blurring of the line between semiconductor and circuit manufacturing caused by increased usage of advanced packaging and chip-scale integration technologies
- Rapidly increasing demand for additional electronics manufacturing caused by the adoption of high-performance computing (HPC), electric vehicles and consumer electronics
- Geopolitical pressures forcing the relocation of manufacturing to areas without an abundant expert labor pool
- A changing workforce with fewer deep experts being asked to oversee many more lines and factories


These pressures are coming at a time when rapid advancements in new artificial intelligence (AI) technologies are challenging conventional notions about what is possible to automate and potentially providing a new path forward for the industry. In many ways, the frontier of electronics manufacturing is increasingly resembling the semiconductor 
industry one or two decades ago in terms of the level of process complexity and required automation. This analogy of the electronics manufacturing industry following the path of the semiconductor industry provides the ability to look into the possible future of electronics manufacturing by examining how the semiconductor industry has evolved over the past 20 years. There are many insights one could draw from this analogy, but the focus of this white paper is on one of the most conspicuous differences one will see, even today, when walking the floor of an electronics factory and a semiconductor fab. No semiconductor fab runs without data analytics at the core of the manufacturing process. In fact, semiconductor fabs incorporate a complete Fault Detection and Classification (FDC) system as a core operational tool next to the manufacturing execution system (MES) where rich data from all process steps is automatically collected, unified, enriched and analyzed in real time to flag problems and enable high-yield production. In stark contrast, very few, if any, EMS factories employ a similar level of data analytics today simply because it was not historically necessary and the industry focus instead has been on direct automation of manual production tasks without reimagining how the factory was run overall. Looking forward, however, many of the biggest opportunities facing the industry are about shifting how factories are managed using data instead of just replacing humans with robots doing the exact same work

Author(s)
IPC’s Chief Technologist Council
Resource Type
Technical Paper
Event
White Paper

ELECTRONIC DESIGN AND MANUFACTURING SUSTAINABILITY

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Environmental sustainability is a driving force for both consumers and businesses across many industries; the electronic sector is no exception. Sustainability reporting standards are being developed and implemented. Requirements are already in place in many countries regarding restricted materials, energy utilization, extended life requirements, recyclability, and end-oflife management. The industry must be ready to meet or exceed these requirements if we are to be good stewards of the planet. This paper provides an overview of several environmental sustainability matters, tools/mitigation systems, recommendations, and useful resources for the electronics industry.
 

Author(s)
IPC’s Chief Technologist Council
Resource Type
Technical Paper
Event
White Paper

MAXIMIZING RETURNS: THE ROI OF TRAINING IN ELECTRONICS MANUFACTURING

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The whitepaper Maximizing Returns: The ROI of Training in Electronics Manufacturing aims to provide a comprehensive analysis of how evaluating the return on investment (ROI) of training programs can optimize workforce performance and drive profitability in the electronics manufacturing industry. This paper explores both the direct and indirect benefits of training, discusses the importance of accurately tracking costs, and outlines best practices for maximizing ROI through tailored training, continuous learning, and management involvement.

Author(s)
Carlos Plaza
Resource Type
Technical Paper
Event
White Paper

Electronics Industry Reimagines the Possibilities at IPC APEX EXPO 2025

The electronics industry is driven by innovators and problem-solvers, and IPC APEX EXPO 2025 provided endless opportunities to connect, collaborate, and shape the future. From hot topics such as artificial intelligence, high performance computing, advanced packaging and EV electronics covered in keynotes, conference sessions and standards meeting to the latest innovations in capital equipment on the show floor, this year’s event provided ample knowledge sharing and networking opportunities, for 3,541 attendees from 39 countries. 

 

Four hundred two (402) exhibitors engaged in three days of business development, generating 22,900 qualified sales leads on 132,100 net square feet of Anaheim Convention Center show floor space. IPC APEX EXPO attracted 6,863 total visitors including attendees and exhibitor personnel. 

 

In keeping with the event’s theme, “Reimagining the Possibilities,” the IPC APEX EXPO Technical Program Committee built a strong technical conference program with 15 topic tracks, 28 sessions and 79 papers, with peer-reviewed content from industry thought leaders from across the globe, detailing original research and innovations. “Every year, I am reminded what an exciting and fast-paced tradeshow and conference IPC APEX EXPO is—the colleagues you run into, the new people you meet, the innovations you encounter, and the fascinating discussions you dive into. From attendees and exhibitors alike, feedback was generally positive, but we also walked away with several new ideas for next year to further improve the attendee and exhibitor experience and we’re eager to implement them,” said IPC President and CEO John W. Mitchell.

 

Commenting on his attendee experience, Josh Hanney, an electronics technician with the Oregon State Lottery offered, “We had a couple very niche issues with our rework and repair shop. The wide exposure to exhibiting companies at IPC APEX EXPO allowed us to find vendors that were able to provide specific solutions to these problems. We even found products and services to dramatically improve our processes and functionality. I feel like a much better technician for attending!”

 

The exhibitor experience at APEX EXPO 2025 was equally beneficial. “IPC APEX EXPO 2025 was head and shoulders above the 2024 show. We received more leads in the first day of the show than the full three days last year,” said Gregg Kleinberg, chief technical officer, Microscope World. “Our team was thankful to see the resurgence of activity in the PCB market and were grateful to be part of all the positive energy at the show!”

 

In 2026, IPC APEX EXPO will return to the Anaheim Convention Center, March 14-19. For more information on IPC APEX EXPO 2026, visit www.ipcapexexpo.org.

 

Statement from IPC on ‘Liberation Day’ Pressing for Domestic Manufacturing Strategy

IPC shared the following statement today on U.S. tariffs and their implications on the global electronics industry. It can be attributed to Richard Cappetto, IPC senior director of North American government relations: 

 

For decades, IPC has worked to restore U.S. leadership in electronics manufacturing, urging the government to recognize its strategic importance and invest in rebuilding critical domestic capabilities. We welcome President Trump’s commitment to strengthening American manufacturing, particularly his focus on revitalizing the defense industrial base. Electronics design and production are the backbone of innovation and industrial resilience across all sectors of the economy, and we stand ready to work with the administration on a bold strategy to rebuild this vital sector.

 

Tariffs will not achieve this goal. A strong U.S. electronics industry requires a comprehensive approach—one that pairs targeted investments and incentives with policies that enhance mutually beneficial trade partnerships. Trade is essential to supply chain resilience, innovation, and cost competitiveness. Without it, tariffs risk raising costs for American businesses and further driving production offshore.

 

IPC is eager to work with President Trump, his administration, and Congress on policies that profoundly strengthen U.S. electronics manufacturing. We urge a collaborative strategy that fosters domestic growth while maintaining global connections critical to long-term competitiveness.

Electronics Industry Demand Strengthens in March

IPC releases March 2025 Global Sentiment of the Electronics Manufacturing Supply Chain report

This past March, electronics industry demand strengthened to its highest level in nearly a year, indicating strong expansion in customer and manufacturing activity according to IPC’s March Sentiment of the Global Electronics Manufacturing Supply Chain Report. In addition, the Shipment Index also reached its highest point since March 2024, reflecting firms’ abilities to fulfill rising demand and maintain supply chain performance. Capacity utilization increased to its highest level since late 2023, indicating strong operational activity and efficient resource deployment.

 

Per the report, ease of recruiting skilled talent improved to a record-high, indicating that hiring constraints are continuing to ease for many firms. Material costs have risen, reversing a multi-month decline and pointing to renewed input cost pressures that may warrant monitoring. Labor costs decreased slightly.

 

In response to special questions regarding supply chain management strategies being considered or implemented to address the impact of recent or proposed tariffs, 31 percent of electronics manufacturers have invested in automation or optimization to counter the impact of tariffs, while 28 percent have switched to non-tariffed suppliers.

 

Sixty-one percent of electronics manufacturers are considering renegotiating supplier contracts, making it the most widely considered supply chain strategy. Said Shawn DuBravac, Ph.D., IPC chief economist and report author, “On the workforce side, 18 percent have implemented a hiring freeze, with another 36 percent considering it—indicating growing caution around workforce expansion.”                                 

 

Additional survey data show:

  • Over the next six months, electronics manufacturers expect labor and material costs to remain high, with a notable increase in both orders and shipments.
  • European electronics manufacturers anticipate a greater decline in capacity utilization over the next six months when compared to North American electronics manufacturers.
  • On average, 29 percent of manufacturers’ supply chains are currently reliant on Chinese suppliers.
  • Electronics manufacturers expressed greatest concern regarding U.S. trade policies as it relates to overall economic impact (47 percent) and Impact on Business Operations (32 percent).      

     

These results are based upon the findings of IPC’s Current State of Electronics Manufacturing Survey, fielded between February 13 and February 28, 2025.

Read the full report.